JPH02264880A - Chip magnetic sensor and manufacture thereof - Google Patents
Chip magnetic sensor and manufacture thereofInfo
- Publication number
- JPH02264880A JPH02264880A JP1085427A JP8542789A JPH02264880A JP H02264880 A JPH02264880 A JP H02264880A JP 1085427 A JP1085427 A JP 1085427A JP 8542789 A JP8542789 A JP 8542789A JP H02264880 A JPH02264880 A JP H02264880A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- sensor
- substrate
- magnetic sensor
- chip magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005291 magnetic effect Effects 0.000 title claims description 39
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 239000010408 film Substances 0.000 claims abstract description 26
- 230000005294 ferromagnetic effect Effects 0.000 claims abstract description 19
- 239000010409 thin film Substances 0.000 claims abstract description 19
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- 239000011521 glass Substances 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims abstract description 3
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 4
- 238000005266 casting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 17
- 238000000605 extraction Methods 0.000 abstract description 8
- 239000011253 protective coating Substances 0.000 abstract description 7
- 238000010276 construction Methods 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 238000001514 detection method Methods 0.000 description 7
- 239000002519 antifouling agent Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000002161 passivation Methods 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 229910003266 NiCo Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001252 Pd alloy Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- XZWYZXLIPXDOLR-UHFFFAOYSA-N metformin Chemical compound CN(C)C(=N)NC(N)=N XZWYZXLIPXDOLR-UHFFFAOYSA-N 0.000 description 1
- 230000000414 obstructive effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Measuring Magnetic Variables (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、表面実装可能なチップ磁気センサーに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a surface-mountable chip magnetic sensor.
従来の技術
従来、磁気センサーは、第７図ａ、ｂに示すような構造
であった。第７図ａは、従来品の斜視図で、ｂはその断
面図である。１はセンサー基板、２は強磁性薄膜からな
るセンサーエレメント、３はパッシベーション膜、４は
保護塗料、５はハンダ部、６は端子であり、センサー基
板１の片面にセンサーエレメント３を設けてこの面と同
じ面から端子６を引き出した構造であり、センサー基板
１の裏面には何も設けられていない構造である。BACKGROUND ART Conventionally, magnetic sensors have had structures as shown in FIGS. 7a and 7b. FIG. 7a is a perspective view of a conventional product, and FIG. 7b is a sectional view thereof. 1 is a sensor board, 2 is a sensor element made of a ferromagnetic thin film, 3 is a passivation film, 4 is a protective paint, 5 is a solder part, and 6 is a terminal.The sensor element 3 is provided on one side of the sensor board 1, and this side is The terminal 6 is drawn out from the same surface as the sensor board 1, and nothing is provided on the back surface of the sensor board 1.
この構造の磁気センサーでは、ハンダ部５の機械的補強
が必要不可欠であるため、保護塗料４の厚みが約５００
μｍと厚かった。つまり、ハンダ部５は電極膜厚が約１
μｍと薄く、よってハンダ付は時の種々のストレスや実
装時の熱的９機械的ストレス等によってクラックや断線
を引き起こし易いという欠点があり、このハンダ部５を
保護するために厚い保：ｌ！塗料４が必要であった。In a magnetic sensor with this structure, mechanical reinforcement of the solder portion 5 is essential, so the thickness of the protective coating 4 is approximately 500 mm.
It was as thick as μm. In other words, the solder portion 5 has an electrode film thickness of about 1
Since the solder portion 5 is as thin as μm, it has the disadvantage that it is susceptible to cracks and disconnections due to various stresses during mounting and thermal and mechanical stress during mounting. Paint 4 was required.
また、端子のフォーミング等の不具合から、第７図Ｃの
ように磁気センサー自体が実装基板に密着せず、浮き上
がった形で固着されることから検出位置のバラツキ、出
力が小さい等の問題があった。さらに第７図ｄのように
、ハンダ付けでイモハンダを生じやすく実装基板への接
続信頼性が充分ではなかった。In addition, due to problems such as terminal forming, the magnetic sensor itself does not come into close contact with the mounting board, as shown in Figure 7C, and is fixed in a floating manner, resulting in problems such as variations in detection position and small output. Ta. Furthermore, as shown in FIG. 7d, soldering tends to cause immobilized soldering, and the reliability of connection to the mounting board is not sufficient.
発明が解決しようとする課題
本発明は、このような問題点に鑑み、保護塗料膜が薄（
、高信頼性の面実装ができるチップ磁気センサーの実現
を目的とする。PROBLEMS TO BE SOLVED BY THE INVENTION In view of these problems, the present invention solves the problem by providing a thin (thin) protective coating film.
The aim is to realize a chip magnetic sensor that can be mounted on a surface with high reliability.
課題を解決するための手段
この問題点を解決するために本発明は、角形のセンサー
基板の少なくとも２個の角部を切欠いて設けた切欠き部
の側面に各々第１電極を備え、前記センサー基板の表面
に、前記第１電極に接続する第２電極を有し、この第２
電極に接続した強磁性薄膜を前記センサー基板の表面上
に有し、前記センサー基板の表面に、前記第１電極に接
続した取り出し電極を備えたものである。Means for Solving the Problems In order to solve this problem, the present invention provides a first electrode on each side of a notch formed by cutting out at least two corners of a rectangular sensor substrate. A second electrode connected to the first electrode is provided on the surface of the substrate, and the second electrode is connected to the first electrode.
A ferromagnetic thin film connected to an electrode is provided on the surface of the sensor substrate, and a take-out electrode connected to the first electrode is provided on the surface of the sensor substrate.
またその製造方法として、基板に少なくとも２個のスル
ホール電極を設けた後、このスルホール電極を各々４分
割するように基板を切断してセンサー基板を形成し、セ
ンサー基板の表面にスルホール電極に接続するように強
磁性薄膜を形成し、前記センサー基板の裏面に前記スル
ホール電極に接続した取り出し電極を形成するものであ
る。In addition, as a manufacturing method, at least two through-hole electrodes are provided on a substrate, and then the substrate is cut into four parts each to form a sensor substrate, and the through-hole electrodes are connected to the surface of the sensor substrate. A ferromagnetic thin film is formed in this manner, and an extraction electrode connected to the through-hole electrode is formed on the back surface of the sensor substrate.
作用
本発明の構成によれば、センサーエレメント形成面にハ
ンダ部がな（なったため厚い保護塗料が不要となり、チ
ップ磁気センサーの薄型化が実現でき、さらにセンサー
エレメント形成面の裏面に取り出し電極を備え、端子の
ない構成であるため、高信頼性の面実装が可能となる。Effects According to the configuration of the present invention, there is no solder on the sensor element forming surface, so a thick protective paint is not required, and the chip magnetic sensor can be made thinner.Furthermore, an extraction electrode is provided on the back side of the sensor element forming surface. Since the structure has no terminals, highly reliable surface mounting is possible.
実施例 （実施例１） 第１図ａ、ｂに本発明の一実施例を示す。Example (Example 1) An embodiment of the present invention is shown in FIGS. 1a and 1b.
第１図ａは本実施例の斜視図、第１図すはその断面図を
示すものである。１はアルミナよりなるセンサー基板、
７はセンサー基板上に設けた焼成ガラス、８はセンサー
エレメントとして強磁性薄膜、９は第１電極、１０は取
り出し電極、１１は第２電極、１２は保護膜である。角
形のセンサー基板１の４つの角部のうち、隣の角部２個
所は切欠かれて、湾曲面となっている。この湾曲面には
Ａｇ−Ｐｄ合金から成る第１電極９が設けられている。FIG. 1a shows a perspective view of this embodiment, and FIG. 1a shows a sectional view thereof. 1 is a sensor board made of alumina,
7 is a fired glass provided on the sensor substrate, 8 is a ferromagnetic thin film as a sensor element, 9 is a first electrode, 10 is an extraction electrode, 11 is a second electrode, and 12 is a protective film. Of the four corners of the rectangular sensor substrate 1, two adjacent corners are cut out to form curved surfaces. A first electrode 9 made of an Ag-Pd alloy is provided on this curved surface.
センサー基板１の一方の主面には焼成ガラス７が備えら
れている。この焼成ガラス７と２つの第１電極９に重な
るように、第２電極１１が形成されていて、Ｃｒ、Ｃｕ
、Ｎｉが３層となるように蒸着され、厚みは１００００
Ａ〜３００００Ａである。センサー基板１の裏面には、
２つの第１電極９に接続するように取り出し電極９が設
けられている。また第２電極１１に接続し、焼成ガラス
７を覆うように強磁性薄膜８が設けられている。これは
ＮｉＣｏを全面蒸着した後、任意のパターン出しを行っ
たものである。さらにセンサー基板１の強磁性薄膜８を
設けた面は、保護膜１２で覆われている。A fired glass 7 is provided on one main surface of the sensor substrate 1. A second electrode 11 is formed so as to overlap this fired glass 7 and the two first electrodes 9.
, Ni is deposited in three layers, and the thickness is 10,000 mm.
A to 30000A. On the back side of the sensor board 1,
An extraction electrode 9 is provided so as to be connected to the two first electrodes 9. Further, a ferromagnetic thin film 8 is provided so as to be connected to the second electrode 11 and cover the fired glass 7 . In this case, after NiCo was deposited on the entire surface, arbitrary patterns were formed. Furthermore, the surface of the sensor substrate 1 on which the ferromagnetic thin film 8 is provided is covered with a protective film 12 .
以上のような構成によれば、従来強磁性薄膜８形成面に
設けていたハンダ部５が無く、従来のように厚い保護塗
料４は不必要となる。このため、チップ磁気センサーの
薄型化が可能となる。また、電極材料にＡｇ−Ｐｄ合金
を採用し、さらに電極膜厚を約１μｍから約２０μｍに
大幅に増強することによって従来弱、へであったハンダ
付は時の熱など種々のストレスに対し、充分耐え得るも
のとなり、クラックや断線の問題もない。According to the configuration described above, there is no solder portion 5 that was conventionally provided on the surface on which the ferromagnetic thin film 8 was formed, and the thick protective coating 4 that was conventionally required is unnecessary. Therefore, it is possible to make the chip magnetic sensor thinner. In addition, by adopting an Ag-Pd alloy as the electrode material and significantly increasing the electrode film thickness from about 1 μm to about 20 μm, we have improved the ability to withstand various stresses such as heat during soldering, which was previously weak. It has sufficient durability and there are no problems with cracks or disconnections.
さらに強磁性薄膜８形成面の裏面に、取り出し電極９が
設けられ、端子のない構成であるため実装基板上に極め
て低く、密着した状態でハンダ付けが可能となり、極め
て高信頼性の面実装が実現できる。また端子のない構造
なのてせ自動実装も行える。Furthermore, a lead-out electrode 9 is provided on the back side of the surface on which the ferromagnetic thin film 8 is formed, and since the configuration has no terminals, it is possible to solder the mounting board at an extremely low level and in close contact with the mounting board, allowing extremely reliable surface mounting. realizable. Also, since it has a structure without terminals, it can be mounted automatically.
また、本実施例のチップ磁気センサーの製造方法につい
て説明する。第４図はこの製造方法を示した製造工程図
である。まず、第５図に示すようなセンサー基板１上に
焼成ガラス７を設ける。このセンサー基板１中夫の穴２
カ所にスルホール印刷で第１電極９を設ける。この第１
電極９はＡｇ−Ｐｄを印刷し、焼成することで形成する
。次にセンサー基板１の焼成ガラス７の形成されていな
い面へ前記第１電極９と接続するようにＡｇ−Ｐｄを印
刷し焼成して、取り出し電極１０を形成する。これら第
１電極９と、取り出し電極１０は、印刷後、７００℃〜
９００℃の酸素炉で焼成する。次に前記第１電極９と接
続するように焼成ガラス７形成面に第２電極１１を形成
する。この第２電極６はＣｒ、Ｃｕ、Ｎｉの３層からな
り、膜厚１００００Ａ〜３００００Ａとなるよう蒸着法
で固着する。続いて第２電極１１に接続するように強磁
性薄膜８（ＮｉＣｏあるいはＮｉＦｅからなる）を焼成
ガラス７表面に全面蒸着した後、任意のパターン出しを
おこなった後、その上に保護膜１２を形成するものであ
る。そして、チップごとに分割し、チップ磁気センサー
とする。Also, a method for manufacturing the chip magnetic sensor of this example will be explained. FIG. 4 is a manufacturing process diagram showing this manufacturing method. First, a fired glass 7 is provided on a sensor substrate 1 as shown in FIG. This sensor board 1 middle man's hole 2
The first electrode 9 is provided at several locations by through-hole printing. This first
The electrode 9 is formed by printing Ag-Pd and firing it. Next, Ag--Pd is printed on the surface of the sensor substrate 1 on which the fired glass 7 is not formed so as to be connected to the first electrode 9 and fired to form the extraction electrode 10. These first electrodes 9 and extraction electrodes 10 are heated to 700°C to 700°C after printing.
Calcinate in an oxygen furnace at 900°C. Next, a second electrode 11 is formed on the surface on which the fired glass 7 is formed so as to be connected to the first electrode 9. This second electrode 6 consists of three layers of Cr, Cu, and Ni, and is fixed by vapor deposition to a thickness of 10,000 Å to 30,000 Å. Subsequently, a ferromagnetic thin film 8 (made of NiCo or NiFe) is deposited on the entire surface of the fired glass 7 so as to be connected to the second electrode 11, and after forming an arbitrary pattern, a protective film 12 is formed thereon. It is something to do. Then, each chip is divided into chip magnetic sensors.
一方、従来の磁気センサーの製造方法は、第６図すのよ
うなセンサー基板１の片面に強磁性薄膜（ＮｉＣｏ、Ｎ
１Ｆｅ）を蒸着し、パターン出しを行ってセンサーエレ
メント２を形成した後に、センサーエレメント３に接続
するようにハンダ部５を形成し、ハンダ部５の一部を残
すようにしてセンサーエレメント３の全面に、パッシベ
ーション膜３（ＳｉＯからなる）を蒸着し、残したハン
ダ部５に端子６をハンダ付けする。その後、エポキシ系
の保護塗料４を厚く全面に塗布し、硬化していたもので
ある。このような製造方法では磁気センサーの裏面にハ
ンダ付けする取り出し電極が形成出来ず、また、ハンダ
山の高さのばらつき等から保護塗料４の厚みも均一に出
来ず、従ってセンサー各々の検知精度がばらついていた
。On the other hand, in the conventional magnetic sensor manufacturing method, a ferromagnetic thin film (NiCo, N
1Fe) is vapor-deposited and patterned to form the sensor element 2, a solder portion 5 is formed so as to be connected to the sensor element 3, and a part of the solder portion 5 is left to cover the entire surface of the sensor element 3. Then, a passivation film 3 (made of SiO) is deposited, and terminals 6 are soldered to the remaining solder portions 5. Thereafter, a thick layer of epoxy-based protective paint 4 was applied to the entire surface and cured. With this manufacturing method, it is not possible to form an extraction electrode to be soldered to the back surface of the magnetic sensor, and the thickness of the protective coating 4 cannot be made uniform due to variations in the height of the solder mounds, and therefore the detection accuracy of each sensor is reduced. It varied.
しかし、本実施例のチップ磁気センサーの製造方法であ
れば、最終工程で各チップごとに分割するので簡単に取
り扱うことができ、ハンダ山もない構成なので保護膜１
２の厚みも各チップごと均一なものができる。However, with the manufacturing method of the chip magnetic sensor of this embodiment, each chip is divided into chips in the final process, so it can be easily handled, and since there is no solder pile, the protective film 1
The thickness of each chip can also be made uniform.
（実施例２）
次に本発明の第２の実施例を示す。第１の実施例の保護
膜１２を低融点ガラス、Ｓ ｉｏ、Ｓ ｉｏ２゜５ｉｚ
Ｎ４で形成したものである。(Example 2) Next, a second example of the present invention will be shown. The protective film 12 of the first embodiment is made of low melting point glass, S io, S io2゜5iz
It was formed using N4.
従来の磁気センサーでは、パッシベーション膜３にＳｉ
Ｏを用いているが、第７図すに示すようにセンサーエレ
メント２１′ＩＩＩにハンダ部５があるため、センサ−
エレメント２全面にわたってパッシベーション膜３で覆
うことができなかった。このためにパッシベーション膜
３とハンダ部５との界面からの湿気侵入が防げず、酸に
弱い強磁性薄膜は次第にこれに腐食され断線にいたって
しまう。In the conventional magnetic sensor, the passivation film 3 is made of Si.
However, as shown in FIG. 7, there is a solder part 5 on the sensor element 21'III, so the sensor
The entire surface of the element 2 could not be covered with the passivation film 3. For this reason, it is impossible to prevent moisture from entering from the interface between the passivation film 3 and the solder portion 5, and the ferromagnetic thin film, which is sensitive to acids, is gradually corroded by this, leading to disconnection.
この現象を防ぐために、センサーエレメント２側の全面
コートできるように、厚い保護塗料が必要であった。In order to prevent this phenomenon, a thick protective paint was required to coat the entire surface of the sensor element 2 side.
しかし、本実施例の構成ならば、ハンダ部がないので強
磁性薄膜８全面を覆う保護膜１２にＳｉＯを用いること
が可能である。この保護膜１２が強磁性薄膜８全面を覆
うので、外からの水分の侵入による強磁性薄膜８の腐食
を十分に防ぐことができる。なお保護膜の材質はＳｉＯ
だけでなく、低融点ガラス、ＳｉＯ２，Ｓｉ３Ｎ４でも
よい。However, with the configuration of this embodiment, since there is no solder part, it is possible to use SiO for the protective film 12 that covers the entire surface of the ferromagnetic thin film 8. Since this protective film 12 covers the entire surface of the ferromagnetic thin film 8, corrosion of the ferromagnetic thin film 8 due to invasion of moisture from the outside can be sufficiently prevented. The material of the protective film is SiO.
In addition, low melting point glass, SiO2, Si3N4 may also be used.
また第８図のように信号磁界に極めて近い位置（約５０
μｍ前後）で取り付ける場合に、従来の磁気センサーで
は調節不具合等から、磁気センサー表面が削られ、セン
サーエレメント２が露出したり、さらには自動実装等で
機械的な傷が磁気センサー表面に入ったりする。しかし
、本実施例によれば、磁気センサー表面から邪魔な出っ
ばりを無（すると共に、硬い材質の保護膜１２を用いて
いるので傷が入りに（＜、近接した取り付けが実現でき
、またより近接することで検知精度が向上する。Also, as shown in Figure 8, the position is extremely close to the signal magnetic field (approximately 50
When installing a conventional magnetic sensor (around μm), the surface of the magnetic sensor may be scraped due to adjustment problems, exposing the sensor element 2, or mechanical scratches may enter the surface of the magnetic sensor due to automatic mounting, etc. do. However, according to this embodiment, there is no obstructive protrusion from the surface of the magnetic sensor, and since the protective film 12 is made of a hard material, it can be mounted close to the Detection accuracy improves by being closer.
（実施例３）
第２図に第３の実施例を示す。これは第１の実施例の保
護膜１２をエポキシ系樹脂保護膜を形成したチップ磁気
センサ１３を実装基板１４に面実装し、これをエポキシ
系注型樹脂１５で封じてユニットケース１６に収めてな
るセンサーユニットを示したものである。このように樹
脂保護膜を採用したチップ磁気センサー１３を注型樹脂
１５で覆うと、樹脂相互の強固な密着力が得られるとと
もに、ユニット製品本来の検知能力を充分発揮できるも
のである。また注型樹脂１５の代わりに成型樹脂を用い
てもよい。(Example 3) FIG. 2 shows a third example. In this case, a chip magnetic sensor 13 with an epoxy resin protective film formed on the protective film 12 of the first embodiment is surface mounted on a mounting board 14, and this is sealed with an epoxy molding resin 15 and housed in a unit case 16. This figure shows the sensor unit. When the chip magnetic sensor 13 employing the resin protective film is covered with the casting resin 15 in this manner, strong adhesion between the resins can be obtained, and the original sensing ability of the unit product can be fully exhibited. Moreover, a molding resin may be used instead of the casting resin 15.
（実施例４）
第３図に本発明の第４の実施例を示す。第１の実施例の
チップ磁気センサーのセンサー基板１の材料のアルミナ
を純度９９．９％以上のものを用いたものである。第１
の実施例では第１図ａ、ｂで示すように、センサー基板
１上に焼成ガラス７を設けているが製造工程をより少な
くし、製品完成までに長い時間がかからないように、純
度９９．９％以上のアルミナを用いる。基板表面が非常
に平滑であるため、焼成ガラスを設けての平滑な表面を
得る必要がなくなり、よって製造工程での工程削減、製
造時間短縮さらには、材料削減ができることとなる。ま
た、この焼成ガラス７の厚み分く約２０μｍ〜５０μｍ
）を無くする事によって、より薄いチップ磁気センサー
が可能となるものである。(Embodiment 4) FIG. 3 shows a fourth embodiment of the present invention. The sensor substrate 1 of the chip magnetic sensor of the first embodiment is made of alumina having a purity of 99.9% or more. 1st
In this embodiment, as shown in FIGS. 1a and 1b, the fired glass 7 is provided on the sensor substrate 1, but in order to reduce the number of manufacturing steps and to avoid the long time it takes to complete the product, it is made with a purity of 99.9. % or more of alumina is used. Since the surface of the substrate is very smooth, there is no need to provide a fired glass to obtain a smooth surface, thereby reducing the number of steps in the manufacturing process, the manufacturing time, and the materials used. In addition, the thickness of this fired glass 7 is approximately 20 μm to 50 μm.
), it becomes possible to create a thinner chip magnetic sensor.
（実施例５） 第６図ａ、ｂ、ｃに本発明の第５の実施例を示す。(Example 5) A fifth embodiment of the present invention is shown in FIGS. 6a, b, and c.
従来は、第７図ａ、ｂのように保護塗料４が、約５０μ
ｍと厚＜、シかも各々の保護塗料４が均一な厚みでない
ためにセンサー面中央が盛り上がっていた。このため電
子回路ユニットに実装した時、実装基板上でのセンサー
面高さが一定でなく、さらには、第７図ｃ、ｄのような
不充分な接続であったために、実装基板等からの振動に
よって検知位置がふらつき、よって検知精度が一定しな
かった。また、保護塗料４の樹脂厚みが厚くなることか
ら樹脂応力による出力歪みや出力が小さくなることがあ
った。Conventionally, the protective paint 4 has a thickness of about 50μ as shown in Fig. 7a and b.
Since each protective coating 4 did not have a uniform thickness, the center of the sensor surface was raised. For this reason, when mounted on an electronic circuit unit, the height of the sensor surface on the mounting board was not constant, and furthermore, due to insufficient connections as shown in Figure 7 c and d, the sensor surface height on the mounting board etc. The detection position fluctuated due to vibration, and therefore the detection accuracy was inconsistent. Furthermore, since the resin thickness of the protective coating 4 is increased, output distortion and output due to resin stress may be reduced.
本実施例は、本発明のチップ磁気センサー１３を他の電
子部品と共に実装基板１４に実装し、ユニットケース１
６に内蔵したものである。本発明の薄型のチップ磁気セ
ンサーを実装しているため、より薄型のユニット化が可
能となる上、検知精度も向上する。In this embodiment, a chip magnetic sensor 13 of the present invention is mounted on a mounting board 14 together with other electronic components, and a unit case 1
It is built into 6. Since the thin chip magnetic sensor of the present invention is mounted, it is possible to form a thinner unit, and detection accuracy is also improved.
発明の効果
以上のように本発明によれば、実装基板上に極めて低く
、密着した状態で、ハンダ付けが可能となり、保護膜が
薄く均一で良い膜であることから、極めて高信頼性の面
実装が可能なチップ磁気センサーとなる。また、端子の
ない構造により、自動実装も可能となる。さらに、チッ
プ表面がフラットになることから、信号磁界に近接でき
、検知精度が向上し、合わせて出力も向上し、その上、
製造での歩留アップ等から安価で高品質、高信頼性のチ
ップ磁気センサーが提供できる。Effects of the Invention As described above, according to the present invention, it is possible to solder to the mounting board in an extremely low and intimate state, and the protective film is thin, uniform, and good, resulting in extremely high reliability. It becomes a chip magnetic sensor that can be mounted. Additionally, the terminal-free structure also enables automatic mounting. Furthermore, since the chip surface is flat, it can be brought closer to the signal magnetic field, improving detection accuracy and output.
It is possible to provide chip magnetic sensors that are inexpensive, high quality, and highly reliable due to improved manufacturing yields.
第１図ａは本発明の一実施例のチップ磁気センサーの斜
視図、第１図すは同断面図、第２図は本発明の第３の実
施例のチップ磁気センサーを実装し、内蔵してなるセン
サーユニットの断面図、第３図は本発明の第４の実施例
のチップ磁気センサーの断面図、第４図は本発明の第１
の実施例のチップ磁気センサーの製造方法を示す製造工
程図、第５図は分割前のセンサー基板の正面図、第６図
ａは本発明の第５の実施例のチップ磁気センサー内蔵の
電子回路ユニットの斜視図、第６図すはその断面図、第
６図Ｃはその等価回路の説明図、第７図ａは従来例の斜
視図、第７図すは従来例の断面図、第７図Ｃは従来例の
端子フォーミング不具合等により生じた実装時の浮いた
固着状態図、第７図ｄは従来例の端子フォーミング不具
合等により生じた実装時のイモハンダ付は状態図、第８
図はチップ磁気センサーを信号磁界に近接した状態を示
す説明図である。
１・・・・・・センサー基板、８・・・・・・強磁性薄
膜、９・・・・・・第１電極、１０・・・・・・取り出
し電極、１１・・・・・・第２電極、１２・・・・・・
保護膜、１３・・・・・・チップ磁気センサー １４・
・・・・・実装基板、１５・・・・・・注型樹脂、１６
・・・・・・ユニットケース。
代理人の氏名 弁理士 粟野重孝 ほか１名第１図
８−・・
９−・−
ＩＯ−・−
センワ暮籾
１付カラス
彊磁性薄傾
第１１ｆ！
トノ出しｉｊｌｇｌ
Ｉ２−ｍ−澤 謂 護
窮
２図
１１！３ 図
第４図
第 ６ 図
＜Ｃ）
第 ５ 図FIG. 1a is a perspective view of a chip magnetic sensor according to an embodiment of the present invention, FIG. 1 is a cross-sectional view of the same, and FIG. FIG. 3 is a cross-sectional view of a chip magnetic sensor according to a fourth embodiment of the present invention, and FIG. 4 is a cross-sectional view of a sensor unit according to a fourth embodiment of the present invention.
FIG. 5 is a front view of the sensor board before division, and FIG. 6a is an electronic circuit with a built-in chip magnetic sensor according to the fifth embodiment of the present invention. FIG. 6 is a sectional view of the unit, FIG. 6 C is an explanatory diagram of its equivalent circuit, FIG. 7 a is a perspective view of a conventional example, FIG. 7 is a sectional view of a conventional example, and FIG. Figure C is a state diagram of floating fixation during mounting caused by terminal forming defects in the conventional example, Figure 7 d is a state diagram of immo-soldering during mounting caused by terminal forming defects, etc. of the conventional example, and Figure 8
The figure is an explanatory diagram showing a state in which a chip magnetic sensor is brought close to a signal magnetic field. DESCRIPTION OF SYMBOLS 1...Sensor board, 8...Ferromagnetic thin film, 9...First electrode, 10...Takeout electrode, 11......First electrode 2 electrodes, 12...
Protective film, 13... Chip magnetic sensor 14.
... Mounting board, 15 ... Casting resin, 16
...Unit case. Name of agent: Patent attorney Shigetaka Awano and one other person Figure 1 8-... 9--- IO--- Senwa kuremomi 1 with crow magnetism thin tilt No. 11f! Figure 4 Figure 6 Figure <C) Figure 5
Claims (5)
欠いて設けた切欠き部の側面に各々第１電極を備え、前
記センサー基板の表面に、前記第１電極に接続する第２
電極を有し、この第２電極に接続した強磁性薄膜を前記
センサー基板の表面上に有し、前記センサー基板の裏面
に、前記第１電極に接続した取り出し電極を備えたチッ
プ磁気センサー。(1) A first electrode is provided on each side of a notch formed by cutting out at least two corners of a rectangular sensor substrate, and a second electrode is provided on the surface of the sensor substrate and connected to the first electrode.
A chip magnetic sensor comprising an electrode, a ferromagnetic thin film connected to the second electrode on the front surface of the sensor substrate, and a take-out electrode connected to the first electrode on the back surface of the sensor substrate.
＿２、Ｓｉ＿３Ｎ＿４あるいは樹脂で保護膜を形成した
請求項１記載のチップ磁気センサー。(2) Low melting point glass, SiO, SiO on the ferromagnetic thin film
The chip magnetic sensor according to claim 1, wherein the protective film is formed of Si_2, Si_3N_4, or resin.
ナ基板を用いた請求項１記載のチップ磁気センサー。(3) The chip magnetic sensor according to claim 1, wherein an alumina substrate with a purity of 99.9% or more is used as the sensor substrate.
た後、このスルーホール電極を各々４分割するように基
板を切断してセンサー基板を形成し、センサー基板の表
面にスルーホール電極に接続するように強磁性薄膜を形
成し、前記センサー基板の裏面に前記スルーホール電極
に接続した取り出し電極を形成しチップごとに分割した
請求項１記載のチップ磁気センサーの製造方法。(4) After providing at least two through-hole electrodes on the board, cut the board into four parts each to form a sensor board, and connect the through-hole electrodes to the surface of the sensor board. 2. The method of manufacturing a chip magnetic sensor according to claim 1, wherein a ferromagnetic thin film is formed as shown in FIG.
装基板に実装してユニットケース内に収納し、ユニット
ケース内の空隙を注型樹脂で充填した電子回路ユニット
。(5) An electronic circuit unit in which the chip magnetic sensor according to claim 1, 2, or 3 is mounted on a mounting board and housed in a unit case, and a gap in the unit case is filled with casting resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085427A JPH02264880A (en) | 1989-04-04 | 1989-04-04 | Chip magnetic sensor and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1085427A JPH02264880A (en) | 1989-04-04 | 1989-04-04 | Chip magnetic sensor and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02264880A true JPH02264880A (en) | 1990-10-29 |
Family
ID=13858536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1085427A Pending JPH02264880A (en) | 1989-04-04 | 1989-04-04 | Chip magnetic sensor and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02264880A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112362920A (en) * | 2020-11-11 | 2021-02-12 | 贵州电网有限责任公司 | State monitoring sensor protection device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334986A (en) * | 1986-07-29 | 1988-02-15 | Matsushita Electric Ind Co Ltd | Magnetic sensor |
-
1989
- 1989-04-04 JP JP1085427A patent/JPH02264880A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334986A (en) * | 1986-07-29 | 1988-02-15 | Matsushita Electric Ind Co Ltd | Magnetic sensor |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112362920A (en) * | 2020-11-11 | 2021-02-12 | 贵州电网有限责任公司 | State monitoring sensor protection device |
| CN112362920B (en) * | 2020-11-11 | 2023-01-24 | 贵州电网有限责任公司 | State monitoring sensor protection device |
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