JPH02279584A - Diameter control device for single crystal pulling-up device - Google Patents
Diameter control device for single crystal pulling-up deviceInfo
- Publication number
- JPH02279584A JPH02279584A JP10054989A JP10054989A JPH02279584A JP H02279584 A JPH02279584 A JP H02279584A JP 10054989 A JP10054989 A JP 10054989A JP 10054989 A JP10054989 A JP 10054989A JP H02279584 A JPH02279584 A JP H02279584A
- Authority
- JP
- Japan
- Prior art keywords
- control
- speed
- diameter
- circuit
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004033 diameter control Methods 0.000 title claims abstract description 30
- 239000013078 crystal Substances 0.000 title claims abstract description 17
- 239000000155 melt Substances 0.000 claims abstract 3
- 230000007423 decrease Effects 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims description 5
- 230000003247 decreasing effect Effects 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔発明の目的〕 (産業上の利用分野) 本発明は、単結晶引上げ装置の直径制御装置に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a diameter control device for a single crystal pulling device.
(従来の技術)
従来の単結晶引上げ装置は、ルツボの中にシリコン融液
が有り、引き上げ電動機で徐々に結晶の引上げを行い、
シリコン単結晶を製造しており、電動機は速度制御装置
により速度制御されている。(Prior art) A conventional single crystal pulling device has a silicon melt in a crucible, and uses a pulling motor to gradually pull the crystal.
It manufactures silicon single crystals, and the speed of the electric motor is controlled by a speed control device.
そして、速度制御装置は回転発電機(タコジェネレーク
)のフィードバックによって速度制御され、直径制御は
直径制御PID演算回路によってPID制御され、測定
値は工業用カメラで入力したものを画像処理して得られ
、直径制御の操作量は上下限リミット回路を通り速度制
御装置の速度基亭となり、温度制御は温度制御PID演
算回路によりPID制御され、測定値は温度センサによ
り与えられ、温度制御の操作量はヒータに流れる電流を
制御し、温度制御設定値は結晶の引上げ長さの函数とし
てパラメータで与えられる。The speed control device is speed controlled by the feedback of the rotary generator (tacho generator), the diameter control is PID controlled by the diameter control PID calculation circuit, and the measured values are obtained by image processing input with an industrial camera. The manipulated variable for diameter control passes through the upper and lower limit circuits and becomes the speed base of the speed control device, and the temperature control is PID controlled by the temperature control PID calculation circuit, the measured value is given by the temperature sensor, and the manipulated variable for temperature control controls the current flowing through the heater, and the temperature control set point is given by a parameter as a function of the pulled length of the crystal.
そして、温度一定のときは引上げ速度が高くなると直径
は細くなり、引上げ速度が低くなると直径は太くなる。When the temperature is constant, the diameter becomes smaller as the pulling speed increases, and the diameter becomes thicker as the pulling speed becomes lower.
また速度一定のときは温度が高くなると直径は細くなり
、温度が低くなると直径は太くなる。Also, when the speed is constant, the diameter becomes smaller as the temperature increases, and the diameter becomes larger as the temperature decreases.
(発明が解決しようとする課題)
直径制御中に引上げ速度が、ある上下限リミット値より
高くなったり、低くなったりすると結晶切れを起こした
り、特性が均一で無くなったりするので、直径制fal
lPID演算回路の操作量値に上下限リミット回路を設
けているが、直径制御中に上下限リミット回路にかかる
と、速度制御で直径は制御しきれず直径制御は無制御と
なる。(Problem to be solved by the invention) If the pulling speed becomes higher or lower than a certain upper or lower limit value during diameter control, crystal breakage may occur or the characteristics may become uneven, so diameter control fal
Although upper and lower limit circuits are provided for the operation amount value of the lPID calculation circuit, if the upper and lower limit circuits are applied during diameter control, the diameter cannot be fully controlled by speed control and diameter control becomes uncontrolled.
この状態が長く続くと所定の直径のものが得られず、良
品の製品とならない。If this state continues for a long time, it will not be possible to obtain a product with a predetermined diameter, and the product will not be of good quality.
本発明は上下限リミット回路にかかったことを検出して
温度制御PID演算回路の設定値を増減させ、速やかに
上下限リミット領域から脱出させ、引上げ速度による直
径制御に戻す事を目的とする。The object of the present invention is to detect that the upper and lower limit circuits are involved, increase or decrease the set value of the temperature control PID calculation circuit, quickly escape from the upper and lower limit regions, and return to diameter control based on the pulling speed.
(課題を解決するための手段)
本発明は単結晶引上げ装置の直径制御装置において、引
上げ速度制御だけでは直径が制御しきれない領域になっ
たときにこれを検出し、温度$I1gaで補償すること
により直径が制御しきれない領域から制御可能領域に引
戻すことを特徴とする単結晶引上げ装置の直径制御装置
である。(Means for Solving the Problems) The present invention uses a diameter control device for a single crystal pulling device to detect when the diameter reaches a region where it cannot be controlled only by controlling the pulling speed, and to compensate by using a temperature of $I1ga. This is a diameter control device for a single crystal pulling device, which is characterized by pulling the diameter back from an uncontrollable region to a controllable region.
即ち、上下限リミット回路にかかったことを検出し、温
度制御設定値を増減させる単結晶引上げ装置の直径制御
装置である。That is, this is a diameter control device for a single crystal pulling device that detects that the upper and lower limit circuits are connected and increases or decreases the temperature control set value.
(作 用)
上下限リミットにかかると引上げ速度による直径制御が
不能になるので、速度基準が上限リミットにかかったら
直径をより細くしたいが速度制御では制御出来ない領域
になっているため設定温度SVを高くする。これにより
上限リミットにかかっていたものを上下限リミット内に
戻す。反対に速度基準が下限リミットにかかったら直径
をより太くしたいが、速度制御では制御出来ない領域に
なっているため設定温度を低くする。(Function) When the upper and lower limits are reached, it becomes impossible to control the diameter by the pulling speed, so when the speed reference reaches the upper limit, it is desired to make the diameter thinner, but the set temperature SV is in a region that cannot be controlled by speed control. make it higher. As a result, what was within the upper limit is returned to within the upper and lower limits. On the other hand, if the speed standard reaches the lower limit, you would like to make the diameter thicker, but since it is in an area that cannot be controlled by speed control, lower the set temperature.
このときの温度補償はパルス的に与える温度補償量ΔT
と、次に与える温度補償量の時間をパラメータとして各
々設定出来る。The temperature compensation at this time is the temperature compensation amount ΔT given in a pulsed manner.
and the time for the next temperature compensation amount can be set as parameters.
即ち、温度時定数が大きい為、温度補償量ΔTを時間に
対してランプ函数的に与えず、上下限リミットにかかっ
ている時間が予め定められた時間以上持続した場合、更
にパルス的に温度補償量ΔTを与える回路と・する。In other words, since the temperature time constant is large, the temperature compensation amount ΔT is not given as a ramp function with respect to time, and if the time applied to the upper and lower limits continues for more than a predetermined time, temperature compensation is further performed in a pulsed manner. Let it be a circuit that gives a quantity ΔT.
温度補償が無いときの温度設定値をTとすると温度制御
の温度設定値Tsetは下記の式になる。Letting T be the temperature set value when there is no temperature compensation, the temperature set value Tset for temperature control is expressed by the following formula.
TsetmT+ΔT (t) (実施例) 以下本発明を第1図に示す一実施例について説明する。TsetmT+ΔT (t) (Example) The present invention will be described below with reference to an embodiment shown in FIG.
ルツボ1の中にシリコン融液2が有り、引上げ用の電動
機3で徐々に結晶引上を行い、シリコン単結晶を製造す
る。電動機3は速度制御装置4により速度制御され、速
度制御装置4は回転発電機5のフィードバックにより速
度制御する。直径制御は直径$l制御PID演算回路7
によりPID制御され、測定値PVは工業用カメラ8で
入力したものを画像処理して得られ、直径制御の操作量
MVは上下限リミット回路6を通り速度制御装置4の速
度基準となる。There is a silicon melt 2 in a crucible 1, and a crystal is gradually pulled up by a pulling electric motor 3 to produce a silicon single crystal. The speed of the electric motor 3 is controlled by a speed control device 4, and the speed control device 4 controls the speed by feedback from a rotary generator 5. Diameter control is performed by diameter $l control PID calculation circuit 7
The measured value PV is obtained by image processing the inputted value with the industrial camera 8, and the manipulated variable MV for diameter control passes through the upper and lower limit circuit 6 and becomes the speed reference for the speed control device 4.
そして、上下限リミットにかかったことを検出するリミ
ット検出回路12と、リミットにかかったとき設定温度
を増減するための温度補償回路13が設けられている。A limit detection circuit 12 that detects whether the upper or lower limits are reached, and a temperature compensation circuit 13 that increases or decreases the set temperature when the limits are reached are provided.
温度制御は温度制御PID演算回路9によりPID制御
され、測定値PVは温度補償回路13により与えられる
。Temperature control is PID controlled by a temperature control PID calculation circuit 9, and the measured value PV is given by a temperature compensation circuit 13.
リミット検出回路12により直径制御PID演算回路7
の操作m(引上げ速度基準)が上限又は下限にかかった
事を検出し、上限リミットにかかったときは直径が太す
ぎるが引上げ速度制御では制御しきれない領域に有るた
め、温度補償回路13により第2図のごとく一定値を温
度設定値に対し加算し、設定温度を高くし、直径を細く
するようにする。Diameter control PID calculation circuit 7 by limit detection circuit 12
It is detected that the operation m (pulling speed standard) has reached the upper limit or the lower limit. As shown in Fig. 2, a constant value is added to the temperature set value to increase the set temperature and make the diameter thinner.
尚、加算量は時間に対しランプ函数的に与えるのではな
く実際温度に効いてくる時定数が大きいため1シヨツト
で与える。同様に下限リミットにかかったときは直径か
細すぎるものの、引上げ速度制御では制御しきれない領
域に有るため、温度補償回路12により第2図のごとく
一定値を温度設定値に対し減算し、設定温度を低くし、
直径を太くするようにする。Note that the addition amount is not given as a ramp function with respect to time, but is given in one shot because the time constant that actually affects the temperature is large. Similarly, when the lower limit is reached, the diameter is too small, but it is in an area that cannot be controlled by the pulling speed control, so the temperature compensation circuit 12 subtracts a constant value from the temperature set value as shown in Figure 2, and sets the temperature. lower the temperature,
Make the diameter thicker.
以上により速やかに上下限リミット領域から抜けだし、
引上げ温度による直径制御に戻すことにより直径制御が
可能になる。As a result of the above, it quickly escapes from the upper and lower limit areas,
Diameter control becomes possible by returning to diameter control based on pulling temperature.
本発明により、温度設定値を段階的に増加又は、減少さ
せるので、引上げ速度による直径制御に戻し、引き続き
直径制御が可能になる。According to the present invention, the temperature setting value is increased or decreased in steps, so that it is possible to return to diameter control based on the pulling rate and continue diameter control.
第1図は本発明の一実施例を示す直径制御装置の構成図
、第2図は温度補償の説明図である。
7・・・直径制御PID演算回路
9・・・温度制御PID演算回路
lO・・・ヒータ 11・・・温度センサ
12・・・リミット検出回路 13・・・温度補償回
路代理人 弁理士 大 胡 典 夫FIG. 1 is a block diagram of a diameter control device showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of temperature compensation. 7...Diameter control PID calculation circuit 9...Temperature control PID calculation circuit lO...Heater 11...Temperature sensor 12...Limit detection circuit 13...Temperature compensation circuit agent Patent attorney Nori Ogo husband
Claims (1)
度を制御する速度制御装置と、前記融液部を監視する工
業用カメラ装置と、この工業用カメラ装置を画像処理し
て得られる測定値及び予め定めた直径設定値とからPI
D制御して操作量を出力する直径制御PID演算回路と
からなる単結晶引上げ装置の直径制御装置に於て、前記
操作量に基づいて前記速度制御装置に速度基準を与える
上下限リミット回路と、この上下限リミット回路の上下
限リミットにかかったことを検出するリミット検出回路
と、このリミット検出回路からの信号によって設定温度
を増減する温度補償回路とを具備してなる単結晶引上げ
装置の直径制御装置。An electric motor that pulls up a single crystal from a melt, a speed control device that controls the speed of this motor, an industrial camera device that monitors the melt section, and a measured value obtained by image processing the industrial camera device. PI from predetermined diameter setting value
A diameter control device for a single crystal pulling device comprising a diameter control PID calculation circuit that performs D control and outputs a manipulated variable; an upper and lower limit circuit that provides a speed reference to the speed control device based on the manipulated variable; Diameter control of a single crystal pulling device comprising a limit detection circuit that detects whether the upper and lower limits of the upper and lower limit circuits have been reached, and a temperature compensation circuit that increases or decreases the set temperature based on the signal from this limit detection circuit. Device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10054989A JPH02279584A (en) | 1989-04-20 | 1989-04-20 | Diameter control device for single crystal pulling-up device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10054989A JPH02279584A (en) | 1989-04-20 | 1989-04-20 | Diameter control device for single crystal pulling-up device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02279584A true JPH02279584A (en) | 1990-11-15 |
Family
ID=14277027
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10054989A Pending JPH02279584A (en) | 1989-04-20 | 1989-04-20 | Diameter control device for single crystal pulling-up device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02279584A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004018742A1 (en) * | 2002-07-05 | 2004-03-04 | Sumitomo Mitsubishi Silicon Corporation | Method of producing silicon monocrystal |
WO2010048790A1 (en) * | 2008-10-28 | 2010-05-06 | Hui Mengjun | A method for controlling czochralski crystal growth |
-
1989
- 1989-04-20 JP JP10054989A patent/JPH02279584A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004018742A1 (en) * | 2002-07-05 | 2004-03-04 | Sumitomo Mitsubishi Silicon Corporation | Method of producing silicon monocrystal |
WO2010048790A1 (en) * | 2008-10-28 | 2010-05-06 | Hui Mengjun | A method for controlling czochralski crystal growth |
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