JPH022837U - - Google Patents
Info
- Publication number
- JPH022837U JPH022837U JP7970888U JP7970888U JPH022837U JP H022837 U JPH022837 U JP H022837U JP 7970888 U JP7970888 U JP 7970888U JP 7970888 U JP7970888 U JP 7970888U JP H022837 U JPH022837 U JP H022837U
- Authority
- JP
- Japan
- Prior art keywords
- heater chip
- mounting surface
- head
- surface parallel
- chip mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7970888U JPH022837U (de) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7970888U JPH022837U (de) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH022837U true JPH022837U (de) | 1990-01-10 |
Family
ID=31304566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7970888U Pending JPH022837U (de) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH022837U (de) |
-
1988
- 1988-06-15 JP JP7970888U patent/JPH022837U/ja active Pending
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