JPH02310989A - Method and apparatus for cleaning of painted board - Google Patents
Method and apparatus for cleaning of painted boardInfo
- Publication number
- JPH02310989A JPH02310989A JP13128789A JP13128789A JPH02310989A JP H02310989 A JPH02310989 A JP H02310989A JP 13128789 A JP13128789 A JP 13128789A JP 13128789 A JP13128789 A JP 13128789A JP H02310989 A JPH02310989 A JP H02310989A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- cleaning
- cleaning liquid
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 223
- 238000000034 method Methods 0.000 title description 8
- 239000007788 liquid Substances 0.000 claims abstract description 121
- 238000001035 drying Methods 0.000 claims abstract 2
- 238000007654 immersion Methods 0.000 claims description 46
- 238000005476 soldering Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- 238000007602 hot air drying Methods 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 239000000356 contaminant Substances 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 2
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 239000012530 fluid Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Landscapes
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、はんだ付けを終了したプリント基板の洗浄
を行うプリント基板の洗浄方法およびその装置に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a printed circuit board cleaning method and apparatus for cleaning a printed circuit board after soldering.
従来、はんだ付けを終了したプリント基板、あるいはは
んだ付けを終了した後、リード線またはリード端子をカ
ッティングしたプリント基板は、水または洗剤を溶解し
た水、あるいはフレオン（デュポン社の商品名）の液か
らなる洗浄液の中に浸漬したり、洗浄液を吹き付けたり
してプリント基板に付着したフラックスやカッティング
により付着した金属粉末を除去していた。Conventionally, printed circuit boards that have been soldered or whose lead wires or lead terminals have been cut after soldering have been treated with water, detergent-dissolved water, or Freon (a product name of DuPont). Flux adhering to the printed circuit board and metal powder adhering to it by cutting were removed by immersing it in a cleaning solution or spraying it with the cleaning solution.
ところで、上記従来のプリント基板の洗浄方法およびそ
の装置は、走行するプリント基板を洗浄槽に貯溜された
洗浄液に浸漬させたり、あるいは洗浄液を吹き付けたり
するだけであるため、フラックス処理により付着したフ
ラッフやリード線のカッティングにより付着した金属粉
末等の汚れを完全に取り除くことができないにもがかわ
らず、２枚目以降のプリント基板においては、フラック
スや金属粉末が混入して汚染された洗浄液で洗浄を行わ
なければならないという問題点があった。By the way, in the conventional printed circuit board cleaning method and apparatus described above, the running printed circuit board is simply immersed in the cleaning liquid stored in the cleaning tank or sprayed with the cleaning liquid. Although it is not possible to completely remove dirt such as metal powder that has adhered to the lead wires by cutting them, cleaning the second and subsequent printed circuit boards with a cleaning solution contaminated with flux and metal powder is not recommended. There was a problem that it had to be done.
また、フレオンの蒸気を使用するものは、フレオンが高
価であり、また、加熱されたフレオンの蒸気の一部が外
部へ排出されることにより、無駄に消費されて製品のコ
ストが上昇し、また、作業環境が悪化し、さらにフレオ
ンの蒸気による公害が発生するという問題点があった。In addition, in products that use Freon steam, Freon is expensive, and some of the heated Freon steam is discharged outside and is wasted, increasing the cost of the product. However, there were problems in that the working environment deteriorated and furthermore, Freon vapor caused pollution.
この発明は、上記の問題点を解決するためになされたも
ので、プリンＩ・基板に付着したフラッフや金属粉末等
の大きな汚れは洗浄液を含んだロールブラシによる洗浄
と、流動する洗浄液に浸漬してから洗浄液のシャワーに
よる洗浄とを行うとともに、上記それぞれの洗浄を行う
ごとにプリント基板に付着した洗浄液を除去するように
したプリント基板の洗浄方法およびその装置を得ること
を目的とする。This invention was made to solve the above problems, and large stains such as fluff and metal powder adhering to the print I/substrate can be removed by cleaning with a roll brush containing cleaning liquid and by immersing it in a flowing cleaning liquid. It is an object of the present invention to provide a method and apparatus for cleaning a printed circuit board, in which cleaning is performed by showering a cleaning liquid after cleaning, and the cleaning liquid adhering to the printed circuit board is removed each time the above-mentioned cleaning is performed.
乙の発明の第１の発明に係るプリン１一基板の洗浄方法
は、はんだ付けを終了したプリン１〜基板を搬送手段に
より搬送するとともに、洗浄液を含んだロールブラシに
よりプリント基板の下面を洗浄した後、加圧空気の吹き
付けによりプリント基板に付着した洗浄液を除去し、次
いで、プリント基板を下降させてから、プリント基板の
走行方向に対して反対方向と、プリン！・基板の走行方
向に対して交差する方向とにそれぞれ噴流する洗浄液の
中にプリント基板を浸漬して洗浄し、次いで、プリント
基板を上昇させるときに洗浄液を吹き付けてプリント基
板の上面と下面とを洗浄し、次いで、加圧空気の吹き付
けによりプリント基板に付着した洗浄液を除去し、次い
で、プリント基板を熱風により乾燥した後、冷風により
冷却を行うものである。The cleaning method for the printed circuit board 1 according to the first invention of invention B includes transporting the printed circuit board 1 to the printed circuit board after soldering by a conveying means, and cleaning the lower surface of the printed circuit board with a roll brush containing a cleaning liquid. After that, the cleaning liquid adhering to the printed circuit board is removed by blowing pressurized air, and then the printed circuit board is lowered, and then the printed circuit board is moved in the opposite direction to the running direction of the printed circuit board.・The printed circuit board is cleaned by immersing it in cleaning liquid that is jetted in a direction crossing the running direction of the printed circuit board, and then when the printed circuit board is raised, the cleaning liquid is sprayed to clean the top and bottom surfaces of the printed circuit board. The printed circuit board is cleaned, the cleaning liquid adhering to the printed circuit board is removed by blowing pressurized air, the printed circuit board is dried with hot air, and then the printed circuit board is cooled with cold air.
また、この発明の第２の発明にがかるプリント基板の洗
浄装置は、はんだ付けを終了したプリント基板を搬送す
る搬送手段と；洗浄液を収容した洗浄槽にプリント基板
の下面を洗浄するロールブランを設けたブラシ洗浄装置
と；プリント基板（ζ付着した洗浄液を加圧空気により
除去する液除去装置と；プリント基板の走行方向に対し
て反対方向と、プリント基板の走行方向と交差する方向
とにそれぞれ洗浄液を噴流する噴流管を有し、これらの
噴流管から噴流する洗浄液の中へプリント基板を下降さ
せて洗浄を行う浸漬洗浄槽と、プリント基板を上昇させ
るときにプリント基板の上面と下面とに向けて洗浄液を
噴出する噴出管を有し、これらの噴出管から噴出する洗
浄液により洗浄を行うシャワー洗浄器とを設けた浸漬・
シャワー洗浄装置と；プリント基板に付着した洗浄液を
熱風により乾燥する熱風乾燥装置と；加熱されたプリン
ト基板を冷風により冷却する冷却装置；とをプリント基
板の走行方向に対して順次備えたものである。Further, the printed circuit board cleaning apparatus according to the second aspect of the present invention is provided with: a transport means for transporting the printed circuit board after soldering; and a roll blank for cleaning the lower surface of the printed circuit board in the cleaning tank containing the cleaning liquid. A brush cleaning device that uses pressurized air to remove the cleaning fluid that has adhered to the printed circuit board (ζ); A cleaning fluid removal device that removes the cleaning fluid that has adhered to the printed circuit board (ζ) using pressurized air; The immersion cleaning tank has jet tubes that jet water and cleans the printed circuit board by lowering it into the cleaning liquid that jets from these jet tubes, and an immersion cleaning tank that cleans the printed circuit board by lowering it into the cleaning liquid that jets from these jet tubes. The immersion cleaner is equipped with a shower washer that has jetting pipes that spout cleaning fluid from these jetting pipes, and a shower washer that performs cleaning with the cleaning fluid spouted from these jetting pipes.
A shower cleaning device; a hot air drying device that dries the cleaning liquid adhering to the printed circuit board with hot air; and a cooling device that cools the heated printed circuit board with cold air; these are sequentially provided in the running direction of the printed circuit board. .
この発明にかかるプリント基板の洗浄方法およびその装
置は、プリント基板の下面を洗浄液を含んだロールブラ
シにより洗浄した後、プリント基板に付着した洗浄液を
除去する。次いで、プリント基板を流動する洗浄液によ
り洗浄した後、プリント基板の上面と下面を噴出する洗
浄液により洗浄し、次いで、プリント基板に付着した洗
浄液を除去し、さらに、プリント基板を熱風で乾燥した
後、冷却する。The method and apparatus for cleaning a printed circuit board according to the present invention cleans the lower surface of the printed circuit board with a roll brush containing a cleaning liquid, and then removes the cleaning liquid adhering to the printed circuit board. Next, after cleaning the printed circuit board with a flowing cleaning liquid, the top and bottom surfaces of the printed circuit board are cleaned with a jetting cleaning liquid, then the cleaning liquid adhering to the printed circuit board is removed, and the printed circuit board is further dried with hot air. Cooling.
第１図はこの発明の一実施例を示す概略構成図で、１は
プリント基板で、１ａは上面、１ｂははんだ付は面であ
る下面を示す。２は前記プリント基板１を装着して矢印
Ａ方向へ搬送するキャリア、３は前記プリント基板１を
搬送する手段としての搬送チェーン、４は前記はんだ付
けを終了したプリント基板１を洗浄する洗浄装置の全体
を示す。FIG. 1 is a schematic diagram showing an embodiment of the present invention, in which 1 is a printed circuit board, 1a is the top surface, and 1b is the bottom surface for soldering. 2 is a carrier on which the printed circuit board 1 is mounted and transported in the direction of arrow A; 3 is a conveyance chain as means for transporting the printed circuit board 1; and 4 is a cleaning device for cleaning the printed circuit board 1 after soldering. Show the whole.
５は前記プリント基板１の搬入口、６は搬出口、７は洗
浄液である。１１は前記プリント基板１のはんだ付は面
である下面１ｂを洗浄するブラシ洗浄装置、１２は洗浄
槽、１３は前記洗浄液７を含んで回転するロールブラシ
、１４は前記洗浄液７が供給される供給パイプ、１５は
前記洗浄槽１２の上部から溢れ出た洗浄液７を受ける受
溜槽、１６は排出パイプ、１７は前記プリント基板１に
付着した洗浄液７を除去する第１の液除去装置、２１は
第１の浸漬・シャワー洗浄装置、２２は前記第１の浸漬
・シャワー洗浄装置２１の第１の浸漬洗浄槽で、その詳
細を第２図（”）ｐ （ｂ）に示す、第２図（ａ）、（
ｂ）において、第２図（ａ）は平面図、第２図（ｂ）は
、第２図（ａ）のｌ−１１４１による断面図を示す。第
１図、第２図（ａ）、（ｂ）において、２３は前記洗浄
液７の噴流管で、洗浄液７をプリント基板１の走行方向
（矢印Ａ方向）と反対方向の矢印Ｂ方向に噴流する。２
４は前゛記洗浄ｔｅｉ、７の噴流管で、第２図（ｂ）に
示すように噴流管２３よりも高さｈだけ下方に位置して
おり、洗浄液７をプリント基板１の走行方向（矢印Ａ方
向）と交差する方向（矢印Ｃ方向）に噴流する。第１図
において、２５は前記洗浄液７を加熱するヒータ、２６
はフィルタ、２７は前記第１の浸漬洗浄槽２２内の洗浄
液７が循環する循環パイプ、２８は前記循環パイプ２７
内の洗浄液７を噴流管２３，２４から噴流せしめるポン
プである。２９は前記第１の浸漬洗浄槽２２円から溢れ
出た洗浄液７を受ける受溜槽、３０は前記受溜槽２９内
の洗浄液７を排出する排出パイプζ３１はフィルタであ
る。３２は第１のシャワー洗浄器、３３，３４．３５は
いずれも前記洗浄ｗＲ７を噴出する噴出管で、噴出管３
３は洗浄液７を下方の液面に向けて噴出し、洗浄液７を
第１の浸漬洗浄槽２２に貯溜する。噴出管３４は前記斜
め方向に上昇するプリント基板１の上面１ａに向けて噴
出する。噴出管３５は前記走行するプリント基板１の下
面１ｂに向けて噴出する。Reference numeral 5 designates an entrance for carrying the printed circuit board 1, 6 an exit for transporting the printed circuit board 1, and 7 a cleaning liquid. 11 is a brush cleaning device for cleaning the lower surface 1b of the printed circuit board 1, which is the soldering surface; 12 is a cleaning tank; 13 is a roll brush that rotates and contains the cleaning liquid 7; and 14 is a supply to which the cleaning liquid 7 is supplied. A pipe 15 is a receiving tank for receiving the cleaning liquid 7 overflowing from the upper part of the cleaning tank 12, 16 is a discharge pipe, 17 is a first liquid removal device for removing the cleaning liquid 7 adhering to the printed circuit board 1, and 21 is a first liquid removal device. Reference numeral 1 indicates an immersion/shower cleaning device, and 22 indicates a first immersion cleaning tank of the first immersion/shower cleaning device 21, the details of which are shown in FIG. ), (
In b), FIG. 2(a) is a plan view, and FIG. 2(b) is a sectional view taken along l-1141 in FIG. 2(a). 1, 2(a) and 2(b), 23 is a jet pipe for the cleaning liquid 7, which jets the cleaning liquid 7 in the direction of arrow B, which is opposite to the running direction of the printed circuit board 1 (direction of arrow A). . 2
Reference numeral 4 designates a jet pipe for the cleaning fluid 7, which is located below the jet pipe 23 by a height h, as shown in FIG. The jet flows in a direction (direction of arrow C) that intersects the direction of arrow A). In FIG. 1, 25 is a heater that heats the cleaning liquid 7;
is a filter, 27 is a circulation pipe through which the cleaning liquid 7 in the first immersion cleaning tank 22 circulates, and 28 is the circulation pipe 27.
This is a pump that jets the cleaning liquid 7 inside from the jet pipes 23 and 24. Reference numeral 29 designates a reservoir tank for receiving the cleaning liquid 7 overflowing from the first immersion cleaning tank 22, and reference numeral 30 designates a discharge pipe ζ31 for discharging the cleaning liquid 7 in the reservoir tank 29, which is a filter. 32 is a first shower washer; 33, 34, and 35 are all ejection pipes that eject the cleaning wR7;
3 jets the cleaning liquid 7 toward the lower liquid surface and stores the cleaning liquid 7 in the first immersion cleaning tank 22. The ejection pipe 34 ejects water toward the upper surface 1a of the printed circuit board 1 rising in the diagonal direction. The ejection pipe 35 ejects water toward the lower surface 1b of the traveling printed circuit board 1.
３６は第２の液除去装置、４１は第２の浸漬・シャワー
洗浄装置で、その構成は第２図（Ｊｌ）、 （ｂ）の第
１の浸漬・シャワー洗浄装置２１と同一である。第２の
浸漬・シャワー洗浄装置４１において、４２は第２の浸
漬洗浄槽、４３．４４は噴流管、４５はヒータ、４６は
フィルタ、４７は循環パイプ、４８はポンプ、４９は受
溜槽、５０は排出パイプ、５１はフィルタ、５２は第２
のシャワー洗浄器、５３，５４，５５は噴出管、５６は
第３の液除去装置、５７は熱風乾燥装置、５８は熱風の
噴出口、５９は熱風の吸入口、６０は前記熱風乾燥装置
５７で加熱されたプリント基板１を冷却する冷却器、６
１は新しい洗浄液７を供給する新液供給槽、６２は前記
新しい洗浄液７を加熱する加熱器である。７１は前記第
１．第２の浸漬・シャワー洗浄装置２１．４１から排出
された洗浄液７を貯溜する貯溜装置の全体を示し、７２
．７３は前記第１．第２の浸漬・シャワー洗浄装置２１
゜４１から排出された洗浄液７を貯溜する第１．第２の
貯溜槽で、仕切壁７４により仕切られている。36 is a second liquid removal device, and 41 is a second immersion/shower cleaning device, the configuration of which is the same as the first immersion/shower cleaning device 21 in FIG. 2 (Jl), (b). In the second immersion/shower cleaning device 41, 42 is a second immersion cleaning tank, 43, 44 is a jet pipe, 45 is a heater, 46 is a filter, 47 is a circulation pipe, 48 is a pump, 49 is a reservoir tank, 50 is a discharge pipe, 51 is a filter, and 52 is a second
53, 54, 55 are the jetting pipes, 56 is the third liquid removing device, 57 is the hot air drying device, 58 is the hot air jetting port, 59 is the hot air inlet, 60 is the hot air drying device 57 a cooler 6 for cooling the printed circuit board 1 heated by the
1 is a new liquid supply tank for supplying new cleaning liquid 7, and 62 is a heater for heating the new cleaning liquid 7. 71 is the first. 72 shows the entire storage device for storing the cleaning liquid 7 discharged from the second immersion/shower cleaning device 21.41;
．． 73 is the first. Second immersion/shower cleaning device 21
41 for storing the cleaning liquid 7 discharged from the first. It is a second storage tank and is partitioned off by a partition wall 74.
７５は前記第１の貯溜槽７２内の洗浄液７をブラシ洗浄
装置１１の洗浄槽１２へ供給する供給パイプ、７６はポ
ンプ、７７は前記第２の貯溜槽７３内の洗浄液７を第２
の浸漬・シャワー洗浄装置４１の第１のシャワー洗浄器
３２へ供給する供給パイプ、７８はポンプ、７９はヒー
タ、８０は前記第１の貯溜槽７２から溢れ出た洗浄液７
を受ける受溜槽、８１は排出パイプ、８２は前記各受溜
槽１５゜８０から汚染により排出された洗浄液７の廃液
を受ける廃液受溜槽であるつ
次に動作について説明する。75 is a supply pipe that supplies the cleaning liquid 7 in the first storage tank 72 to the cleaning tank 12 of the brush cleaning device 11, 76 is a pump, and 77 is a supply pipe that supplies the cleaning liquid 7 in the second storage tank 73 to the cleaning tank 12 of the brush cleaning device 11.
78 is a pump, 79 is a heater, and 80 is a cleaning liquid 7 overflowing from the first storage tank 72.
81 is a discharge pipe, and 82 is a waste liquid receiving tank for receiving the waste liquid of the cleaning liquid 7 discharged due to contamination from each of the receiving tanks 15 and 80.The operation will now be described.
キャリア２に装着され、はんだ付けを終了し、あるいは
はんだ付けを終了した後、リード線またはリード端子を
カッティングしたプリント基板１は、搬送チェーン３に
より矢印Ａ方向に走行し、搬入口５から洗浄装置４内に
入る。次いで、ブラシ洗浄装置１１のロールブラシ１３
によりプリント基板１の下面１ｂにフラックス処理によ
り付着したフラックスやカッティングにより付着した金
属粉末等の大きな汚れが洗浄され、第１の液除去装置１
７で空気の吹き付けにより洗浄液７が除去される。次い
で、プリント基板１を下降させて第１の浸漬洗浄槽２２
の洗浄Ｈ！ｉ、７内に浸漬する。ここで、噴流’！’２
３．２４から噴流する洗浄液７と噴出管３３から噴出す
る洗浄液７により第１の浸漬洗浄槽２２内の洗浄液７が
攪拌されるので、プリント基板１の上面ｌａ、下面１ｂ
が洗浄される。次いで、プリント基板１を第１の浸漬洗
浄槽２２の洗浄液７から上昇させるとき、第１のシャワ
ー洗浄器３２の各噴出管３４．３５から噴出する洗浄液
７によりプリント基板１の上面１ａと下面１ｂを洗浄す
る。次いで、プリント基板１は水平に走行し、第２の液
除去装置３６に入ると、空気の吹き付けにより洗浄液７
が除去される。次いで、プリント基板１を第２の浸漬・
シャワー洗浄装置４１で、第１の浸漬・シャワー洗浄装
置２１と同一の工程を経て洗浄を行い１次いで、第３の
液除去装置５６内に入り、空気の吹き付けにより洗浄液
７が除去される１次いで、熱風乾燥装置５７内に入り噴
出口５８から噴出する熱風により乾燥される。なお、プ
リント基板１を乾燥した熱風は吸入口５９に入り、熱風
乾燥装置５７内を循環する。次いで、乾燥されたプリン
ト基板１は冷却器６ｏから噴出する冷風により冷却され
、搬出口〇から送り出される。The printed circuit board 1 mounted on the carrier 2 and soldered or having the lead wires or lead terminals cut thereon is transported by a conveyor chain 3 in the direction of arrow A, and is transported through a loading port 5 to a cleaning device. Enter within 4. Next, the roll brush 13 of the brush cleaning device 11
By this, large stains such as flux that has adhered to the lower surface 1b of the printed circuit board 1 due to flux treatment and metal powder that has adhered due to cutting are cleaned, and the first liquid removal device 1
At step 7, the cleaning liquid 7 is removed by blowing air. Next, the printed circuit board 1 is lowered to the first immersion cleaning tank 22.
Washing H! i, immerse in 7. Here, the jet'! '2
Since the cleaning liquid 7 in the first immersion cleaning tank 22 is agitated by the cleaning liquid 7 jetted from 3.24 and the cleaning liquid 7 jetted from the jetting pipe 33, the upper surface la and lower surface 1b of the printed circuit board 1 are agitated.
is washed. Next, when the printed circuit board 1 is lifted out of the cleaning liquid 7 of the first immersion cleaning tank 22, the upper surface 1a and the lower surface 1b of the printed circuit board 1 are washed away by the cleaning liquid 7 jetted from each jet pipe 34, 35 of the first shower cleaner 32. Wash. Next, the printed circuit board 1 travels horizontally and enters the second liquid removing device 36, whereupon the cleaning liquid 7 is removed by air blowing.
is removed. Next, the printed circuit board 1 is subjected to a second immersion process.
The shower cleaning device 41 performs cleaning through the same process as the first immersion/shower cleaning device 21, and then enters the third liquid removal device 56, where the cleaning liquid 7 is removed by blowing air. , and is dried by hot air that enters the hot air drying device 57 and blows out from the blowout port 58. Note that the hot air that has dried the printed circuit board 1 enters the suction port 59 and circulates within the hot air drying device 57. Next, the dried printed circuit board 1 is cooled by cold air blown from the cooler 6o, and is sent out from the outlet 〇.
次に洗浄液７の流動する系統について、第１図と第３図
により説明する。Next, the system through which the cleaning liquid 7 flows will be explained with reference to FIGS. 1 and 3.
第３図は洗浄液７が流動する系統を示す図で、第１図と
同一符号は同一部分を示す。第１図〜第３図において、
新しい洗浄液７は新液供給槽６１内に貯溜された後、加
熱器６２で加熱され、濡液となった洗浄液７は第２の浸
漬・シャワー洗浄装置４１の第２のシャワー洗浄器５２
へ送られてから噴出し、噴出された洗浄液７はさらに第
２の浸漬洗浄槽４２に入る。第２の浸漬洗浄槽４２内の
洗浄液７はポンプ４８により第１図に示す各噴流管４３
，４４から噴流され、噴流された洗浄液７は第２の浸漬
洗浄槽４゛２内を循環する。一方、第２の浸漬洗浄槽４
２から溢れた洗浄液７は貯溜槽７１のうちの第２の貯溜
槽７３内に入る。次いで、第２の貯溜槽７３内の洗浄液
７はポンプ７８により第１の浸漬・シャワー洗浄装置２
１の第１のシャワー洗浄器３２へ送られてから噴出し、
噴出された洗浄液７は、さらに第１の浸漬洗浄槽２２に
入る。第１の浸漬洗浄槽２２内の洗浄液７はポンプ２８
により第１図に示す各噴流管２３，２１１カ）ら噴流さ
れ、第１の浸漬洗浄槽２２内を循環する。FIG. 3 is a diagram showing a system through which the cleaning liquid 7 flows, and the same reference numerals as in FIG. 1 indicate the same parts. In Figures 1 to 3,
After the new cleaning liquid 7 is stored in the new liquid supply tank 61, it is heated by the heater 62, and the cleaning liquid 7 that has become a wet liquid is transferred to the second shower cleaning device 52 of the second immersion/shower cleaning device 41.
The cleaning liquid 7 is sent to the cleaning tank 42 and then jetted out, and the jetted cleaning liquid 7 further enters the second immersion cleaning tank . The cleaning liquid 7 in the second immersion cleaning tank 42 is supplied to each jet pipe 43 shown in FIG. 1 by a pump 48.
, 44, and the jetted cleaning liquid 7 circulates within the second immersion cleaning tank 4'2. On the other hand, the second immersion cleaning tank 4
The cleaning liquid 7 overflowing from the second reservoir 73 enters the second reservoir 73 of the reservoirs 71. Next, the cleaning liquid 7 in the second storage tank 73 is pumped to the first immersion/shower cleaning device 2 by a pump 78.
After being sent to the first shower washer 32 of 1, it is ejected,
The jetted cleaning liquid 7 further enters the first immersion cleaning tank 22. The cleaning liquid 7 in the first immersion cleaning tank 22 is pumped 28
As a result, the water is jetted from each jet pipe 23, 211 shown in FIG. 1 and circulated within the first immersion cleaning tank 22.
また、第１の浸漬洗浄槽２２から溢れ出た洗浄液７は第
１の貯溜槽７２内に入る。次いで、第１の貯溜槽７２内
の洗浄液７はポンプ７６によりブラシ洗浄装置１１へ供
給される１次いで、ブラシ洗浄装置１１から溢れた洗浄
液７と第１の貯溜槽７２から溢れた洗浄液７はいずれも
廃液受溜槽８２に受溜される。Further, the cleaning liquid 7 overflowing from the first immersion cleaning tank 22 enters the first storage tank 72. Next, the cleaning liquid 7 in the first storage tank 72 is supplied to the brush cleaning device 11 by the pump 76. Next, the cleaning liquid 7 overflowing from the brush cleaning device 11 and the cleaning liquid 7 overflowing from the first storage tank 72 are The waste liquid is also collected in the waste liquid storage tank 82.
また、第２の貯溜槽７３から溢れた洗浄液７は、第１の
貯溜槽７２内に入る。Further, the cleaning liquid 7 overflowing from the second storage tank 73 enters the first storage tank 72.
乙のように、第２の浸漬・シャワー洗浄装置４１には加
熱された新しい洗浄液７が供給され、第１の浸漬・シャ
ワー洗浄装置２１では第２の浸漬・シャワー洗浄装置４
１で使用された洗浄液７により洗浄が行われる。また、
ブラシ洗浄装置１１においても、第１の浸漬・シャワー
洗浄装置２１で使用された洗浄液７により洗浄が行オ）
れる。As shown in Part B, the second immersion/shower cleaning device 41 is supplied with new heated cleaning liquid 7, and the first immersion/shower cleaning device 21 is supplied with the second immersion/shower cleaning device 4.
Cleaning is performed using the cleaning liquid 7 used in step 1. Also,
Cleaning is also performed in the brush cleaning device 11 with the cleaning liquid 7 used in the first immersion/shower cleaning device 21)
It will be done.
また、第１の液除去装置１７を設けたことによりブラシ
洗浄装置１１で汚れた洗浄液７が、第１の浸漬・シャワ
ー洗浄器ｗ２１に混入することがない。また、第２の液
除去装置３６においても第１の浸漬・シャワー洗浄装置
２１で汚れた洗浄液７が完全に除去されて、第２の浸漬
・シャワー洗浄装置４１に混入することがないようにな
っている。Further, by providing the first liquid removing device 17, the cleaning liquid 7 contaminated by the brush cleaning device 11 does not mix into the first immersion/shower cleaning device w21. Also, in the second liquid removal device 36, the cleaning liquid 7 contaminated by the first immersion/shower cleaning device 21 is completely removed, so that it does not mix into the second immersion/shower cleaning device 41. ing.
以上説明したように、この発明の第１の発明は、はんだ
付けを終了したプリン１一基板を搬送手段により搬送す
るとともに、洗浄液を含んだロールブランによりプリン
ト基板の下面を洗浄した後、加圧空気の吹き付けにより
プリント基板に付着した洗浄液を除去し、次いで、プリ
ンＩ・基板を下降させてから、プリント基板の走行方向
に対して反対方向と、プリント基板の走行方向に対して
交差する方向とにそれぞれ噴流する洗浄液の中にプリン
ト基板を浸漬して洗浄し、次いで、プリント基板を上昇
させるときに洗浄液を吹き付けてプリント基板の上面と
下面とを洗浄し、次いで、加圧空気の吹き付けによりプ
リント基板に付着した洗浄液を除去し、次いで、プリン
ト基板を熱風により乾燥した後、冷風により冷却を行う
ので、プリント基板の洗浄が完全に行われ、品質のよい
プリント基板が得られる利点がある。As explained above, the first aspect of the present invention is to transport the printed circuit board after soldering by the transport means, and after cleaning the lower surface of the printed circuit board with a roll blank containing a cleaning liquid, pressurize the printed circuit board. The cleaning liquid adhering to the printed circuit board is removed by blowing air, and then the printed circuit board is lowered, and then the cleaning liquid is removed in the opposite direction to the running direction of the printed circuit board and in the direction crossing the running direction of the printed circuit board. The printed circuit board is cleaned by immersing it in a cleaning solution that is jetted at each step.Then, when the printed circuit board is raised, the cleaning solution is sprayed to clean the top and bottom surfaces of the printed circuit board.Then, the printed circuit board is cleaned by spraying pressurized air. Since the cleaning liquid adhering to the substrate is removed, the printed circuit board is then dried with hot air, and then cooled with cold air, the printed circuit board is completely cleaned and there is an advantage that a high quality printed circuit board can be obtained.
また、この発明の第２の発明は、はんだ付けを終了した
プリント基板を搬送する搬送手段と；洗浄液を収容した
洗浄槽にプリント基板の下面を洗浄するロールブラシを
設けたブラシ洗浄装置と；プリント基板に付着した洗浄
液を加圧空気により除去する液除去装置と；プリント基
板の走行方向に対して反対方向と、プリント基板の走行
方向と交差する方向とにそれぞれ洗浄液を噴流する噴流
管を有し、これらの噴流管から噴流する洗浄液の中へプ
リント基板を下降させて洗浄を行う浸漬洗浄槽と、プリ
ント基板を上昇させるときにプリント基板の上面と下面
とに向けて洗浄液を噴出する噴出管を有し、これらの噴
出管から噴出する洗浄液により洗浄を行うシャワー洗浄
器とを設けた浸漬・シャワー洗浄装置と；プリント基板
に付着した洗浄液を熱風により乾燥する熱風乾燥装置と
；加熱されたプリント基板を冷風により冷却する冷却装
置；とをプリント基板の走行方向に対して順次備えたの
で、プリント基板に付着したフラックスや金属粉本等の
大きな汚れが次段の洗浄液に混入する乙とがないため、
プリント基板が洗浄されるごとにきれいな洗浄液で洗浄
されるので、プリント基板の汚れが完釜に除去されると
ともに、洗浄液の消前景が少なく経済的である等の利点
を有する。Further, a second aspect of the present invention provides a conveying means for conveying a printed circuit board after soldering; a brush cleaning device having a cleaning tank containing a cleaning liquid and a roll brush for cleaning the lower surface of the printed circuit board; A liquid removal device that uses pressurized air to remove the cleaning liquid adhering to the board; and a jet tube that jets the cleaning liquid in a direction opposite to the running direction of the printed circuit board and in a direction that intersects with the running direction of the printed board. , an immersion cleaning tank that cleans the printed circuit board by lowering it into the cleaning solution jetted from these jet tubes, and a jetting tube that sprays the cleaning solution toward the top and bottom surfaces of the printed circuit board when the printed circuit board is raised. an immersion/shower cleaning device that is equipped with a shower cleaning device that performs cleaning with cleaning liquid ejected from these jetting pipes; a hot air drying device that uses hot air to dry the cleaning liquid adhering to the printed circuit board; and a heated printed circuit board. A cooling device that uses cold air to cool the PCB is installed in sequence in the running direction of the printed circuit board, so large contaminants such as flux and metal powder attached to the printed circuit board do not get mixed into the next-stage cleaning solution. ,
Since the printed circuit board is cleaned with a clean cleaning liquid every time the printed circuit board is cleaned, dirt on the printed circuit board is completely removed, and there are advantages such as less waste of the cleaning liquid and economical performance.
第１図はこの発明の一実施例を示す概略構成図、第２図
（ａ）、（ｂ）は、第１図の第１の浸漬洗浄槽を示すも
ので、第２図（ａ）は平面図、第２図（ｂ）は、第２図
（ａ）のＩ−Ｉ線による断面図、第３図は洗浄液の流動
する系統を示す図である。
図中、１はプリント基板、１ａは上面、１ｂは下面、３
は搬送チェーン、４は洗浄装置、７は洗浄液、１１はブ
ラシ洗浄装置、１２は洗浄槽、１３はロールブラシ、１
７は第１の液除去装置、２１は第１の浸漬・シャワー洗
浄装置、２２は第１の浸漬洗浄槽、２３，２４，４３，
４１は噴流管、３２は第１のシャワー洗浄器、３３，３
４゜３５．５３，５４，５５は噴出管、３６は第２の液
除去装置、４１は第２の浸漬・シャワー洗浄装置、４２
は第２の浸漬洗浄槽、５２は第２のシャワー洗浄器、５
６は第３の液除去装置、５７は熱風乾燥装置、６０は冷
却器、６１は新液供給槽、６２は加熱器である。FIG. 1 is a schematic configuration diagram showing one embodiment of the present invention, FIGS. 2(a) and (b) show the first immersion cleaning tank in FIG. 1, and FIG. The plan view and FIG. 2(b) are a sectional view taken along the line II in FIG. 2(a), and FIG. 3 is a diagram showing a system in which the cleaning liquid flows. In the figure, 1 is a printed circuit board, 1a is the top surface, 1b is the bottom surface, 3
1 is a conveyance chain, 4 is a cleaning device, 7 is a cleaning liquid, 11 is a brush cleaning device, 12 is a cleaning tank, 13 is a roll brush, 1
7 is a first liquid removal device, 21 is a first immersion/shower cleaning device, 22 is a first immersion cleaning tank, 23, 24, 43,
41 is a jet pipe, 32 is a first shower cleaner, 33,3
4゜35. 53, 54, 55 are ejection pipes, 36 is a second liquid removal device, 41 is a second immersion/shower cleaning device, 42
5 is a second immersion cleaning tank, 52 is a second shower cleaning device, and 5 is a second immersion cleaning tank;
6 is a third liquid removing device, 57 is a hot air drying device, 60 is a cooler, 61 is a new liquid supply tank, and 62 is a heater.
Claims (2)
より搬送するとともに、洗浄液を含んだロールブラシに
より前記プリント基板の下面を洗浄した後、加圧空気の
吹き付けにより前記プリント基板に付着した洗浄液を除
去し、次いで、前記プリント基板を下降させてから、前
記プリント基板の走行方向に対して反対方向と、前記プ
リント基板の走行方向に対して交差する方向とにそれぞ
れ噴流する洗浄液の中に前記プリント基板を浸漬して洗
浄し、次いで、前記プリント基板を上昇させるときに洗
浄液を吹き付けて前記プリント基板の上面と下面とを洗
浄し、次いで、加圧空気の吹き付けにより前記プリント
基板に付着した洗浄液を除去し、次いで、前記プリント
基板を熱風により乾燥した後、冷風により冷却を行うこ
とを特徴とするプリント基板の洗浄方法。(1) After the printed circuit board that has been soldered is transported by a transport means and the bottom surface of the printed circuit board is cleaned with a roll brush containing cleaning liquid, the cleaning liquid attached to the printed circuit board is removed by blowing pressurized air. Then, after lowering the printed circuit board, the printed circuit board is placed in a cleaning liquid that is jetted in a direction opposite to the running direction of the printed circuit board and in a direction crossing the running direction of the printed circuit board. Then, when the printed circuit board is raised, a cleaning liquid is sprayed to clean the top and bottom surfaces of the printed circuit board, and the cleaning liquid adhering to the printed circuit board is removed by spraying pressurized air. and then, after drying the printed circuit board with hot air, the printed circuit board is cooled with cold air.
送手段と；洗浄液を収容した洗浄槽に前記プリント基板
の下面を洗浄するロールブラシを設けたブラシ洗浄装置
と；前記プリント基板に付着した洗浄液を加圧空気によ
り除去する液除去装置と；前記プリント基板の走行方向
に対して反対方向と、前記プリント基板の走行方向と交
差する方向とにそれぞれ洗浄液を噴流する噴流管を有し
、これらの噴流管から噴流する洗浄液の中へ前記プリン
ト基板を下降させて洗浄を行う浸漬洗浄槽と、前記プリ
ント基板を上昇させるときに前記プリント基板の上面と
下面とに向けて洗浄液を噴出する噴出管を有し、これら
の噴出管から噴出する洗浄液により洗浄を行うシャワー
洗浄器とを設けた浸漬・シャワー洗浄装置と；前記プリ
ント基板に付着した洗浄液を熱風により乾燥する熱風乾
燥装置と；前記加熱されたプリント基板を冷風により冷
却する冷却装置；とを前記プリント基板の走行方向に対
して順次備えたことを特徴とするプリント基板の洗浄を
行うプリント基板の洗浄装置。(2) A transport means for transporting the printed circuit board after soldering; a brush cleaning device having a cleaning tank containing a cleaning liquid and a roll brush for cleaning the lower surface of the printed circuit board; and a brush cleaning device for cleaning the cleaning liquid attached to the printed circuit board. a liquid removal device that removes with pressurized air; jet tubes that jet cleaning liquid in a direction opposite to the running direction of the printed circuit board and in a direction that intersects with the running direction of the printed circuit board, and these jets; It has an immersion cleaning tank that cleans the printed circuit board by lowering it into a cleaning solution jetted from a pipe, and a jetting pipe that sprays the cleaning solution toward the upper and lower surfaces of the printed circuit board when the printed circuit board is raised. and a shower washer that performs cleaning with the cleaning liquid spouted from these jetting pipes; a hot air drying device that dries the cleaning liquid adhering to the printed circuit board with hot air; and the heated printed circuit board. A cleaning device for a printed circuit board for cleaning a printed circuit board, comprising: a cooling device for cooling the circuit board with cold air; and a cooling device for cooling the circuit board with cold air.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13128789A JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13128789A JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02310989A true JPH02310989A (en) | 1990-12-26 |
| JPH0634444B2 JPH0634444B2 (en) | 1994-05-02 |
Family
ID=15054431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13128789A Expired - Lifetime JPH0634444B2 (en) | 1989-05-26 | 1989-05-26 | Printed circuit board cleaning method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634444B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06285440A (en) * | 1992-04-16 | 1994-10-11 | Seikosha Co Ltd | Cleaning and drying apparatus |
| JPH08841U (en) * | 1995-10-17 | 1996-05-21 | 株式会社精工舎 | Washing / drying device |
| CN102227157A (en) * | 2011-04-14 | 2011-10-26 | 北京泰拓精密清洗设备有限公司 | Hairbrush cleaning machine of through type |
-
1989
- 1989-05-26 JP JP13128789A patent/JPH0634444B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06285440A (en) * | 1992-04-16 | 1994-10-11 | Seikosha Co Ltd | Cleaning and drying apparatus |
| JPH08841U (en) * | 1995-10-17 | 1996-05-21 | 株式会社精工舎 | Washing / drying device |
| CN102227157A (en) * | 2011-04-14 | 2011-10-26 | 北京泰拓精密清洗设备有限公司 | Hairbrush cleaning machine of through type |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0634444B2 (en) | 1994-05-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |