JPH0227672U - - Google Patents
Info
- Publication number
- JPH0227672U JPH0227672U JP10568488U JP10568488U JPH0227672U JP H0227672 U JPH0227672 U JP H0227672U JP 10568488 U JP10568488 U JP 10568488U JP 10568488 U JP10568488 U JP 10568488U JP H0227672 U JPH0227672 U JP H0227672U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- large number
- silicone rubber
- positioning means
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920001971 elastomer Polymers 0.000 claims description 2
- 229920002379 silicone rubber Polymers 0.000 claims 2
- 239000004945 silicone rubber Substances 0.000 claims 2
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す分解斜視図、
第２図は本考案の他の実施例を示す分解斜視図、
第３図及び第４図は従来例を示す部分斜視図であ
る。
３，４……プリント回路基板、５……位置決め
ピン（位置決め手段）、８，１２……入出力端子
、９，１３，１７……位置決め用孔、１６……ゴ
ムコネクタ。
FIG. 1 is an exploded perspective view showing an embodiment of the present invention;
FIG. 2 is an exploded perspective view showing another embodiment of the present invention;
3 and 4 are partial perspective views showing a conventional example. 3, 4... Printed circuit board, 5... Positioning pin (positioning means), 8, 12... Input/output terminal, 9, 13, 17... Positioning hole, 16... Rubber connector.
Claims (1)
プリント回路基板と、このプリント回路基板を所
定の間隔を開けて複数積層支持し互いの位置決め
を行う位置決め手段と、薄い導電性シリコンゴム
、と絶縁性シリコンゴムを多数交互に積層してな
り、上下のプリント回路基板の入出力端子間にそ
の積層面を圧接して介挿されるとともに前記位置
決め手段によつて位置決めされるゴムコネクタか
らなることを特徴とするプリント回路基板の接続
構造。 A printed circuit board consisting of a large number of circuit components fixed in a circuit pattern, a positioning means for supporting a plurality of printed circuit boards stacked at predetermined intervals and positioning each other, a thin conductive silicone rubber, and an insulating material. The rubber connector is made of a large number of alternately laminated layers of silicone rubber, and is inserted between input and output terminals of upper and lower printed circuit boards with the laminated surfaces in pressure contact, and is positioned by the positioning means. Connection structure of printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10568488U JPH0227672U (en) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10568488U JPH0227672U (en) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0227672U true JPH0227672U (en) | 1990-02-22 |
Family
ID=31338519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10568488U Pending JPH0227672U (en) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0227672U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018022788A (en) * | 2016-08-04 | 2018-02-08 | Ｎｅｃスペーステクノロジー株式会社 | Printed board connection structure |
-
1988
- 1988-08-10 JP JP10568488U patent/JPH0227672U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018022788A (en) * | 2016-08-04 | 2018-02-08 | Ｎｅｃスペーステクノロジー株式会社 | Printed board connection structure |
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