JPH02292175A - Polishing tool - Google Patents

Abstract

PURPOSE:To polish a material of higher hardness than that of Si with high surface smoothness and without generating any scratch and work deterioration layer by using a Si powder as abrasive grains. CONSTITUTION:A desired tool for polishing is obtained by fixing Si powder with various kinds of resin bonds. A high temperature and high pressure are generated locally and instantaneously at the contact point with the material to be worked by using Si powder as abrasive grains and reaction with the material to be worked or the surface oxidizing layer is caused. The polishing of the material to be worked proceeds by removing this reaction product by a sliding friction power.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a tool for precision surface polishing of metals, ceramics, electronic materials, etc.

Conventional fixed abrasive tools for polishing use diamond, alumina, cerium oxide, etc. as the abrasive grains, and metals such as cast iron and copper or resins such as polyurethane and acrylic as the bond (binding agent) for fixing the abrasive grains. have been put into practical use. These tools are generally used to polish materials whose hardness is mechanically lower than that of abrasive grains, and the processing mechanism is to remove minute amounts of the surface of the workpiece by mechanical pushing or cutting action at the tip of the abrasive grains. It is something to do. With such processing methods, cracks and scratches always remain on the surface of the workpiece, so it is difficult to obtain a mirror surface without a damaged layer. Problems to be Solved by the Invention Conventional fixed abrasive tools leave a damaged layer on the surface of the workpiece as described above, so it is necessary to further polish workpieces that require a strain-free surface such as functional parts. A polishing process is required. The present invention uses Si powder with high chemical activity as the abrasive grains and a resin with high elasticity as the bond.
The purpose of the present invention is to provide a polishing tool that can finish a workpiece material with a hardness higher than that of I to a mirror surface without any damaged layer such as scratches. Means for Solving the Problems The present invention is characterized in that it is a polishing tool in which S1 powder is fixed with various resin bonds. The present invention will be explained in detail below. Si is extremely active chemically and forms reaction products with many materials. It is also known that in an oxygen atmosphere, it reacts immediately to form an oxide layer on the surface, and this oxide layer reacts with other materials. When such S1 powder is used as abrasive grains, high temperature and pressure are generated locally and instantaneously at the point of contact with the workpiece, causing a reaction between the workpiece and Si or the surface oxide layer. If this reaction product is removed by the sliding friction force, polishing of the workpiece progresses (this phenomenon in which the reaction is promoted by mechanical action is called mechanochemical reaction, and the polishing method that utilizes this phenomenon is called mechanochemical reaction). (called chemical polishing). At this time, the workpiece is one that can cause a chemical reaction with Si or S1 oxide, and
If the hardness is greater than that of the S1 powder, the S1 powder will not be pushed into or scratched on the surface of the workpiece, making it possible to create a mirror surface without processing damage such as scratches. The particle size of the Si powder is about 1 to 10 gm, and the resin is polyurethane. A suitable blending ratio (volume ratio) of Si powder and resin such as acrylonitrile, polyethylene, fufu crude resin, etc. is 20 to 80%.

Possible materials to be processed include, for example, oxides such as Al203 (single sapphire, alumina sintered body), and diamond. Furthermore, if a highly elastic resin is used as the bond, the applied pressure at the contact point will be equalized, making it easier to process the entire surface uniformly. Function: Using the above-mentioned polishing tool, it is possible to polish highly hard materials with high precision without producing a damaged layer. In addition, if the tool shape is not only a flat plate but also a small diameter pellet, a sphere, or a shape that matches the surface shape of the workpiece, it is possible to polish not only flat surfaces but also arbitrary free-form surfaces with high precision. It is also possible to do so. Example A flat grindstone was manufactured by dispersing and solidifying Si powder with an average particle diameter of 5 pm (3 to 71 j-m or more, 90% or more) in a polyurethane resin at a Si powder blending ratio of 50%. The results of polishing sapphire (M203 single crystal) and diamond using this grindstone are shown below.

Sliding speed on the Saf7ear (0001) surface is approximately 100m/si
n. When polished under dry conditions in the atmosphere with a pressing pressure of 1 kgf/c 2, polishing was achieved with a processing efficiency of approximately 4 gm/h. However, the sapphire pre-processed surface at this time is B4C#40
This is the surface finished by lapping with 00 abrasive grains. Next, the surface of the diamond thin film (thickness approximately IQgm) formed on the Si single crystal substrate by the CvD method was polished using a flat grindstone containing 80% Si powder. Slide speed 500 m/sin, pressing pressure 0.1 kgf/cm2. When polished under dry conditions in the atmosphere, the result was 0. ．． Polishing was possible at a processing efficiency of 8 μm/h. Effects of the Invention As explained above, by using the polishing tool of the present invention, it is possible to polish materials with higher hardness than Si with high surface smoothness and without producing scratches or damaged layers, making it a suitable final polishing method for high-performance parts. It is suitable as In this polishing tool, the S1 powder does not push or scratch the workpiece material, so there is no need to make the grain size uniform, and for example, low-grade Si powder, such as that generated when slicing a single-crystal Si ingot, is used as the raw material. It also has the advantage of being able to be manufactured at low cost.

Claims (1)

[Claims] A fixed abrasive tool for polishing in which abrasive grains are fixed with various resin bonds, characterized in that Si powder is used as the abrasive grains.