JPS6245898U - - Google Patents
Info
- Publication number
- JPS6245898U JPS6245898U JP13728785U JP13728785U JPS6245898U JP S6245898 U JPS6245898 U JP S6245898U JP 13728785 U JP13728785 U JP 13728785U JP 13728785 U JP13728785 U JP 13728785U JP S6245898 U JPS6245898 U JP S6245898U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- power semiconductor
- substrate
- hole
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000000758 substrate Substances 0.000 claims 4
- 238000005452 bending Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13728785U JPS6245898U (cs) | 1985-09-07 | 1985-09-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13728785U JPS6245898U (cs) | 1985-09-07 | 1985-09-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6245898U true JPS6245898U (cs) | 1987-03-19 |
Family
ID=31041199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13728785U Pending JPS6245898U (cs) | 1985-09-07 | 1985-09-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6245898U (cs) |
-
1985
- 1985-09-07 JP JP13728785U patent/JPS6245898U/ja active Pending
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