JPH02100221A - Thermal fuse device and its formation - Google Patents
Thermal fuse device and its formationInfo
- Publication number
- JPH02100221A JPH02100221A JP63252110A JP25211088A JPH02100221A JP H02100221 A JPH02100221 A JP H02100221A JP 63252110 A JP63252110 A JP 63252110A JP 25211088 A JP25211088 A JP 25211088A JP H02100221 A JPH02100221 A JP H02100221A
- Authority
- JP
- Japan
- Prior art keywords
- fuse
- thermal fuse
- temperature
- printing
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000015572 biosynthetic process Effects 0.000 title abstract description 9
- 238000007639 printing Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 9
- 239000010409 thin film Substances 0.000 claims abstract description 5
- 239000010408 film Substances 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000010304 firing Methods 0.000 claims description 4
- 210000003298 dental enamel Anatomy 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Fuses (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はフラット型抵抗体に使用する、作動温度精度の
優れた温度ヒユーズおよびその形成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a temperature fuse with excellent operating temperature accuracy, which is used in a flat resistor, and a method for forming the same.
本発明の温度ヒユーズを取り付ける抵抗回路基板は、例
えば自動車用送風制御装置に用いる抵抗回路基板で、フ
ァンモーターへの印加電圧を変化させ送風聞を制御させ
るフラット型抵抗体等に使用されるものである。この抵
抗体はモーターがロックされた時等に効果的な過昇温防
止策をとるために高抵抗、低抵抗各々に温度ヒユーズが
設置されるようになっている。The resistance circuit board to which the temperature fuse of the present invention is attached is, for example, a resistance circuit board used in an automobile air blower control device, and is used as a flat resistor that changes the voltage applied to a fan motor to control the air blower. be. In order to take effective measures to prevent excessive temperature rise when the motor is locked, temperature fuses are installed in each of the high resistance and low resistance elements.
従来、この温度ヒユーズは、本出願人により実開昭５９
−１５９８４７号公報に開示されたように、棒半田や糸
半田を必要長さに切断して、ヒユーズ端子部にまたがら
せ、半田ゴテやホットプレート等の加熱により、溶融し
て第２図に示すような形で形成していた。Conventionally, this temperature fuse was developed by the present applicant in U.S. Pat.
As disclosed in Japanese Patent No. 159847, solder rods or solder wires are cut to the required length, placed across the fuse terminal, and melted by heating with a soldering iron or hot plate, as shown in Figure 2. It was formed as shown.
第２図で１はホウロウ基板の金属コア、２はボウロウ層
、３は抵抗回路導体、５は糸半田であり、６は半田ゴテ
等による溶着部である。この糸半田によるヒユーズ部は
、最も薄くても１．０〜２．０ｍの厚さを必要とし゛【
いた。In FIG. 2, 1 is the metal core of the enamel substrate, 2 is the porcelain layer, 3 is the resistor circuit conductor, 5 is the thread solder, and 6 is the welded part using a soldering iron or the like. The fuse part made of this thread solder requires a thickness of 1.0 to 2.0 m at its thinnest.
there was.
この従来の方法は、ヒユーズ形成後の形状がまちまちで
、ヒユーズの作動条件（温度、時間）が定まらず、温度
ヒユーズとしての作動温度特性は不十分なものであフだ
。In this conventional method, the shape of the fuse after formation varies, the operating conditions (temperature, time) of the fuse are not fixed, and the operating temperature characteristics as a temperature fuse are insufficient.
また棒状半田、糸状半田によるヒユーズ形成では盛り−
Ｅり状態になり、フラット型抵抗体の特徴である平面性
が損われ、前記の送風制御装置においては送風ファンか
らの風力抵抗が大きくなるばかりでなく製品として梱包
および重ねた状態での取り扱い時にスペースファクター
が悪く、また荷くずれ等を起し、破損し易い状態にあっ
た。In addition, when forming fuses using bar-shaped solder or thread-shaped solder,
This causes the flatness, which is a characteristic of a flat resistor, to be damaged, and in the above-mentioned air blower control device, not only does the wind resistance from the air blower fan increase, but also when the product is packaged and handled in a stacked state. The space factor was poor, and the load was likely to collapse and be easily damaged.
本発明の目的は作動温度精度に優れ、フラット型抵抗体
の特徴を損わず、スペースファクターに優れた温度ヒユ
ーズを提供し、またこの薄膜型ヒユーズを精度よく容易
に形成する形成方法を提供することである。The purpose of the present invention is to provide a temperature fuse that has excellent operating temperature accuracy, does not impair the characteristics of a flat resistor, and has an excellent space factor, and also provides a method for easily forming this thin film fuse with precision. That's true.
本発明者らは前記の課題を解決するため鋭意研究を行っ
た。その結果、半田ペーストを使用して、０．１〜１．
０＃厚の薄膜ヒユーズとすることによって解決し得るこ
とを見い出した。The present inventors conducted extensive research to solve the above problems. As a result, using solder paste, 0.1 to 1.
It has been found that the problem can be solved by using a thin film fuse with a thickness of 0#.
すなわち本発明はホウロウ基板上に厚膜導体ペーストを
印刷、焼成して形成した分割状態の抵抗回路導体の端部
間に電気的に接続する温度ヒユーズにおいて、該ヒユー
ズを０．１〜１．Ｏｓの薄膜ヒユーズとしてなる温度ヒ
ユーズである。That is, the present invention provides a temperature fuse that is electrically connected between the ends of divided resistor circuit conductors formed by printing and firing a thick film conductor paste on an enamel substrate. The temperature fuse is a thin film fuse of Os.
その形成方法としては、温度ヒユーズを半田ペーストを
用いて、スクリーンメツシュあるいはメタルマスクによ
って０．１〜１．０ｓ厚さに調整する事を特徴とする温
度ヒユーズの形成方法である。The method for forming the temperature fuse is characterized in that the temperature fuse is adjusted to a thickness of 0.1 to 1.0 seconds using a screen mesh or a metal mask using solder paste.
以下に更に詳細に説明する。This will be explained in more detail below.
半田ヒユーズの形成には、要求作動温度に適合したｐｂ
と３ｎを主要成分として含む半田ペーストを選ぶと共に
、本発明の０．１〜１．０Ｍ厚さの範囲で要求作動条件
に合わせた形成厚さとするため、印刷のスクリーンメツ
シュやエマルジョンの厚さを調整し、更には印刷時のへ
らの硬度（スキージ−硬度）や形状を変えて行なうこと
になる。For forming solder fuses, use PB compatible with the required operating temperature.
In addition to selecting a solder paste containing 3n and 3n as main components, the thickness of the printed screen mesh or emulsion should be adjusted to suit the required operating conditions within the range of 0.1 to 1.0 M thickness according to the present invention. This is done by adjusting the hardness (squeegee hardness) and shape of the spatula during printing.
印刷用版にはスクリーンメツシュタイプの他にＳＵＳ製
のメタルマスクが用いられ、これも所望の形成厚さに応
じてＳＵＳの板厚を変えている。In addition to the screen mesh type, a metal mask made of SUS is used for the printing plate, and the thickness of the SUS plate is also changed depending on the desired formation thickness.
ヒユーズの作動条件は形状、半田幅り厚さ、半田組成に
よって自由にその条件を変えられるが、このような調整
操作ができるのは、所望形状のヒユーズを印刷法によっ
て精度よく０．１〜１．０酬の厚さに形成するからであ
る。このため従来タイプの半田ヒユーズではなかなか満
足できなかった微妙な作動条件（作ｌｌ温度と時間）が
容易に得られる特徴を有するものである。The operating conditions of a fuse can be changed freely depending on the shape, solder width and thickness, and solder composition, but this type of adjustment is possible by printing a fuse in the desired shape with a precision of 0.1 to 1. This is because it is formed to a thickness of . For this reason, it has the characteristic that delicate operating conditions (manufacturing temperature and time) that are difficult to satisfy with conventional solder fuses can be easily obtained.
第１図に示したのは本発明の印刷用半田ペーストを用い
て、スクリーンメツシュ又はメタルマスクによって印刷
、形成されたヒユーズの断面形状である。FIG. 1 shows the cross-sectional shape of a fuse printed and formed with a screen mesh or metal mask using the printing solder paste of the present invention.
第１図で、１は金属コア、２はホウロウ層、３は回路導
体、４はヒユーズである。In FIG. 1, 1 is a metal core, 2 is an enamel layer, 3 is a circuit conductor, and 4 is a fuse.
第２図の従来タイプの棒半田や糸半田を用いて形成した
ものに比較して、従来のものが１．０〜２、Ｏｓ＋厚で
あるのに対し、０．１〜１．０ｍｍ厚となっている。Compared to the conventional type formed using bar solder or thread solder as shown in Fig. 2, the thickness of the conventional type is 1.0 to 2, Os+, while the thickness is 0.1 to 1.0 mm. It has become.
本発明の半田ヒユーズの印刷は、スクリーンメツシュの
場合は４０〜８０メツシュ程度のスクリーンが適当であ
り、印刷厚さは通常の回路印刷とは異なり、０．１Ｍ以
上の厚膜が必要なため、エマルジョン（乳剤）厚は１０
０〜４００１１Ｍが用いられる。またステンレス等のメ
タルマスクでは、２００〜３００声厚のステンレスのメ
タルマスクが適当である。半田ヒユーズの形成厚さは、
印刷時の押圧、スピード、スキージ−硬度、角度等の調
整で０．１〜１．０＃ｌ厚にすることが可能である。２
００〜３００−厚のメタルマスクで１．０Ｍ以上の厚さ
の印刷も可能であるが、あまり厚くすると、溶融形成時
、ヒユーズ形状が整わず、丸形に形成されてしまうので
、印刷厚さは精々１．０酬以内が適当である。For printing the solder fuse of the present invention, in the case of screen mesh, a screen of about 40 to 80 mesh is appropriate, and the printing thickness is different from normal circuit printing, because a thick film of 0.1M or more is required. , the emulsion thickness is 10
0 to 40011M is used. In addition, a stainless steel metal mask with a thickness of 200 to 300 mm is suitable. The thickness of the solder fuse is
It is possible to achieve a thickness of 0.1 to 1.0 #l by adjusting the pressure, speed, squeegee hardness, angle, etc. during printing. 2
It is possible to print a thickness of 1.0M or more with a 00 to 300-thick metal mask, but if it is too thick, the fuse shape will not be properly formed during melt forming and will be formed into a round shape, so the printing thickness It is appropriate that it should be within 1.0 reward at most.
即ちヒユーズ厚さを１．０履超とすると、焼成時、所定
の印刷部分からはみ出してしまう問題があり、またヒユ
ーズ厚さが０．１ｍ未満では焼成時、ひげを生じて、印
刷したパターンの一部に欠損部分を生じるので好ましく
ない。That is, if the thickness of the fuse is more than 1.0 mm, there is a problem that it will protrude from the designated printed area during firing, and if the thickness of the fuse is less than 0.1 m, hairs will occur during firing and the printed pattern will be distorted. This is not preferable because it causes some defects.
一方、糸半田を用いたヒユーズ形成は、半田ヒユーズと
抵抗回路導体との接着力を良くするために回路中を一杯
に使って形成している（これに関しては印刷法も同じで
ある）ので、少量且つ均一な形成量にコントロールする
のが非常に困難である。従って極力一定量に調整して形
成したヒユーズでも、比較例に示した通り、付Ｗｆｆｉ
ｌもバラつきがあり、よって作ｖＪ温度も一定にならな
いのが実状である。On the other hand, when forming fuses using thread solder, the entire circuit area is used to improve the adhesion between the solder fuse and the resistor circuit conductor (the same applies to the printing method). It is very difficult to control the formation amount to be small and uniform. Therefore, even if the fuse is formed by adjusting the amount to be as constant as possible, as shown in the comparative example, the attached Wffi
The reality is that l also varies, and therefore the production vJ temperature is not constant.
以下に実施例によって、本発明を更に具体的に説明する
が、本発明は、この実施例に限定されるものではない。EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples.
（実施例１）
低抵抗位置、高抵抗位置の２ケ所の温度ヒユーズを有す
る抵抗回路基板に、それぞれのヒユーズが目標温度の２
３０℃で作動するように次のように温度ヒユーズを形成
した。(Example 1) A resistance circuit board has temperature fuses at two locations, one at a low resistance position and one at a high resistance position.
A temperature fuse was constructed to operate at 30°C as follows.
■半田ペーストの配合比は５ｎ４０！１％、ｐｂ６０重
量％のものを用いた。(2) The compounding ratio of the solder paste used was 5N40!1% and PB60% by weight.
■形成形状は長方形とし、低抵抗部Ａは５＃×６．５Ｍ
の面積、高抵抗部Ｂは５１１ＩｌｌＩ×３＃の面積とし
た。■The forming shape is rectangular, and the low resistance part A is 5# x 6.5M.
The area of the high resistance part B was 511IllI×3#.
■印刷法については、メタルマスクを用いて、印刷形成
し、焼成後印刷したパターンから半田がはみ出さない程
度の形成量Ａ、Ｂ各々２水準とした。(2) Regarding the printing method, printing was performed using a metal mask, and after baking, two levels were set for each of solder formation amounts A and B to the extent that the solder did not protrude from the printed pattern.
このように形成した各々の温度ヒユーズについて、Ａは
８Ａ、Ｂは４Ａの直流電流を通電し、各々の作動温度を
確認した。A DC current of 8 A and B of 4 A were applied to each of the temperature fuses thus formed, and the operating temperature of each was confirmed.
その結果を第１表に示す。The results are shown in Table 1.
第１表 通電して、各々の作動温度を確認した。Table 1 We turned on electricity and checked the operating temperature of each.
その結果を第２表に示す。The results are shown in Table 2.
この結果、印刷法による形成では、Ａ部は３６０〜４０
０μ、８部は１７５〜２１９μの範囲とすれば、目標作
ＩＪ ２度２００〜２３０℃が得られることが判明した
。As a result, when formed by the printing method, the A part is 360 to 40
It has been found that if the 0μ and 8 parts are set in the range of 175 to 219μ, a target IJ of 2 degrees and 200 to 230°C can be obtained.
（比較例）
実施例１と同じ配合比の糸半田を用いて、形成面積をＡ
（５ａｅ＋Ｘ６．５１１＊） 、Ｂ （５ｓｘ３Ｍ）
共に印刷法と同様になるように形成した温度ヒユーズに
ついて、八に８Ａ、Ｂに４Ａの直流電流をこの比較例か
ら判るように、糸半田で形成したヒユーズは、形成量が
定まらず、狙いの作動温度に調整するのは極めて困難で
ある。(Comparative example) Using thread solder with the same blending ratio as in Example 1, the forming area was A.
(5ae+X6.511*), B (5sx3M)
As can be seen from this comparative example, for the temperature fuses formed in the same manner as the printing method, a direct current of 8 A for 8 and 4 A for B was applied. It is extremely difficult to adjust to operating temperature.
（実施例２）
実施例１の実験から得られた適正形成量で作製したヒユ
ーズ付回路基板（目標ヒユーズ作動温度２００〜２３０
℃）について実際の使用条件に合わせた出力となるよう
、Ａ部は８Ａ１Ｂ部は４Ａの直流電流を通電し、各々の
作ｌｌ温度が目標温度内にあるかどうか確認した。その
結果を第３表に示す。(Example 2) A circuit board with a fuse (target fuse operating temperature of 200 to 230
℃), a direct current of 8 A and 4 A was applied to the A part and 4 A to the B part, and it was confirmed whether the temperature of each part was within the target temperature. The results are shown in Table 3.
以上の如く、印刷法においては、形成母の一定化が計れ
ることから、作動温度範囲も極めて小さいところにおさ
めることができ、安定品質の温度ヒユーズが得られる。As described above, in the printing method, since the formation matrix can be kept constant, the operating temperature range can be kept within an extremely small range, and a temperature fuse of stable quality can be obtained.
本発明のように、温度ヒユーズを印刷焼成によって厚さ
０．１〜１．０ｍｍに形成させたことによって、厚さを
精疾よく調整できるので、各ヒユーズの面積に応じて、
形成最を精度よく調整できることになり、作動温度を狭
い範囲内に調整することができる。As in the present invention, by forming the temperature fuses to a thickness of 0.1 to 1.0 mm by printing and baking, the thickness can be precisely adjusted, so depending on the area of each fuse,
The formation temperature can be adjusted with high precision, and the operating temperature can be adjusted within a narrow range.
また温度ヒユーズが薄層に形成されているので、スペー
スファクターがよく梱包、輸送時に荷くずれを起し破損
するおそれが少ない。Furthermore, since the temperature fuse is formed in a thin layer, the space factor is good, and there is little risk of damage due to the cargo becoming loose during packaging and transportation.
第１図は本発明の温度ヒユーズの断面立面図を示す。 第２図は従来の温度ヒユーズの断面立面図を示す。 FIG. 1 shows a cross-sectional elevational view of the temperature fuse of the present invention. FIG. 2 shows a cross-sectional elevation view of a conventional thermal fuse.
Claims (2)
て形成した分割状態の抵抗回路導体の端部間に電気的に
接続する温度ヒューズにおいて、該ヒューズを０．１〜
１．０ｍｍの薄膜ヒューズとしてなる温度ヒューズ。1. In a thermal fuse that is electrically connected between the ends of a divided resistance circuit conductor formed by printing and firing a thick film conductor paste on an enameled substrate, the temperature of the fuse is 0.1~
A thermal fuse that is a 1.0mm thin film fuse.
メッシュあるいはメタルマスクによって、０．１〜１．
０ｍｍ厚さに調整する事を特徴とする請求項１記載の温
度ヒューズの形成方法。2. A thermal fuse of 0.1~1.
2. The method of forming a thermal fuse according to claim 1, wherein the thickness is adjusted to 0 mm.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63252110A JPH02100221A (en) | 1988-10-07 | 1988-10-07 | Thermal fuse device and its formation |
| ES89310180T ES2130112T3 (en) | 1988-10-07 | 1989-10-05 | FLAT RESISTOR FOR A VEHICLE AIR CONDITIONER BLOWER CONTROL UNIT AND A CONTROL UNIT USED. |
| US07/417,571 US5000662A (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner |
| DE68928918T DE68928918T2 (en) | 1988-10-07 | 1989-10-05 | Flat resistor for blower control unit of an automotive air conditioner and blower control unit |
| EP89310180A EP0363191B1 (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| KR1019890014406A KR950006465B1 (en) | 1988-10-07 | 1989-10-06 | Flat resistance fo rblower control unit of automobile air conditioner |
| CA 2000290 CA2000290C (en) | 1988-10-07 | 1989-10-06 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| US07/636,901 US5192940A (en) | 1988-10-07 | 1990-12-31 | Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same |
| KR1019940026026A KR950006464B1 (en) | 1988-10-07 | 1994-10-20 | Blower control unit for automobile air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63252110A JPH02100221A (en) | 1988-10-07 | 1988-10-07 | Thermal fuse device and its formation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02100221A true JPH02100221A (en) | 1990-04-12 |
Family
ID=17232628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63252110A Pending JPH02100221A (en) | 1988-10-07 | 1988-10-07 | Thermal fuse device and its formation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02100221A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02304829A (en) * | 1989-05-19 | 1990-12-18 | Fujikura Ltd | Temperature fuse |
| US6040754A (en) * | 1998-06-11 | 2000-03-21 | Uchihashi Estec Co., Ltd. | Thin type thermal fuse and manufacturing method thereof |
| US6556122B2 (en) * | 2000-07-21 | 2003-04-29 | Matsushita Electric Industrial Co., Ltd. | Thermal fuse, battery pack, and method of manufacturing thermal fuse |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
-
1988
- 1988-10-07 JP JP63252110A patent/JPH02100221A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02304829A (en) * | 1989-05-19 | 1990-12-18 | Fujikura Ltd | Temperature fuse |
| US6040754A (en) * | 1998-06-11 | 2000-03-21 | Uchihashi Estec Co., Ltd. | Thin type thermal fuse and manufacturing method thereof |
| US6556122B2 (en) * | 2000-07-21 | 2003-04-29 | Matsushita Electric Industrial Co., Ltd. | Thermal fuse, battery pack, and method of manufacturing thermal fuse |
| US7477130B2 (en) | 2005-01-28 | 2009-01-13 | Littelfuse, Inc. | Dual fuse link thin film fuse |
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