JPH0227737U - - Google Patents
Info
- Publication number
- JPH0227737U JPH0227737U JP10578788U JP10578788U JPH0227737U JP H0227737 U JPH0227737 U JP H0227737U JP 10578788 U JP10578788 U JP 10578788U JP 10578788 U JP10578788 U JP 10578788U JP H0227737 U JPH0227737 U JP H0227737U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- holding surface
- circuit element
- holding
- screw hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Control Of Voltage And Current In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10578788U JPH0227737U (fr) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10578788U JPH0227737U (fr) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227737U true JPH0227737U (fr) | 1990-02-22 |
Family
ID=31338716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10578788U Pending JPH0227737U (fr) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227737U (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (ja) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | 発熱する回路素子を有する回路モジュールおよび携帯形機器 |
-
1988
- 1988-08-10 JP JP10578788U patent/JPH0227737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1097348A (ja) * | 1996-09-20 | 1998-04-14 | Toshiba Corp | 発熱する回路素子を有する回路モジュールおよび携帯形機器 |