JPH02264421A - Resist spin coating device - Google Patents

Abstract

PURPOSE:To avoid the uneven coating of a resist solution on an Si substrate by a method wherein an orientation flat jig is fixed on an orifla of the Si substrate so as to coat the Si substrate taking a circular shape with the resist solution. CONSTITUTION:When an orientation flat jig axle 36 is fixed on the periphery of a driving axle 33 of a substrate mounting stage 32 so as to drive an orifla jig 25 around the periphery of an Si substrate 31, a spring 39 is contracted as soon as the orientation flat jig 35 is aligned with the orifla position of the substrate 31 so that the jig 35 may be aligned with an orientation flat 38 to make the substrate 31 take circular shape. When the alignment of the orientation flat jig 35 is finished, the orientation flat jig axle 36 and the driving axle 33 are integrated into one body to be driven together by the driving axle 33 so as to coat the substrate 31 mounted on the stage 32 with a resist solution dripped on the substrate 31. Through these procedures, the resist solution can be spread very well to be coated evenly to avoid the uneven coating of the resist solution.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a resist spin coating apparatus, and more particularly to a resist spin coating apparatus that eliminates uneven resist coating near the orientation flat of a wafer.

(Prior Art) As a matter of fact, as a technology in this field, there are, for example, the following.

FIG. 3 is a top view of a conventional resist spin coating device.
A Si substrate 1 is fixed on a substrate mounting table 2 which is equipped with a substrate rotation drive shaft 3 and has a chuck mechanism.
The resist liquid was dropped onto the substrate 1 from a resist liquid dropping nozzle (not shown) using high-pressure nitrogen, and was coated by high-speed rotation. In this case, the resist film thickness was determined by the number of high-speed rotations, and the film thickness was made uniform by adjusting the exhaust pressure above the coating.
Variations in film thickness lead to variations in pattern formation, so adjustments have been made under particularly fine-grained conditions.

In addition, as shown in FIG.
2 has been proposed in such a way that the entire periphery of the hard mask 11 is on the same plane, and the apparent resist coating area is larger than the area of the mask 11 (Japanese Patent Laid-Open No. (Refer to No. 104650 of 1983)
, 13 is a rotation axis.

Furthermore, as shown in FIG. 16, in the spin coating method, the top surface is coated on the side surface of the processed substrate 23.
It has been proposed that a plate material 25 is brought into close contact with the surface of the processed substrate 23 so as to be flush with the surface thereof, and the plate material 25 and the processed substrate 23 are rotated together (Japanese Patent Laid-Open No. 52-890).
72), 21 is a rotation stage, 22 is an intake hole, 24 is a small hole for removing the plate 25, 26 is a stopper, and 27 is a spring.

(Problem to be Solved by the Invention) However, in the resist rotation coating apparatus shown in FIGS. 3 and 4, the resist solution is dropped from the resist solution dropping nozzle 7, and the Si substrate 1 is rotated at high speed in a counterclockwise direction. There was a problem in that when the resist was rotated to 9 and the resist was skipped, uneven coating of the resist 4 occurred near the orientation flat (hereinafter simply referred to as orientation flat) 8, especially at the edge 10, which affected the yield. .

Furthermore, in the apparatuses shown in FIGS. 5 and 6, the application area is simply expanded by providing a member around the object to be coated, and therefore it is possible to eliminate uneven coating around the object to be coated. However, there are problems in that the apparatus must be large due to the space required, and it is troublesome to attach and detach the applied material. In particular, no special consideration has been given to uneven coating near the orientation flat, and the problem of uneven coating near the orientation flat described above remains unsolved.

SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned problems and provide a resist spin coating apparatus that eliminates uneven resist coating by attaching an orientation flat jig that is brought into close contact with the orientation flat of an St substrate.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a resist spin coating apparatus that drips and spins a resist solution onto a silicon substrate on which an orientation flat is formed. An orientation flat jig that can be brought into close contact with the orientation flat jig, a spring that attracts the orientation flat jig toward the rotation center, and the spring and the orientation flat jig are rotated integrally along the side peripheral surface of the silicon substrate, and the orientation flat jig is A means for positioning the tool on the orientation flat is provided, and the orientation flat jig is replenished so that the resist is coated on the silicon substrate in a substantially circular state.

(Function) According to the present invention, as described above, an orientation flat jig is attached to the orientation flat of the 31 substrate, and the resist solution is applied with the St substrate in a circular shape. Therefore, the resist is applied even near the orientation flat. Since it is spread well, uneven coating of the resist on the Si substrate can be eliminated.

(Example) Hereinafter, an example of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view of a resist spin coating apparatus showing an embodiment of the present invention, and FIG. 2 is a top view of the resist spin coating apparatus.

As shown in these figures, the drive shaft 33 of the substrate mounting table 32
An orientation flat jig shaft 36 is attached around the orientation flat jig shaft 36 so that the orientation flat jig 35 formed on the orientation flat jig shaft 36 is arranged parallel to the Si substrate 31.

Therefore, before dropping the resist liquid from the resist liquid dropping nozzle 37 and rotating the Si substrate 31, the orientation flat jig shaft 36
rotates, and the orientation flat jig 35 rotates around the Si substrate 31 with the spring 39 stretched. Then, the Si substrate 31
When the orientation flat jig 35 is defeated at the orientation flat position,
The spring 39 is compressed, the orientation flat jig 35 is positioned on the orientation flat 38, and the Si substrate 31 becomes circular.

Since the force of the spring 39 is greater than the force that fixes the Si substrate 31 on the substrate mounting table 32, as long as the orientation flat jig 35 is pressed against the outer peripheral side of the substrate, the Si substrate 31 will be displaced from the substrate mounting table 32. Never.

In addition, the drive shaft 33 of the substrate a placement table 32 and the orientation flat jig 35
For example, a ratchet mechanism (not shown) is provided between the orientation flat jig shaft 36 and the orientation flat jig shaft 36 to position the orientation flat jig 35 on the orientation flat 38.
6 only rotates, for example counterclockwise. Therefore, when the positioning of the orientation flat jig 35 is completed, the substrate mounting table 35
For example, when the drive shaft 33 of the substrate mounting table 32 rotates clockwise, the orientation flat jig shaft 36 of the orientation flat jig 35 and the drive shaft 33 of the substrate mounting table 32 are integrated and rotate clockwise together. A resist liquid is applied dropwise onto the Si substrate 31 to be set.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible based on the spirit of the present invention, and these are not excluded from the scope of the present invention.

(Effects of the Invention) As described above in detail, according to the present invention, by attaching an orientation flat jig to the orientation flat of the Si substrate,
Since the substrate is circular, the resist spreads well and is applied uniformly, thereby eliminating uneven resist application.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a resist spin coating device showing an embodiment of the present invention, FIG. 2 is a top view of the resist spin coating device,
FIG. 3 is a top view of a conventional resist spin coating device, FIG. 4 is a diagram showing problems with the resist spin coating device, FIG. 5 is a block diagram of another conventional resist spin coating device, and FIG. 6 is a diagram showing the problems of the resist spin coating device. FIG. 7 is a cross-sectional view of still another conventional resist spin coating device. 31...Si substrate, 32...Substrate mounting stand, 33...
・Drive shaft, 35... Orientation flat jig, 36... Orientation flat jig shaft, 37... Resist liquid dropping nozzle, 38.
...Ori flat, 39...spring. Patent Applicant Oki Electric Industry Co., Ltd. Agent Patent Attorney Mamoru Shimizu (1 other person) Figure 1 Figure 4

Claims (1)

[Scope of Claims] A resist coating device that drips and spins a resist solution onto a silicon substrate on which an orientation flat is formed, comprising: (a) an orientation flat jig that can be brought into close contact with the orientation flat of the silicon substrate; (b) the orientation flat. (c) a means for rotating the spring and the orientation flat jig integrally along the side peripheral surface of the silicon substrate to position the orientation flat jig on the orientation flat; and (d) replenishing the orientation flat jig and applying resist to the silicon substrate in a substantially circular state.