JP2956266B2 - Laser cutting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting device for cutting a tie bar portion of a lead frame sealed with a semiconductor product with a laser beam.

[0002]

2. Description of the Related Art Conventionally, a method of cutting a tie bar portion of a lead frame sealed with a semiconductor product of this type is, as shown in FIG. Lead 1
The tie bar 9 of the semiconductor product 10
Had been blown.

[0003]

When the tie bar is cut (blown) by the above-described conventional apparatus for cutting a tie bar of a semiconductor product sealed lead frame, the diameter of the laser beam is about φ0.2 mm. Yes, tie bar thickness is 0.2
Since it is about 0.5 mm, the number of shots to be used for cutting needs to be 2-3 shots. Therefore, it is necessary to spend 2 to 3 shots per laser beam for cutting, and the processing time is long. There were drawbacks.
For example, when cutting 100 PINs by spending 3 shots per tie bar, set the laser irradiation interval to 10
Assuming 0 pulses / second, about 3.2 seconds are required.

An object of the present invention is to provide a laser cutting device in which the processing time required for cutting a tie bar is reduced.

[0005]

In order to achieve the above object, a laser cutting apparatus according to the present invention has a laser beam portion, and cuts a tie bar portion of a semiconductor product sealed lead frame with a laser beam. In the cutting device, the laser beam portion is to shape the laser beam into an elliptical shape corresponding to the length of the tie bar portion, and irradiates the tie bar portion,
Having two cylindrical lenses, wherein the two
Dical lenses face flat surfaces back to back
Is what it is.

[0006]

The laser beam is formed into an elliptical shape using a cylindrical lens. The length of the elliptical shape in the major axis direction is set in accordance with the length of the cut portion of the tie bar, and 1
Cut the tie bar with a shot.

[0007]

BRIEF DESCRIPTION OF THE DRAWINGS FIG.

FIG. 1A is a perspective view showing a first embodiment of the present invention, and FIG. 1B is a view showing a cut state.

In the figure, a cylindrical lens 2, an optical drive unit 3, an imaging lens 5, and the like for shaping a laser beam into an elliptical shape are arranged in an optical path system of a laser beam emitted from a laser oscillator 1. An assist gas supply unit 6 and an assist gas blowing unit 7 are arranged at an image forming position by the image forming lens 5, and the semiconductor product sealed lead 12 is conveyed by the conveying unit 13 toward the image forming position. The tie bar 9 of the lead 12 is positioned. Reference numeral 8 denotes an assist gas moving unit that moves the assist gas supply unit 6 and the assist gas blowing unit 7, and reference numeral 14 denotes a control unit that drives and controls the assist gas moving unit 8 and the laser oscillator 1.

In this case, as shown in FIG. 1B, the laser beam condensing portion 15 for the laser beam tie bar 9 is formed into an elliptical shape by using the cylindrical lens 2, and the length of the elliptical shape in the major axis direction is increased. Saga lead 12 tie bar 9
Is set to a length necessary to cut the shot by one shot.

The laser beam emitted from the laser oscillator 1 is circular, but is formed into an elliptical beam by passing through a cylindrical lens 2. While positioning control of the beam shaped into an ellipse by the optical system driving unit 3,
The light passes through an imaging lens 5, an assist gas supply unit 6, and an assist gas blowing unit 7, and irradiates a tie bar 9 of a semiconductor product.

The laser cutting method will be described below. The semiconductor product sealed lead frame 11 is sent by the transport unit 13 and positioned. The cut portion of the semiconductor product sealed lead frame 11 is stored in the control unit 14 in advance as data.
Register in. Thereafter, a laser beam 4 is emitted from the laser oscillator 1, and the emitted laser beam 4 is radiated to the cut portion according to the data of the cut portion by the optical system drive unit 3 including a cylindrical lens 2, a galvanometer, and the like. The assist gas supply unit 6 and the assist gas blowing unit 7 are operated by the assist gas moving unit 8 on the same path as the laser light moving position. The laser beam 4 passes through the assist gas blowing unit 7 and reaches the cutting position. By the above operation, the laser beam condensing part 15 condensed in an elliptical shape hits the cutting part of the tie bar 9 and the lead 13 of the semiconductor product 10, and the cutting is performed in one shot.

(Embodiment 2) FIGS. 2A and 2B are perspective views showing Embodiment 2 of the present invention, and FIG. 3 is a view showing a cut state in Embodiment 2.

In this embodiment, the basic configuration and operating state on the laser side are the same as those in the first embodiment, but the configuration of the cylindrical lens is different.

In this embodiment, as shown in FIG.
This is used for cutting a semiconductor product (for example, QFP) that needs to be cut in the Y direction. The cylindrical lens forms the laser beam 4 into a horizontal elliptical shape, and the cylindrical lens 2a forms a vertical elliptical shape. And a cylindrical lens 2b.

FIG. 2A shows the state of FIG.
(B) shows a state used when cutting in the Y direction. The switching of the cylindrical lenses 2a and 2b in the X and Y directions is performed by moving the cylindrical lenses 2a and 2b fixed to the table 16 in parallel on the motor shaft using the rotation of the motor 17.

According to the present embodiment, even in a semiconductor product that requires two types of cutting in the X and Y directions, one tie bar, one
There is an advantage that cutting by shots can be performed and productivity can be increased.

[0018]

As described above, according to the present invention, the laser beam is formed into an elliptical shape, so that what was conventionally spent 2-3 shots per tie bar can be processed with only one shot, and the processing time can be reduced. There is an effect that the width can be greatly reduced and the productivity can be improved.

[Brief description of the drawings]

FIG. 1 (a) is a perspective view showing a first embodiment of the present invention,
FIG. 3B is a diagram illustrating a cutting state in the first embodiment.

FIGS. 2A and 2B are perspective views showing a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a cutting state according to a second embodiment of the present invention.

FIG. 4 is a diagram showing a cutting state in a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Laser oscillator 2 Cylindrical lens 3 Optical system drive part 4 Laser beam 5 Imaging lens 6 Assist gas supply part 7 Assist gas blowing part 8 Assist gas moving part 9 Tie bar 10 Semiconductor product 11 Semiconductor product sealed lead frame 12 Lead 13 Transport Unit 14 Control unit 15 Laser beam focusing unit 16 Table 17 Motor

Claims (3)

(57) [Claims] 1. A laser cutting device having a laser beam portion and cutting a tie bar portion of a lead frame sealed with a semiconductor product with a laser beam, wherein the laser beam portion cuts the laser beam to the length of the tie bar portion. It is shaped into a corresponding elliptical shape and illuminates the tie bar. It has two cylindrical lenses, and the two cylindrical lenses have a flat surface
A laser cutting device characterized in that it faces each other . 2. The laser beam part according to claim 1,
Laser beam shaping corresponding to the X and Y cuts in the bar
2. The apparatus according to claim 1, wherein the direction is changed.
Laser cutting device. 3. The laser beam part according to one shot.
3. The method according to claim 1, wherein the tie bar is cut.
The laser cutting device as described in the above.