JPH0227608A - Heatproof insulating compound sheet - Google Patents

Heatproof insulating compound sheet

Info

Publication number
JPH0227608A
JPH0227608A JP63178555A JP17855588A JPH0227608A JP H0227608 A JPH0227608 A JP H0227608A JP 63178555 A JP63178555 A JP 63178555A JP 17855588 A JP17855588 A JP 17855588A JP H0227608 A JPH0227608 A JP H0227608A
Authority
JP
Japan
Prior art keywords
sheet
aspect ratio
reinforcing filler
scaly
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63178555A
Other languages
Japanese (ja)
Inventor
Katsura Ito
桂 伊藤
Hirosumi Izawa
伊沢 広純
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP63178555A priority Critical patent/JPH0227608A/en
Publication of JPH0227608A publication Critical patent/JPH0227608A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To have a raise in the heatproof limit of the sheet in the title, by using polyorganosiliceus-quioxane prepared through a heat curing process on an organosiliceus-quioligomer as a binder of scaly or fibrous power which has a specific aspect ratio. CONSTITUTION:As a reinforcing filler, it is required to prepare a composition consisting of 10 to 1,000wt.% of scaly or fibrous powder having its aspect ratio of not less than 10 against 100wt.% of polyorganosiliceus-quioxane. The reinforcing filler has a function to form the skeletal structure of a compound sheet so as to produce a reinforcing effect. This function therefore, can not be exhibited unless the scaly or fibrous powder being used has an aspect ratio of not less than 10. Moreover, the filling amount of the reinforcing filler is adequate to have its extent from 10 to 1,000wt.% against 100wt.% of the organosiliceus-quaoxane oligomer. If the amount is less than 10wt.%, it is impossible to form the skeletal structure of the compound sheet to its perfection with the mechanical characteristic remaining unimproved, and if the amount exceeds 1,000wt.%, the strength of the compound sheet is reduced without having any effect required as the function of a binder. The heatproof limit of the sheet is thus raised.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電気・電子機器の絶縁材およびフレキシブル
プリント基板、難燃紙、壁装材等に用いられる耐熱絶縁
シートに関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat-resistant insulating sheet used for insulating materials for electrical and electronic equipment, flexible printed circuit boards, flame-retardant paper, wall covering materials, and the like.

従来の技術 従来の耐熱絶縁複合シートには、主として天然マイカま
たは合成マイカが補強用充填材として使われ、シート化
するための有機系バインダーとしては、例えば[特開昭
48−7073Jに示されるポリオレフィン、ポリ塩化
ビニル、ポリアミド、[特開昭52−88141Jに示
されるイソシアネート化合物、「特開昭57−8259
8Jに示されるエポキシ樹脂、不飽和ポリエステル樹脂
、シリコーン樹脂等が知られている。又、無機系バイン
ダーとしては、例えば「特公昭43−17880Jに示
されるコロイダルシリカ、コロイダルアルミナ、[特開
昭48−70096Jに示されるBa0−P2O3を基
本成分とするリン酸塩ガラス、「特開昭57−8259
8Jに示されるリン酸アルミニウム組成物等が知られて
いる。
BACKGROUND ART In conventional heat-resistant insulating composite sheets, natural mica or synthetic mica is mainly used as a reinforcing filler, and as an organic binder for forming the sheet, for example, [polyolefin shown in JP-A-48-7073J] , polyvinyl chloride, polyamide, [isocyanate compounds shown in JP-A-52-88141J, "JP-A-57-8259"
Epoxy resins, unsaturated polyester resins, silicone resins, etc. shown in No. 8J are known. Examples of inorganic binders include colloidal silica and colloidal alumina shown in Japanese Patent Publication No. 43-17880J, phosphate glass containing Ba0-P2O3 as a basic component shown in Japanese Patent Application Publication No. 48-70096J, and Showa 57-8259
An aluminum phosphate composition shown in No. 8J is known.

発明が解決しようとする課題 有機系バインダーを用いた絶縁シートは、無機系バイン
ダーの場合に比べ、バインダーの硬化には余り高温を必
要としないし、高い透明性が得られる。また電気特性、
耐湿性、可撓性にも優れた特性を持ち、広く用いられて
いる。ところが、バインダーとして用いる有機物そのも
のの物性から耐熱性が低く、使用限界は、最も耐熱性の
高いシリコーン樹脂またはポリイミド系樹脂でも最高4
50℃程度であると言われている。
Problems to be Solved by the Invention Compared to the case of inorganic binders, insulating sheets using organic binders do not require much high temperature for curing the binder, and high transparency can be obtained. Also, the electrical properties
It has excellent moisture resistance and flexibility, and is widely used. However, due to the physical properties of the organic material itself used as a binder, it has low heat resistance, and even the most heat-resistant silicone resin or polyimide resin has a maximum usage limit of 4.
It is said to be around 50°C.

ところが、耐熱性に対する要求は、電気機器の高集積化
および高い安全性に対する要求と相まって、増々強くな
っており、前記の耐熱的限界を超える複合シートの出現
が強く望まれている。
However, the demand for heat resistance is becoming increasingly strong, coupled with the demand for higher integration of electrical equipment and higher safety, and there is a strong desire for the emergence of a composite sheet that exceeds the above-mentioned heat resistance limit.

課題を解決するための手段 本発明者は耐熱的限界を向上させるべく種々検討した結
果、アスペクト比が10以上の鱗片状または繊維状粉末
のバインダーとして、オルガノシルセスキオリゴマーを
熱硬化せしめたポリオルガノシルセスキオキサンが最適
であるとの結論に達し、ポリオルガノシルセスキオキサ
ン100重量部に対し、補強用充填材としてアスペクト
比が10以上の鱗片状または、繊維状粉末lO〜1oo
oi量部よりなる耐熱絶縁複合シートを提供するもので
ある。
Means for Solving the Problems As a result of various studies in order to improve the heat resistance limit, the present inventor has developed a polyorganosilsesquioligomer thermosetted organosilsesquioligomer as a binder for scale-like or fibrous powder having an aspect ratio of 10 or more. It was concluded that silsesquioxane is optimal, and scaly or fibrous powder with an aspect ratio of 10 or more is added as a reinforcing filler to 100 parts by weight of polyorganosilsesquioxane.
The present invention provides a heat-resistant insulating composite sheet comprising oi parts.

補強用充填材としては、アスペクト比が10以上のマイ
カ等の鱗片状粉末または繊維状粉末が使用できる。
As the reinforcing filler, a scaly powder or fibrous powder such as mica having an aspect ratio of 10 or more can be used.

アスペクト比とは鱗片状粉末の場合、粉末の径を厚みで
割った値をいい、繊維状粉末の場合、粉末の長袖方向の
長さを短軸方向の幅または径で割った値をいう。
In the case of scaly powder, the aspect ratio refers to the value obtained by dividing the powder diameter by the thickness, and in the case of fibrous powder, it refers to the value obtained by dividing the length in the long direction of the powder by the width or diameter in the short axis direction.

使用できるマイカの種類としては、白雲母、金雲母、黒
雲母等の天然マイカでも良いし、フッ素金雲母で代表さ
れる合成マイカでも良い。
The types of mica that can be used include natural mica such as muscovite, phlogopite, and biotite, and synthetic mica such as fluorophlogopite.

また使用できる鱗片状粉末としては、マイカ類の他に、
六方晶窒化硼素、黒鉛、二硫化モリブデン等があげられ
る。また繊維状粉末としては、アルミナ繊維、シリカ繊
維、炭化珪素ウィスカー等である。バインダーとして使
用するオルガノシルセスキオリゴマーは、一般式で表わ
すと〔R1〜R8は、 末端はOH基、 アルキル基又はフェニル基、 OCH基又はOC2H5基等〕 となり、ラダー(梯子)型シリコーン系オリゴマーで加
熱によって縮合してラダー間の橋かけ構造となり三次元
的なポリオルガノシルセスキオキサンになる熱硬化性樹
脂である。その優れた耐熱性、電気絶縁性、耐アーク性
、耐候性、耐炎性等に優れて、絶縁膜、保護膜等に使用
されている。
In addition to mica, other scaly powders that can be used include
Examples include hexagonal boron nitride, graphite, and molybdenum disulfide. Examples of the fibrous powder include alumina fiber, silica fiber, and silicon carbide whiskers. The organosilsesquioligomer used as a binder is represented by the general formula [R1 to R8 are terminals of OH group, alkyl group, phenyl group, OCH group, OC2H5 group, etc.], and is a ladder-type silicone oligomer. It is a thermosetting resin that condenses when heated to form a bridge structure between ladders and become a three-dimensional polyorganosilsesquioxane. It has excellent heat resistance, electrical insulation, arc resistance, weather resistance, flame resistance, etc., and is used for insulating films, protective films, etc.

しかしながら、従来、その使用法としては、オリゴマー
を有機溶媒に溶解してワニスにしたものを塗料用ビヒク
ル、コーティング用ビヒクルあるいは成形および積層用
バインダーとして用いるのみであった。
However, conventionally, the oligomers have only been used as varnishes by dissolving them in organic solvents as paint vehicles, coating vehicles, or binders for molding and lamination.

ポリオルガノシルセスキオキサンの優れた性質を引き出
した用途としてポリオルガノシルセスキオキサンをフィ
ルムまたはシート状として電気・電子部品用の絶縁フィ
ルムまたはシートとして利用することが考えられるが、
オリゴマーのワニスをフィルム状に展延して乾燥硬化さ
せたシートは、それ自身可撓性がほとんどなく、使用に
耐えないものである。
One possible application that brings out the excellent properties of polyorganosilsesquioxane is to use polyorganosilsesquioxane in the form of a film or sheet as an insulating film or sheet for electrical and electronic parts.
A sheet made by spreading an oligomer varnish into a film and drying and hardening it has almost no flexibility and cannot be used.

ポリオルガノシルセスキオキサンと前述のマイカ等のア
スペクト比10以上の鱗片状または繊維状粉末とを複合
シート化することによって初めて使用に耐え、可撓性の
ある耐熱絶縁複合シートが造れるのである。
By forming a composite sheet of polyorganosilsesquioxane and the above-mentioned mica or other scaly or fibrous powder with an aspect ratio of 10 or more, a heat-resistant insulating composite sheet that is durable and flexible can be produced.

補強用充填材の役割としては充填材が鱗片状粉末の場合
は、鱗片の広い面同志が密接して連なり、繊維状粉末の
場合は粉末同志が絡み合う様にして、骨格構造を作り補
強効果が出るものと考えられる。
The role of the reinforcing filler is that when the filler is a scaly powder, the wide surfaces of the scales are closely connected, and when it is a fibrous powder, the powders are intertwined to form a skeletal structure and have a reinforcing effect. It is thought that it will come out.

そのためには補強用充填材として使用する鱗片状あるい
は繊維状粉末はアスペクト比が10以上でないと機能を
発揮せず、ひいては複合シートとして機械的特性も高く
ならない。アスペクト比を高くするにこしたことがない
場合もあるがアスペクト比が300以上の補強用充填材
を造ることは難しい。
For this purpose, the scaly or fibrous powder used as the reinforcing filler must have an aspect ratio of 10 or more to function, and as a result, the composite sheet will not have high mechanical properties. Although there are cases where it is desirable to increase the aspect ratio, it is difficult to produce a reinforcing filler with an aspect ratio of 300 or more.

バインダーとして使用するオルガノシルセスキオキサン
オリゴマーは、アルコール、エステル。
The organosilsesquioxane oligomers used as binders are alcohols and esters.

ケトン等の極性溶剤、およびトルエン等の芳香族系溶剤
に可溶で、その溶液であるワニスは低粘度であり、種々
の有機溶剤が使用できる。オルガノシルセスキオキサン
オリゴマーを有機溶剤に溶解し、ワニスにする場合、オ
リゴマーの濃度は、作成する複合シートの目標厚さおよ
び補強用充填材の種類に応じて異なるが好ましい濃度範
囲は、10〜50vt、%で、1Ovt、5未満では緻
密なコート層が出来にくいし、50vt、%を越えると
ワニスの粘度が上がり過ぎ、均一なコート層が造りにく
く、また取扱いもしにくい。
It is soluble in polar solvents such as ketones and aromatic solvents such as toluene, and the varnish that is the solution thereof has a low viscosity, and various organic solvents can be used. When an organosilsesquioxane oligomer is dissolved in an organic solvent to make a varnish, the concentration of the oligomer varies depending on the target thickness of the composite sheet to be created and the type of reinforcing filler, but the preferred concentration range is 10 to 10. If the varnish is less than 1 Ovt, 50%, it is difficult to form a dense coating layer, and if it exceeds 50vt, %, the viscosity of the varnish increases too much, making it difficult to form a uniform coating layer, and making it difficult to handle.

補強用充填材である鱗片状あるいは繊維状粉末をワニス
に分散させる方法は、特に問わないが、ボールミル、振
動ミル、媒体撹拌ミル、プラネタリ−ミル等の一般的な
分散機で分散し、スラリー化すればよい。こうして得ら
れたスラリーを用いて耐熱絶縁複合シートを造るには、
ドクターブレード法、ロールコータ−法、カレンダー法
等を用いて、離形性フィルムの上にスラリーを展延した
後、溶剤を蒸発させる乾燥工程、樹脂を固化させる熱処
理工程を経た後、離形性フィルムから剥がすことで得ら
れる。この熱処理条件は、120〜250℃で、0.1
〜40時間程度である。
There is no particular method for dispersing the scaly or fibrous powder, which is a reinforcing filler, into the varnish, but it can be dispersed using a general dispersion machine such as a ball mill, vibration mill, media stirring mill, or planetary mill to form a slurry. do it. To make a heat-resistant insulating composite sheet using the slurry obtained in this way,
After spreading the slurry on a releasable film using a doctor blade method, roll coater method, calendar method, etc., it is subjected to a drying process to evaporate the solvent and a heat treatment process to solidify the resin. Obtained by peeling off the film. The heat treatment conditions were 120 to 250°C, 0.1
~40 hours.

上記の他にシート化する方法としては、抄造法でもよく
、補強用充填材のみを単独に抄造したシートに前述のワ
ニス液を含浸するか、スプレーコートするか、ロールコ
ートする方法等により行なうことも可能である。
In addition to the method described above, a paper-forming method may be used, and a sheet made of only the reinforcing filler may be impregnated with the above-mentioned varnish, spray coated, or roll coated. is also possible.

上記の種々の方法でシート化され硬化熱処理されたシー
ト膜厚は、20〜500μsが好ましい値である。
The thickness of the sheet formed into a sheet by the various methods described above and subjected to curing heat treatment is preferably 20 to 500 μs.

補強用充填材のアスペクト比は、抄造法の場合、50以
上が好ましく、ドクターブレード法、ロールコータ−法
等のコーター法の場合、20以上が好ましい。
The aspect ratio of the reinforcing filler is preferably 50 or more in the case of a papermaking method, and preferably 20 or more in the case of a coater method such as a doctor blade method or a roll coater method.

また、補強用充填材の充填量はオルガノシルセスキオキ
サンオリゴマー100ffiJ1部に対し10〜100
0重量部が適当であり、10重量部未満では、複合シー
トの骨格構造が十分に出来ず、機械的特性も高くならな
いし、1000重量部を越えるとバインダーとしての効
果を持たず、また却って複合シートの強度が失なわれる
ことになる。
In addition, the filling amount of the reinforcing filler is 10 to 100 per part of 100ffiJ of organosilsesquioxane oligomer.
0 parts by weight is suitable; if it is less than 10 parts by weight, the skeleton structure of the composite sheet will not be sufficiently formed and the mechanical properties will not be high; if it exceeds 1000 parts by weight, it will not have the effect as a binder, and on the contrary, The strength of the sheet will be lost.

実施例 以下、本発明を実施例により詳しく説明する。Example Hereinafter, the present invention will be explained in detail with reference to Examples.

実施例 1 市販の合成マイカ粉末(オオタケセラム製、平均粒径2
50m、アスペクト比+10)61Hを11)の水中で
15分間撹拌分散後、スタンダードシートマシーン(熊
谷理機工業製)にて、159■璽φのウェットシートを
抄造した。得られたウェットシートを熱風乾燥器にて、
105℃で3時間乾燥後、側鎖が全てメチル基であるオ
ルガノシルセスキオキサンオリゴマーの30vt、%エ
タノール溶液中に15秒間浸漬し、引き上げた。そのシ
ートを熱風乾燥器にて、100℃で1時間乾燥し、更に
150℃で35時間熱処理した。
Example 1 Commercially available synthetic mica powder (manufactured by Otake Ceram, average particle size 2
After stirring and dispersing 61H (50 m, aspect ratio +10) in water of 11) for 15 minutes, a wet sheet of 159 mm diameter was made using a standard sheet machine (manufactured by Kumagai Riki Kogyo). The obtained wet sheet is dried in a hot air dryer.
After drying at 105° C. for 3 hours, it was immersed for 15 seconds in a 30% ethanol solution of an organosilsesquioxane oligomer whose side chains were all methyl groups, and then pulled out. The sheet was dried in a hot air dryer at 100°C for 1 hour, and further heat-treated at 150°C for 35 hours.

この様にして得られた複合シートは、厚みが85虜で透
明であり、引張強度をテンシロン測定機にて測定したと
ころ1.5kg/−と強く、非常に柔軟性があった。ま
た、絶縁抵抗値は、1.OX 10’Ω・1以上と高く
、更に表面に水滴を落としても全く浸透を起こさなかっ
た。また、熱処理後のシートを更に800℃で1時間熱
し、そのシートの引張強度、絶縁抵抗を測定した結果、
それぞれの測定値が1.5kg/mj、冊X1013Ω
・(1)と再熱処理前と比べほとんど変りがなかった。
The thus obtained composite sheet had a thickness of 85 mm and was transparent, had a tensile strength of 1.5 kg/- when measured using a Tensilon measuring machine, and was extremely flexible. In addition, the insulation resistance value is 1. OX was high at 10'Ω·1 or more, and even when water droplets were dropped on the surface, no penetration occurred at all. In addition, the sheet after heat treatment was further heated at 800°C for 1 hour, and the tensile strength and insulation resistance of the sheet were measured.
Each measurement value is 1.5kg/mj, book x 1013Ω
- There was almost no difference compared to (1) before reheat treatment.

実施例 2 市販の合成マイカ粉末(オオタケセラム製、平均粒径1
0μ、アスペクト比40)を用い、その200gを実施
例1と同様のオルガノシルセスキオキサンオリゴマーの
30vt、%エタノール溶液600ccと予備混合した
後、内容積6gのボットミルにて24時間分散した。こ
うして得られた粘稠なスラリーを原料としてドクターブ
レードにてシート化して、乾燥、熱処理し厚み95虜1
幅210關の長尺シートを得た。
Example 2 Commercially available synthetic mica powder (manufactured by Otake Ceram, average particle size 1
0 μ, aspect ratio 40), 200 g of the same was premixed with 600 cc of a 30 vt, % ethanol solution of the same organosilsesquioxane oligomer as in Example 1, and then dispersed for 24 hours in a bot mill with an internal volume of 6 g. The viscous slurry obtained in this way is used as a raw material and is made into a sheet with a doctor blade, dried and heat treated to a thickness of 95mm.
A long sheet with a width of about 210 mm was obtained.

このものは透明であり、引張強度も1.3kg/a+i
と高く、絶縁抵抗も1.OX 1013Ω・備以上と高
い値が得られた。
This item is transparent and has a tensile strength of 1.3kg/a+i
It has a high insulation resistance of 1. A high value of more than OX 1013Ω was obtained.

このシートを実施例1と同じく更に600℃で1時間熱
した後の引張強度、絶縁抵抗は、それぞれ1−2kg/
+eJ、I×1013Ω・備以上とほとんど変化はなか
った。
After heating this sheet at 600°C for 1 hour in the same manner as in Example 1, the tensile strength and insulation resistance were 1-2 kg/1, respectively.
+eJ, I×1013 Ω・There was almost no change.

実施例 3 側鎖がメチル基2に対しフェニル基1であるオルガノシ
ルセスキオキサンオリゴマー300gをエタノール57
0ccに溶解させた後、平均粒径9−、アスペクト比2
0の六方晶窒化硼素粉末225gを添加し、ラボスター
ラーにて30分間予予備金し、更に内容積6gのアルミ
ナ製ボットミルに入れ、直径20龍φのアルミナボール
2.4j!を添加し、65「p−で24時間混合した。
Example 3 300 g of an organosilsesquioxane oligomer whose side chains are 2 methyl groups and 1 phenyl group was added to 57 g of ethanol.
After dissolving in 0cc, average particle size 9-, aspect ratio 2
Add 225 g of hexagonal boron nitride powder of 0.0 ml, pre-prepare for 30 minutes in a lab stirrer, and then place it in an alumina bot mill with an internal volume of 6 g, and form 2.4 j! was added and mixed for 24 hours at 65"p-.

こうして得られたスラリーをドクターブレード型シート
成形機にてウェットシート厚さ 150fiの設定によ
りシート化し、150℃で35時間の条件で硬化後、膜
厚57虜のシートが得られた。
The slurry thus obtained was formed into a sheet using a doctor blade type sheet forming machine with a wet sheet thickness of 150 fi, and after curing at 150° C. for 35 hours, a sheet with a film thickness of 57 mm was obtained.

このシートは、可撓性があり、また引張強度の測定を行
なったところ1.8kg/−と高かった。
This sheet was flexible, and when the tensile strength was measured, it was as high as 1.8 kg/-.

実施例 4〜7 実施例3と同じオルガノシルセスキオキサンオリゴマー
のエタノール溶液を用い、補強用充填材として、合成マ
イカ粉末(平均粒径20Hn 、アスペクト比50)、
アルミナ繊維(繊維径9Itm、アスペクト比25)、
アルミナ・シリカ繊維(繊維径3虜。
Examples 4 to 7 Using the same ethanol solution of organosilsesquioxane oligomer as in Example 3, as a reinforcing filler, synthetic mica powder (average particle size 20Hn, aspect ratio 50),
Alumina fiber (fiber diameter 9Itm, aspect ratio 25),
Alumina/silica fiber (fiber diameter 3.

アスペクト比40)および炭化珪素ウィスカー(繊維径
2趨、アスペクト比30)をそれぞれ独立に用いた場合
、実施例3と同様なシートを造り、特性評価を行ない表
・1の結果を得た。
When a silicon carbide whisker (aspect ratio 40) and a silicon carbide whisker (fiber diameter 2, aspect ratio 30) were used independently, sheets similar to those in Example 3 were made and properties were evaluated, and the results shown in Table 1 were obtained.

表     1 比較例 実施例3と同じオルガノシルセスキオキサンオリゴマー
のエタノール溶液を用い充填材として、実施例3と同じ
六方晶窒化硼素を20g添加してシート化したものは、
可撓性がなかった。
Table 1 Comparative Example The same ethanol solution of organosilsesquioxane oligomer as in Example 3 was used as a filler, and 20 g of hexagonal boron nitride as in Example 3 was added to form a sheet.
It had no flexibility.

発明の効果 本発明の耐熱絶縁複合シートは、補強用充填材としてマ
イカ類を用いた場合、高い透明性、可撓性および撥水性
を保持したまま、耐熱限界は500℃以上、最大600
℃程度に引き上げられ、マイカ類以外のアスペクト比1
0以上の充填材を用いても透明性はマイカの場合より劣
るが他の特性は損なわれることなく、変圧器の素線1層
問およびバリヤーの絶縁、高圧の電動機や発電機の導体
絶縁用を始めとする耐熱絶縁性を要求されるシートの使
用および応用が可能になる。
Effects of the Invention When mica is used as a reinforcing filler, the heat-resistant insulating composite sheet of the present invention maintains high transparency, flexibility, and water repellency, and has a heat resistance limit of 500°C or higher and a maximum temperature of 600°C.
℃, and the aspect ratio of non-micas is 1.
Even when a filler of 0 or more is used, the transparency is inferior to that of mica, but other properties are not impaired, and it can be used for insulation of single layer wires and barriers of transformers, and conductor insulation of high-voltage motors and generators. This makes it possible to use and apply sheets that require heat-resistant insulation, such as .

Claims (2)

【特許請求の範囲】[Claims] (1)ポリオルガノシルセスキオキサン100重量部に
対し、補強用充填材としてアスペクト比が10以上の鱗
片状または繊維状粉末10〜1000重量部よりなる耐
熱絶縁複合シート。
(1) A heat-resistant insulating composite sheet comprising 10 to 1000 parts by weight of scale-like or fibrous powder having an aspect ratio of 10 or more as a reinforcing filler to 100 parts by weight of polyorganosilsesquioxane.
(2)補強用充填材が天然マイカまたは合成マイカ粉末
である第1項記載の耐熱絶縁複合シート。
(2) The heat-resistant insulating composite sheet according to item 1, wherein the reinforcing filler is natural mica or synthetic mica powder.
JP63178555A 1988-07-18 1988-07-18 Heatproof insulating compound sheet Pending JPH0227608A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63178555A JPH0227608A (en) 1988-07-18 1988-07-18 Heatproof insulating compound sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63178555A JPH0227608A (en) 1988-07-18 1988-07-18 Heatproof insulating compound sheet

Publications (1)

Publication Number Publication Date
JPH0227608A true JPH0227608A (en) 1990-01-30

Family

ID=16050533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63178555A Pending JPH0227608A (en) 1988-07-18 1988-07-18 Heatproof insulating compound sheet

Country Status (1)

Country Link
JP (1) JPH0227608A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738865A (en) * 1980-08-21 1982-03-03 Fujitsu Ltd Film-forming resin composition
JPS5818809A (en) * 1981-07-24 1983-02-03 株式会社デンソー Overload resistant insulating wire and method of producing same
JPS5920911A (en) * 1982-07-28 1984-02-02 住友ベークライト株式会社 Pps composition and sealed electronic part

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5738865A (en) * 1980-08-21 1982-03-03 Fujitsu Ltd Film-forming resin composition
JPS5818809A (en) * 1981-07-24 1983-02-03 株式会社デンソー Overload resistant insulating wire and method of producing same
JPS5920911A (en) * 1982-07-28 1984-02-02 住友ベークライト株式会社 Pps composition and sealed electronic part

Similar Documents

Publication Publication Date Title
CA1133648A (en) Silicone composition which forms a ceramic at high temperatures
KR850000140A (en) Powder Core Magnetic Device
EP1765929B1 (en) High thermal conductivity organic-inorganic resin materials with grafted functional groups bridging the organic part to the inorganic part and porous materials comprising the resin
DE3008084C2 (en)
JP5574703B2 (en) Mixture of grafted and ungrafted particles in resin
US8039530B2 (en) High thermal conductivity materials with grafted surface functional groups
DE3213247C2 (en)
KR100472738B1 (en) Coating composition for metallic conductors and coating method using same
JP6317322B2 (en) Thermally conductive platy pigments coated with aluminum oxide
EP0115399A2 (en) Synthetic mica products
JP2002206060A (en) Varnish composition, method for manufacturing the composition, coated winding wire and resultant coil
CN116057814A (en) Powder coating formulation for an insulation system of an electric machine, electric machine with such an insulation system and method for manufacturing such an insulation system
JPH0227608A (en) Heatproof insulating compound sheet
NL8004628A (en) CORONA-RESISTANT RESINS, INSULATING MATERIAL IN WHICH THIS IS APPLIED, AND METHODS.
US2620317A (en) Organosiloxane films
CA1168857A (en) Corona-resistant resin compositions
JP2000256618A (en) Resin composition and film-forming material comprising same
JP2927589B2 (en) Heat-resistant fiber binder, heat-resistant fiber nonwoven fabric and method for producing the same
TWI830495B (en) Resin composition and use thereof
JP2859904B2 (en) Heat resistant coil
CN108864973A (en) A kind of film low resin mica tape of heat-resistant fireproof
JPS6168813A (en) Electrically insulating sheet having corona resistance discharge characteristic and insulating withstand breakdown voltage characteristic
JPS6110922B2 (en)
US3834938A (en) Flameproof moisture-resistant coatings for electrical components
JPH06262694A (en) Heat resistive sheet