JPH0226239U - - Google Patents
Info
- Publication number
- JPH0226239U JPH0226239U JP1988104063U JP10406388U JPH0226239U JP H0226239 U JPH0226239 U JP H0226239U JP 1988104063 U JP1988104063 U JP 1988104063U JP 10406388 U JP10406388 U JP 10406388U JP H0226239 U JPH0226239 U JP H0226239U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic package
- bonder
- die bonder
- brazes
- heats
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
- H10W72/01365—Thermally treating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07311—Treating the bonding area before connecting, e.g. by applying flux or cleaning
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104063U JPH0226239U (enFirst) | 1988-08-08 | 1988-08-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104063U JPH0226239U (enFirst) | 1988-08-08 | 1988-08-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226239U true JPH0226239U (enFirst) | 1990-02-21 |
Family
ID=31335449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988104063U Pending JPH0226239U (enFirst) | 1988-08-08 | 1988-08-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226239U (enFirst) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562646A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Removal and reinstallation of silicon chip |
| JPS6049637A (ja) * | 1983-08-29 | 1985-03-18 | Nec Corp | 半導体基板のマウント方法 |
| JPS62296432A (ja) * | 1986-06-17 | 1987-12-23 | Toshiba Corp | 半導体装置の組立装置 |
-
1988
- 1988-08-08 JP JP1988104063U patent/JPH0226239U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS562646A (en) * | 1979-06-22 | 1981-01-12 | Hitachi Ltd | Removal and reinstallation of silicon chip |
| JPS6049637A (ja) * | 1983-08-29 | 1985-03-18 | Nec Corp | 半導体基板のマウント方法 |
| JPS62296432A (ja) * | 1986-06-17 | 1987-12-23 | Toshiba Corp | 半導体装置の組立装置 |