JPH0226816U - - Google Patents
Info
- Publication number
- JPH0226816U JPH0226816U JP10555088U JP10555088U JPH0226816U JP H0226816 U JPH0226816 U JP H0226816U JP 10555088 U JP10555088 U JP 10555088U JP 10555088 U JP10555088 U JP 10555088U JP H0226816 U JPH0226816 U JP H0226816U
- Authority
- JP
- Japan
- Prior art keywords
- resin molded
- circuit
- components
- electronic
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000010355 oscillation Effects 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10555088U JPH0226816U (bs) | 1988-08-10 | 1988-08-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10555088U JPH0226816U (bs) | 1988-08-10 | 1988-08-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226816U true JPH0226816U (bs) | 1990-02-21 |
Family
ID=31338265
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10555088U Pending JPH0226816U (bs) | 1988-08-10 | 1988-08-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226816U (bs) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139347A (ja) * | 1985-12-13 | 1987-06-23 | Matsushima Kogyo Co Ltd | 樹脂封止型半導体実装用金属リ−ドフレ−ム |
-
1988
- 1988-08-10 JP JP10555088U patent/JPH0226816U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62139347A (ja) * | 1985-12-13 | 1987-06-23 | Matsushima Kogyo Co Ltd | 樹脂封止型半導体実装用金属リ−ドフレ−ム |