JPH0227855U - - Google Patents
Info
- Publication number
- JPH0227855U JPH0227855U JP10532988U JP10532988U JPH0227855U JP H0227855 U JPH0227855 U JP H0227855U JP 10532988 U JP10532988 U JP 10532988U JP 10532988 U JP10532988 U JP 10532988U JP H0227855 U JPH0227855 U JP H0227855U
- Authority
- JP
- Japan
- Prior art keywords
- diamond abrasive
- dresser
- main body
- attaching
- base metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 28
- 239000010432 diamond Substances 0.000 claims description 28
- 239000006061 abrasive grain Substances 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 11
- 239000010953 base metal Substances 0.000 claims description 10
- 238000004070 electrodeposition Methods 0.000 claims 1
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Description
第1図は、この考案の実施例1の拡大斜視図、
第2図は実施例1のダイヤモンド砥粒チツプの拡
大斜視図、第3図は実施例1のダイヤモンド砥粒
チツプ取付け用の金属製の主体の拡大斜視図、第
4図は、実施例2のダイヤモンド砥粒チツプの拡
大斜視図、第5図は、実施例3の拡大側面図、第
6図は実施例4のドレツサー主体の側面図、第7
図は実施例4の側面図、第8図は実施例4の台金
部の斜視図、第9図は他の実施例の縦断面図、第
10図は、この考案の使用状態を示す側面図、第
11図は従来例のダイヤモンド砥粒チツプの拡大
斜視図である。
主要部分の符号の説明、10,30,32……
ダイヤモンド砥粒、12,26……ダイヤモンド
砥粒チツプ、14……シヤンク、16,35,3
6……ダイヤモンド砥粒チツプ取付け用の台金部
、18,33,34……金属製のドレツサー主体
、28……金属板、31……結合部。
FIG. 1 is an enlarged perspective view of Embodiment 1 of this invention;
FIG. 2 is an enlarged perspective view of the diamond abrasive chip of Example 1, FIG. 3 is an enlarged perspective view of the metal main body for attaching the diamond abrasive chip of Example 1, and FIG. 4 is an enlarged perspective view of the diamond abrasive chip of Example 1. FIG. 5 is an enlarged perspective view of a diamond abrasive chip, FIG. 5 is an enlarged side view of Example 3, FIG. 6 is a side view of the dresser main body of Example 4, and FIG.
The figure is a side view of Embodiment 4, FIG. 8 is a perspective view of the base metal part of Embodiment 4, FIG. 9 is a vertical sectional view of another embodiment, and FIG. 10 is a side view showing the state of use of this device. 11 are enlarged perspective views of conventional diamond abrasive grain chips. Explanation of the symbols of the main parts, 10, 30, 32...
Diamond abrasive grain, 12,26...Diamond abrasive chip, 14...Shank, 16,35,3
6... Base metal part for attaching diamond abrasive grain chips, 18, 33, 34... Metal dresser main body, 28... Metal plate, 31... Joint part.
Claims (1)
較的小さなダイヤモンド砥粒10群をつの砥粒1
0間に間隙を生ずることなく少なくとも一層電着
させて薄い板状のダイヤモンド砥粒チツプ12が
設けられ、他方、一側にシヤンク14を備え、他
側にダイヤモンド砥粒チツプ取付け用の台金部1
6を設けてなる金属製のドレツサー主体18が設
けられ、このドレツサー主体18のダイヤモンド
砥粒チツプ取付け用の台金部16の一側面に板状
のダイヤモンド砥粒チツプ12が少なくとも一層
電着されてなるブレード形ダイヤモンドドレツサ
ー。 (2) 粒径が0.200〜0.600mm程度の比
較的小さなダイヤモンド砥粒30群をその砥粒3
0間に間隙を形成することなく少なくとも一層を
0.3〜1mm程度の比較的薄い金属板28に電着
させて板状のダイヤモンド砥粒チツプ26が設け
られ、他方、一側にシヤンク14が設けられ、他
側にダイヤモンド砥粒チツプ取付け用の台金部1
6を設けてなる金属製のドレツサー主体18が形
成され、このドレツサー主体18のダイヤモンド
砥粒チツプ取付け用の台金部16の一側面に板状
のダイヤモンド砥粒チツプ26の金属板28側が
少なくとも一層電着されてなるブレード形ダイヤ
モンドドレツサー。 (3) 一側にシヤンク14を備え、他側にダイヤ
モンド砥粒取付け用の台金部36を設けてなる金
属製のドレツサー主体34が設けられ、このドレ
ツサー主体34のダイヤモンド砥粒取付け用の台
金部36の一側面に0.200〜0.600mm程
度の比較的小さなダイヤモンド砥粒32群がその
砥粒32間に間隙を生ずることなく少なくとも一
層電着されてなるブレード形ダイヤモンドドレツ
サー。 (4) 一側にシヤンク14を備え、他側に台金部
取付け用の結合部31を設けてなる金属製のドレ
ツサー主体33が設けられ、一側面に0.200
〜0.600mm程度の比較的小さなダイヤモンド
砥粒32群がその砥粒32間に間隙を生ずること
なく少なくとも一層電着してなる台金部35を設
け、この台金部35を金属製のドレツサー主体3
3の結合部31に固定させてなるブレード形ダイ
ヤモンドドレツサー。[Scope of claim for utility model registration] (1) 1 abrasive grain consisting of 10 groups of relatively small diamond abrasive grains with a grain size of approximately 0.200 to 0.600 mm.
A thin plate-shaped diamond abrasive chip 12 is provided by electrodepositing at least one layer without creating a gap between the diamond abrasive chips 12, and a shank 14 is provided on one side, and a base metal portion for attaching the diamond abrasive grain chip is provided on the other side. 1
A metal dresser main body 18 is provided, and at least one layer of plate-shaped diamond abrasive chips 12 is electrodeposited on one side of a base metal part 16 of the dresser main body 18 for attaching diamond abrasive chips. A blade-shaped diamond dresser. (2) 30 groups of relatively small diamond abrasive grains with a grain size of about 0.200 to 0.600 mm are used as the abrasive grain 3.
A plate-shaped diamond abrasive chip 26 is provided by electrodepositing at least one layer on a relatively thin metal plate 28 of about 0.3 to 1 mm without forming a gap between the diamond abrasive chips 26 and a shank 14 on one side. A base metal part 1 for attaching diamond abrasive chips is provided on the other side.
A metal dresser main body 18 is formed, and the metal plate 28 side of the plate-shaped diamond abrasive chips 26 is attached to one side of the base metal part 16 of the dresser main body 18 for attaching the diamond abrasive chips. A blade-shaped diamond dresser made by electrodeposition. (3) A metal dresser main body 34 is provided with a shank 14 on one side and a base metal part 36 for attaching diamond abrasive grains on the other side, and a stand for attaching diamond abrasive grains to the dresser main body 34 is provided. A blade-shaped diamond dresser in which at least one layer of relatively small diamond abrasive grains 32 of about 0.200 to 0.600 mm are electrodeposited on one side of a metal part 36 without leaving any gaps between the abrasive grains 32. (4) A metal dresser main body 33 is provided with a shank 14 on one side and a joint 31 for attaching the base metal part on the other side, and a 0.200 mm
A base metal part 35 is provided in which groups of relatively small diamond abrasive grains 32 of approximately 0.600 mm are electrodeposited in at least one layer without creating gaps between the abrasive grains 32, and this base metal part 35 is attached to a metal dresser. Subject 3
A blade-shaped diamond dresser fixed to the connecting portion 31 of No. 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988105329U JPH0621656Y2 (en) | 1988-08-09 | 1988-08-09 | Blade type diamond dresser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988105329U JPH0621656Y2 (en) | 1988-08-09 | 1988-08-09 | Blade type diamond dresser |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0227855U true JPH0227855U (en) | 1990-02-22 |
JPH0621656Y2 JPH0621656Y2 (en) | 1994-06-08 |
Family
ID=31337844
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988105329U Expired - Lifetime JPH0621656Y2 (en) | 1988-08-09 | 1988-08-09 | Blade type diamond dresser |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0621656Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007537890A (en) * | 2004-05-18 | 2007-12-27 | サンーゴバン アブレイシブズ,インコーポレイティド | Brazed diamond dressing tool |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5417474A (en) * | 1977-06-28 | 1979-02-08 | Girling Ltd | Booster device for use in liquid pressure brake system |
-
1988
- 1988-08-09 JP JP1988105329U patent/JPH0621656Y2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5417474A (en) * | 1977-06-28 | 1979-02-08 | Girling Ltd | Booster device for use in liquid pressure brake system |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007537890A (en) * | 2004-05-18 | 2007-12-27 | サンーゴバン アブレイシブズ,インコーポレイティド | Brazed diamond dressing tool |
US8795034B2 (en) | 2004-05-18 | 2014-08-05 | Saint-Gobain Abrasives, Inc. | Brazed diamond dressing tool |
Also Published As
Publication number | Publication date |
---|---|
JPH0621656Y2 (en) | 1994-06-08 |
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