JPH0227598Y2 - - Google Patents

Description

[Detailed explanation of the invention] [Purpose of the invention] (Field of industrial application) The invention is a method of continuously transporting a large number of small electronic substrates in a connected state and sequentially subjecting them to various processing such as painting, baking, display printing, etc. The present invention relates to a device for transporting small electronic substrates.

(Prior art) Conventionally, in order to connect a plurality of lead wires to an electronic component board having a plurality of electrodes, a long lead wire board on which a number of lead wires are protruded in a comb-teeth shape is connected to an appropriate length, for example, about 50 cm. A plurality of electrodes of a plurality of electronic component boards are welded to the lead wires of the cut lead wire board pieces to hold a plurality of electronic component boards on the lead wire board pieces. The lead wire board pieces holding the component boards are placed in a transportation box or the like and transported to the painting process, where each lead wire board piece is painted on the electronic component board, and once the coating is completed, each lead wire board piece is reassembled. Each item is placed in a transport box and transported to the printing process, where it is printed in the same way, and then it is similarly transported to the display printing process where markings are applied. That is, there was a problem in that continuous work could not be carried out because the lead wire board pieces with a length of about 50 cm to which a plurality of electronic component boards were attached were carried out and processed in units.

Furthermore, in Japanese Utility Model Application Publication No. 56-154100, a magnet is placed horizontally on a conveyance path through which parts connected by a lead wire board are sent horizontally, and the lead wire board of the part is strongly attracted to the magnet, thereby allowing parts to be separated. A conveyance device is arranged to correct warpage and twist.

(Problems to be solved by the invention) The transfer device described in the above-mentioned Japanese Utility Model Publication No. 56-154100 can continuously transfer parts using a lead wire board, Since the parts are supported horizontally, there is a problem in that it is not possible to paint, bake, etc. from both sides while transporting the parts.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, an object of the present invention is to provide a small electronic substrate transfer device that can continuously transfer small electronic substrates in a connected state and perform processing such as painting, baking, display printing, etc. from both sides.

[Structure of the invention] (Means for solving the problems) The small electronic substrate transfer device of the present invention comprises a guide groove with an opening at the bottom into which the lead wire board is inserted with the lead wire protruding side facing downward; It consists of a guide rail having magnets provided at appropriate intervals in the guide groove to which the lead wire substrate is magnetically attached, and a feed roller for transporting the lead wire substrate within the guide groove.

(Function) In the device for transferring a small electronic substrate of the present invention, when the lead wire board is inserted with the lead wire protruding side facing down from the guide groove opened on the lower surface of the guide rail and is transported by the feed roller, the lead wire board is transferred. It is magnetically attached to the magnet in the guide groove and moves forward while being held so as not to fall out of the guide groove. A large number of small electronic substrates suspended from the lead wire board via lead wires protrude downward from the guide groove and pass through a coating device, a printing device, and a display printing device in sequence, so that each processing is performed continuously. It will be done.

(Embodiment) Reference numeral 1 is a small electronic substrate, in which a plurality of electrodes 3 and resistor pieces 4 are formed on a ceramic plate 2, and a capacitor, a transistor, a diode, etc. are incorporated to form a circuit.

Reference numeral 5 denotes a lead wire substrate in the form of a long conductive strip, on the lower side of which the width direction is the vertical direction, a large number of lead wires 6 are formed hanging in parallel in a comb-teeth shape, and a large number of delivery channels are formed. A hole 7 is bored. The lower end of the lead wire 6 is connected to a plurality of electrodes 3 of the small electronic substrate 1.
The small electronic substrates 1 are connected to the lead wire substrate 5 by a plurality of lead wires 6, and a large number of small electronic substrates 1 are held suspended from the long lead wire substrate 5. .

Reference numeral 8 denotes a guide rail, which is laid in a series so as to pass through a coating device, a printing device, a display printing device, etc. in which the small electronic substrate 1 is processed in the processing order, and has an open lower end into which the lead wire board 5 is inserted from below. Guide groove 9
is formed over the entire length. Furthermore, guide rail 8
Magnet holders 10 are fitted and fixed at appropriate intervals, and a magnet 11 held by the magnet holder 10 is located inside the guide groove 9.

Reference numeral 12 denotes a feed roller, which is provided on the feed side to the guide rail 8 or at a position where it is fed out from the guide rail 8 so as to face the lead wire board 5 whose width direction is supported in a substantially vertical direction by the guide rail 8, and is vertically rotated. It is mounted on a shaft 13, and a number of feed pawls 14 protruding from its peripheral surface are engaged with the through holes 7 of the lead wire board 5.

Next, the operation of the above embodiment will be explained.

A large number of small electronic substrates 1 are connected to the lead wires 6 protruding from the bottom of the lead wire substrate 5 which is rolled up in a roll shape, and the small electronic substrates 1 are connected to each other with the width direction of the lead wire substrate 5 being the vertical direction. is supported in a suspended state by a lead wire 6 protruding downward. The magnetically conductive lead wire board 5 fed out in a straight line is inserted into the guide groove 9 of the guide rail 8 with its width direction facing up and down, and is held magnetically by the magnet 11 so as not to fall from the guide groove 9. The feed pawl 14 of the rotating feed roller 12 engages with the through hole 7 to advance the lead wire board 5 in the guide rail 8.
At this time, the magnets 11 are provided inside the guide groove 9 with an interval that does not prevent the lead wire board 5 from moving forward. The large number of small electronic substrates 1 held on the lead wire board 5 transported in this manner protrude downward from the guide rail 8 via the lead wires 6, so that they can be directly used in painting equipment, baking equipment, etc.
The pieces are sequentially passed through a display printing device and subjected to various processing. The small electronic substrate 1 that has been processed is separated from the lead wire substrate 5 by cutting the lead wire 6 from the middle, and the lead wire substrate 5 is wound up on a winding shaft.

[Effect of idea]

According to the present invention, the lead wire board with the lead wire protruding from the lower side of the guide groove of the guide rail is inserted, and the lead wire is sent out by the feed roller while being magnetically attached to the magnet of the guide groove. A large number of small electronic substrates can be transported in a suspended state and projected downwardly from the guide groove. Therefore, when insulating coating, baking, display printing, etc. are applied to small electronic substrates from both sides, if guide rails are laid so as to pass through these devices in sequence, a large number of small electronic substrates can be processed while being continuously transported. be able to.

[Brief explanation of drawings]

Figure 1 is a front view showing one embodiment of the present invention;
The figure is a vertical side view of the same as the above, and FIG. 3 is an enlarged front view showing the state of connection between the small electronic substrate and the lead wires. 1...Small electronic base, 5...Lead wire board, 6
... Lead wire, 8 ... Guide rail, 9 ... Guide groove, 11 ... Magnet, 12 ... Feed roller.

Claims (1)

[Claims for Utility Model Registration] A guide groove with an open bottom surface into which a lead wire board is inserted with the lead wire protruding side facing downward, and a guide groove provided at appropriate intervals within this guide groove, and the lead wire board is magnetically attached. 1. A device for transferring a small electronic substrate, comprising: a guide rail having a magnet; and a feed roller for transferring the lead wire board within the guide groove.