JPH0225786B2 - - Google Patents

Description

[Detailed description of the invention]

<Industrial Application Field> The present invention relates to a method for manufacturing a composite plate having a laminated structure in which a core material of phenolic resin foam is sandwiched between a bottom material and a top material, and a manufacturing apparatus used to carry out this method. It is related to. <Conventional technology> Conventional resin foams such as urethane foam, polystyrene foam, and phenol foam are used as core materials, and this is used as asbestos paper, glass paper,
Composite boards are known that have a laminated structure sandwiched between various facing materials such as aluminum foil, gypsum board, and steel plates. The general method for continuously manufacturing such composite boards is to discharge a resin mixture onto the bottom material that is being transported continuously, and then continuously layer the top material on top of this resin mixture. supply to form a laminate continuum. Next, this laminated continuous body is heated by passing it through a curing furnace while pressing it from the top and bottom surfaces.
A resin foam composite plate is obtained by foaming and curing a layer of the resin mixture to a predetermined thickness and cutting the laminated continuous body coming out of the curing furnace into a predetermined size. However, among resin foams that serve as core materials, phenolic resin foams have excellent properties such as heat resistance, flame retardance, and low smoke emission, but compared to other resin foams, they are very It was difficult to use because it was brittle. In order to overcome the drawbacks of phenolic resin foams, a novel foamable phenolic resin mixture has been proposed by the same applicant as the present application (Japanese Patent Application No. 43866/1983). This foamable phenolic resin mixture consists of a benzyl ether type phenolic resin, a polyisocyanate compound, an aromatic sulfonic acid compound, water, a foaming agent, and a foam stabilizer.
By foaming and curing this liquid mixture, a phenolic resin foam having good mechanical properties can be obtained. <Problems to be Solved by the Invention> The present inventors manufactured a phenolic resin foam composite board using the above-described foamable phenolic resin mixture. For this production, the general method described above was adopted, and the temperature of the cure furnace was set at 60 to 80°C. When the composite board thus obtained was examined, it was found that the phenolic resin foam layer had good mechanical properties, but there were some areas where the foam was not uniformly foamed, and the uniformity of the density was poor. I found out that there was a slight problem. Further, although the above-mentioned foamable phenolic resin mixture has good self-adhesion to various face materials, the adhesion of the face material to the foam may not always be sufficient depending on the conditions. Therefore, the object of the present invention is to produce a phenolic resin foam composite board with high productivity, in which the foam layer foams uniformly, has excellent density uniformity, and has sufficient adhesion to the facing material. and equipment. <Means for Solving the Problems> The present inventors have developed the foam hardening process in a curing furnace, which is adopted in the conventional continuous composite plate manufacturing method as described above, into two stages: a foaming process and a hardening process. The inventors have completed this invention by discovering that the above object can be achieved by completely separating the two steps and providing optimal conditions for each step. In other words, the method for manufacturing a phenolic resin foam composite board, which is the first invention, replaces the conventional one-step foaming and curing process of forming a foamable phenolic resin mixed liquid layer with this resin mixture at a temperature of 20 to 80°C. The process of foaming the liquid layer and the temperature of the foamed resin mixture liquid layer
The process is divided into a step of curing at 50 to 100°C. Further, the second invention, a manufacturing apparatus for a phenolic resin foam composite board, includes: a continuous supply device for a bottom material; a discharge machine for discharging a foamable phenolic resin mixture onto the bottom material; a top material lamination supply device that continuously laminates and supplies the top material on top of the resin mixture to form a continuous layered body; and a belt conveyor or rollers arranged vertically facing each other with a predetermined interval. , a curing furnace that heats the layer of the resin mixture and foams and hardens it to a predetermined thickness by continuously passing the laminated continuum between these; and cutting the foamed and hardened laminated continuum into a predetermined size. In this apparatus, the curing furnace is heated at a temperature of 20 to 80°C.
a foaming chamber that heats the laminated continuum to foam the resin mixed liquid layer, and a curing chamber that heats the laminated continuum coming out of this foaming chamber to a temperature of 50 to 100°C to harden the foamed resin mixed liquid layer. It is characterized by being composed of the following. In this invention, it is necessary to set the curing temperature to be higher than the foaming temperature of the resin mixed liquid layer, thereby clearly dividing the foaming process and the subsequent curing process into two stages. This will be done separately. <Function> The quality of this type of composite board product is mainly influenced by the quality of foaming of the resin foam that is the core material.
According to the present invention, since the foaming step and the curing step are completely separated, the optimal temperature for foaming the foamable phenolic resin mixture and the optimal temperature for curing after foaming can be provided in each step. Therefore, the phenolic resin foam is efficiently foamed in the foaming process or foaming chamber at the optimal foaming temperature within the temperature range of 20 to 80°C until just before the rise time (the time required for the foam to reach the optimal height). layer, temperature 50~
Efficient curing can be performed in a curing process or curing chamber with an optimum curing temperature within the range of 100°C. If the foaming temperature is lower than 20℃, the rise time will be very long, and if it is higher than 80℃, the foaming speed cannot be controlled and uniform foaming will not be achieved.
Density uniformity deteriorates. On the other hand, the curing temperature is 50℃
If it is lower, curing will not be sufficient and the mechanical properties of the foam will be poor. Furthermore, if the temperature is higher than 100°C, there is a tendency for cracks to occur in the foam. <Examples> Preferred examples of the present invention will be described below in further detail. The attached drawing shows an example of the composite plate manufacturing apparatus of the present invention, which includes a continuous supply device 1 for bottom material, a discharge device 2 for foamable phenolic resin mixture, a layered supply device 3 for top material, a foaming chamber 4, A curing chamber 5 and a cutting machine 6 are arranged in this order. The bottom material supply device 1 includes an uncoiler 11 wrapped with the bottom material.
and pinch rollers 12, whereby the bottom material is continuously fed from left to right in the drawing. The discharge machine 2 is a device that discharges a predetermined amount of the foamable phenolic resin mixture onto the lower surface material, and includes one or more discharge nozzles. The top material lamination supply device 3 has an uncoiler 31 wrapped with the top material and a guide roller 32, and thereby continuously laminates the top material on top of the resin mixture discharged onto the bottom material.
This is a device for supplying and forming a laminated continuous body. The foaming chamber 4 has a pressing conveyor device in which a belt conveyor 41 and a plurality of rollers 42 are arranged vertically facing each other with a predetermined gap, and the curing chamber 5 has a belt conveyor 41 and a plurality of rollers 42 facing each other vertically with a predetermined gap. It has a press conveyance device consisting of a two-shaft belt conveyor placed opposite to each other. In the illustrated example, a preheater 7 is installed in front of the discharge machine 2 to preheat the lower surface material. Further, when a steel plate or the like is used as the lower surface material, an embossing roll and a molding machine can be installed between the pinch roller 12 and the preheater 7 as necessary. To explain the operation of this device, the bottom material that is continuously supplied from the bottom material supply device 1 is preheated through a preheater 7 and then continuously fed into the line. Next, a predetermined amount of the foamable phenolic resin mixture is continuously discharged from the dispensing machine 2 onto the bottom material, and the top material, which is continuously supplied from the top material supplying device 3, is further poured onto this resin mixture. By covering, a laminated continuous body in which a layer of the resin mixture is sandwiched between the upper surface material and the lower surface material is formed. The laminated continuous body is conveyed through the foaming chamber 4 while being pressed from its upper and lower surfaces to maintain a predetermined thickness.
During this time, the resin mixture in the laminated continuous body is spread uniformly between the lower surface material and the upper surface material, and is heated to 20 to 80°C via the belt conveyor 41 and rollers 42, and rise time is reached near the exit of the foaming chamber 4. The thickness is reached immediately before reaching the predetermined thickness. The foamed continuous laminate that has left the foaming chamber 4 is then sent to a curing chamber 5, where it is heated to 50 to 100° C. via twin-shaft belt conveyors 51 and 52 to complete curing. The foamed and cured continuous laminated body continuously sent out from the curing chamber 5 is cut into a predetermined size by a cutter 6 to produce a composite board product. Phenolic resins that can be preferably used in this invention include benzyl ether type phenolic resins and resol type phenolic resins, which can self-adhere to the surface material without using an adhesive. As the surface material, asbestos paper, glass paper, aluminum foil, various heat-resistant and flame-resistant laminated papers, gypsum board, metal surface material, etc. can be used as appropriate. The method of this invention will be explained in more detail below using Examples and Comparative Examples. Example Synthesis of benzyl ether type phenolic resin: 357 g of phenol, 174 g of paraformaldehyde
g, lead naphthenate, 1.5 g, and zinc naphthenate, 3.0 g, were stirred and mixed, reacted at 110 to 114°C for 3 hours, and then immediately dehydrated under reduced pressure to obtain a viscosity of 30,000 cps (at25
A benzyl ether type phenolic resin was obtained. Preparation of foamable phenolic resin mixture: Component A: benzyl ether type phenolic resin (synthesized above) 88.5 parts by weight Foaming agent "Freon R-11" (manufactured by Mitsui Fluorochemical Co., Ltd.) 8.8 parts by weight foam stabilizer "Tween" -40” (manufactured by Kao Atlas)
2.7 parts by weight Component B curing agent (p-toluenesulfonic acid 70% aqueous solution)
30 parts by weight Component C crude diphenylmethane diisocyanate (“Millionate MR-200”, manufactured by Nippon Polyurethane Co., Ltd.) 10 parts by weight The above A, B, and C components were mixed in a Kixer (P-306 type manufactured by Toho Kikai Co., Ltd.) and foamed. A mixed phenolic resin mixture was prepared. Manufacture of composite boards: Composite boards of various sizes were manufactured using a device as shown in the attached drawings, using a colored steel plate as the bottom material and aluminum foil-covered kraft paper as the top material. The amount of foamable phenolic resin mixture at this time was 39
Table ¹ summarizes the dimensions and manufacturing conditions of the composite plate, with a line speed of 15 m/min, a foaming chamber length of 11.3 m, and a curing chamber length of 22.3 m.

【table】

[Table] The phenolic resin foam layer of the obtained composite board has a small skin layer, and there is no layered part in the cross section of the foam, and it is uniformly foamed, and the density is 34 to 35.
It was Kg/ ^m3 . Furthermore, the obtained composite board had sufficient adhesive strength to withstand cutting with a jigsaw, circular saw, etc., and machining of inside and outside corners. Comparative Example A phenolic resin foam composite board (width 250 ± 2 mm, thickness 15 ± 2mm) was manufactured. The phenolic resin foam of the obtained composite plate had a high coarse density and a layered portion in the cross section. The density also varies from 20Kg/ ^m3 to 40Kg/m3 depending on the area.
In some cases, the size was up to ³ m. In addition, some of these composite plates were unsuitable for cutting with a jigsaw, circular saw, etc., and for machining inside and outside corners. <Effects of the Invention> As explained above, according to the present invention, the foaming and curing process, which was conventionally performed in one step, can be replaced with a foaming process that provides the optimum temperature for foaming, and a foaming process that provides the optimum temperature for curing after foaming. By carrying out the curing process in two stages, the phenolic resin foam layer is effectively and uniformly foamed, resulting in excellent density uniformity, and the bond between the face material and the foam layer is improved. A phenolic resin foam composite board with good adhesive strength can be obtained.

[Brief explanation of drawings]

The accompanying drawings are explanatory views showing embodiments of the apparatus of the present invention. DESCRIPTION OF SYMBOLS 1... Bottom material continuous supply device, 2... Discharge machine, 3... Top material lamination supply device, 4... Foaming chamber, 5... Curing chamber, 6
…Cutting machine.

Claims (1)

[Claims] 1. A foamable phenolic resin mixture is discharged onto the continuously conveyed bottom material, and the top material is continuously supplied on top of the resin mixture to form a continuous laminated body. The layer of the resin mixture is foamed and cured to a predetermined thickness by heating the laminated continuum to a predetermined thickness by pressing the laminated continuum from its upper and lower surfaces, and then cutting the laminated continuum into a predetermined size. In the method for producing a phenolic resin foam composite board, the foaming and curing step is performed by foaming the resin mixed liquid layer at a temperature of 20 to 80°C, and foaming the foamed resin mixed liquid layer to a temperature of 50 to 100°C. A method for manufacturing a phenolic resin foam composite board, characterized in that the process is carried out separately from curing process. 2. a continuous supply device for the bottom material; a discharge machine that discharges the foamable phenolic resin mixture onto the bottom material; and a top material continuously laminated on the resin mixture discharged onto the bottom material; A top material laminate supply device that feeds to form a laminate continuous body; and belt conveyors or rollers arranged vertically facing each other with a predetermined interval, and the laminate continuous body is continuously passed between them. A curing furnace that heats the layer of the resin mixture to foam and harden it to a predetermined thickness; and a cutting machine that cuts the foam-hardened laminated continuous body into a predetermined size to produce a composite plate product. In an apparatus for manufacturing a resin foam composite board, the curing furnace is configured to include a foaming chamber that heats the laminated continuum to a temperature of 20 to 80°C to foam the resin mixed liquid layer, and a laminated continuum that comes out of the foaming chamber. and a curing chamber for heating the resin mixture to a temperature of 50 to 100°C to harden the foam layer of the resin mixture.