JPH022888U - - Google Patents

Info

Publication number
JPH022888U
JPH022888U JP1988078821U JP7882188U JPH022888U JP H022888 U JPH022888 U JP H022888U JP 1988078821 U JP1988078821 U JP 1988078821U JP 7882188 U JP7882188 U JP 7882188U JP H022888 U JPH022888 U JP H022888U
Authority
JP
Japan
Prior art keywords
heat
electronic circuit
circuit package
plate
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988078821U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988078821U priority Critical patent/JPH022888U/ja
Publication of JPH022888U publication Critical patent/JPH022888U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
    • H01L2224/331—Disposition
    • H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H01L2224/33181—On opposite sides of the body

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1988078821U 1988-06-16 1988-06-16 Pending JPH022888U (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988078821U JPH022888U (cs) 1988-06-16 1988-06-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988078821U JPH022888U (cs) 1988-06-16 1988-06-16

Publications (1)

Publication Number Publication Date
JPH022888U true JPH022888U (cs) 1990-01-10

Family

ID=31303718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988078821U Pending JPH022888U (cs) 1988-06-16 1988-06-16

Country Status (1)

Country Link
JP (1) JPH022888U (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024520046A (ja) * 2021-05-25 2024-05-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 挿入モジュール及びモジュールアセンブリ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024520046A (ja) * 2021-05-25 2024-05-21 ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング 挿入モジュール及びモジュールアセンブリ

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