JPH02304829A - Temperature fuse - Google Patents
Temperature fuseInfo
- Publication number
- JPH02304829A JPH02304829A JP1124386A JP12438689A JPH02304829A JP H02304829 A JPH02304829 A JP H02304829A JP 1124386 A JP1124386 A JP 1124386A JP 12438689 A JP12438689 A JP 12438689A JP H02304829 A JPH02304829 A JP H02304829A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- circuit
- thickness
- temperature
- end parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 19
- 239000000155 melt Substances 0.000 claims abstract description 8
- 230000004907 flux Effects 0.000 claims description 8
- 210000003298 dental enamel Anatomy 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 238000010304 firing Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 abstract description 12
- 238000002844 melting Methods 0.000 abstract description 12
- 229910000679 solder Inorganic materials 0.000 description 15
- 239000006071 cream Substances 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、昇温による回路の遮断動作を確実にした温度
ヒユーズに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a temperature fuse that ensures circuit breakage due to temperature rise.
本発明の温度ヒユーズは、例えば自動車用送風制御装置
に用いられる抵抗回路基板で、ファンモータへの印加電
圧を変化させ送風量を制御するフラット型抵抗基板に取
り付けられ、基板の温度が許容値を越えて上昇したとき
溶断して回路を遮断し装置の破損を未然に防止するもの
である。前記抵抗基板は、鋼板等のコア材の表面にホウ
ロウ層を焼成させたホウロウ基板で、適当な値の電気抵
抗を持つ厚膜ペースト（Ａｇ−Ｐｄ系など）を表面に印
刷・焼成して回路導体を形成し、抵抗基板として使用す
るものである。温度ヒユーズは、この回路導体の途中に
設けた不連続部分の端部間に仮ハンダや糸ハンダを取り
付けたり、あるいは低融点金属の金属ペーストをスクリ
ーン印刷等でこの端部間に塗布・加熱して形成しである
。The temperature fuse of the present invention is a resistor circuit board used in, for example, an automotive air blower control device, and is attached to a flat resistor board that changes the voltage applied to a fan motor to control the amount of air blown. When it rises above the limit, it melts and cuts off the circuit, preventing damage to the equipment. The resistance board is an enamel board with an enamel layer baked on the surface of a core material such as a steel plate, and a thick film paste (Ag-Pd type, etc.) having an appropriate electrical resistance is printed and baked on the surface to form a circuit. It forms a conductor and is used as a resistance substrate. Temperature fuses can be made by attaching temporary solder or thread solder between the ends of a discontinuous part provided in the middle of this circuit conductor, or by applying and heating a metal paste of a low melting point metal between the ends by screen printing, etc. It is formed.
しかしながら、糸ハンダは適当な長さに切断したものを
端部間に載せ、こてを当てて端部上のハンダを溶解させ
て端部間を連結することから、使用するハンダの量が多
くなり、温度上昇時に溶融しても大きな一つの液状の塊
となって端部を連結させたままでいることがあった。し
たがって、回路が遮断されず所定の温度で作動するべき
ヒユーズの働きをしないことがあった。又、スクリーン
印刷等によりヒユーズを形成した場合には、かかる点を
改善するためヒユーズの厚さを０．１ｍｍ〜１．０ｍｍ
とした発明が本出願人より出願されている（特願昭６３
−２５２１１０号）。ところが、端部の形状や端部間の
間隔によっては、作動温度にばらつきが生じたり、ヒユ
ーズが溶融しても両端部に分離せず回路が遮断されない
という問題点があった。However, since thread solder is cut to an appropriate length and placed between the ends, a trowel is applied to melt the solder on the ends and connect the ends, so a large amount of solder is used. Even if it melts when the temperature rises, it sometimes forms into one large liquid mass and the ends remain connected. Therefore, the circuit may not be interrupted and the fuse may not function as it should at a predetermined temperature. In addition, when the fuse is formed by screen printing or the like, the thickness of the fuse may be adjusted to 0.1 mm to 1.0 mm to improve this problem.
This invention has been filed by the present applicant (Japanese Patent Application No. 1983)
-252110). However, depending on the shape of the ends and the spacing between the ends, there are problems in that the operating temperature varies, and even if the fuse melts, it does not separate into both ends and the circuit is not interrupted.
又、回路基板を傾斜させて取り付けるときには下方の端
部側にヒユーズが多く溜まることとなるが、このとき十
分に保持できず、保持しきれなかったヒユーズが他方の
端部に接して回路が遮断されないことがあった。更に、
ヒユーズの表面が酸化された状態にあると、溶融ヒユー
ズが良好に凝集されず確実な回路の遮断が得られないと
いう問題点があった。Also, when installing a circuit board at an angle, many fuses will accumulate on the lower edge side, but in this case, the fuses that cannot be held in place may come into contact with the other edge, breaking the circuit. Sometimes it wasn't done. Furthermore,
When the surface of the fuse is in an oxidized state, there is a problem in that the molten fuse is not well aggregated and the circuit cannot be reliably interrupted.
本発明は、上記問題点を解決するため次のようにした。 The present invention has been made as follows to solve the above problems.
すなわち、ヒユーズの厚さをを０．１ｍｉ〜１．０＋ｎ
ｒ＠とし、ヒユーズと接する回路上の導体の端部の長さ
、幅、及び両端部の間隔を前記厚さをの２倍以上とした
のである。又、傾斜した基板においては、下方の端部を
上方の端部より幅を広くし面積を拡大させた。更に、ク
リームハンダなどを溶融した原生じる表面のフラックス
を洗浄等により除去せずにおくこととした。In other words, the thickness of the fuse should be 0.1 mi to 1.0+n.
r@, and the length and width of the end of the conductor on the circuit in contact with the fuse, as well as the spacing between both ends, were made to be more than twice the above thickness. Furthermore, in the case of an inclined substrate, the lower end is made wider than the upper end to increase the area. Furthermore, it was decided not to remove the flux on the surface caused by melting cream solder or the like by cleaning or the like.
ヒユーズがヒユーズの溶融温度以上に加熱されると、溶
融すると同時に表面張力が働きそれぞれの端部の上に分
離して凝集し回路が確実に遮断される。又、下方の端部
に、溶融したヒユーズが保持されて端部間にヒユーズが
残存せず回路が確実に遮断される。更に、フラックスに
よりヒユーズの酸化が防止され耐久性が向上し、かつ溶
融時の凝集が容易になり作動が確実になる。 ・〔
実施例〕
以下、本発明にかかる温度ヒユーズの実施例について述
べる。When the fuse is heated above the melting temperature of the fuse, it melts and at the same time, surface tension acts to separate and condense on each end, ensuring that the circuit is interrupted. Further, the melted fuse is held at the lower end, so that no fuse remains between the ends, and the circuit is reliably interrupted. Furthermore, the flux prevents oxidation of the fuse, improving durability, and facilitates agglomeration during melting, ensuring reliable operation.・〔
Examples] Examples of the temperature fuse according to the present invention will be described below.
温度ヒユーズを取付ける基板は、鋼板製のコア材を中心
にホウロウ層を周囲に焼成したもので、このホウロウ層
の表面に導体ペーストを印刷・焼成して抵抗回路が形成
しである。導体ペーストは、Ａｇ−Ｐｄなどからなる適
当な電気抵抗値を持つものを用い、スクリーン印刷など
により回路基板上に印刷した後焼成して回路を形成する
。ヒユーズは、回路基板の上に適宜な位置を少なくとも
１ケ所設定して設けてあり、回路導体を切断する切り欠
き上にその切り欠きを跨いで回路導体の端部間を連続さ
せるように印刷形成しである。ヒユーズは例えば鉛、す
ず、銀、インジウム、アンチモン、ビスマスなどを成分
とする合金であり、自動車用送風機などこの回路基板を
取り付ける電気器具の許容温度に融点か設定しである。The board to which the temperature fuse is attached is made of a core made of steel with a fired enamel layer around it, and a resistor circuit is formed by printing and firing a conductive paste on the surface of this enamel layer. The conductor paste is made of Ag-Pd or the like and has an appropriate electrical resistance value, and is printed on the circuit board by screen printing or the like and then fired to form a circuit. The fuse is provided in at least one appropriate position on the circuit board, and is printed on a notch for cutting the circuit conductor so as to straddle the notch and connect the ends of the circuit conductor. It is. The fuse is an alloy containing lead, tin, silver, indium, antimony, bismuth, etc., and its melting point is set to the allowable temperature of electrical appliances such as automobile blowers to which this circuit board is installed.
具体的には、ヒユーズの厚さｔは、０．１ｍｍ〜１．Ｏ
ｎ＋ｎ＋の範囲内のいずれかの値に設定してあり、又ヒ
ユーズと接する回路導体の端部は、長さ幅共にこの厚さ
をの値の２倍以上で、かつ端部どうじの間隔もｔの値の
２倍以上離しである。このようにしてヒユーズを形成し
たことにより、器具の温度が上昇しヒユーズが溶融した
ときには、ヒユーズが表面張力の働きにより凝集し、し
かもヒユーズの溶融量に比べ両端部の面積が広くかつ端
部間に充分な間隔が設けられていることから、両方の端
部上にヒユーズが分離して載り回路が確実に遮断される
。又、回路基板が傾斜、あるいは垂直など水平以外の形
で器具に取り付けられるときには、上記条件を満たした
上で更に両端部のうち下方の端部を上方のものより幅を
広くし面積を大きく形成する。このようにしてヒユーズ
を形成すると、溶融したヒュ−ズが下方に下がった際そ
れを下方の端部上に保持でき、端部間にヒユーズが残存
することがなく、回路が確実に遮断される。Specifically, the thickness t of the fuse is 0.1 mm to 1. O
It is set to any value within the range of n+n+, and the end of the circuit conductor in contact with the fuse has a length and width that are at least twice the thickness of this value, and the distance between the ends is also t. They are separated by more than twice the value of . By forming the fuse in this way, when the temperature of the instrument rises and the fuse melts, the fuse aggregates due to the action of surface tension, and the area of both ends is large compared to the amount of melting of the fuse, and the area between the ends is large. Sufficient spacing is provided between the two ends to ensure that the fuses are placed separately on both ends and the circuit is interrupted. Additionally, when the circuit board is installed in a device in a non-horizontal manner, such as at an angle or vertically, the lower end of both ends should be made wider than the upper end to create a larger area after satisfying the above conditions. do. Forming the fuse in this way allows the melted fuse to be held on the lower end as it descends, ensuring that no fuse remains between the ends and the circuit is reliably broken. .
更にクリームハンダを用いた際、ヒユーズ形成後クリー
ムハンダに含まれるフラックスが表面に残るので、これ
を洗浄除去せずにそのまま残しておく。すると、表面の
フラックスによりヒユーズ表面の酸化が防止されかつ溶
融時に凝集し易くなる。それゆえ、ヒユーズの耐久性が
向上しかつ確実な作動が得られる。尚、端部はＡｇ−Ｐ
ｄ等からなる導体自身であってよいが、ハンダぬれ性
が悪い導体を用いる場合などには端部をＡｇやＣｕなど
ハンダぬれ性のよい材料で形成するのが望ましい。更に
、第３図に示すように端部１０は上記条件を満たせば同
図（ａ）に示すように導体８と同一幅でなく、同図（ｂ
）に示すように広くしたり、また同図（ｃ）に示すよう
に狭くともよい。Furthermore, when cream solder is used, the flux contained in the cream solder remains on the surface after the fuse is formed, so this is left as is without being washed away. Then, the flux on the surface prevents oxidation of the fuse surface and facilitates agglomeration during melting. Therefore, the durability of the fuse is improved and reliable operation can be obtained. In addition, the end part is Ag-P
The conductor itself may be made of d or the like, but if a conductor with poor solder wettability is used, it is desirable to form the end portion with a material with good solder wettability such as Ag or Cu. Furthermore, as shown in FIG. 3, if the above conditions are met, the end portion 10 will not have the same width as the conductor 8 as shown in FIG.
It may be wide as shown in ) or narrow as shown in (c) of the same figure.
次に、上記例について行った実験の結果について述べる
。Next, the results of experiments conducted on the above example will be described.
（実験例１）
Ａｇ−Ｐｄ厚膜を第１図に示すようにホウロウ基板６上
に印刷・焼成して幅（Ｗ）２ｍｍの導体８の回路を形成
した。これに間隔（Ｇ）２ｍｍの隙間を設け、ここにク
リームハンダ（Ｓｎ−Ｐｂ共品ハンダ：溶融温度１８３
℃）を厚さ０．３ｍｍのメタルマスクを使用して塗布し
た。塗布は、端部４が長さくＬ）２ｍｍとなるように、
すなわち導体８とクリームハンダとが２ ｍｒ６重なる
ように全体で長さが６ ｍ＋＊となるように行い、これ
を加熱溶融して厚さ０．２順のヒユーズ２を形成した。(Experimental Example 1) As shown in FIG. 1, an Ag--Pd thick film was printed and fired on an enamel substrate 6 to form a circuit of a conductor 8 having a width (W) of 2 mm. A gap (G) of 2 mm is provided between these, and cream solder (Sn-Pb solder: melting temperature 183
℃) was applied using a metal mask with a thickness of 0.3 mm. Apply so that the length of the end 4 is L) 2 mm.
That is, the conductor 8 and the cream solder were overlapped by 2 mr6 so that the total length was 6 m+*, and this was heated and melted to form the fuse 2 having a thickness of 0.2 m.
ヒユーズ２の表面は洗浄せず、フラックスで覆われたま
まにして、かかるヒユーズ２を１００枚の基板に１ケ所
ずつ計１００ケ所に作製した。実験は、回路基板全体を
毎分１０℃の上昇率で加熱して行った。The surface of the fuse 2 was not cleaned and was left covered with flux, and a total of 100 such fuses 2 were fabricated, one on each of 100 substrates. The experiment was conducted by heating the entire circuit board at a rate of increase of 10° C. per minute.
すると、１８３℃に至った時点で一部のヒユーズ２が溶
融し始め、そして最初の溶融が開始されてから１０秒経
過後には全てのヒユーズ２が溶融され溶融されたヒユー
ズ２が両端部に分離して回路が確実に遮断された。Then, some of the fuses 2 begin to melt when the temperature reaches 183°C, and 10 seconds after the first melting starts, all the fuses 2 are melted and the fused fuses 2 are separated into both ends. The circuit was definitely cut off.
（実験例２）
第２図に示すようにホウロウ基板６の上に上記実験例１
と同様にして導体８を幅１．０ｍｍで形成し、ここに少
なくとも１６０關の間隔の隙間を設ける。この隙間の端
部の一方に長さくＬｌ）幅（Ｗｌ）共に２．０＋ｎ＋ｅ
のＡｇからなる第１ヒユーズベース３を形成し、他方に
は第１ヒユーズベース３から間隔（Ｇ）を１，０關設け
て幅（Ｗ２）１．０ｍｍ、長さくＬ２ ）１．０ｍ＋ｓ
の第２ヒユーズベース５を形成する。これら第１ヒユー
ズベース３及び第２ヒユーズベース５上にクリームハン
ダ（Ｓ ｎ−Ｐ ｂ共晶ハンダ溶融温度１８３℃）を厚
さ０．１５ｍｍのメタルマスクを使用して当該第１ヒユ
ーズベース３及び第２ヒユーズベース５を覆うように印
刷し、印刷後これを加熱溶融させて厚さ０．１ｍｍのヒ
ユーズ２を形成した。加熱によって生じた表面のフラッ
クスは洗浄せず、付着させておく。このようなヒユーズ
２を１００枚の回路基板に１ケ所ずつ計１００ケ所に作
製して、作動実験を行った。実験は、回路基板を前記第
１ヒユーズベース３の側を下方にした４５°傾けた状態
で全体を毎分１０℃の上昇率で加熱した。すると、１８
３℃に至った時点で一部のヒユーズ２が溶融し始め、溶
融が開始されてから５秒以内に全てのヒユーズ２が溶融
された。そして溶融したヒユーズ２は主に下方の第１ヒ
ユーズベース３上に溜まり第１ヒユーズベース３と第２
ヒユーズベース５の間には残留せず、回路が確実に遮断
されたことが確認できた。(Experiment Example 2) As shown in FIG. 2, the above Experiment Example 1 was placed on the enamel substrate 6.
Conductor 8 is formed to have a width of 1.0 mm in the same manner as above, and a gap of at least 160 mm is provided here. At one end of this gap, the length (Ll) and the width (Wl) are both 2.0+n+e.
A first fuse base 3 made of Ag is formed, and the other side is provided with a distance (G) of 1.0 mm from the first fuse base 3, and has a width (W2) of 1.0 mm and a length L2) of 1.0 m+s.
A second fuse base 5 is formed. Apply cream solder (S n-P b eutectic solder melting temperature 183°C) onto these first fuse base 3 and second fuse base 5 using a metal mask with a thickness of 0.15 mm. It was printed so as to cover the second fuse base 5, and after printing, it was heated and melted to form a fuse 2 with a thickness of 0.1 mm. The flux generated on the surface due to heating is not cleaned, but is allowed to adhere. The fuses 2 were fabricated at a total of 100 locations, one on each of 100 circuit boards, and an operation experiment was conducted. In the experiment, the circuit board was heated at a rate of increase of 10° C. per minute while the circuit board was tilted at 45 degrees with the first fuse base 3 side facing downward. Then, 18
When the temperature reached 3° C., some of the fuses 2 began to melt, and all the fuses 2 were melted within 5 seconds from the start of melting. The melted fuse 2 mainly accumulates on the lower first fuse base 3 and the first fuse base 3 and second fuse base 3.
No residue remained between the fuse bases 5, and it was confirmed that the circuit was reliably interrupted.
以上述べたように、本発明のヒユーズによれば、ヒユー
ズの厚さをを０．１ｍｍ〜１．０ｍｍとした上で、導体
回路のヒユーズ端部を幅・長さ共前記厚さをの２倍以上
とし、且つ端部間の間隔を当該厚さをの２倍以上とした
ので、器具の許容温度以上に雰囲気温度が上昇しヒユー
ズが溶融したとき、溶融したヒユーズが両端部上に分散
し確実に回路の遮断が行われる。又、傾斜や垂直など水
平以外の形で配置される回路基板において、下方に置か
れる端部の面積を上方の端部のものより拡大させたこと
により、溶融ヒユーズが下方の端部に流れ保持されてヒ
ユーズが分離され、回路の遮断が確実に行われる。更に
、上記ヒユーズ表面に付着したフラックスを洗浄せず残
存させたことから、ヒユーズの酸化を防止して耐久性を
向上でき、かつヒユーズ溶融時に凝集しやすくなり確実
な作動を得ることができる。As described above, according to the fuse of the present invention, the thickness of the fuse is set to 0.1 mm to 1.0 mm, and the width and length of the fuse end of the conductor circuit are set to 2 mm. Because the thickness is more than double that of the thickness, and the distance between the ends is more than twice the thickness, when the ambient temperature rises above the allowable temperature of the device and the fuse melts, the melted fuse is dispersed over both ends. The circuit is reliably cut off. In addition, for circuit boards that are arranged in a non-horizontal manner, such as at an angle or vertically, by making the area of the lower edge larger than that of the upper edge, the melted fuse flows to the lower edge and is retained. This isolates the fuse and ensures that the circuit is disconnected. Furthermore, since the flux adhering to the surface of the fuse is left unwashed, it is possible to prevent the fuse from oxidation and improve its durability, and the fuse is more likely to aggregate when melted, resulting in reliable operation.
第１図は本発明にかかるヒユーズの一実施例を示す斜視
図、
第２図は本発明にかかるヒユーズの他の実施例を示す斜
視図、
第３図は本発明にかかるヒユーズの他の実施例を示す平
面図である。
図面中
２・・・ヒユーズ、３・・・第１ヒユーズベース。
４．１０・・・端部、５・・・第２ヒユーズベース６・
・・ホウａつ基板、８・・−導体。
第 ３ 図FIG. 1 is a perspective view showing one embodiment of the fuse according to the invention, FIG. 2 is a perspective view showing another embodiment of the fuse according to the invention, and FIG. 3 is another embodiment of the fuse according to the invention. FIG. 3 is a plan view showing an example. In the drawing, 2...fuse, 3...1st fuse base. 4.10... End part, 5... Second fuse base 6.
...Golden board, 8...-conductor. Figure 3
Claims (1)
連続部分を有する抵抗回路導体を形成し、当該不連続部
分に設けられこの不連続部分の端部間を電気的に接続す
るとともに所定温度において溶融し前記抵抗回路を遮断
する温度ヒューズにおいて、該温度ヒューズの厚さをを
０．１ｍｍ〜１．０ｍｍとし、該温度ヒューズを取り付
ける端部の幅、長さ及び端部間の間隔を前記厚さをの２
倍以上とした温度ヒューズ。 ２、水平以外の状態で使用される請求項第１項記載の温
度ヒューズにおいて、前記端部のうち下方に位置する端
部を上方の端部より幅を広げ面積を拡大させた温度ヒュ
ーズ。 ３、温度ヒューズ形成後、表面のフラックスを除去しな
いこととした請求項第１項記載および請求項第２項記載
の温度ヒューズ。[Claims] 1. A resistive circuit conductor having a discontinuous portion is formed by applying and firing a metal paste on an enamel substrate, and an electric conductor is provided in the discontinuous portion and connected between the ends of the discontinuous portion. In a thermal fuse that is connected to a circuit and melts at a predetermined temperature to interrupt the resistance circuit, the thickness of the thermal fuse is 0.1 mm to 1.0 mm, and the width, length, and end of the end to which the thermal fuse is attached are determined. The distance between the parts is 2 of the above thickness.
Temperature fuse more than doubled. 2. The thermal fuse according to claim 1, which is used in a state other than horizontal, in which the lower end of the end portions is made wider than the upper end to increase the area. 3. The thermal fuse according to claim 1 and claim 2, wherein the flux on the surface is not removed after the thermal fuse is formed.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1124386A JPH0656734B2 (en) | 1989-05-19 | 1989-05-19 | Thermal fuse |
| ES89310180T ES2130112T3 (en) | 1988-10-07 | 1989-10-05 | FLAT RESISTOR FOR A VEHICLE AIR CONDITIONER BLOWER CONTROL UNIT AND A CONTROL UNIT USED. |
| EP89310180A EP0363191B1 (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| US07/417,571 US5000662A (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner |
| DE68928918T DE68928918T2 (en) | 1988-10-07 | 1989-10-05 | Flat resistor for blower control unit of an automotive air conditioner and blower control unit |
| CA 2000290 CA2000290C (en) | 1988-10-07 | 1989-10-06 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| KR1019890014406A KR950006465B1 (en) | 1988-10-07 | 1989-10-06 | Flat resistance fo rblower control unit of automobile air conditioner |
| US07/636,901 US5192940A (en) | 1988-10-07 | 1990-12-31 | Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same |
| KR1019940026026A KR950006464B1 (en) | 1988-10-07 | 1994-10-20 | Blower control unit for automobile air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1124386A JPH0656734B2 (en) | 1989-05-19 | 1989-05-19 | Thermal fuse |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02304829A true JPH02304829A (en) | 1990-12-18 |
| JPH0656734B2 JPH0656734B2 (en) | 1994-07-27 |
Family
ID=14884126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1124386A Expired - Fee Related JPH0656734B2 (en) | 1988-10-07 | 1989-05-19 | Thermal fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0656734B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0510900A2 (en) * | 1991-04-26 | 1992-10-28 | AT&T Corp. | Wetting-based breakable links |
| WO2017126450A1 (en) * | 2016-01-18 | 2017-07-27 | 株式会社オートネットワーク技術研究所 | Circuit board and power supply control device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0180743U (en) * | 1987-11-19 | 1989-05-30 | ||
| JPH02100221A (en) * | 1988-10-07 | 1990-04-12 | Fujikura Ltd | Thermal fuse device and its formation |
| JPH02288124A (en) * | 1989-04-28 | 1990-11-28 | Uchihashi Estec Co Ltd | Flat type temperature fuse |
-
1989
- 1989-05-19 JP JP1124386A patent/JPH0656734B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0180743U (en) * | 1987-11-19 | 1989-05-30 | ||
| JPH02100221A (en) * | 1988-10-07 | 1990-04-12 | Fujikura Ltd | Thermal fuse device and its formation |
| JPH02288124A (en) * | 1989-04-28 | 1990-11-28 | Uchihashi Estec Co Ltd | Flat type temperature fuse |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0510900A2 (en) * | 1991-04-26 | 1992-10-28 | AT&T Corp. | Wetting-based breakable links |
| WO2017126450A1 (en) * | 2016-01-18 | 2017-07-27 | 株式会社オートネットワーク技術研究所 | Circuit board and power supply control device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0656734B2 (en) | 1994-07-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5097247A (en) | Heat actuated fuse apparatus with solder link | |
| US6373371B1 (en) | Preformed thermal fuse | |
| US7327214B2 (en) | Chip resistor and method of making the same | |
| US5939969A (en) | Preformed thermal fuse | |
| US4494104A (en) | Thermal Fuse | |
| US3978443A (en) | Fusible resistor | |
| JP2004214033A (en) | Protection element | |
| US6614341B2 (en) | Thick film circuit with fuse | |
| JP2000285777A (en) | Protective element | |
| JP4464554B2 (en) | Fuse element and chip type fuse | |
| US3836883A (en) | Fuse and resistor device | |
| JP2011082064A (en) | Chip fuse | |
| JPH02304829A (en) | Temperature fuse | |
| JP5711212B2 (en) | Chip fuse | |
| JP2991726B2 (en) | Thermal fuse | |
| JP2006319260A (en) | Chip resistor | |
| JPH0465046A (en) | Chip-type fuse resistor | |
| JP2542570Y2 (en) | Chip type resistor | |
| JP2788072B2 (en) | Thermal fuse | |
| JP4104140B2 (en) | Resistive circuit board thermal fuse | |
| JPH09129403A (en) | Varistor provided with fuse | |
| JPS6046507B2 (en) | Thick film fuse and its manufacturing method | |
| JPH02244531A (en) | Base board type thermo-fuse and resistance element and manufacture of them | |
| JPH0515698Y2 (en) | ||
| JPH0514433Y2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |