JPH02301160A - Laser cutter - Google Patents

Abstract

PURPOSE:To speed up cutting by providing an optical system driving unit which can move a laser at a high speed and an assist gas supply unit which can be continuously moved. CONSTITUTION:A leadframe 12 with a semiconductor device sealed is sent to a transfer unit 10 and positioned. Then a laser beam 4 is emitted from a laser oscillator 1, and the emitted laser beam 4 is directed to a part to be cut based on the data of the part to be cut by an optical system driving unit 7 comprising a fiber 2, an optical system 3, a galvanometer, etc. An assist gas supply unit 5 and an assist gas jetting unit 8 are operated in the same path as the moving position of the laser beam by an assist gas moving unit 9. The assist gas supply unit 5 is equipped with glass 6 on the upper face. The laser beam 4 passes through the glass 6 and reaches the part to be cut through the assist gas jetting unit 8. The laser beam 4 comes against and cuts the part to be cut of a tie bar 14 and a lead 13 of a semiconductor device 11.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a laser cutting device for cutting tie bar portions and lead portions of a semiconductor product encapsulated lead frame with a laser beam.

[Conventional technology]

Conventionally, in this type of laser cutting device, an optical system 3, an assist gas supply section 5, and an assist gas blowing section 8 have been integrally constructed, as shown in FIG.

In operation, the semiconductor product encapsulated lead frame 12 is sent to the laser irradiation part by the conveyor part 10, and then the optical system 3
, an assist gas supply section 5, an assist gas blowing section 8
While being operated by the optical system driver 7, a laser beam is emitted from the laser oscillator 1 through the fiber 2! 14 was being irradiated to cut the semiconductor product 11. 17 is a control section.

Fig. 5 shows the semiconductor product encapsulated lead frame before cutting, and Fig. 6 shows the lead frame after cutting. be.

[Problem to be solved by the invention]

The conventional laser cutting device described above has a structure in which the optical system 3, the assist gas supply section 5, and the assist gas blowing section 8 are operated by the optical system drive section 7, so it cannot be operated at high speed. The time required for spot cutting is 0.
It takes about 2 seconds, and it takes about 20 seconds to process a 100 PIN semiconductor product, which has the disadvantage that productivity cannot be improved.

An object of the present invention is to provide a laser cutting device that solves the above problems.

[Differences between the invention and the prior art]

The present invention differs from the conventional apparatus described above in that it can cut the tie bar portion and lead portion of a lead frame at high speed.

[Means to solve the problem]

In order to achieve the above object, the present invention provides a laser cutting device for cutting tie bar parts and lead parts of a sealed lead frame of a semiconductor product. The assist gas supply side consisting of a supply section, an assist gas blowing section, and an assist gas moving section are separated and separated.

〔Example〕 Embodiments of the present invention will be described below with reference to the drawings.

(Example 1) FIG. 1 is a perspective view showing a first embodiment of the present invention.

In the figure, 1 is a high-output YAG or CO2 gas laser oscillator, 2 is a fiber that guides the laser beam 4 from the laser oscillator 1, 3 is an optical system for the laser beam 4, 5 is an assist gas supply unit, 6 is glass, 7 is an optical system drive section. Further, 8 is an assist gas blowing section, 9 is an assist gas moving section, 10 is a conveyance section, and 17 is a control section. The present invention separates the laser irradiation side consisting of the laser oscillator 1, optical system 3, and optical system drive section 7 from the assist gas supply side consisting of the assist gas supply section 5, the assist gas blowing section 8, and the assist gas moving section 9. The laser irradiation side and the assist gas supply side are operated independently by the control section 17.

The semiconductor product encapsulated lead frame 12 is transported by the transport section 10 and positioned. The cutting location of the semiconductor product encapsulated lead frame 12 is determined in advance by the control unit 1 as data.
Register on 7. After that, a laser beam 4 is emitted from the laser oscillator 1, and the emitted laser beam tl&4 is transmitted to the cutting point based on the data of the cutting point by the optical system driving section 7, which is composed of the fiber 2, the optical system 3, the galvanometer, etc. irradiate to.

In addition, an assist gas supply section 5 and an assist gas blowing section 8
is moved by the assist gas moving unit 9 along the same path as the moving position of the laser beam. The assist gas supply section 5 has a glass 6 housed on its upper surface.

The laser beam 4 passes through the glass 6, passes through the assist gas blowing section 8, and reaches the cutting location. Through the above operations, the laser beam 4 hits the cut portions of the tie bar 14 and the lead 13 of the semiconductor product 11, and cutting is performed.

(Example 2) FIGS. 2 and 3 are diagrams showing Example 2 of the present invention. FIG. 2 shows a state in which the assist gas supply section is moved to a state in which a large package is processed, and FIG. 3 shows a state in which the assist gas supply section is moved in a state in which a small package is processed.

The basic configuration and operating conditions on the laser side are the same as in the first embodiment. In this embodiment, the assist gas supply section 5 and the blowing section 8 are divided into four parts.

In addition, an assist gas moving section (-axis) 9 is provided in the divided assist gas supply section 5. Once positioning is performed according to the semiconductor product using 0 or more, the assist gas is moved until the next type of semiconductor product is supplied. There is no need to move the gas supply section 5, and there is an advantage that the control of the apparatus is simpler than in the first embodiment.

〔Effect of the invention〕

As explained above, the present invention has an optical system drive unit that can move a laser beam at high speed and an assist gas supply unit that can move continuously, so that cutting can be performed at high speed. It can cut in about 3 seconds, and even a 100 PIN semiconductor product can be cut by about 3 degrees, which has the effect of improving productivity6.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing Embodiment 1 of the present invention, FIG.
The figure is a front view showing Embodiment 2 of the present invention, FIG. 4 is a view showing a conventional example, FIG. 5 is a view showing a semiconductor encapsulated lead frame before cutting, and FIG. 6 is a view showing semiconductor product encapsulation after cutting. FIG. 3 is a diagram showing a fixed lead frame. 71...Laser oscillator 2...Fiber 3...
・Optical system 4... Laser beam 5... Assist scum supply section 6... Glass 7... Optical system drive section 8.
...Assist gas blowing section 9...Assist gas moving section 10...Transporting section Fig. 4 Fig. 1 Fig. 5 Fig. 6

Claims (1)

[Claims] (1) In a laser cutting device that cuts tie bars and leads of semiconductor product encapsulated lead frames, the laser irradiation side consists of a laser oscillator, optical system, and optical system drive section, and the assist gas supply section and assist gas blowout section A laser cutting device characterized in that an assist gas supply side consisting of an assist gas moving section and an assist gas supply side are separated and separated.