JPH02265854A - Warp correcting method for plated board - Google Patents

Abstract

PURPOSE:To sufficiently correct a warp in a metal band plate regardless of its thickness and strength by making position adjustment even for a synchroll in addition to position adjustment of a correcting roll so as to increase the ability of correcting the warp of the plated plate. CONSTITUTION:A synchroll 3, provided in a plating bath 2, converts the passing through direction of a metal band plate 1 and, after its direction is changed, it is guided between a path stabilizing roll 4 and a correcting roll 5 possible to be adjusted in its position. Here supporting also the synchroll 3, position adjustably its position is changed by a predetermined amount step by step when the band plate 1 passes through. Each time after a surplus adhering layer is removed, the band plate 1 is detected in the thickness of its plating layer in the end part of width direction and in the central part, and the position of the synchroll 3 is set, in a position, where a difference between detected values in these parts becomes the minimum value. Simultaneously, also a position of the correcting roll 5 is controlled. Thus, a warp can be corrected high accurately through a simplified production process.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is particularly intended for correcting warping of a plated plate that occurs in a metal strip when the plate is passed through a plating bath for hot-dip metal plating. The present invention relates to a method for correcting warpage of a plated plate.

[Prior Art] Generally, in a plating line for plating molten metal onto a metal strip, a large number of rolls are installed, and the strip is bent and bent under tension each time it passes through the rolls. undergoes bending back.

If the deformation at this time is elastic deformation, the plate after passing through the rolls will be elastically restored to its original state and will remain unchanged from before passing through the rolls, but if plastic deformation occurs due to bending, the metal after passing through the rolls will be Warpage occurs in the strip. When such a warp occurs on the plated plate, the distance between the air wiper's gas injection port and the surface of the plated layer changes.
The thickness of the plating layer cannot be made uniform. Therefore, in order to make the thickness of the plating layer constant, it is essential to correct the warpage of the plating plate in advance.

As a specific example of this type of device for correcting the warpage of a plated plate, the technique disclosed in, for example, Japanese Unexamined Patent Publication No. 63-262498 is known.

This conventional technology will be explained below with reference to FIG. 5, which is an overview diagram, FIG. 6, which shows a self-propelled laser distance meter, and FIG. 7, which shows a fixed laser distance meter. 5
The symbol (1) shown in the figure is a strip, and this strip (1) is energized by an energizing roll (3), and after its width is corrected by a straightening roll (5), it is passed through a path stabilizing roll 021 to a plating cell. The plate is passed between the inner electrodes (2) and (2), and the surface is plated.Next, the traveling direction is changed by the sink roll (6), and the plate is passed between the electrodes (2a) and (2a). After being plated again in the meantime, it is sent to the next step via an energizing roll (3a). In addition, the energizing rolls (3) and (3a) are provided with strips (
Hold-down rolls 00) are provided on the inlet and outlet sides of 1), which stabilizes the pass line of the strip (1) and removes excess plating solution adhering to the strip (]) above the plating solution surface. The dust is wiped away by a seal roll 00 provided halfway from to the current-carrying roll (3a).

Then, the warped state of the width of the strip (1) above the plating solution in the plating cell is measured by moving the laser distance meter (4) in the width direction of the strip (1), as shown in FIG. 6, for example. Alternatively, as shown in Figure 7, a strip (1
) The warpage that occurs in the strip (1) is corrected by arranging a plurality of laser distance meters (4) in the width direction of the strip (4) to take measurements, and feeding back the measurement results to control the pressing force of the straightening roll. .

[Problem to be solved by the invention]

However, since the above-mentioned device is configured to correct the warp of the plated plate only by adjusting the position of the straightening roll, there is a limit to its ability to correct the warp, and depending on the thickness and strength of the metal strip, it may be difficult to correct the warp sufficiently. There is a problem in that it cannot be corrected.

In addition, the warpage of the plated plate is detected by measuring the distance from the tip of the rangefinder to the surface of the plating layer using a laser rangefinder. This also creates the problem that a detector must be provided, which complicates the production process of the plated plate.

Therefore, the present invention corrects warpage with high precision regardless of the thickness and strength of the metal strip, and also corrects warpage in the production process. ! The purpose of the present invention is to provide a method for straightening the warpage of a plated plate that avoids sloping.

[Means to solve the problem]

The present invention aims to solve the above-mentioned problems by correcting the warpage of a metal band plate based on the thickness of the plating layer. Therefore, the gist of the method for straightening the warp of a plated plate according to the present invention is as follows. The passing direction of the metal strip is changed by a sink roll installed in the plating tank, and the metal strip after the direction change is passed between a path stabilizing roll and a straightening roll whose position can be freely adjusted. In the method for correcting the warpage of a plated plate, the sink roll is supported so as to be adjustable in position, the straightening roll is preset to a preset position, and the position of the sink roll is adjusted when passing the metal strip. The thickness of the plating layer is detected between the ends and the center in the width direction of the plate after changing it by a predetermined amount and removing the excess adhesion layer each time, and the minimum value of the difference between the detected values is obtained. The present invention is characterized in that, while a sink roll is set at a certain position, the correction roll is controlled based on the difference between the detected values.

[Effect]

In the present invention, since the method for straightening the warp of a plated plate is as described above, the warp of the metal strip changes little by little as the position of the sink roll changes by a predetermined amount, and the ends of the metal strip in the width direction The difference in the thickness of the plating layer at the center changes, but this changing difference in the thickness of the plating layer is calculated, and the sink roll position is set at the position where the difference in the thickness of the plating layer becomes the minimum value. is set, and the position of the straightening roll is controlled based on the difference in the thickness of the plating layer. Moreover, when setting the position of the sink roll, a large tension is applied to the metal strip.

Furthermore, since the thickness of the plating layer at the ends and center of the metal strip is always measured, there is no need to measure the thickness of the plating layer in the subsequent process.

〔Example〕

The first embodiment of the present invention is a diagram illustrating the configuration of its main parts.
Figure 2, a block diagram showing the flow of warp correction,
FIG. 3 is an explanatory diagram of the relationship between the amount of push-in of the straightening roll and the amount of warpage;
This will be explained below with reference to FIG. 4, which is a diagram illustrating the relationship between the amount of push-in of the straightening roll and the difference in plating thickness between the end portion and the center portion of the metal strip.

That is, the symbol (1) shown in Fig. 1 is a metal strip plate, and this strip plate (1) is immersed in molten metal placed in a plating bath (2) for molten metal plating. The metal strip (1) is hung on the sink roll (3) which is supported by the positioning support (3a) so that the position can be adjusted freely.
The threading direction of the metal strip (11 is the threading side thereof) after the direction is changed is changed to the upper direction.
And melting money! Path stabilizing roll (4) and positioning sabot installed in iA6'rO (5a
) is supported by a straightening roll (5) whose position can be adjusted freely.
) Next, an air wiper (6) is installed at a predetermined distance from both sides of the metal strip (1) that has come out of the molten metal (E). )
Similar to the air wiper (6), a plating amount detector (7) is installed above the metal strip @ (1) at a predetermined distance from both sides, and the plating amount detector (7) Based on the detected value, the position of the straightening roll (5), that is, the position of the straightening roll (5) is determined in the direction of the metal strip (), and the straightening roll (5) is pushed through the support (5a).

The above-mentioned plating amount detector (8) has a well-known configuration, and for example, a coating amount meter using a three-point measurement method using an X gland may be used.

The warpage of the metal strip (1) is corrected in the following manner using such a plating apparatus.

First, the metal strip (1) is placed in a plating bath for hot-dip metal plating (
2) After being sequentially bent by sink rolls (3), straightening rolls (5), and path stabilizing rolls (4),
The air wiper (6) removes the excess hot-dip metal plating layer attached to the metal strip (1), and in this state, the thickness q of the plating layer at the ends of the metal strip (1) and the center portion are removed. The thickness qc of the plating layer is detected by the plating amount detector (2). And the metal band plate (1) at this time
As shown in FIG.
By changing the metal band Fi, (1
) in the threading direction (hereinafter referred to as L warp), IM is O.
The positive warpage becomes 0 when the IM is less than 2 mm, and when the IM is 2 mm, the positive warpage becomes 0.
It exhibits the maximum negative warpage at a little over mm and then reverses, then becomes 0 when the IM becomes about 5 mm, and changes to positive warpage when the IM becomes larger than that. On the other hand, the warpage in the width direction of the metal strip (1) indicated by the broken line in the figure (hereinafter referred to as C warp) has a small absolute value, but the C warp changes in the opposite trend to the warp described above. do.

Furthermore, the relationship between this IM and the difference in the thickness of the plating layer between the ends and the center in the width direction of the L-warped metal strip (1), that is, the relationship between IM and δ=q, -(lゎ) As shown in Fig. 4, it was found that the metal strip (1) had the same tendency as the warpage, so the position of the straightening roll (5) was adjusted and the metal strip (1) was warped. It has been found that correcting warpage is effective.

In addition, as can be well understood from Fig. 4, there are two positions where the difference in plating layer thickness is δ-0, so the sink roll (3) is positioned at one of the positions using the positioning support (
3a), and as shown in FIG.
The metal strip (1) is passed through the metal strip (1) with the maximum value IM of M set to 0°5 times -1lAx, and then the IM of the sink roll (3) is changed by a constant amount ΔIM, and the 9.
and qc are detected by a plating amount detector (8), and these detected values are input to a calculator (not shown), whereby δ wealth is determined from the difference δ between these detected values. Then, for the i-th set IM,' and δ5,
1.11mM and δ3.8, and when either one exceeds these limit values, that is, i > l as, or δ1 rich>δ,
1. 1, the square of δ, t is the smallest among the δ directs detected so far (fix i as 1fiX and set IM as 1M3-irix to support positioning). While controlling the position of the sink roll (3) via (3a), in order to finely adjust the warpage of the metal strip (1) with even higher precision, the difference δ is fed back and the straightening roll (5) is moved to the IMF. It is controlled by the pushing amount of +ΔIMP.

In this way, the thickness of the metal strip (1) is adjusted based on the slight difference in the thickness of the plating layer at the edge and center of the metal strip (1), which changes depending on the amount of warpage of the metal strip (1). Because it corrects warpage,
In addition to being able to correct the warpage of the metal strip (1) with greater accuracy than conventional methods, it is also possible to apply large tension to the metal strip (1), making it possible to correct warpage in the metal strip (1) with greater thickness. On the other hand, it can now also be applied to high-strength metal strips (1).

Moreover, as mentioned above, since the method corrects the warpage of the metal strip (1) based on the detected value of the thickness of the plating layer, there is no need to check the thickness of the plating layer in subsequent post-processes. Therefore, it is no longer necessary to take the trouble to measure the thickness of the plating layer in order to confirm it, unlike in the case of conventional plating equipment.

Furthermore, the above control does not need to be performed all the time; for example, IM data may be stored and the stored IM values may be utilized as needed.

In addition, although the explanation above uses molten metal plating as an example,
The technical idea of the present invention can also be applied to correcting warpage of electroplated plates.

Therefore, the scope of the technical idea of the present invention is not limited by the above-mentioned embodiments (furthermore, design changes etc. can be freely made within the scope of this technical idea).

〔Effect of the invention〕

According to the method for straightening warpage of a plated plate according to the present invention, the position of the sink roll is adjusted in addition to the position adjustment of the straightening roll, instead of only adjusting the position of the straightening roll as in the conventional warpage straightening method. The ability to correct the warpage of plated plates has been improved, and it has become possible to sufficiently correct the warpage regardless of the thickness or strength of the metal strip through which the plate is passed.

In addition, since the thickness of the plating layer at the edges and center in the width direction of the metal strip is constantly measured, unlike conventional straightening methods, the thickness of the plating layer can be checked in the subsequent process. There is no need to measure the thickness, making it possible to avoid complicating the process.

Therefore, it is an object of the present invention to establish an extremely excellent and useful method for straightening warpage of a plated plate, which can correct warpage with high precision regardless of the thickness and strength of the metal strip, and can avoid complicating the production process. was completed.

[Brief explanation of drawings]

Part 1 is an explanatory diagram of the configuration of the main parts according to an embodiment of the present invention, Figure 2 is a block diagram showing the flow of warpage correction, Figure 3 is an illustration of the relationship between the amount of pushing of the straightening roll and the amount of warpage, and Part 4 The figure is an explanatory diagram of the relationship between the indentation amount of the straightening roll and the difference in plating layer thickness between the edge and center of the metal strip. Figure 5 is a schematic diagram of a conventional plating device. Figure 6 is a diagram of a conventional plating device. FIG. 7 is a diagram showing a self-propelled laser distance meter of the device, and FIG. 7 is a diagram showing a quantitative laser distance meter of a conventional plating device. (1) - Metal strip plate, (2) - Plating tank, (3), - Sin roll, (3a), (5aL - Positioning support, (
4) - Path stabilizing roll, (5) - Straightening roll, (6)
- Air wiper, (7) - Plating amount detector, (e) - Molten metal. Figure 2 Patent applicant: Kobe Steel, Ltd.

Claims (1)

[Claims] (1) The direction of threading of the metal strip is changed by a sink roll installed in the plating tank, and the metal strip after the direction change is passed between a path stabilizing roll and a straightening roll whose position can be freely adjusted. In the method for correcting the warpage of a plated plate, the sink roll is supported so that its position can be adjusted, the straightening roll is preset at a preset position, and the position of the sink roll is adjusted when threading the metal strip. is changed by a predetermined amount, and the thickness of the plating layer between the ends and the center in the width direction of the plate after removing the excess adhesion layer each time is detected, and the minimum value of the difference between the detected values is obtained. A method for correcting warpage of a plated plate, characterized in that a sink roll is set at a position where a sink roll is set, and the correction roll is controlled based on the difference between the detected values.