JPH0230692A - Apparatus for pulling up semiconductor single crystal - Google Patents

Apparatus for pulling up semiconductor single crystal

Info

Publication number
JPH0230692A
JPH0230692A JP17937588A JP17937588A JPH0230692A JP H0230692 A JPH0230692 A JP H0230692A JP 17937588 A JP17937588 A JP 17937588A JP 17937588 A JP17937588 A JP 17937588A JP H0230692 A JPH0230692 A JP H0230692A
Authority
JP
Japan
Prior art keywords
supporting shaft
crucible
single crystal
heater
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17937588A
Other languages
Japanese (ja)
Inventor
Toshio Yasunaga
安永 壽夫
Takashi Fujii
高志 藤井
Joshi Nishio
譲司 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP17937588A priority Critical patent/JPH0230692A/en
Publication of JPH0230692A publication Critical patent/JPH0230692A/en
Pending legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Abstract

PURPOSE:To enable free control of the rotational speed of a crucible by combining a rotatable crucible, a heater, a uniform-temperature wall and a semiconductor single crystal pull-up means in such a manner as to exert a specific action. CONSTITUTION:Two coaxial supporting shafts are extended through an opening 12a. A cylindrical uniform-temperature wall 14 made of carbon or calcined BN is attached to the top end of the outside hollow 1st supporting shaft 13 interposing a space between a heater 12. The uniform-temperature wall 14 is provided with an opening 14a inside of the connection part of the 1st supporting shaft 13 and the inside 2nd supporting shaft 23 is extended through the opening 14a. A table 15 is attached to the top of the 2nd supporting shaft 23 extending through the opening 14a. The table 15 is kept from contact with the uniform-temperature wall 14. A rotation driving mechanism 16 for the 1st supporting shaft is placed below the 1st supporting shaft 13 and a rotation driving mechanism 26 for the 2nd supporting shaft is placed below the 2nd supporting shaft 23 and each supporting shaft is rotated at an independently selected rotational speed.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明は半導体材科学を製造するチョクラルスキ法(以
下Cz法と省略する)、あるいは液体カプセル法(Li
quid Encapusulated Czochr
alski法。
Detailed Description of the Invention [Objective of the Invention] (Field of Industrial Application) The present invention is directed to the Czochralski method (hereinafter abbreviated as Cz method) or the liquid capsule method (Li
Quid Encapsulated Czochr
alski method.

以下LEC法と省略する)による半導体単結晶引上げ装
置に関する。
The present invention relates to a semiconductor single crystal pulling device using the LEC method (hereinafter abbreviated as LEC method).

(従来の技術) 従来のCz法、あるいはLEC法によるGaAS単結晶
引上げ装置のホット・ゾーンの構造を第2図に断面図で
示す。第2図において、101は半導体材料を収容し熔
融するるつぼで熱処理の施されたボロンナイトライドで
形成されている。
(Prior Art) The structure of the hot zone of a GaAS single crystal pulling apparatus using the conventional Cz method or LEC method is shown in cross section in FIG. In FIG. 2, reference numeral 101 is a crucible for storing and melting semiconductor material, and is made of heat-treated boron nitride.

このるつぼ101は、その側面と一部底面に対向し、か
つカーボンで形成されたヒータ102の中心に配置され
ている。また、上記るつぼ101は、前記ヒータ102
の底部中心の開口102aを貫通して設けられている支
持軸103の上端に、カーボンまたは窒化はうぞ(BN
)等で形成されたテーブル104と均温壁部105との
組立体に内装されている。
This crucible 101 is disposed at the center of a heater 102 made of carbon, with its side surfaces and a portion of its bottom facing each other. Further, the crucible 101 has the heater 102
There is a carbon or nitride groove (BN
), etc., and is housed in an assembly of a table 104 and a temperature-uniforming wall 105.

ヒータ102に電流を流して発熱させ、同等に回転駆動
橢構106により上記支持軸103を回転駆動させると
、テーブル104、均温壁部105.およびるつぼ10
1を一体に回転する。上記回転軸103は、例として5
ppm程度の回転が与えられる。なお、上記るつぼ10
1の上方には、種結晶体107を下端に装着しこのるつ
ぼ101と回軸かつ等速回転する単結晶引上げ軸108
が配置され、この単結晶引上軸108は所定速度で引上
げられて単結晶半導体が製造される。
When a current is applied to the heater 102 to generate heat and the support shaft 103 is similarly driven to rotate by the rotary drive structure 106, the table 104, the temperature-uniforming wall 105. and crucible 10
Rotate 1 as one unit. The rotating shaft 103 is, for example, 5
Rotation on the order of ppm is given. In addition, the above crucible 10
Above the crucible 101 is a single crystal pulling shaft 108 which has a seed crystal body 107 attached to its lower end and rotates at the same speed as the crucible 101.
is arranged, and this single crystal pulling shaft 108 is pulled up at a predetermined speed to manufacture a single crystal semiconductor.

(発明が解決しようとする課題) 叙上の従来の単結晶引上げ装置におけるホットゾーンの
構造で、ヒータの温度むら、特にるつぼの側壁に沿う方
向の温度むらに対しては、組立体の回転速度を上げるこ
とが均温化に有効であるが、一方で、るつぼ内の半導体
融液に強制印加される力が増大して融液流動などが生じ
得られる単結晶の特性に問題を生ずる。
(Problem to be Solved by the Invention) In the structure of the hot zone in the conventional single crystal pulling apparatus described above, the rotational speed of the assembly is Although increasing the temperature is effective for temperature equalization, on the other hand, the force forcefully applied to the semiconductor melt in the crucible increases, causing problems with the properties of the single crystal, which may cause melt flow.

本発明は叙上の従来の装置における問題点に鑑み、るつ
ぼの回数を自在に制御できるように改良されたCz法、
あるいはLEC法による単結晶引上げ装置を提供するこ
とを目的とするものである。
In view of the problems with the conventional apparatus described above, the present invention provides a Cz method that is improved so that the number of crucibles can be freely controlled.
Alternatively, it is an object of the present invention to provide a single crystal pulling device using the LEC method.

[発明の構成] (課題を解決するための手段) 本発明の半導体単結晶引上げ装置は、半導体材料を溶融
して収容する回転可能なるつぼと、前記るつぼを離隔し
て包囲し加熱するヒータと、前記ヒータと前記るつぼと
の間にこれらのいずれとも非接触に設けられ、るつぼと
別個に回転駆動される均温壁体と、前記るつぼから半導
体単結晶を引上げる半導体単結晶の引上げ手段とを具備
したものである。
[Structure of the Invention] (Means for Solving the Problems) A semiconductor single crystal pulling apparatus of the present invention includes a rotatable crucible for melting and storing a semiconductor material, and a heater for separately surrounding and heating the crucible. , a constant temperature wall body provided between the heater and the crucible in a non-contact manner and rotated separately from the crucible; and a semiconductor single crystal pulling means for pulling the semiconductor single crystal from the crucible. It is equipped with the following.

(作 用) 上述の構造によってテーブルと均温壁体を自由な回転数
を選定して回転させることができ、ヒータの発熱分布の
不均一を解消しるつぼの充分な均温が得られる。また、
るつぼは結晶成長に最も有利な回転数を選定して回転さ
せることができ、結晶性の向上が達成される。
(Function) With the above-described structure, the table and the temperature-uniforming wall can be rotated at a freely selected rotation speed, and sufficient temperature uniformity of the crucible can be obtained to eliminate unevenness in the heat generation distribution of the heater. Also,
The crucible can be rotated by selecting the most advantageous rotation speed for crystal growth, thereby achieving improved crystallinity.

(実施例) 以下、本発明の一実施例につき第1図を参照して説明す
る。第1図は一実施例の半導体単結晶引上げ装置のホッ
トゾーンを断面図で示す。カーボン製のるつは11は半
導体材料を収容し溶融するもので、例えば半導体として
(3a ASを対象にしている。このるつぼ11は炉の
中心に配置され、カーボンで形成されたヒータ12で包
囲している。そして、るつぼ11に内装された一例のQ
a ASをその融点のほぼ1300℃に加熱する。
(Example) An example of the present invention will be described below with reference to FIG. FIG. 1 shows a cross-sectional view of a hot zone of an apparatus for pulling a semiconductor single crystal according to an embodiment. A carbon crucible 11 is used to store and melt a semiconductor material, for example, a semiconductor (3a AS). This crucible 11 is placed in the center of the furnace and is surrounded by a heater 12 made of carbon. And, an example of Q installed inside crucible 11
a. Heat the AS to approximately its melting point of 1300°C.

このヒータ12は外部から加熱電流が供給されるもので
、板状抵抗体を蛇行配列し、円筒面状に形成している。
This heater 12 is supplied with a heating current from the outside, and is formed into a cylindrical shape with plate-shaped resistors arranged in a meandering manner.

そして前記るつぼ11の側面および底面とある間隔有し
て離隔対向し、下面の中央に開口12aが設けられる。
An opening 12a is provided at the center of the lower surface of the crucible 11, facing the side and bottom surfaces of the crucible 11 at a certain distance.

この開口12aに同軸になる2本の支持軸が貫通して設
けられ、その外側にある中空の第1支持軸13はその上
端にヒータ12と非接触にカーボンまたは、焼成りNで
形成された筒状均温壁体14が取着され、ざらに、この
均温壁体14は第1支持軸13との接続部の内方に内側
の第2支持軸23を貫通させる開口14aが設けられて
いる。そして、上記開口14aを貫通した第2支持軸2
3の上端にテーブル15が上記均温壁体14と非接触に
取着され、この上にるつぼ11が上記均温壁体14と非
接触に取着されている。次に、上記第1支持軸13には
下部に第1支持軸回転駆動機構16が、また、第2支持
軸23には下部に第2支持軸回転駆動機構26が夫々設
けられており、各々に自由な回転数を選定して回転させ
るものである。なお、−例として上記第1支持軸13の
回転速度を5 r pmに、また上記第2支持軸23の
回転速度を2Orpmでかつ、第1支持軸13の回転と
同方向または逆方向に回転駆動して良好な結果が得られ
た。
Two coaxial support shafts are provided penetrating through this opening 12a, and a hollow first support shaft 13 on the outside thereof is formed of carbon or fired N at its upper end without contacting the heater 12. A cylindrical temperature-uniforming wall body 14 is attached, and the temperature-uniforming wall body 14 is provided with an opening 14a on the inner side of the connecting portion with the first support shaft 13, through which the inner second support shaft 23 passes. ing. The second support shaft 2 passes through the opening 14a.
A table 15 is attached to the upper end of the table 15 without contacting the temperature-uniforming wall 14, and a crucible 11 is attached thereon without contacting the temperature-uniforming wall 14. Next, the first support shaft 13 is provided with a first support shaft rotation drive mechanism 16 at the bottom, and the second support shaft 23 is provided with a second support shaft rotation drive mechanism 26 at the bottom, respectively. The rotation speed can be freely selected and rotated. As an example, the rotation speed of the first support shaft 13 is 5 rpm, and the rotation speed of the second support shaft 23 is 2 Orpm, and the rotation speed is the same as that of the first support shaft 13 or the opposite direction. Good results were obtained with the drive.

[発明の効果] 本発明にかかる半導体単結晶引上げ装置によれば、るつ
ぼとヒータの間にこれらのいずれにも非接触で、かつ、
充分速い回転数で回転する均温壁体を設けることにより
、ヒータの発熱分布の不均一を解消し、円周方向の均温
が充分良好となり、良質な単結晶引上げが達成される。
[Effects of the Invention] According to the semiconductor single crystal pulling apparatus according to the present invention, there is no contact between the crucible and the heater, and
By providing a temperature-uniform wall that rotates at a sufficiently high rotational speed, non-uniform distribution of heat generation from the heater is eliminated, temperature uniformity in the circumferential direction is sufficiently improved, and high-quality single crystal pulling is achieved.

一方、るつぼは均温壁体の回転と無関係であるため、結
晶成長に最も適した回転数を選定し回転させることがで
きる利点もある。
On the other hand, since the crucible is unrelated to the rotation of the isothermal wall, it has the advantage of being able to select and rotate the crucible at the most suitable rotation speed for crystal growth.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例の半導体単結晶引上げ装置に
おけるホットゾーンの断面図、第2図は従来例の半導体
単結晶引上げ装置におけるホットゾーンの断面図でおる
。 11・・・るつぼ 12・・・ヒータ 14・・・均温壁体 13・・・第1支持軸 23・・・第2支持軸
FIG. 1 is a sectional view of a hot zone in a semiconductor single crystal pulling apparatus according to an embodiment of the present invention, and FIG. 2 is a sectional view of a hot zone in a conventional semiconductor single crystal pulling apparatus. 11... Crucible 12... Heater 14... Unitemperature wall body 13... First support shaft 23... Second support shaft

Claims (1)

【特許請求の範囲】[Claims]  半導体材料を溶融して収容する回転可能なるつぼと、
前期るつぼを離隔して包囲し加熱するヒータと、前記ヒ
ータと前記るつぼとの間にこれらのいずれとも非接触に
設けられ、るつぼと別個に回転駆動される均温壁体と、
前記るつぼから半導体単結晶を引上げる半導体単結晶の
引上げ手段とを具備したことを特徴とする半導体単結晶
引上げ装置。
a rotatable crucible for melting and containing semiconductor material;
a heater that surrounds and heats the crucible at a distance; a constant temperature wall that is provided between the heater and the crucible in a non-contact manner and is rotationally driven separately from the crucible;
A semiconductor single crystal pulling apparatus comprising: a semiconductor single crystal pulling means for pulling the semiconductor single crystal from the crucible.
JP17937588A 1988-07-19 1988-07-19 Apparatus for pulling up semiconductor single crystal Pending JPH0230692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17937588A JPH0230692A (en) 1988-07-19 1988-07-19 Apparatus for pulling up semiconductor single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17937588A JPH0230692A (en) 1988-07-19 1988-07-19 Apparatus for pulling up semiconductor single crystal

Publications (1)

Publication Number Publication Date
JPH0230692A true JPH0230692A (en) 1990-02-01

Family

ID=16064757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17937588A Pending JPH0230692A (en) 1988-07-19 1988-07-19 Apparatus for pulling up semiconductor single crystal

Country Status (1)

Country Link
JP (1) JPH0230692A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103160932A (en) * 2011-12-18 2013-06-19 洛阳金诺机械工程有限公司 Uniform heating device of crucible when crystal materials are machined and method thereof
CN103160933A (en) * 2011-12-18 2013-06-19 洛阳金诺机械工程有限公司 Temperature equilibrium device of crucible when crystal materials are machined and method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103160932A (en) * 2011-12-18 2013-06-19 洛阳金诺机械工程有限公司 Uniform heating device of crucible when crystal materials are machined and method thereof
CN103160933A (en) * 2011-12-18 2013-06-19 洛阳金诺机械工程有限公司 Temperature equilibrium device of crucible when crystal materials are machined and method thereof

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