JPH0229526U - - Google Patents

Info

Publication number
JPH0229526U
JPH0229526U JP1988108518U JP10851888U JPH0229526U JP H0229526 U JPH0229526 U JP H0229526U JP 1988108518 U JP1988108518 U JP 1988108518U JP 10851888 U JP10851888 U JP 10851888U JP H0229526 U JPH0229526 U JP H0229526U
Authority
JP
Japan
Prior art keywords
bonding jig
bonding
island
semiconductor chip
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988108518U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988108518U priority Critical patent/JPH0229526U/ja
Publication of JPH0229526U publication Critical patent/JPH0229526U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/07553
    • H10W72/531
    • H10W72/5449
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP1988108518U 1988-08-17 1988-08-17 Pending JPH0229526U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988108518U JPH0229526U (cg-RX-API-DMAC10.html) 1988-08-17 1988-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988108518U JPH0229526U (cg-RX-API-DMAC10.html) 1988-08-17 1988-08-17

Publications (1)

Publication Number Publication Date
JPH0229526U true JPH0229526U (cg-RX-API-DMAC10.html) 1990-02-26

Family

ID=31343929

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988108518U Pending JPH0229526U (cg-RX-API-DMAC10.html) 1988-08-17 1988-08-17

Country Status (1)

Country Link
JP (1) JPH0229526U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569135A (zh) * 2012-02-07 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的加热块

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569135A (zh) * 2012-02-07 2012-07-11 三星半导体(中国)研究开发有限公司 用于引线键合的加热块

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