JPS5723926U - - Google Patents

Info

Publication number
JPS5723926U
JPS5723926U JP9778580U JP9778580U JPS5723926U JP S5723926 U JPS5723926 U JP S5723926U JP 9778580 U JP9778580 U JP 9778580U JP 9778580 U JP9778580 U JP 9778580U JP S5723926 U JPS5723926 U JP S5723926U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9778580U
Other languages
Japanese (ja)
Other versions
JPS6116079Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9778580U priority Critical patent/JPS6116079Y2/ja
Publication of JPS5723926U publication Critical patent/JPS5723926U/ja
Application granted granted Critical
Publication of JPS6116079Y2 publication Critical patent/JPS6116079Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743Apparatus for manufacturing layer connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Accessories And Tools For Shearing Machines (AREA)
  • Die Bonding (AREA)
  • Details Of Cutting Devices (AREA)
  • Nonmetal Cutting Devices (AREA)
  • Shearing Machines (AREA)
JP9778580U 1980-07-10 1980-07-10 Expired JPS6116079Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9778580U JPS6116079Y2 (en) 1980-07-10 1980-07-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9778580U JPS6116079Y2 (en) 1980-07-10 1980-07-10

Publications (2)

Publication Number Publication Date
JPS5723926U true JPS5723926U (en) 1982-02-06
JPS6116079Y2 JPS6116079Y2 (en) 1986-05-17

Family

ID=29459543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9778580U Expired JPS6116079Y2 (en) 1980-07-10 1980-07-10

Country Status (1)

Country Link
JP (1) JPS6116079Y2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226106A (en) * 1988-07-14 1990-01-29 Nec Corp Delay line
JP2010508160A (en) * 2006-10-31 2010-03-18 エス・エム・エス・ジーマーク・アクチエンゲゼルシャフト Metal strip shearing method and shearing device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226106A (en) * 1988-07-14 1990-01-29 Nec Corp Delay line
JP2010508160A (en) * 2006-10-31 2010-03-18 エス・エム・エス・ジーマーク・アクチエンゲゼルシャフト Metal strip shearing method and shearing device

Also Published As

Publication number Publication date
JPS6116079Y2 (en) 1986-05-17

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