JPH0231148U - - Google Patents
Info
- Publication number
- JPH0231148U JPH0231148U JP10906988U JP10906988U JPH0231148U JP H0231148 U JPH0231148 U JP H0231148U JP 10906988 U JP10906988 U JP 10906988U JP 10906988 U JP10906988 U JP 10906988U JP H0231148 U JPH0231148 U JP H0231148U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- diameter
- package
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906988U JPH0231148U (fr) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10906988U JPH0231148U (fr) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231148U true JPH0231148U (fr) | 1990-02-27 |
Family
ID=31344982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10906988U Pending JPH0231148U (fr) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231148U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (ja) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | はんだ付け部品 |
-
1988
- 1988-08-22 JP JP10906988U patent/JPH0231148U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020035947A (ja) * | 2018-08-31 | 2020-03-05 | 日本航空電子工業株式会社 | はんだ付け部品 |