JPH022959B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrolytic plating method, particularly an electrolytic plating method using an auxiliary energy beam such as a laser.

[Conventional technology]

Conventionally, there has been a device of this type as shown in FIG. Figure 4 shows, for example, the publication of patent applications in 1797, 1983.
It is a sectional view showing an electrolytic device shown in the publication,
In the figure, 1 is a metal layer deposited on an insulating substrate 2, forming a cathode. 3 is an electrolyte solution, for example, a plating solution such as CuSO ₄ . 4 is an electrolytic bath, in this case a plating bath, and 5 is a counter electrode which is immersed together with the metal layer 1 in the electrolytic solution 3. Reference numeral 6 represents an electrolytic power source that supplies current to the metal layer 1 and the counter electrode 5, and 7 represents a potential modulator that modulates the potential applied by the power source 5. 8 is a beam oscillator, which in this case is a laser oscillator. 9 is a beam modulator that modulates the waveform of the beam emitted from the beam oscillator, 10 is the beam emitted from the beam oscillator, 11 is a lens that focuses the beam, and 12 is a scanning device that controls the irradiation position of the beam 10. Showing a mirror.

Furthermore, FIG. 5 is a correlation diagram showing the relationship between the output form of the laser beam and the plating current applied to the cathode (workpiece) in a conventional electrolysis device. b shows the time change of the plating current applied to the workpiece irradiated with the laser beam in the form a.

Furthermore, FIG. 6 is a sectional view showing a workpiece plated with a conventional electrolytic apparatus. In the figure,
Reference numeral 13 indicates a plating layer in the laser irradiated area, and 4 indicates a plating layer in the laser non-irradiation area.

Next, the operation will be explained. In Figure 4,
A metal layer 1 on an insulating substrate 2 immersed in an electrolytic solution 3 and connected to a counter electrode 5 via an electrolytic power source 6
Then, a predetermined negative pulse current is applied by the electrolysis power source 6 and the potential modulator 7, as shown in FIG. 5b. In this case, the applied current value is usually much smaller than the value used when plating the entire surface of the metal layer 1. In this state, a laser beam 10 of Ar, Kr, YAG, etc. having a wavelength that transmits through the electrolyte solution 3 is emitted from the outside of the electrolytic cell 4 from the beam oscillator 8 in the output form shown in FIG. etc. are converted into an appropriate form by a beam modulator 9, focused by a lens 11, moved by a scanning mirror 12,
The surface of the metal layer 1 on the insulating substrate 2 is irradiated.

According to the above device, the metal layer 1 on the insulating substrate 2
By irradiating a predetermined portion of the laser beam 10, the irradiated portion is electrochemically activated, resulting in selective plating. Figure 6 shows an insulating substrate 2 plated using such a conventional device.
A cross section of the upper metal layer 1 is shown. When it comes to plating,
When the ionization tendency of the metal layer 1 material is higher than the ionization tendency of the electrolyte solution 3, such as Ag plating on Cu and Ni cathodes, displacement plating can be achieved by simply immersing the metal layer 1 in the electrolyte solution 3 without applying electricity. A layer 14 is applied over the entire surface of the metal layer 1. Further, since the pulse current shown in FIG. 5B is applied to the metal layer 1 when the laser beam 10 is irradiated, a minute plating layer 14 is formed even when the laser beam 10 is not irradiated. When the plating layer 13 used during laser beam irradiation is used for energizing electrical circuits or for material saving when plating precious metals, the plating layer 14 in the areas not irradiated with the laser beam becomes a hindrance, so pickling is required after plating. It is necessary to remove it by methods such as

[Problem that the invention seeks to solve]

Conventional electrolytic equipment is configured as described above, so that it can be used by simply immersing the workpiece in the electrolytic solution, or by applying a minute current during plating, even on parts of the workpiece surface that do not require plating. A plating layer is formed, and it is necessary to remove these unnecessary plating layers after plating, which increases the number of processing steps and can also cause defective products due to insufficient removal. ing.

This invention was made to solve the above-mentioned problems, and it prevents the formation of a plating layer on unnecessary parts before and after plating, and also by periodically changing the polarity of the plating current. An object of the present invention is to obtain an electrolytic device that can prevent the formation of a plating layer on unnecessary parts during plating processing.

[Means for solving problems]

The electrolytic plating method according to the present invention consists of the following steps.

(i) A step in which a positive current or voltage is applied to the workpiece before electrolytic plating.

(ii) During the electrolytic plating process, a negative current or voltage is applied to the workpiece during beam irradiation in synchronization with the beam pulse irradiated to the workpiece, and a positive current or voltage is applied when the beam is paused. Step to apply.

(iii) After the electrolytic plating process, a step of applying a positive current or voltage to the workpiece.

[Effect]

In the electrolytic plating method according to the present invention, in the first step, a positive current or voltage is applied to the workpiece before electrolytic plating processing.

In addition, in the next step, during the electrolytic plating process, a negative current or voltage is applied to the workpiece during beam irradiation in synchronization with the beam pulse irradiated to the workpiece, and the beam is stopped. Sometimes a positive current or voltage is applied.

Then, in a final step, a positive current or voltage is applied to the workpiece after the electrolytic plating process.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 15 is a workpiece made of a conductor and serves as a cathode, 16 is an attachment/detachment mechanism that attaches and detaches the workpiece 15 into the electrolytic cell 4 and is linked to the electrolytic power source 17, and 17 is a polarity converter between positive and negative. This shows a power source for electrolysis that performs this periodically and in conjunction with a beam oscillator.

In addition, Fig. 2 shows the output and time a of the laser beam to be irradiated, as well as the time a and the time a of the laser beam applied to the workpiece, corresponding to the process from when the workpiece is immersed in the electrolytic bath until it is pulled out after plating. This figure shows the relationship between the luminescent current and time b.

Furthermore, FIG. 3 is a diagram showing a cross section of a workpiece plated according to the present invention.

A workpiece 15 made of a metal material is an electrolytic solution 3
The beam is emitted from the beam oscillator 8, and the beam is emitted from the condenser lens 1.
1, the workpiece is immersed in the electrolytic bath 4 by the electrolytic bath attachment/detachment mechanism 16 in order to be machined at the irradiated point of the beam 10 focused by the electrolytic bath 1. A predetermined positive current is applied to the workpiece 15 before it is immersed. Next, when the surface of the workpiece 15 in the electrolytic solution 3 is externally irradiated with the beam 10 in the pulse waveform shown in FIG. As shown in FIG. 2b, a negative current is applied during laser beam irradiation, and a positive current is applied during pause.

After the plating process is completed, the workpiece 15 is placed in the electrolytic bath 4.
A positive current is applied to the workpiece 15 by the electrolysis power supply 17 to prevent displacement plating from occurring until the electrolytic solution attached to the surface is removed by the desorption mechanism 16. be done.

In the above embodiments, the case where the beam irradiated onto the surface of the workpiece is a laser beam has been described, but the same effect can be obtained even if other energy sources such as an ultrasonic beam are used. Furthermore, in the above embodiment, an example was shown in which the energization to the workpiece is controlled by electric current.
It may be controlled by voltage. The electrolysis device using the above embodiment links the electrolysis power source with the mechanism for attaching and detaching the workpiece to the electrolytic cell, and during the time when the workpiece surface is in contact with the electrolytic solution before and after plating, the electrolysis device In addition to applying a positive current to the object, a current that changes the polarity periodically is applied to the workpiece during the plating time, and the laser beam is irradiated when the polarity is negative. It is possible to prevent unnecessary parts from being replaced by plating before the plating process, or from being replaced by the electrolyte adhering to the surface by the time the workpiece is taken out of the electrolytic bath and washed with water after plating. can.

[Effects of the Invention] As described above, according to the present invention, there is a step of applying a positive current or voltage to the workpiece before the electrolytic plating process, and a step of applying irradiation to the workpiece during the electrolytic plating process. A step of applying a negative current or voltage to the workpiece during beam irradiation in synchronization with the beam pulse to be processed, and applying a positive current or voltage to the workpiece when the beam is paused, and applying a positive current or voltage after the electrolytic plating process. Since the process consists of the step of applying a voltage to the workpiece, it is possible to prevent machining from reaching unnecessary parts before, during and after electrolytic plating, and at the same time obtain highly accurate machining results. This has the effect of simplifying the post-process.

[Brief explanation of drawings]

Fig. 1 is a cross-sectional side view showing an electrolysis device using an embodiment of the present invention, Fig. 2 is a schematic diagram showing the beam irradiation waveform and the current waveform applied to the workpiece according to the invention, and Fig. 3 is a schematic diagram showing the electrolysis device according to the present invention. FIG. 4 is a cross-sectional side view of a workpiece after plating according to the invention; FIG. 4 is a cross-sectional side view showing a conventional electrolytic device; FIG. The schematic diagram shown in FIG. 6 is a cross-sectional side view of a workpiece after plating using a conventional electrolytic device. 3 is an electrolytic solution, 5 is a counter electrode, 8 is a beam oscillator, 10 is a beam, 15 is a workpiece, 16 is an attachment/detachment mechanism, and 17 is an electrolytic power source. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.

Claims (1)

[Claims] 1. A step of applying a positive current or voltage to the workpiece before the electrolytic plating process, and a step of applying the beam to the workpiece in synchronization with a beam pulse irradiated to the workpiece during the electrolytic plating process. a step of applying a negative current or voltage to the workpiece at times and a positive current or voltage when the beam is at rest; and a step of applying a positive current or voltage to the workpiece after the electrolytic plating process. An electrolytic plating method characterized by comprising: