JPH02282484A - Electroless plating method - Google Patents
Electroless plating methodInfo
- Publication number
- JPH02282484A JPH02282484A JP10243589A JP10243589A JPH02282484A JP H02282484 A JPH02282484 A JP H02282484A JP 10243589 A JP10243589 A JP 10243589A JP 10243589 A JP10243589 A JP 10243589A JP H02282484 A JPH02282484 A JP H02282484A
- Authority
- JP
- Japan
- Prior art keywords
- electroless plating
- holes
- gaseous hydrogen
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007772 electroless plating Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims description 9
- 238000007747 plating Methods 0.000 claims abstract description 13
- 239000003054 catalyst Substances 0.000 claims abstract description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 15
- 230000008021 deposition Effects 0.000 abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 abstract 4
- 239000001257 hydrogen Substances 0.000 abstract 4
- 230000002950 deficient Effects 0.000 abstract 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract 1
- 238000007872 degassing Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は無電解めっき方法に関し、特に高板厚で小径の
スルーホールを有する印刷配線板の無電解めっき方法に
関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electroless plating method, and particularly to a method for electroless plating a printed wiring board having a large thickness and small diameter through holes.
従来、印刷配線板を無電解めっきする場合、めっき液を
満たした浴槽に、触媒が付与された印刷配線板を垂直方
向に浸漬し、無電解めっきを行なっている。Conventionally, when electroless plating a printed wiring board, the printed wiring board coated with a catalyst is vertically immersed in a bath filled with a plating solution to perform electroless plating.
しかし、この方法では、高板厚で小径のスルーホールを
有する印刷配線板を無電解めっきする場合、スルーホー
ル内に於いて、めっき反応で生成される水素ガスの脱泡
性が悪く、めっき析出不良が発生する。However, with this method, when electroless plating is performed on a printed wiring board with a high thickness and small diameter through-holes, the degassing properties of the hydrogen gas generated by the plating reaction in the through-holes are poor, resulting in plating precipitation. A defect occurs.
そこで、高板厚で小径のスルーホールを有する印刷配線
板を無電解めっき液内で斜めに傾向けて無電解めっきを
行ない、スルーホール内の水素ガスの脱泡性を良くし、
めっき析出不良を防止する方法が行なわれている。Therefore, electroless plating is performed on a printed wiring board with a high thickness and small diameter through holes by tilting it diagonally in an electroless plating solution to improve the degassing performance of hydrogen gas in the through holes.
Methods are being used to prevent poor plating deposition.
上述した従来の無電解めっき方法は、高板厚で小径のス
ルーホールを有する印刷配線板を、無電解めっき液内で
、単に、斜めに傾けて固定しただけであるため、水素ガ
スの脱泡性に限界があり、アスペクト比（板厚／きり径
）が約２０以上の印刷配線板では、完全に、めっき析出
不良を抑制する事が困難であるという欠点がある。In the conventional electroless plating method described above, a printed wiring board with a large thickness and small diameter through-holes is simply fixed at an angle in an electroless plating solution, so hydrogen gas degassing is difficult. Printed wiring boards with an aspect ratio (board thickness/cut diameter) of about 20 or more have the disadvantage that it is difficult to completely suppress plating precipitation defects.
また、ポンプ等を利用して、印刷配線板の片側から無電
解めっき液を送り込む方法や無電解めっき液中で印刷配
線板をゆらしたり、回転させる方法等の強制的にスルー
ホール内に無電解めっき液を流通させる方法も考えられ
るが印刷配線板内で、スルーホールのきり径が二種類以
上ある場合、大径のすぐ近傍にある小径では、無電解め
っき液が大径の方が流れ安いため、小径の方の液の流通
性が悪くなり、水素ガスの脱泡性も良くないという欠点
がある。In addition, electroless plating can be applied forcefully into through-holes by using a pump, etc., to feed electroless plating solution from one side of the printed wiring board, or by shaking or rotating the printed wiring board in the electroless plating solution. Another option is to allow the plating solution to flow, but if there are two or more different through-hole diameters in a printed wiring board, the electroless plating solution will flow more easily in the smaller diameters that are in the immediate vicinity of the larger diameters. Therefore, there are disadvantages in that the flowability of the liquid in the smaller diameter side is poor and the defoaming property of hydrogen gas is also poor.
本発明の目的は、水素ガスの脱泡性が良く、めっき析出
不良の発生のない無電解めっき方法を提供することにあ
る。An object of the present invention is to provide an electroless plating method that has good hydrogen gas degassing properties and does not cause poor plating deposition.
本発明の無電解めっき方法は、中心軸を持つ円板上の台
を設け、前記円板状の台の上の外周側に無電解めっき槽
を複数槽設置し、前記無電解めっき槽に無電解めっき液
を満たし、該無電解めっき液を満たした前記無電解めっ
き槽に、触媒が付与された印刷配線板を前記円板状の台
の半径方向と直角に浸漬し、前記円板状の台を回転させ
ながら無電解めっきが行われる。In the electroless plating method of the present invention, a disk-shaped stand having a central axis is provided, a plurality of electroless plating tanks are installed on the outer peripheral side of the disk-shaped stand, and a plurality of electroless plating tanks are installed in the electroless plating tank. A printed wiring board to which a catalyst has been applied is immersed in the electroless plating tank filled with an electrolytic plating solution at right angles to the radial direction of the disc-shaped base. Electroless plating is performed while rotating the table.
無電解めっき液が満たされている無電解めっき槽を回転
させながら印刷配線板を無電解めっきすると、遠心力の
ため、無電解めっき液には、円板の台の軸から外側の方
向に向かって力が働く。反対に、スルーホール内の水素
ガスの気泡は、周囲の無電解めっき液より軽いため、円
板状の台の中心軸へ向かって移動し、水素ガスは脱泡さ
れる。When a printed wiring board is electrolessly plated while rotating an electroless plating tank filled with an electroless plating solution, centrifugal force causes the electroless plating solution to move outward from the axis of the disk table. The force works. On the other hand, since the hydrogen gas bubbles in the through-hole are lighter than the surrounding electroless plating solution, they move toward the central axis of the disc-shaped table, and the hydrogen gas is degassed.
さらに、印刷配線板の内の全てのスルーホールの水素ガ
スに、円板状の台の回転速度と中心軸からの距離に比例
した力が中心軸の方向へ働くため、きり径による水素ガ
スの脱泡性のむらがなくなる。Furthermore, since a force proportional to the rotational speed of the disc-shaped table and the distance from the center axis acts on the hydrogen gas in all the through holes in the printed wiring board, the hydrogen gas is Eliminates uneven defoaming performance.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は、本発明の無電解めっきに用いた無電解めっき
装置の一実施例の平面図、第２図は第１図の無電解めっ
き装置の要部断面図、第３図は第１図の無電解めっき槽
が静止しているときの断面図、第４図は第１図の無電解
めっき槽が稼働しているときの断面図である。FIG. 1 is a plan view of an embodiment of the electroless plating apparatus used in the electroless plating of the present invention, FIG. 2 is a sectional view of essential parts of the electroless plating apparatus shown in FIG. FIG. 4 is a cross-sectional view of the electroless plating tank shown in FIG. 1 when it is stationary, and FIG. 4 is a cross-sectional view of the electroless plating tank shown in FIG. 1 when it is in operation.
第１図及び第２図に示すように、まず、円板状の台１を
設け、駆動系９によって中心軸２を中心に回転できる様
にする。As shown in FIGS. 1 and 2, first, a disk-shaped table 1 is provided and made to be rotatable about a central axis 2 by a drive system 9. As shown in FIGS.
次に、円板状の台１の外周側に無電解めっき槽４を設置
し、円板状の台１に固定する。Next, the electroless plating tank 4 is installed on the outer circumferential side of the disc-shaped base 1 and fixed to the disc-shaped base 1.
次に、無電解めっき槽４に無電解めっき液を循環するた
めの循環用配管５を設け、循環用ポンプ６により、無電
解めっき槽４の外側から内側へ、無電解めっき液を循環
させる。Next, a circulation pipe 5 for circulating the electroless plating solution is provided in the electroless plating tank 4, and the circulation pump 6 circulates the electroless plating solution from the outside to the inside of the electroless plating tank 4.
次に、バブリング用のエアー配管７を無電解めっき槽４
内の中心軸２の反対側に設置し、中心軸２を通して外部
のエアー供給管に接続する。無電解めっき槽４は、印刷
配線板３を設置後、ふたをして密閉できるものとし、上
部に通気孔８を設ける。Next, air piping 7 for bubbling is connected to electroless plating tank 4.
It is installed on the opposite side of the inner central shaft 2, and connected to the external air supply pipe through the central shaft 2. The electroless plating tank 4 can be sealed with a lid after installing the printed wiring board 3, and a ventilation hole 8 is provided in the upper part.
次に、無電解めっき液の組成管理をするためのサンプリ
ング管、補充用配管は、中心軸２を通して外部の無電解
めっき液分析及び補充系から無電解めっき槽４に接続す
る。Next, sampling pipes and replenishment pipes for controlling the composition of the electroless plating solution are connected to the electroless plating tank 4 from an external electroless plating solution analysis and replenishment system through the central shaft 2.
以上のように構成された装置を用い、まず、第３図に示
すように、触媒を付与された印刷配線板３を無電解めっ
き槽４内に、円板状の台１の半径方向と直角に設置し、
無電解めっき槽４にふたをして密テする。Using the apparatus configured as described above, first, as shown in FIG. installed in
Cover the electroless plating tank 4 and seal it tightly.
次に、無電解めっき液１０を無電解めっき槽４内に送り
込みほぼ、いっばいに満たす。Next, the electroless plating solution 10 is fed into the electroless plating tank 4 to almost completely fill it.
次に、第４図に示すように、駆動系９によって円板状の
台１を回転させると、印刷配線板３のスルーホール内で
無電解めっき反応によって発生した水素ガスは、中心軸
方向に向かって脱泡される。Next, as shown in FIG. 4, when the disk-shaped table 1 is rotated by the drive system 9, the hydrogen gas generated by the electroless plating reaction in the through holes of the printed wiring board 3 is moved in the central axis direction. The bubbles are defoamed.
アスペクト比２０の印刷配線板について、無電解めっき
液としてアディティブ用無電解めっき液を用いて、めっ
き時間を２０時間として無電解めっきを行なったところ
、スルーホール内のめっきボイドの発生は見られなかっ
た。When electroless plating was performed on a printed wiring board with an aspect ratio of 20 using an additive electroless plating solution and a plating time of 20 hours, no plating voids were observed in the through holes. Ta.
以上説明したように本発明は、印刷配線板を浸漬した無
電解めっき槽を回転させながら無電解めっきを行なう事
により、遠心力が働くなめ、印刷配線板の板厚及びスル
ーホールのきり径によらず、スルーホール内でめっき反
応によって発生した水素ガスを脱泡し、めっき析出不良
をなくす事ができる効果がある。As explained above, the present invention performs electroless plating while rotating the electroless plating tank in which the printed wiring board is immersed, so that the thickness of the printed wiring board and the diameter of the through hole can be adjusted by applying centrifugal force. This has the effect of defoaming the hydrogen gas generated by the plating reaction within the through-hole and eliminating defects in plating deposition.
板、４・・・無電解めっき槽、５・・・循環用配管、６
・・・循環用ポンプ、７・・エアー配管、８・・・通気
孔、９・・・駆動系、１０・・・無電解めっき液。Plate, 4... Electroless plating tank, 5... Circulation piping, 6
... Circulation pump, 7. Air piping, 8. Ventilation hole, 9. Drive system, 10. Electroless plating solution.
Claims (1)
外周側に無電解めっき槽を複数槽設置し、前記無電解め
っき槽に無電解めっき液を満たし、該無電解めっき液を
満たした前記無電解めっき槽に、触媒が付与された印刷
配線板を前記円板状の台の半径方向と直角に浸漬し、前
記円板状の台を回転させながら無電解めっきを行なうこ
とを特徴とする無電解めっき方法。A disc-shaped stand having a central axis is provided, a plurality of electroless plating tanks are installed on the outer circumference side of the disc-shaped stand, the electroless plating tank is filled with an electroless plating solution, and the electroless plating tank is filled with an electroless plating solution. A printed wiring board to which a catalyst has been applied is immersed in the electroless plating bath filled with a plating solution at right angles to the radial direction of the disk-shaped table, and electroless plating is performed while rotating the disk-shaped table. An electroless plating method characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10243589A JP2762548B2 (en) | 1989-04-21 | 1989-04-21 | Electroless plating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10243589A JP2762548B2 (en) | 1989-04-21 | 1989-04-21 | Electroless plating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02282484A true JPH02282484A (en) | 1990-11-20 |
| JP2762548B2 JP2762548B2 (en) | 1998-06-04 |
Family
ID=14327389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10243589A Expired - Fee Related JP2762548B2 (en) | 1989-04-21 | 1989-04-21 | Electroless plating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2762548B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014064153A3 (en) * | 2012-10-24 | 2014-09-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for the metallization of blind vias |
| CN114786366A (en) * | 2022-06-22 | 2022-07-22 | 四川英创力电子科技股份有限公司 | Floating type chemical plating device and method for driving bubbles in holes of circuit board |
-
1989
- 1989-04-21 JP JP10243589A patent/JP2762548B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014064153A3 (en) * | 2012-10-24 | 2014-09-04 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method for the metallization of blind vias |
| CN114786366A (en) * | 2022-06-22 | 2022-07-22 | 四川英创力电子科技股份有限公司 | Floating type chemical plating device and method for driving bubbles in holes of circuit board |
| CN114786366B (en) * | 2022-06-22 | 2022-09-02 | 四川英创力电子科技股份有限公司 | Floating type chemical plating device and method for driving bubbles in holes of circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2762548B2 (en) | 1998-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7727863B1 (en) | Sonic irradiation during wafer immersion | |
| JPS6140737B2 (en) | ||
| JP2006193822A (en) | Plating apparatus, plating method, semiconductor device, and method for manufacturing the semiconductor device | |
| CN1961099A (en) | Chambers, systems, and methods for electrochemically processing microfeature workpieces | |
| JPH02282484A (en) | Electroless plating method | |
| US5167779A (en) | Process and apparatus for electrolyte exchange | |
| JP2007527948A6 (en) | Method and system for processing microfeature workpieces using a flow stirrer and / or multiple electrodes | |
| JP2007527948A (en) | Method and system for processing microfeature workpieces using a flow stirrer and / or multiple electrodes | |
| KR101027810B1 (en) | Liquid Tank | |
| US7108776B2 (en) | Plating apparatus and plating method | |
| JP2008179872A (en) | Surface treatment apparatus | |
| KR20150003510A (en) | Electroplating cell apparatus | |
| JP3877910B2 (en) | Plating equipment | |
| WO2020106590A1 (en) | Cross flow conduit for foaming prevention in high convection plating cells | |
| KR101103442B1 (en) | Wafer plating apparatus | |
| JP3746221B2 (en) | Cup type plating equipment | |
| CN1960799A (en) | Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes | |
| JPS62183036A (en) | Plating equipment for magnetic disc base | |
| WO2017037757A1 (en) | Surface treatment apparatus | |
| JP3877911B2 (en) | Plating equipment | |
| CN215086321U (en) | Anti-splashing material port on inner wall of stirring machine | |
| KR101858855B1 (en) | Phosphate bath module capable of reducing sludge and apparatus for treating surface of material comprising thereof | |
| JPS5958631A (en) | Painting method of magnetic disc | |
| CN218880116U (en) | Film coating device | |
| JP2877217B2 (en) | Surface treatment equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |