JPH02277279A - Simultaneously baked ceramic circuit board - Google Patents
Simultaneously baked ceramic circuit boardInfo
- Publication number
- JPH02277279A JPH02277279A JP9853189A JP9853189A JPH02277279A JP H02277279 A JPH02277279 A JP H02277279A JP 9853189 A JP9853189 A JP 9853189A JP 9853189 A JP9853189 A JP 9853189A JP H02277279 A JPH02277279 A JP H02277279A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- ceramic
- circuit board
- sb2o3
- cracks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title abstract description 32
- 239000004020 conductor Substances 0.000 claims abstract description 24
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 10
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 abstract description 4
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 abstract description 4
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 abstract 1
- 238000010304 firing Methods 0.000 description 10
- 239000000843 powder Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229940058905 antimony compound for treatment of leishmaniasis and trypanosomiasis Drugs 0.000 description 1
- 150000001463 antimony compounds Chemical class 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- -1 sb resinate Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
七二九１へ１吐
Ｅ産業上の利用分野］
本発明は電子機器に使用されるセラミック多層回路基板
に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Use] The present invention relates to a ceramic multilayer circuit board used in electronic equipment.
［従来の技術］ 一般に、セラミック多層回路基板はＷまたはＭ。[Conventional technology] Generally, ceramic multilayer circuit boards are W or M.
を導体とする高アルミナ系の高温焼成＜１５００℃以上
）の多層回路基板を用いているが、アルミナは比誘電率
が高く、導体の導通抵抗も高いため、信号伝播遅延時間
も長くなりコンピュータ等の高速化、高性能化の障害と
なっていた。A multilayer circuit board made of high alumina and fired at a high temperature <1500℃ or higher) is used as a conductor, but since alumina has a high dielectric constant and conductor resistance is high, the signal propagation delay time is also long, making it difficult for computers, etc. This has been an obstacle to increasing speed and performance.
このため、高温焼成多層回路基板に代わるものとして、
基板材料は、例えば特開昭６０−２６０４６５号公報、
特開昭６０−２２７３１１号公報等に、低融点ガラスに
アルミナを添加したセラミックやＡ１□０ｇ−８ｉＯ□
ＣａＯ−ＭｇＯ−Ｂ２Ｏ５系セラミック等を用い、さら
に導体は、例えばＡｇ 、 Ａｇ−Ｐｄ 、 Ｃｕ等の
低抵抗金属を用い、これらを多層に積層した後８００〜
１１００℃で焼成する同時焼成セラミック回路基板が発
表されている。ここで使用されているスルーホール用導
体ペーストは、Ａｇ、 Ａｇ−Ｐｄが酸化雰囲気焼成で
使用されている。Therefore, as an alternative to high-temperature fired multilayer circuit boards,
The substrate material is, for example, disclosed in Japanese Patent Application Laid-Open No. 60-260465,
JP-A No. 60-227311, etc., discloses ceramics made by adding alumina to low-melting glass and A1□0g-8iO□.
Using CaO-MgO-B2O5 ceramic, etc., the conductor is a low resistance metal such as Ag, Ag-Pd, Cu, etc., and after laminating these in multiple layers,
A co-fired ceramic circuit board that is fired at 1100°C has been announced. The through-hole conductor paste used here is made of Ag or Ag-Pd and is fired in an oxidizing atmosphere.
［発明が解決しようとする課題１
導体としてのＡｇおよびＡｇ−Ｐｄは、熱膨張係数がセ
ラミックに比較し、著しく大きく、急激な温度変化によ
ってスルーホール中のＡｇおよびＡｇ−Ｐｄとセラミッ
クとの間に大きな引張応力あるいは圧縮応力がかかり、
導体中やセラミック中にクラックが発生しやすい欠点が
ある。またＡｇ−Ｐｄの場合、焼成中にＰｄが酸化膨張
し、セラミック中へのクラックが発生しやすいという欠
点があった。即ち、同時焼成セラミック基板の焼成中に
基板にクラックを発生させないスルーホール導体の開発
が課題であった。[Problem to be Solved by the Invention 1 Ag and Ag-Pd as conductors have significantly larger coefficients of thermal expansion than ceramics, and rapid temperature changes can cause damage between Ag or Ag-Pd in through holes and ceramics. is subjected to large tensile or compressive stress,
The drawback is that cracks are likely to occur in conductors and ceramics. In addition, in the case of Ag-Pd, Pd oxidizes and expands during firing, which tends to cause cracks in the ceramic. That is, the challenge was to develop a through-hole conductor that does not cause cracks in the substrate during firing of the co-fired ceramic substrate.
主−遣づＦバＩ【
［課題を解決するための手段］
本発明は、スルーホール充填導体がＡｇ、 Ｒｈ、Ｓ
ｂ２Ｏ３よりなり、その組成割合がＡｇ １００重量部
に対しＲｈとＳｂ２Ｏ３をそれぞれ、Ｘおよび７重量部
としたとき、Ｘ、Ｙが下記式の範囲内
（−５／２）Ｘ＋１０．０≧Ｙ ≧（−５）Ｘ ＋０．
０５、Ｘ≧０、Ｙ≧０を満足することを特徴とする同時
焼成セラミック回路基板である。[Means for Solving the Problems] The present invention provides a through-hole filling conductor that is composed of Ag, Rh, and S.
When Rh and Sb2O3 are X and 7 parts by weight, respectively, relative to 100 parts by weight of Ag, X and Y are within the range of the following formula (-5/2): X+10.0≧Y≧ (-5)X +0.
05, a co-fired ceramic circuit board characterized by satisfying X≧0 and Y≧0.
［作用］
本発明は、その構成に示すように、同時焼成後のスルー
ホール導体組成の主組成であるＡｇに対しＲｈ、 Ｓｂ
２Ｏ３を一定範囲量添加することで達成される。即ち、
本発明はペースト中のＡｇ扮体に焼成後Ｓｂ２Ｏ．にな
るｓｂ含有物を添加することによってＡｇ焼結体をポー
ラス状としてＡｇとセラミック間の熱膨張係数の不一致
を防ぐことと、従来のペーストの欠点であるＰｄによる
焼成中の体積膨張を防ぐため、Ｐｄを含有させないこと
で課題を解決したものと考えられる。[Function] As shown in the configuration, the present invention has Rh and Sb in contrast to Ag, which is the main composition of the through-hole conductor composition after co-firing.
This is achieved by adding 2O3 in a certain amount. That is,
In the present invention, Sb2O. By adding sb-containing substances, the Ag sintered body is made porous to prevent mismatch in thermal expansion coefficient between Ag and ceramic, and to prevent volume expansion during firing due to Pd, which is a drawback of conventional pastes. It is thought that the problem was solved by not containing Pd.
第１図に、本発明のＡｇ １００重量部に対するＳｂ、
Ｏ，とＲｈ成分の添加量を図示した。その添加量の組成
限定理由は、第１図の斜線部の左下部ではその添加効果
が見られず、また斜線部の左上部では、導通抵抗が上昇
することおよび焼成収縮量が少なくなるためセラミック
の収縮率と一致しなくなり、焼成時にセラミック中にク
ラックが発生し易くなるためである。本発明に用いる金
属ペースト中のＡｇ粉は、通常市販されている沈澱法ま
たはアトマイズ法等で作製された０粒径０．０１〜１０
０μｍ程度の粉末であり、球状あるいは扁平状粉末でよ
い、また添加するｓｂは、Ｓｂ２Ｏ．無機粉やｓｂレジ
ネート等の有機アンチモン化合物を用い、焼成後Ｓｂ２
０ｇとなるものであればよい。Ｒｈも同様にＲｈ金属粉
体やＲｈレジネート等の有機Ｒｈ化合物等で焼成後Ｒｈ
となるものを使用すればよい。FIG. 1 shows Sb for 100 parts by weight of Ag of the present invention,
The amounts of O, and Rh components added are illustrated. The reason why the amount of addition is limited to the composition is that the effect of its addition is not seen in the lower left part of the shaded area in Figure 1, and the conduction resistance increases and the amount of firing shrinkage decreases in the upper left part of the shaded area. This is because the shrinkage rate does not match the shrinkage rate of the ceramic, and cracks are likely to occur in the ceramic during firing. The Ag powder in the metal paste used in the present invention is prepared by a commercially available precipitation method or atomization method, etc., and has a particle size of 0.01 to 10.
It is a powder of about 0 μm, and may be a spherical or flat powder.The sb added is Sb2O. Using inorganic powder and organic antimony compounds such as sb resinate, Sb2
It is sufficient as long as it gives 0g. Rh is also treated with Rh metal powder or an organic Rh compound such as Rh resinate after firing.
You can use the one that becomes .
［実施例］ 以下実施例で説明する。[Example] This will be explained below using examples.
同時焼成セラミック基板としてはＣａ０−Ａｌ□０３−
５ｉＯ□−Ｂ２０３系ガラスとアルミナ粉の混合物を用
いた。As a co-fired ceramic substrate, Ca0-Al□03-
A mixture of 5iO□-B203 glass and alumina powder was used.
セラミックグリンシートは前記混合物と有機バインダー
（アクリル樹脂）、可塑剤（フタル酸ジブチル）、溶剤
（トルエンとブタノール混合）をボールミルで混合し、
ドクターブレード法にて厚み０．４ ｍｍのセラミック
グリンシートを作製した。導体ペーストは第１表に示し
たそれぞれの金属成分の金属粉末・添加物と有機バイン
ダー（エチルセルロース、またはアクリル樹脂）と溶剤
（テレピネオール）の混合物を三本ロールでよく混合混
練して作製した。The ceramic green sheet is made by mixing the above mixture with an organic binder (acrylic resin), a plasticizer (dibutyl phthalate), and a solvent (a mixture of toluene and butanol) in a ball mill.
A ceramic green sheet with a thickness of 0.4 mm was produced using the doctor blade method. The conductor paste was prepared by thoroughly mixing and kneading a mixture of metal powders and additives of the respective metal components shown in Table 1, an organic binder (ethyl cellulose or acrylic resin), and a solvent (terpineol) using a three-roll roll.
スルーホールは穴径０．３ｍｍφの大きさに金型を用い
て打ち抜き、導体ペーストをスクリン印刷法でスルーホ
ール内に充填した。The through holes were punched out using a mold to have a hole diameter of 0.3 mm, and the through holes were filled with conductive paste using a screen printing method.
実施例１〜６は、第２図に示す同時焼成用グリーンシー
ト１．２．３を用いた本発明の実施例を示す、内部配線
用Ａｇ導体ペースト４をグリーンシート２上に印刷し、
また外部に出るセラミックグリンシート１上には外部配
線用Ａｇ−Ｐｄペースト５を印刷しさらに、オーバーコ
ート８として外部配線用Ａｇ−Ｐｄペースト上にセラミ
ックグリーンシートと同一のセラミック材料を用いたペ
ーストを印刷した。こうして作製した配線印刷とスルー
ホール６内に本発明の導体となる導体ペースト７が充填
されたセラミックグリンシート１を第１層とし、２．３
層はスルーホールのないセラミックグリンシートとして
、この３枚を加熱圧着して積層した。Examples 1 to 6 are examples of the present invention using the green sheet 1.2.3 for simultaneous firing shown in FIG.
Furthermore, an Ag-Pd paste 5 for external wiring is printed on the ceramic green sheet 1 exposed to the outside, and a paste made of the same ceramic material as the ceramic green sheet is printed on the Ag-Pd paste for external wiring as an overcoat 8. Printed. The printed wiring and the ceramic green sheet 1 filled with the conductive paste 7 which becomes the conductor of the present invention in the through holes 6 are used as the first layer, and 2.3
The layers were ceramic green sheets without through holes, and these three sheets were heat-pressed and laminated.
次いで、空気雰囲気中の９００°Ｃで焼成して同時焼成
セラミック回路基板とした。こうして得た試験片を用い
て信頼性試験として、温度サイクル試験（条件は一４０
℃〜＋１５０℃、１００サイクル）を行って、導通抵抗
の変化率、またセラミックおよび導体周辺のクラック発
生の有無を調べた。その結果を第１表に示した。Then, it was fired at 900°C in an air atmosphere to obtain a co-fired ceramic circuit board. Using the test piece obtained in this way, a temperature cycle test (conditions were -40
C. to +150.degree. C. for 100 cycles) to examine the rate of change in conduction resistance and the presence or absence of cracks around the ceramic and conductor. The results are shown in Table 1.
第１表
実施例４のＳｂ２Ｏ．はｓｂレジネートで添加し、その
ほかは５ｂ２ｏ、無機物で添加した。また、実施例１の
ＲｈはＲｈレジネートで添加し、そのほかはＲｈ金属粉
末で添加した。Table 1 Example 4 Sb2O. was added as sb resinate, and the others were added as 5b2o and inorganic substances. Further, Rh in Example 1 was added as Rh resinate, and the others were added as Rh metal powder.
実施例では信頼性試験後、導体周辺および導体中にクラ
ックの発生は全くなく、また導通抵抗の変化率は±０．
９Ｘ以内であった。一方、比較例２は、焼成後には、ク
ラックの発生はみられなかったが、温度サイクル試験後
にクラックが発生し導通抵抗の変化率は＋２％以上であ
った。比較例は焼成後にオーバコートにクラックの発生
がみられた。In the example, after the reliability test, there were no cracks around or inside the conductor, and the rate of change in conduction resistance was ±0.
It was within 9X. On the other hand, in Comparative Example 2, no cracks were observed after firing, but cracks occurred after the temperature cycle test, and the rate of change in conduction resistance was +2% or more. In the comparative example, cracks were observed in the overcoat after firing.
なお、本発明はスルーホールと必要な配線を有する１層
の回路基板であっても良いことは当然であり、スルーホ
ール導体を形成する必要があるセラミック多層回路基板
を作製する全てに利用できる。また、セラミックグリン
シートの代わりにセラミック絶縁体ペーストを用いて多
層化する、いわゆる印刷積層多層回路基板にも応用でき
る。It should be noted that the present invention can of course be applied to a single-layer circuit board having through holes and necessary wiring, and can be used for all productions of ceramic multilayer circuit boards that require the formation of through hole conductors. It can also be applied to so-called printed laminated multilayer circuit boards that are multilayered using ceramic insulating paste instead of ceramic green sheets.
ハ２発明の効果
本発明によれば、スルーホール導体およびその周辺にク
ラックの発生のない高信頼性の同時焼成セラミック回路
基板を低温焼成で得ることができる。C.2 Effects of the Invention According to the present invention, a highly reliable co-fired ceramic circuit board free of cracks in through-hole conductors and their surroundings can be obtained by low-temperature firing.
第１図は本発明のＲｈとＳｂ２Ｏ３の範囲を図示したも
ので斜線部が本発明の範囲を示す。
第２図は本発明の１実施例を示すセラミック多層配線基
板の断面図である。
１．２．３・・・セラミックグリンシート、４・・・内
層導体、５・・・外層導体、６・・・スルーホール、７
・・・スルーホール導体、８・・・オーバーコート。
特許出願人 鳴海製陶株式会社
第２図
手続補正書（自発）
１゜
２゜
３゜
事件の表示
平成１年特許願第０９８５３１、
発明の名称
同時焼成セラミック回路基板
補正をする者
事件との関係 特許出願人
〒 ４５８
住所 名古屋市緑区鳴海町字伝治山３番地４゜
５゜
６゜
補正の命令の日付
補正の対象
図面の第１図
補正の内容
別紙のとおり
自発
Ｘ＝Ｒｈ （重量部）FIG. 1 illustrates the range of Rh and Sb2O3 of the present invention, and the shaded area indicates the range of the present invention. FIG. 2 is a sectional view of a ceramic multilayer wiring board showing one embodiment of the present invention. 1.2.3...Ceramic green sheet, 4...Inner layer conductor, 5...Outer layer conductor, 6...Through hole, 7
...Through-hole conductor, 8...Overcoat. Patent applicant: Narumi Seito Co., Ltd. Figure 2 Procedural amendment (voluntary) 1゜2゜3゜Indication of the case 1999 Patent Application No. 098531, Name of the invention Relationship to the person who amends the co-fired ceramic circuit board case Patent applicant: 458 Address: 3-4, Denjiyama, Narumi-cho, Midori-ku, Nagoya City
Claims (1)
＿３よりなり、その組成割合がＡｇ１００重量部に対し
ＲｈとＳｂ＿２Ｏ＿３をそれぞれ、ＸおよびＹ重量部と
したとき、Ｘ、Ｙが下記式の範囲内 （−５／２）Ｘ＋１０．０≧Ｙ≧（−５）Ｘ＋０．０５
、Ｘ≧０，Ｙ≧０を満足することを特徴とする同時焼成
セラミック回路基板。(1) Through-hole filling conductor is Ag, Rh, Sb_2O
When Rh and Sb_2O_3 are X and Y parts by weight, respectively, with respect to 100 parts by weight of Ag, X and Y are within the range of the following formula (-5/2) X+10.0≧Y≧( -5)X+0.05
, X≧0, Y≧0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853189A JPH0738493B2 (en) | 1989-04-18 | 1989-04-18 | Co-fired ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9853189A JPH0738493B2 (en) | 1989-04-18 | 1989-04-18 | Co-fired ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02277279A true JPH02277279A (en) | 1990-11-13 |
| JPH0738493B2 JPH0738493B2 (en) | 1995-04-26 |
Family
ID=14222262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9853189A Expired - Lifetime JPH0738493B2 (en) | 1989-04-18 | 1989-04-18 | Co-fired ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0738493B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0584726A1 (en) * | 1992-08-21 | 1994-03-02 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
| JPH0669651A (en) * | 1992-08-21 | 1994-03-11 | Sumitomo Kinzoku Ceramics:Kk | Manufacture of ceramic circuit board |
| JPH07235215A (en) * | 1994-02-24 | 1995-09-05 | Nikko Co | Conductive paste for filling through hole |
| JPH08222852A (en) * | 1995-02-14 | 1996-08-30 | Nikko Co | Manufacture of through hole filled up with conductor |
| US5723073A (en) * | 1995-03-30 | 1998-03-03 | Sumitomo Metal (Smi) Electronics Devices Inc. | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same |
-
1989
- 1989-04-18 JP JP9853189A patent/JPH0738493B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0584726A1 (en) * | 1992-08-21 | 1994-03-02 | Sumitomo Metal Ceramics Inc. | Method of fabricating ceramic circuit substrate |
| JPH0669651A (en) * | 1992-08-21 | 1994-03-11 | Sumitomo Kinzoku Ceramics:Kk | Manufacture of ceramic circuit board |
| JPH07235215A (en) * | 1994-02-24 | 1995-09-05 | Nikko Co | Conductive paste for filling through hole |
| JPH08222852A (en) * | 1995-02-14 | 1996-08-30 | Nikko Co | Manufacture of through hole filled up with conductor |
| US5723073A (en) * | 1995-03-30 | 1998-03-03 | Sumitomo Metal (Smi) Electronics Devices Inc. | Conductive paste containing 2-tetradecanol and ceramic circuit substrate using the same |
| DE19611239B4 (en) * | 1995-03-30 | 2005-10-06 | Murata Manufacturing Co. Ltd. | Conductive paste |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0738493B2 (en) | 1995-04-26 |
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