JPS6259039A - Method and device for manufacturing phenol resin foam composite board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention provides a method for manufacturing a composite plate having a laminated structure in which a core material of phenolic resin foam is sandwiched between a bottom material and a top material, and This article relates to the manufacturing equipment used to carry out the process.

<Conventional technology> Conventionally, resin foams such as urethane foam, polystyrene foam, and phenol foam have been used as a core material, and this has been used as a material between asbestos (1), paper, glass paper, aluminum foil (2), and various surface materials such as stone blue board and steel plate. Composite plates having a laminated structure sandwiched between two are known.

A common method for continuously manufacturing such composite boards is to discharge a resin mixture onto the bottom material that is being continuously transported.
A top material is further laminated and supplied on top of this resin mixture to form a continuous laminated body. Next, this laminated continuum is passed through a curing furnace and heated while being pressed from the top and bottom surfaces, thereby foaming and hardening the layer of the resin mixture to a predetermined thickness, and the laminated continuum coming out of the curing furnace to a predetermined size. A resin foam composite board is obtained by cutting.

However, among resin foams that serve as core materials, phenolic resin foams have excellent properties such as heat resistance, flame retardance, and low smoke emission, but compared to other resin foams, phenolic resin foams have very low performance. It was difficult to use because it was brittle.

In order to eliminate the drawbacks of phenolic resin foam, a vIr foamable phenolic resin mixture has been proposed by the same applicant as the present application (Japanese Patent Application No. 59-4).
No. 3866). This foamable phenolic resin mixture is a benzylic ether type phenolic resin and a polyisocyanate compound.

It consists of an aromatic sulfonic acid compound, water, a blowing agent, and a foam stabilizer, and by foaming and curing this mixture, a phenolic resin foam having good mechanical properties can be obtained.

<Problems to be Solved by the Invention> The present inventors manufactured a phenolic resin foam composite board using the above-mentioned foamable phenolic resin mixture. For this production, the general method as described above was employed, and the temperature of the curing furnace was set at 60 to 80°C.

When the composite board thus obtained was examined, it was found that the phenolic resin foam layer had good mechanical properties, but there were some areas where the foam was not uniformly foamed, and the uniformity of density was poor. I found out that there were some problems. Further, although the above-mentioned foamable phenol resin mixture has good self-adhesive strength with various face materials, the adhesive strength of the face material with the foam may not necessarily be sufficient depending on the conditions.

Therefore, an object of the present invention is to be able to produce with high productivity a phenolic resin foam composite board in which the foam layer is uniformly foamed, has excellent density uniformity, and has sufficient adhesion to the surface material. An object of the present invention is to provide a method and apparatus.

<Means for Solving the Problems> The present inventors have developed a method of combining the foaming process and the curing process in the curing furnace, which is employed in the conventional continuous composite plate manufacturing method as described above. Completely separated into two stages,
This invention was completed by discovering that the above object can be achieved by providing optimal conditions to each step.

That is, the method for manufacturing a phenolic resin foam composite board, which is the first invention, replaces the conventional one-stage foaming and curing process of the foamable phenolic resin mixed liquid layer with a temperature of 20°C.
The process is divided into a step of foaming the resin mixed liquid layer at ~80°C and a step of curing the foamed resin mixed liquid layer at a temperature of 50 to 100°C.

Further, the second invention provides an apparatus for manufacturing a phenolic resin foam composite board, which includes: a continuous supply device for a bottom material; a discharge machine for discharging a foamable phenolic resin mixture onto the bottom material; a top material lamination supply device that continuously laminates and supplies the top material on top of the resin mixture to form a continuous layered body; and a belt conveyor or rollers arranged vertically facing each other with a predetermined interval. , a curing furnace in which the layer of the resin mixture is heated and foamed and hardened to a predetermined thickness by continuously passing the layered layer between them; In an apparatus comprising a cutting machine for producing a composite product and sequentially arranged, the curing furnace is connected to a foaming chamber that heats the laminated continuous body to a temperature of 20 to 80°C to foam a resin mixed liquid layer, and a foaming chamber that foams a resin mixed liquid layer. It is characterized by comprising a curing chamber for heating the resulting laminated continuous body to a temperature of 50 to 100°C to cure the foamed layer of the resin mixture.

In this invention, it is necessary to set the curing temperature to be higher than the foaming temperature of the resin mixed liquid layer, thereby clearly dividing the foaming process and the subsequent curing process into two stages. That's what we do.

Effects> The quality of this type of composite board product is mainly influenced by the quality of foaming of the resin foam that is the core material, but according to the present invention, the foaming process and curing process are completely separated, so The optimum temperature for foaming the foamable phenolic resin mixture and the optimum temperature for curing after foaming can be provided in each step. Therefore, the phenolic resin foam is efficiently foamed in the foaming process or foaming chamber at the optimal foaming temperature within the temperature range of 20 to 80°C until just before the rice time (the time required for the foam to reach its maximum height). The layer can be efficiently cured in a curing process or curing chamber with an optimum curing temperature within the range of 50 to 100<0>C.

If the foaming temperature is lower than 20°C, the rice time will be very long, and if it is higher than 80°C, the foaming speed cannot be controlled, uniform foaming will not be achieved, and the uniformity of density will deteriorate. On the other hand, if the curing temperature is lower than 50°C, curing will not be sufficient and the mechanical properties of the foam will be poor. Furthermore, if the temperature is higher than 100°C, there is a tendency for cracks to occur in the foam.

<Examples> Preferred examples of the present invention will be listed below and will be described in detail. The attached drawing shows an example of the composite plate manufacturing apparatus of the present invention, which includes a continuous supply device 1 for bottom material, a discharge device 2 for foaming phenolic resin mixture, a layered supply device 3 for top material,
A foaming chamber 4, a curing chamber 5, and a cutting machine 6 are arranged in this order.

The bottom material supply device 1 includes an uncoiler 11 wrapped with the bottom material.
and pinch rollers 12, whereby the underside material is continuously supplied from left to right in the drawing. The discharge machine 2 is a device that discharges a predetermined amount of the foamable phenolic resin mixture onto the lower surface material, and includes one or more discharge nozzles.

The top material lamination supply device 3 has an uncoiler 31 wrapped with the top material and a guide roller 32, and thereby continuously laminates the top material on top of the resin mixture discharged onto the bottom material.
This is a device for supplying and forming a laminated continuous body. The foaming chamber 4 has a suppression conveyor device in which a belt conveyor 41 and a plurality of rollers 42 are disposed vertically facing each other with a predetermined gap, and the curing chamber 5 has a belt conveyor 51, 52 with a predetermined gap between them. It has a suppression conveyance device consisting of a two-shaft bell 1 and a conveyor arranged vertically opposite each other. In the illustrated example, a preheater 7 is installed in front of the discharge machine 2 to preheat the lower surface material. In addition, if a steel plate or the like is used as the bottom material, the pinch roller 12 may be used as necessary.
An embossing roll and a molding machine can be installed between the preheater 7 and the preheater 7.

To explain the operation of this device, the bottom material that is continuously supplied from the bottom material supply device 1 is preheated through a preheater 7, and then continuously fed into the line. Next, a predetermined amount of the foamable phenolic resin mixture is continuously discharged from the dispensing machine 2 onto the bottom material, and the top material, which is continuously supplied from the top material supplying device 3, is further applied onto this resin mixture. By overlapping, a laminated continuous body is formed in which a layer of the resin mixture is sandwiched between the upper surface material and the lower surface material. The laminated continuous body is conveyed through the foaming chamber 4 while being pressed from its upper and lower surfaces to maintain a predetermined thickness. During this time, the resin mixture in the laminated continuous body is spread uniformly between the bottom material and the top material, and is heated to 20 to 80°C via the bell 1 to the conveyor 41 and rollers 42, and near the exit of the foaming chamber 4. The rice is heated just before the rice time to reach a predetermined thickness. The foamed laminate continuous body leaving the foaming chamber 4 is then sent to the curing chamber 5, where it is conveyed via a two-wheeled belt conveyor 51, 52.
Curing is completed by heating to ~100°C. The foamed and cured laminated continuous body continuously sent out from the curing chamber 5 is cut into a predetermined size by a cutter 6 to produce a composite board product.

Phenolic resins that can be preferably used in the present invention include benzylic ether type phenolic resins and resol type phenolic resins, which can be self-adhesive to the face material without using an adhesive.

As the surface material, asbestos paper, glass paper, aluminum foil, various heat-resistant and flame-resistant laminated paper boards, metal surface materials, and the like can be used as appropriate.

The method of the present invention will be explained in more detail below with reference to Examples and Comparative Examples.

Example Synthesis of benzylic ether type phenolic resin: 174 g of phenol 357Q1 paraformaldehyde, 1.5 g of zinc naphthenate, and 3.0 g of zinc naphthenate were stirred and mixed, and reacted rapidly at 110 to 114°C for 3 hours. Dehydrated under reduced pressure, viscosity 30,000 cps
A benzylic ether type phenol resin (at 25°C) was obtained.

Preparation of foamable phenolic resin mixture: A component: 88.5 parts by weight of benzylic ether type phenol resin (synthesized above) Foaming agent "Freon R-11" 8.8@Gobe (Mitsui Fluorochemical Co., Ltd.) ) Foam stabilizer "TWeen-4Q" 2.7 layers (manufactured by Kao Atlas Co., Ltd.) B component curing agent 30 layers (p-1 ~ 70% aqueous solution of polysulfonic acid) C component crude diphenylmethane diisopropylene 1o! 1 anne (
・(“Millionate MR-200”, Japan Polyurethane Formal Attire) The above A, B, and C components are mixed in a mixer (Toho Machinery Co., Ltd. I P-3
06 type) to prepare a foamable phenolic resin l) mixture.

Composite board construction: Composite boards of various sizes were manufactured using the equipment shown in the attached drawings using bound color steel plates as the bottom material and aluminum foil-covered paper as the top material. At this time, the charging rate of the foamable phenolic resin mixture was 39 km, the line speed was 15 m/min, the length of the foaming chamber was 11.3 m, and the length of the curing chamber was 222.3 m. Dimensions and manufacturing of the composite plate. The conditions are summarized in No. 17.

]1 [- size *2 Temperature of the top material coming out of the preheater *3 Conveyor temperature The phenolic resin foam layer of the obtained composite board all has a small skin layer, and the cross section of the foam has a layered part. Without,
It is uniformly foamed, and the density is 34-35 kmM.
It was s. In addition, the obtained composite plywood can be used with a jigsaw,
It was able to withstand cutting with a circular saw, etc., and machining inside and outside corners, and had an adhesive strength of 1q.

Comparative Example A phenolic resin foam was produced by the same procedure as in the above example except that the temperature of the foaming chamber and the temperature of the curing chamber in the apparatus shown in the attached drawings were both 80°C.

The phenolic resin foam of the composite plate prepared in 1q had many dense and dense parts, and a layered part was formed in the cross section. The density also ranged from 20k(]/m3 to 40k(]/m3 depending on the area.In addition, some parts of this composite board were difficult to cut with jigsaws, circular saws, etc.). There was something suitable.

<Effects of the Invention> As explained above, according to the present invention, the foaming and curing process, which was conventionally performed in one step, can be replaced with a foaming process that provides an optimal temperature for foaming, and a foaming process that provides an optimal temperature for curing after foaming. By performing the process in two stages, including the curing process, effective and uniform foaming is achieved in the phenolic resin foam layer, resulting in excellent density uniformity and improved adhesion between the face material and the foam layer. A good kephenol resin foam composite board can be obtained.

BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings are explanatory views showing embodiments of the apparatus of the present invention. 1... Bottom material continuous supply device, 2... Discharge machine, 3...
・Top material lamination supply device, 4... Foaming chamber, 5... Curing chamber, 6... Cutting hall.

Claims (1)

[Claims] 1. A foamable phenolic resin mixture is discharged onto the bottom material that is being continuously transported, and the top material is continuously supplied on top of the resin mixture to form a continuous layered material. The layer of the resin mixture is foamed and cured to a predetermined thickness by heating the laminated continuum to a predetermined thickness by pressing the laminated continuum from its upper and lower surfaces, and then the laminated continuum is cut into a predetermined size. In the method for producing a phenolic resin foam composite board, the foaming and curing step is performed by foaming the resin mixed liquid layer at a temperature of 20 to 80°C, and foaming the foamed resin mixed liquid layer to a temperature of 50 to 100°C. A method for producing a phenolic resin foam composite board, characterized by carrying out the step of curing at °C. 2. A continuous supply device for the bottom material; a discharge machine that discharges the foamable phenolic resin mixture onto the bottom material; and a top material that is continuously laminated on top of the resin mixture discharged onto the bottom material. , a top material laminate supply device that feeds to form a laminate continuous body; and a belt conveyor or rollers arranged vertically facing each other with a predetermined interval, and by continuously passing the laminate continuous body between them. A phenolic resin formed by sequentially arranging a curing furnace that heats a layer of the resin mixture to foam and harden it to a predetermined thickness; and a cutting machine that cuts the foam-hardened laminated continuous body into a predetermined size to produce a composite plate product. In an apparatus for producing a foam composite board, the curing furnace includes a foaming chamber that heats the laminated continuum to a temperature of 20 to 80°C to foam the resin mixed liquid layer, and a laminated continuum that comes out of the foaming chamber. temperature 50
1. An apparatus for manufacturing a phenolic resin foam composite board, comprising a curing chamber for heating to ~100[deg.] C. to harden a foamed layer of the resin mixture.