JPH0226106A - Delay line - Google Patents

Abstract

PURPOSE:To cause an upper limit signal frequency, which can be delayed, to be high and to easily control the length of a delay line by inserting a connector to a slit at an arbitrary position and constituting the induction line of a prescribed length. CONSTITUTION:The interval of terminals for signal connection between respective modules 9 is connected in a shape to go through a ground surface 6 by a through-hole 8 for signal connection, whose internal wall is formed with a metallic film. Slits 20 are provided to a dielectric plate 7A or 7B so that the part of the through-hole 8 can be parted. Then, the electric connection is separated. Connecting pieces 16, which are provided to a connector 15 and mutually insulated, are inserted to the slit 20 and the through-hole 8, which is electrically disconnected, is caused to be in a conductive condition. By inserting the connecting piece 16 to the slit 20, cascade connection is executed for the induction line of the module 9 and the induction line of the desired length is formed. A signal is supplied from the upper module 9 and fetched from the termination of the formed induction line by a signal fetching piece 17.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a distributed constant type delay line.

[Conventional technology]

A conventional distributed constant delay line has a structure as shown in the cross-sectional view of FIG. That is, the center conductor 11 of a coaxial line composed of a center conductor 11 and an outer conductor 14 is wound in a coil shape on the surface of a magnetic material such as ferrite 13 to increase inductance, and further, the center conductor 11 and the outer conductor A dielectric material 12 is arranged between the parts 14 and 14. The inductance L of the coiled center conductor 11 and the distributed capacitance C between the center conductor 11 and the outer conductor 14 form a delay line.

[Problem to be solved by the invention]

In the conventional distributed constant type delay circuit described above, the inductance L is generally larger than the capacitance C, so the characteristic impedance Z of this circuit. Delay circuits that are easily affected by existing stray capacitance and have a long delay time have the disadvantage that the upper limit signal frequency that can be delayed becomes low. In addition, the center conductor 11 is wound in a coil shape on the ferrite, and further,
Because of the structure in which a dielectric material is placed on top of the dielectric material, it is extremely difficult to adjust the inductance L.

The purpose of the present invention is to increase the upper limit signal frequency that can be delayed,
Another object of the present invention is to provide a delay line whose length can be easily adjusted.

[Means to solve the problem]

In the delay line of the present invention, a guiding line pattern made of a microstrip line having signal connection terminals at both ends, a grounding pattern constituting a ground plane, and the guiding line pattern and the grounding pattern are insulated and laminated alternately. In the delay line in which the dielectric plate and the signal connection terminals of the plurality of laminated guiding line patterns are cascade-connected by a plurality of signal connection through holes passing through the plurality of ground patterns and the dielectric plate, A slit that divides the signal No. 1 connection through hole of each dielectric plate, a mutually independent metal piece that connects the metal film of the signal connection through hole divided by the slit, and a signal input/output metal piece. A guide line having a predetermined length is constructed by inserting the connector into the slit at an arbitrary position.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

1 and 2 are plan views showing the main parts of an embodiment of the present invention, and FIG. 3 is a configuration diagram of the main parts of this embodiment. First, FIG. 3 shows the configuration of a module 9 which is a structural unit of the delay line. That is, a guide line pattern 5 is formed on one surface of the dielectric plate 7A by metal vapor deposition or the like, and the other opposing surface is formed with a ground plane 6 also formed by metal vapor deposition or the like. Further, the dielectric plate 7B is a dielectric plate necessary for making the module 9 multi-layered. In the guide line pattern 5, as shown in FIG. 1, the guide line 2 serving as an inductance component is formed of a microstrip line. Further, a capacitance component is formed between the guide line 2 and the surrounding ground portion 4 indicated by hatching in the figure. Terminals IA and IB are terminals for signal input and output to the guide line 2, respectively, and are connected to a signal connection through hole 8, which will be described later. The through hole 3 is a through hole for ground connection. The ground plane 6 is
As shown in FIG. 2, the through holes 1'A and 1'B are used to supply signals from the terminals IA and IB of the guide line pattern 5 to other multilayered modules using the signal connection through holes 8, which will be described later. Opened for connecting wires. Also, the through hole 3 in the ground plane 6 indicated by a hatch is a through hole for connecting to the ground through the through hole 3 of the guide line pattern 5 and the dielectric plates 7A and 7B.

FIGS. 4 and 5 are also assembly diagrams of a plurality of modules of this embodiment. That is, it has a laminated structure in which a plurality of modules 9 are stacked in multiple layers. The ground wire 10 is
As shown in FIG. 5, the ground portions 4 and the ground planes 6 of the guide line pattern of each module 9 are all connected in the vertical direction via through holes 3 in order to have the same potential.

Next, the configuration for setting the connection between each module and the guide line length will be explained with reference to the configuration explanatory diagram of FIG. 6. The signal connection terminals IA and IB between each module are connected by a signal connection through hole 8 whose inner wall is formed of a metal film, passing through the ground plane 6. A slit 20 is provided in the dielectric plate 7A or 7B so as to separate the through hole 8 for electrical connection. Next, as shown in the figure, mutually insulated connection pieces 16 provided on the connector 15 are inserted into the slits 20 to make the electrically disconnected signal connection through holes conductive again. That is, as shown in the cross-sectional view of FIG. 7, which is an enlarged view of section A in FIG. 6, the metal film 19 is connected by the connecting piece 16.

Returning to Figure 6, in this way the plurality of connection pieces 6 are connected to the slit 20
By inserting the guide lines into the module 9, the guide lines of a plurality of modules 9 are connected in cascade to form a guide line of a desired length. In FIG. 6, a signal is supplied from an upper module 9 (not shown), and the signal is extracted from the terminal end of the formed guide line by a signal extraction piece 17.

〔Effect of the invention〕

As explained above, according to the present invention, the delay line formed of a microstrip line has a multilayer structure, so that its characteristic impedance remains almost constant no matter how many layers there are. In particular, the lead-in lines to the signal input/output terminals are shortened, and stray capacitance is reduced. Therefore, the delay time can be increased without deteriorating the upper limit usable frequency characteristics. Furthermore, by reconnecting electrically disconnected multilayer modules using connectors, a delay line of arbitrary length can be constructed, which has the effect of easily adjusting the delay time.

FIG. 8 is an enlarged cross-sectional view of the conventional delay line.

LA, IB... terminal, 1'A, 1'B... through hole,
2...Guidance line, 3...Through hole, 4...Ground part, 5...Guidance line pattern, 6...Ground surface (
Grounding pattern), 7.7A, 7B...dielectric plate, 8...
・Through hole for signal connection, 9...Module, 10
... Earth wire, 11 ... Center conductor, 12 ... Dielectric material, 13 ... Ferrite, 14 ... Outer conductor, 15
... Connector, 16... Connection piece, 17... Signal extraction piece, 18... Insulator, 19 Metal film, 20... Slit.

Claims (1)

[Claims] A guiding line pattern formed by a microstrip line having signal connection terminals at both ends, a grounding pattern constituting a ground plane, and a dielectric plate for insulating and alternately stacking the guiding line pattern and the grounding pattern. In the delay line in which the signal connection terminals of the plurality of laminated guiding line patterns are cascade-connected by a plurality of signal connection through holes passing through the plurality of grounding patterns and dielectric plates, the signal of each of the dielectric plates is A connector having a slit that divides the connection through hole, a mutually independent metal piece that connects the metal film of the signal connection through hole divided by the slit, and a signal input/output metal piece, A delay line characterized in that a guide line of a predetermined length is constructed by inserting the connector into the slit at an arbitrary position.