JPH02274557A - Manufacture of ink jet head - Google Patents
Manufacture of ink jet headInfo
- Publication number
- JPH02274557A JPH02274557A JP9715989A JP9715989A JPH02274557A JP H02274557 A JPH02274557 A JP H02274557A JP 9715989 A JP9715989 A JP 9715989A JP 9715989 A JP9715989 A JP 9715989A JP H02274557 A JPH02274557 A JP H02274557A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating
- gold
- piezoelectric ceramic
- sputtered film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 48
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 24
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000010931 gold Substances 0.000 claims abstract description 22
- 229910052737 gold Inorganic materials 0.000 claims abstract description 22
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 238000007772 electroless plating Methods 0.000 claims abstract description 14
- 238000009713 electroplating Methods 0.000 claims abstract description 9
- 238000007747 plating Methods 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 10
- 238000004544 sputter deposition Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 238000005868 electrolysis reaction Methods 0.000 abstract 1
- 239000003792 electrolyte Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000005498 polishing Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000004913 activation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は、インクジェットヘッドの製造方法に関し、特
に圧電セラミック上への電極の付与に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing an inkjet head, and more particularly to the application of electrodes on piezoelectric ceramics.
[従来の技術]
従来のインクジェットヘッドの構造としては複数のノズ
ル開口を有するノズル形成部材とこの背後にインクと直
接接触する梁状振動子を有する構造が・知られている。[Prior Art] A known structure of a conventional inkjet head includes a nozzle forming member having a plurality of nozzle openings and a beam-shaped vibrator behind the nozzle forming member that directly contacts ink.
(特公昭60−8955等)上記梁状振動子は圧電セラ
ミックに剛性を有する金属層からなる電極を付与した2
層構造の振動子が用いられる。圧電セラミックに電極を
付与する方法どして、(1)圧電セラミックに直接無電
解メッキを行うか、(2)圧電セラミックに第8族の金
属薄膜を付与してから塩酸等の酸で活性化して、無電解
メッキを行うかのいずれかによっていた。(Japanese Patent Publication No. 60-8955, etc.) The above beam-shaped vibrator is a piezoelectric ceramic with an electrode made of a rigid metal layer.
A layered vibrator is used. How to apply electrodes to piezoelectric ceramics: (1) directly electroless plating the piezoelectric ceramics, or (2) applying a Group 8 metal thin film to the piezoelectric ceramics and then activating it with an acid such as hydrochloric acid. Either electroless plating or electroless plating was used.
[発明が解決しようとする課頭]
しかしながら、(1)の圧電セラミックに直接無電解メ
ッキを行う方法では、置換反応等、複雑な工程が多く、
また、メッキの密着性が弱いという課頴を有する。また
、(2)の第8族の金属薄膜を付与してから塩酸等の酸
で活性化してから無電解メッキを行う方法では、第8族
の金属は不動態化しやす(、活性化に時間がかかり、ま
た、−部活性化が行われない部分があるなどして、メッ
キにピンホール、ムラ等の欠陥が生じるという課題を有
する。[Problems to be Solved by the Invention] However, the method (1) of performing electroless plating directly on piezoelectric ceramics involves many complicated steps such as substitution reactions.
In addition, it has the problem that the adhesion of plating is weak. In addition, in the method (2) of applying a thin film of Group 8 metals, activating them with an acid such as hydrochloric acid, and then performing electroless plating, Group 8 metals are easily passivated (and it takes time to activate them). Furthermore, there are problems in that defects such as pinholes and unevenness occur in the plating because some parts are not activated.
そこで本発明の目的とするところは、インクジェットヘ
ッドとして、圧電セラミックに電極を付与する時に、密
着性を高め、ピンホール等の欠陥を生じない無電解メッ
キを行い、精度のよいインクジェットヘッドを提供する
ところにある。Therefore, an object of the present invention is to provide an inkjet head with high precision by performing electroless plating that increases adhesion and does not cause defects such as pinholes when applying electrodes to piezoelectric ceramic. It's there.
[課題を解決するための手段]
本発明のインクジェットヘッドの製造方法は、α) 圧
電セラミック上に金スパッタ膜を形成する工程と、
b) 前記金スパッタ膜にニッケル電解メッキを施し、
活性化する工程と、
C) 前記ニッケル電解メッキを施した金スパッタ膜に
無電解メッキを行う工程とからなることを特徴とする。[Means for Solving the Problems] The method for manufacturing an inkjet head of the present invention includes the following steps: α) forming a gold sputtered film on a piezoelectric ceramic; b) performing nickel electrolytic plating on the gold sputtered film;
and C) performing electroless plating on the gold sputtered film that has been subjected to the nickel electrolytic plating.
[実施例コ
以下、本発明のインクジェットヘッドの上記振動子の製
造方法について実施例に基づき詳細に説明するが、これ
に限定されるものではない。[Example 7] Hereinafter, a method for manufacturing the vibrator of the inkjet head of the present invention will be described in detail based on an example, but the method is not limited thereto.
第1図は、本発明の実施例を工程順に示す図である。ま
ず、(a)図のごとく、厚さ約100μmの圧電セラミ
ック1上に200℃で1時間金スバッタヲ行い、厚さ約
1000オングストロームの金スパッタ膜2を形成する
。ここで、圧電セラミック1は、研磨されており、表面
は平担になっている必要がある。圧電セラミック1が平
担になっていると、金スパッタ膜2の表面も平担になる
。なお、金スパッタ膜2の厚さは、次の工程でニッケル
電解メッキを行うために、電流を通じるに必要なだけで
よいので、ここでは約1000オングストロームとして
いる。また金スパッタは空気中に放置しても酸化せず、
また、圧電セラミックに直接無電解メッキを行5よりも
密着性を高めるという利点を有する。FIG. 1 is a diagram showing an embodiment of the present invention in order of steps. First, as shown in the figure (a), gold sputtering is performed on a piezoelectric ceramic 1 having a thickness of approximately 100 .mu.m at 200.degree. C. for 1 hour to form a gold sputtering film 2 having a thickness of approximately 1000 angstroms. Here, the piezoelectric ceramic 1 must be polished and have a flat surface. When the piezoelectric ceramic 1 is flat, the surface of the gold sputtered film 2 is also flat. Note that the thickness of the gold sputtered film 2 is set to about 1000 angstroms here because it is sufficient to conduct a current to perform nickel electrolytic plating in the next step. In addition, gold sputter does not oxidize even if left in the air.
Further, it has the advantage that the adhesion is improved more than in the case of row 5 in which electroless plating is performed directly on the piezoelectric ceramic.
次いで、ニッケルメッキ液中で、純ニツケル板を陽極に
、金スパッタ膜2を付与した圧電セラミックを陰極にし
て約3vの電圧を印加し、約100mAの電流を数秒間
通じ、ニッケル電解メッキを行い、金スパッタ膜2上に
活性化膜3を形成するとCb>図のようになる。ここで
、ニッケル電解メッキは、金スパッタ膜2には直接無電
解メッキができないため、触媒として必要である。金ス
パッタ膜2は、ニッケル電解メッキによって、全体が一
様に活性化され、次の工程でニッケル無電解メッキを行
う時に、一部下活性によってメッキが付着しないために
起こるピンホールが、皆無になる。Next, in a nickel plating solution, a voltage of about 3 V was applied using the pure nickel plate as an anode and the piezoelectric ceramic coated with the gold sputtered film 2 as a cathode, and a current of about 100 mA was passed for several seconds to perform nickel electrolytic plating. , when the activation film 3 is formed on the gold sputtered film 2, the result becomes Cb> as shown in the figure. Here, nickel electrolytic plating is necessary as a catalyst because direct electroless plating cannot be applied to the gold sputtered film 2. The entire gold sputtered film 2 is uniformly activated by nickel electrolytic plating, and when electroless nickel plating is performed in the next step, there are no pinholes that occur because the plating does not adhere due to partial activation. .
次いで、90℃1時間ニッケル無電解メッキを行い、厚
さ約20μmのニッケルメッキ膜4を形成し、(C)図
のようになり、インクジェットヘッドが完成する。ここ
でインクジェットヘッドの固有振動周波数等の基本特性
は、圧電セラミック・電極(この場合ニッケルメッキ@
4)の厚さ、長さ、幅に依存する。電極では、ニッケル
無電解メッキ厚さの精度をよ(行わなければならない。Next, electroless nickel plating is performed at 90° C. for 1 hour to form a nickel plating film 4 with a thickness of about 20 μm, and the inkjet head is completed as shown in FIG. Here, the basic characteristics of the inkjet head, such as its natural vibration frequency, are based on the piezoelectric ceramic electrode (nickel plating in this case).
4) Depends on thickness, length, and width. On the electrodes, electroless nickel plating must be done to ensure accurate thickness.
上記の実施例は、ピンホールの無い、密着性に′)ぐれ
たニッケル無電解メッキを所定の厚さに精度良(付与し
、振動特性精度のよい、信頼性の高いインクジェットヘ
ッドを実現することができる。In the above embodiment, electroless nickel plating with no pinholes and excellent adhesion is applied to a predetermined thickness with good accuracy to realize a highly reliable inkjet head with accurate vibration characteristics. I can do it.
[発明の効果コ
以上述べたように、本発明の製造工程によればインクジ
ェットヘッドとして圧電セラミックに電極を付与する時
に1密着性を高め、ピンホール等の欠陥を生じない無電
解メッキを行い、精度のよいインクジェットヘッドを提
供することができる。[Effects of the Invention] As described above, according to the manufacturing process of the present invention, when applying electrodes to a piezoelectric ceramic as an inkjet head, 1. adhesion is improved, electroless plating is performed that does not cause defects such as pinholes, A highly accurate inkjet head can be provided.
第1図(α)〜(C)は本発明のインクジェットヘッド
の製造方法の一実施例の工程図である。
1・・・・・・・・・圧電セラミック
2・・・・・・・・・金スパッタ膜
3・・・・・・・・・活性化膜
4・・・・・・・・・無電解メ
キ層
以
上FIGS. 1(α) to (C) are process diagrams of an embodiment of the method for manufacturing an inkjet head of the present invention. 1...Piezoelectric ceramic 2...Gold sputtered film 3...Activated film 4...Electroless Meki layer or above
Claims (1)
と、 (b)前記金スパッタ膜にニッケル電解メッキを施し、
活性化膜を形成する工程と、 (c)前記ニッケル電解メッキを施した金スパッタ膜に
無電解メッキを行う工程とからなることを特徴とする、
インクジェットヘッドの製造方法。[Claims] (a) forming a gold sputtered film on a piezoelectric ceramic; (b) applying nickel electrolytic plating to the gold sputtered film;
and (c) performing electroless plating on the gold sputtered film that has been subjected to the nickel electrolytic plating.
A method of manufacturing an inkjet head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9715989A JPH02274557A (en) | 1989-04-17 | 1989-04-17 | Manufacture of ink jet head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9715989A JPH02274557A (en) | 1989-04-17 | 1989-04-17 | Manufacture of ink jet head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02274557A true JPH02274557A (en) | 1990-11-08 |
Family
ID=14184791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9715989A Pending JPH02274557A (en) | 1989-04-17 | 1989-04-17 | Manufacture of ink jet head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02274557A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001019614A1 (en) * | 1999-09-16 | 2001-03-22 | Matsushita Electric Industrial Co., Ltd. | Ink-jet head, method of manufacture thereof, and ink-jet recorder |
-
1989
- 1989-04-17 JP JP9715989A patent/JPH02274557A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001019614A1 (en) * | 1999-09-16 | 2001-03-22 | Matsushita Electric Industrial Co., Ltd. | Ink-jet head, method of manufacture thereof, and ink-jet recorder |
US6467886B1 (en) | 1999-09-16 | 2002-10-22 | Matsushita Electric Industrial Co., Ltd. | Ink-jet head, method for fabricating same, and ink-jet recording device |
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