JPH02256220A - Manufacture of chip type solid state electrolytic capacitor - Google Patents
Manufacture of chip type solid state electrolytic capacitorInfo
- Publication number
- JPH02256220A JPH02256220A JP7882289A JP7882289A JPH02256220A JP H02256220 A JPH02256220 A JP H02256220A JP 7882289 A JP7882289 A JP 7882289A JP 7882289 A JP7882289 A JP 7882289A JP H02256220 A JPH02256220 A JP H02256220A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- solid electrolytic
- anode
- cathode
- lead member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 66
- 239000007787 solid Substances 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000011347 resin Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 238000007747 plating Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 abstract 4
- 238000000576 coating method Methods 0.000 abstract 4
- 238000004806 packaging method and process Methods 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000007772 electroless plating Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 150000002815 nickel Chemical class 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007784 solid electrolyte Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、チップ状固体電解コンデンサの製造方法に関
するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a chip-shaped solid electrolytic capacitor.
従来の技術
従来のチップ状固体電解コンデンサは、第６図および第
７図に示すように、弁作用金属からなる陽極リード部材
１を接続した陽極体に誘電体層。2. Prior Art As shown in FIGS. 6 and 7, a conventional chip-shaped solid electrolytic capacitor includes a dielectric layer on an anode body to which an anode lead member 1 made of a valve metal is connected.
半導体層、陰極層を順次積層して構成した固体電解コン
デンサ素子２を備え、そしてこの固体電解コンデンサ素
子２の外側を、前記陽極リード部材１および陰極部３が
両端に突出するように外装樹脂４によりモールドし、そ
の後、前記陽極リード部材１の突出部１ａの表面と陰極
部３の露出部および外装樹脂４の両端部にメッキ層６を
形成するようにしていた。The solid electrolytic capacitor element 2 is provided with a solid electrolytic capacitor element 2 constructed by sequentially laminating a semiconductor layer and a cathode layer, and an exterior resin 4 is provided on the outside of the solid electrolytic capacitor element 2 so that the anode lead member 1 and the cathode part 3 protrude from both ends. After that, a plating layer 6 was formed on the surface of the protruding portion 1a of the anode lead member 1, the exposed portion of the cathode portion 3, and both ends of the exterior resin 4.
発明が解決しようとする課題
しかしながら、このような従来のチップ状固体電解コン
デンサにおいては、陽極リード部材１が外装樹脂４の端
面より外方に突出しているため、キャリアテープに設け
た凹状の収納部内に収納されているチップ状固体電解コ
ンデンサを自動実装装置によって取り出し、そしてプリ
ント基板に取り付ける場合、前記陽極リード部材１が凹
状の収納部の内側面にひっかかってチップ状固体電解コ
ンデンサを凹状の収納部からうまく取り出せないという
問題点を有していた。Problems to be Solved by the Invention However, in such a conventional chip-shaped solid electrolytic capacitor, since the anode lead member 1 protrudes outward from the end surface of the outer resin 4, it cannot be seen inside the recessed housing provided in the carrier tape. When a chip-shaped solid electrolytic capacitor housed in a chip-shaped solid electrolytic capacitor is taken out by an automatic mounting device and mounted on a printed circuit board, the anode lead member 1 is caught on the inner surface of the concave-shaped housing part, and the chip-shaped solid electrolytic capacitor is removed from the concave-shaped housing part. The problem was that it could not be taken out properly.
またこのチップ状固体電解コンデンサをプリント基板の
ランド間に取り付けるために、自動実装装置でチップ状
固体電解コンデンサの陽極側端子部と陰極側端子部をつ
かんでプリント基板のランド間に位置決めをする際にお
いても、チップ状固体電解コンデンサの陽極リード部材
１が外装樹脂４の端面より外方に突出しているため、自
動実装装置でチップ状固体電解コ／デ／すの陽極側端子
部と陰極側端子部をつかむときに均等な力で確実につか
むことができず、その結果、自動実装装置によるチップ
状固体電解コンデンサの自動実装が不安定になるという
問題点を有していた。In addition, in order to mount this chip-shaped solid electrolytic capacitor between the lands of the printed circuit board, when the automatic mounting device grasps the anode side terminal part and the cathode side terminal part of the chip-shaped solid electrolytic capacitor and positions it between the lands of the printed circuit board. Also, since the anode lead member 1 of the chip-shaped solid electrolytic capacitor protrudes outward from the end surface of the exterior resin 4, the anode side terminal and cathode side terminal of the chip-shaped solid electrolytic capacitor are separated by an automatic mounting device. When gripping the parts, it is not possible to reliably grip them with uniform force, and as a result, there is a problem in that automatic mounting of chip-shaped solid electrolytic capacitors by an automatic mounting apparatus becomes unstable.
本発明はこのような問題点を解決するもので、自動実装
装置によるチップ状固体電解コンデンサの自動実装が安
定した状態で行なえる外形を有するチップ状固体電解コ
ンデンサの製造方法を提供することを目的とするもので
ある。The present invention solves these problems, and an object of the present invention is to provide a method for manufacturing a chip solid electrolytic capacitor having an external shape that allows automatic mounting of the chip solid electrolytic capacitor using an automatic mounting device in a stable state. That is.
課題を解決するための手段
上記課題を解決するために本発明のチップ状固体電解コ
ンデンサの製造方法は、弁作用金属からなる陽極リード
部材を接続した陽極体上に誘電体層、半導体層、陰極層
を順次積層して構成した固体電解コンデンサ素子に陰極
導出材を接続し、かつ前記固体電解コンデンサ素子の両
端より外方に前記陽極リード部材および陰極導出材が引
き出されるように、前記固体電解コンデンサ素子を、両
端または片端に溝を有する外装樹脂によりモールドし、
かつこの外装樹脂の溝に少なくとも前記陽極リード部材
を収納し、さらに前記陽極リード部材の突出部と外装樹
脂の陽極側端部の表面にメッキ層を形成して陽極側メッ
キ端子を構成するとともに、前記陰極導出材の突出部と
外装樹脂の陰極側端部の表面にもメッキ層を形成して陰
極側メッキ端子を構成するようにしだものである。Means for Solving the Problems In order to solve the above problems, the method for manufacturing a chip-shaped solid electrolytic capacitor of the present invention includes forming a dielectric layer, a semiconductor layer, and a cathode on an anode body to which an anode lead member made of a valve metal is connected. A cathode lead member is connected to a solid electrolytic capacitor element formed by sequentially laminating layers, and the solid electrolytic capacitor is connected so that the anode lead member and the cathode lead member are drawn outward from both ends of the solid electrolytic capacitor element. The element is molded with an exterior resin having grooves on both ends or one end,
and storing at least the anode lead member in the groove of the exterior resin, further forming a plating layer on the surface of the protrusion of the anode lead member and the anode side end of the exterior resin to constitute an anode side plated terminal, A plating layer is also formed on the surface of the protrusion of the cathode lead-out material and the cathode side end of the exterior resin to constitute a cathode side plated terminal.
作用
上記した製造方法によれば、両端または片端に溝を有す
る外装樹脂により固体電解コンデンサ素子をモールドし
、かつこの外装樹脂の溝に少なくとも固体電解コンデン
サ素子の陽極リード部材を収納し、さらに前記陽極リー
ド部材の突出部と外装樹脂の陽極側端部の表面にメッキ
層を形成して陽極側メッキ端子を構成するとともに、固
体電解コンデ／す素子に接続した陰極導出材の突出部と
外装樹脂の陰極側端部の表面にもメッキ層を形成して陰
極側メッキ端子を構成しているため、チップ状固体電解
コ／デンサ全体の外形形状としては陽極リード部材が外
装樹脂の端面より外方に突出しない外形にすることがで
き、その結果、自動実装装置によるチップ状固体電解コ
／デ／すの自動実装も、陽極リード部材と陽極側メッキ
端子の電気的な導通面積および陰極導出材と陰極側メッ
キ端子の電気的な導通面積を減少させることなく、安定
した状態で確実に行なうことができるものである。Effects According to the manufacturing method described above, a solid electrolytic capacitor element is molded with an exterior resin having a groove at both ends or one end, and at least an anode lead member of the solid electrolytic capacitor element is accommodated in the groove of the exterior resin, and the anode A plating layer is formed on the surface of the protruding part of the lead member and the anode side end of the exterior resin to form an anode side plated terminal, and the protrusion of the cathode lead-out material connected to the solid electrolytic capacitor element and the anode side end of the exterior resin are formed. Since a plating layer is also formed on the surface of the cathode side end to form the cathode side plated terminal, the overall external shape of the chip-shaped solid electrolytic capacitor/capacitor is such that the anode lead member is placed outward from the end surface of the exterior resin. As a result, automatic mounting of chip-shaped solid electrolytic chips using automatic mounting equipment can be achieved by reducing the electrical conduction area between the anode lead member and the anode side plated terminal, and between the cathode lead material and the cathode. This can be done reliably in a stable state without reducing the electrically conductive area of the side plated terminals.
実施例
以下、本発明の一実施例を添付図面にもとづいて説明す
る。第１図〜第３図において、１１は固体電解コンデン
サ素子で、この固体電解コンデンサ素子１１は、まず、
タンタルからなる弁作用金属で構成した直径０．２５ｍ
＋ｎの陽極リード部材１２を、タンタルからなる弁作用
金属で構成したＯ Ｂ ｍｍｘｏ、ｓ調ｘ１．○調の陽
極体に埋め込んで焼結し、そしてこの陽極体上に酸化皮
膜層からなる誘電体層、二酸化マンガン層からなる半導
体層、陰極層を順次積層して構成し、その後、前記陰極
層に幅０．５１Ｒ×厚さ０．０５ ｒａｎのυん青銅板
よりなる陰極導出材１３を導電性接着材１４で接続し、
次に前記陽極リード部材１２および陰極導出材１３が固
体電解コンデンサ素子１１の両端より外方に引き吊され
、かつ第４図ａ、ｂに示すように前記陽極リード部材１
２および陰極導出材１３の周囲が凹状の溝となるような
陽極リード部材の据え付は部１５および陰極導出材の据
え付は部１６を有する上金型１アおよび下金型１８に固
体電解コンデンサ素子１１を据え付け、そして下金型１
８の外装樹脂ランナー１９より８＋脂を流し込んで成形
するトランスファーモールド成形により、陽極側に幅０
．６Ｍ、深さ０．２ｍｍの凹状の溝２０を有し、かつ陰
極側に幅０．６調、深さ０．１ｍｍの凹状の溝２１を有
するとともに、全体形状が２．０咽Ｘ １．３ 、 Ｘ
ｌ、３閣の外装樹脂２２により固体電解コンデンサ素子
１１をモールドした。Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings. In FIGS. 1 to 3, 11 is a solid electrolytic capacitor element, and this solid electrolytic capacitor element 11 first includes:
Diameter 0.25m made of valve metal made of tantalum
+n anode lead member 12 is made of a valve metal made of tantalum. A dielectric layer made of an oxide film layer, a semiconductor layer made of a manganese dioxide layer, and a cathode layer are sequentially laminated on this anode body, and then the cathode layer A cathode lead-out material 13 made of a bronze plate with a width of 0.51R and a thickness of 0.05Ran is connected to it with a conductive adhesive 14,
Next, the anode lead member 12 and the cathode lead member 13 are suspended outwardly from both ends of the solid electrolytic capacitor element 11, and as shown in FIGS.
The installation of the anode lead member so that the periphery of the cathode lead material 13 and the cathode lead material 13 is a concave groove is the installation of the solid electrolyte in the upper mold 1a and the lower mold 18, which have a part 15 and a part 16, respectively. Install capacitor element 11, and lower mold 1
A width of 0 is formed on the anode side by transfer molding, which is performed by pouring 8+ fat from the exterior resin runner 19 of 8.
．． It has a concave groove 20 with a width of 6M and a depth of 0.2 mm, and a concave groove 21 with a width of 0.6 mm and a depth of 0.1 mm on the cathode side, and the overall shape is 2.0 mm. 3, X
The solid electrolytic capacitor element 11 was molded with the exterior resin 22 of 1 and 3 layers.
そしてこのモールドが終った後、突出しだ陽極リード部
材１２が凹状の溝２ｏの端面よシ外方に突出しないよう
に陽極リード部材１２の先端を切断し、また露出した陰
極導出材１３は凹状の溝２１に収納するとともに、外装
樹脂２２の表面に沿って折り曲げた。この状態で、さら
に前記陽極リード部材１２の突出部１２２Ｌと外装樹脂
２２の陽極側端部の表面にニッケル無電解メッキ層を形
成し、さらにこのニッケル無電解メッキ層の上に半田メ
ッキ層を形成して陽極側メッキ端子２３を構成するとと
もに、前記陰極導出材１３の突出部１３ａと外装樹脂２
２の陰極側端部の表面にもニッケル無電解メッキ層を形
成し、さらにこのニッケル無電解メッキ層の上に半田メ
ッキ層を形成して陰極側メッキ端子２４を構成し、第１
図に示すようなチップ状固体電解コンデンサを作ったも
のである。After this molding is completed, the tip of the anode lead member 12 is cut so that the protruding anode lead member 12 does not protrude outward beyond the end face of the concave groove 2o, and the exposed cathode lead-out material 13 is removed from the concave groove 2o. While storing it in the groove 21, it was bent along the surface of the exterior resin 22. In this state, a nickel electroless plating layer is further formed on the surface of the protrusion 122L of the anode lead member 12 and the anode side end of the exterior resin 22, and a solder plating layer is further formed on this nickel electroless plating layer. The anode-side plated terminal 23 is formed by forming the anode-side plated terminal 23, and the protrusion 13a of the cathode lead-out material 13 and the exterior resin 2
A nickel electroless plating layer is also formed on the surface of the cathode side end of No. 2, and a solder plating layer is further formed on this nickel electroless plating layer to constitute the cathode side plating terminal 24.
This is a chip-shaped solid electrolytic capacitor as shown in the figure.
第５図は本発明の他の実施例を示したもので、この実施
例は外装樹脂２２の陽極側にのみ凹状の溝２０を設け、
この凹状の溝２ｏに陽極リード部材１２を位置きせると
ともに、この＠極り−ド部材１２の両側面と外装樹脂２
２に設けた凹状の溝２０の内面とを樹脂成形により一体
に連結したものである。そしてこの実施例は外装樹脂２
２の陰極側には凹状の溝は設けていないものである。FIG. 5 shows another embodiment of the present invention, in which a concave groove 20 is provided only on the anode side of the exterior resin 22,
The anode lead member 12 is positioned in this concave groove 2o, and the outer resin 2
2 and the inner surface of a concave groove 20 provided in the groove 20 are integrally connected by resin molding. In this example, the exterior resin 2
No concave groove was provided on the cathode side of No. 2.
上記した第１図〜第３図の実施例および第５図の実施例
においては、外装樹脂２２に設けた凹状の溝２０に陽極
リード部材１２を収納して、陽極リード部材１２が凹状
の溝２０の端部より外方に突出しないようにしているた
め、チップ状固体電解コンデンサ全体の外形形状は陽極
リード部材１２が外装樹脂２２の端面より外方に突出し
ない外形にすることができる。これによって、キャリア
テープに設けた凹状の収納部内に収納されている本発明
のチップ状固体電解コンデンサを自動実装装置によって
取り出し、そしてプリント基板に取り付ける場合におい
ても、従来のようにチップ状固体電解コンデンサが凹状
の収納部の内側面にひっかかってしまうということはな
くなり、その結果、チップ状固体電解コンデンサを凹状
の収納部から自動実装装置によって取り出す場合も、ス
ムーズな取り出しが行なえるものである。In the embodiments shown in FIGS. 1 to 3 and the embodiment shown in FIG. Since the anode lead member 12 is prevented from protruding outward beyond the end of the outer resin 20, the overall external shape of the chip solid electrolytic capacitor can be such that the anode lead member 12 does not protrude outward beyond the end surface of the exterior resin 22. As a result, even when the chip-shaped solid electrolytic capacitor of the present invention stored in the concave storage part provided in the carrier tape is taken out by an automatic mounting device and mounted on a printed circuit board, the chip-shaped solid electrolytic capacitor This eliminates the possibility that the solid electrolytic capacitor gets caught on the inner surface of the recessed housing, and as a result, even when the chip solid electrolytic capacitor is taken out from the recessed housing by an automatic mounting device, it can be taken out smoothly.
またこのチップ状固体電解コンデンサをプリント基板の
ランド間に取り付けるだめに、自動実装装置でチップ状
固体電解コンデンサの陽極側端子部と陰極側端子部をつ
かんでプリント基板のランド間に位置決めをする際にお
いても、チップ状固体電解コンデンサの陽極リード部材
１２が外装樹脂２２の端面より外方に突出していないた
め、自動実装装置でチップ状固体電解コンデンサの陽極
側端子部と陰極側端子部をつかむときには均等な力で確
実につかむことができ、その結果、自動実装装置による
チップ状固体電解コンデンサの自動実装も安定した状態
で行なえるものである。In addition, in order to mount this chip-shaped solid electrolytic capacitor between the lands of the printed circuit board, when the automatic mounting device grasps the anode side terminal part and the cathode side terminal part of the chip-shaped solid electrolytic capacitor and positions it between the lands of the printed circuit board. Also, since the anode lead member 12 of the chip-shaped solid electrolytic capacitor does not protrude outward from the end surface of the exterior resin 22, when grasping the anode side terminal part and the cathode side terminal part of the chip-shaped solid electrolytic capacitor with an automatic mounting device, It can be gripped reliably with uniform force, and as a result, the chip-shaped solid electrolytic capacitor can be automatically mounted in a stable state using an automatic mounting device.
発明の効果
上記実施例の説明から明らかなように本発明によれば、
両端まだは片端に溝を有する外装樹脂により固体電解コ
ンデンサ素子をモールドし、かつこの外装樹脂の溝に少
なくとも固体電解コンデンサ素子の陽極リード部材を収
納し、さらに前記陽極リード部材の突出部と外装樹脂の
陽極側端部の表面にメッキ層を形成して陽極側メッキ端
子を構成するとともに、固体電解コンデンサ素子に接続
した陰極導出材の突出部と外装樹脂の陰極側端部の表面
にもメッキ層を形成して陰極側メッキ端子を構成してい
るため、チップ状固体電解コンデンサ全体の外形形状と
しては陽極リード部材が外装樹脂の端面より外方に突出
しない外形にすることができ、その結果、自動実装装置
によるチップ状固体電解コンデンサの自動実装も、陽極
リード部材と陽極側メッキ端子の電気的な導通面積およ
び陰極導出材と陰極側メッキ端子の電気的な導通面積を
減少させることなく、安定した状態で確実に行なうこと
ができるものである。Effects of the Invention As is clear from the description of the above embodiments, according to the present invention,
A solid electrolytic capacitor element is molded with an exterior resin having grooves at both ends or at one end, and at least an anode lead member of the solid electrolytic capacitor element is accommodated in the groove of the exterior resin, and a protrusion of the anode lead member and the exterior resin are molded. A plating layer is formed on the surface of the anode side end of the anode side to form an anode side plating terminal, and a plating layer is also formed on the surface of the protrusion of the cathode lead-out material connected to the solid electrolytic capacitor element and the cathode side end of the exterior resin. Since the cathode side plated terminal is formed by forming the anode lead member, the overall external shape of the chip solid electrolytic capacitor can be such that the anode lead member does not protrude outward from the end surface of the exterior resin. Automatic mounting of chip solid electrolytic capacitors using automatic mounting equipment is also stable without reducing the electrical conduction area between the anode lead member and the anode side plated terminal, and the electrical conduction area between the cathode lead material and the cathode side plated terminal. This can be done reliably under these conditions.
第１図は本発明の一実施例を示すチップ状固体電解コン
デンサの断面図、第２図は同固体電解コンデンサの陽極
側から見た斜視図、第３図は同固体電解コンデンサの陰
極側から見た斜視図、第４図ａ、ｂは同固体電解コンデ
ンサを製造するための下金型および上金型の部分斜視図
、第５図は本発明の他の実施例を示す固体電解コンデン
サの斜視図、第６図は従来例を示す固体電解コンデンサ
の断面図、第７図は同固体電解コンデンサの斜視図であ
る。
１１・・・・・・固体電解コンデンサ素子、１２・・・
・・・陽極リード部材、１３・・・・・・陰極導出材、
２０．２１・・・・・・凹状の溝、２２・・・・・・外
装樹脂、２３・・・・・・陽極側メッキ端子、２４・・
・・・・陰極側メッキ端子。
代理人の氏名 弁理士 粟 野 重 孝 ほか１名図
／−ｍ−固体を解コンテンワ素子
１２− 陽極リード部材
１３・−隠昏考 出 打
どυ
２１− 凹状の溝
加
［！Ｉ味の清
２４−・−
履１曇り’Ｉメヅ壬を高テ
第 ７
図
べFig. 1 is a sectional view of a chip-shaped solid electrolytic capacitor showing an embodiment of the present invention, Fig. 2 is a perspective view of the solid electrolytic capacitor seen from the anode side, and Fig. 3 is a perspective view of the solid electrolytic capacitor seen from the cathode side. 4a and 4b are partial perspective views of a lower mold and an upper mold for manufacturing the same solid electrolytic capacitor, and FIG. 5 is a partial perspective view of a solid electrolytic capacitor showing another embodiment of the present invention. 6 is a sectional view of a conventional solid electrolytic capacitor, and FIG. 7 is a perspective view of the solid electrolytic capacitor. 11... Solid electrolytic capacitor element, 12...
...Anode lead member, 13...Cathode lead-out material,
20.21...Concave groove, 22...Exterior resin, 23...Anode side plated terminal, 24...
...Cathode side plated terminal. Name of agent: Patent attorney Shigetaka Awano and 1 other person Figure/-m- Solid content element 12- Anode lead member 13 - Hidden thought 21- Concave groove [! I taste clear 24.
Claims (1)
に誘電体層，半導体層，陰極層を順次積層して構成した
固体電解コンデンサ素子に陰極導出材を接続し、かつ前
記固体電解コンデンサ素子の両端より外方に前記陽極リ
ード部材および陰極導出材が引き出されるように、前記
固体電解コンデンサ素子を、両端または片端に溝を有す
る外装樹脂によりモールドし、かつこの外装樹脂の溝に
少なくとも前記陽極リード部材を収納し、さらに前記陽
極リード部材の突出部と外装樹脂の陽極側端部の表面に
メッキ層を形成して陽極側メッキ端子を構成するととも
に、前記陰極導出材の突出部と外装樹脂の陰極側端部の
表面にもメッキ層を形成して陰極側メッキ端子を構成す
ることを特徴とするチップ状固体電解コンデンサの製造
方法。A cathode lead-out material is connected to a solid electrolytic capacitor element constructed by sequentially laminating a dielectric layer, a semiconductor layer, and a cathode layer on an anode body to which an anode lead member made of a valve metal is connected, and the solid electrolytic capacitor element is The solid electrolytic capacitor element is molded with an exterior resin having a groove at both ends or one end so that the anode lead member and the cathode lead member are drawn outward from both ends, and at least the anode lead is inserted into the groove of the exterior resin. A plating layer is formed on the surface of the protruding part of the anode lead member and the anode side end of the exterior resin to form an anode side plated terminal, and the protrusion of the cathode lead member and the anode side end of the exterior resin are formed. A method for manufacturing a chip-shaped solid electrolytic capacitor, characterized in that a plating layer is also formed on the surface of the cathode side end to constitute a cathode side plated terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882289A JP2773207B2 (en) | 1989-03-29 | 1989-03-29 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7882289A JP2773207B2 (en) | 1989-03-29 | 1989-03-29 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02256220A true JPH02256220A (en) | 1990-10-17 |
| JP2773207B2 JP2773207B2 (en) | 1998-07-09 |
Family
ID=13672524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7882289A Expired - Fee Related JP2773207B2 (en) | 1989-03-29 | 1989-03-29 | Manufacturing method of chip-shaped solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2773207B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173303A (en) * | 2005-12-19 | 2007-07-05 | Nichicon Corp | Chip type solid electrolytic capacitor |
-
1989
- 1989-03-29 JP JP7882289A patent/JP2773207B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173303A (en) * | 2005-12-19 | 2007-07-05 | Nichicon Corp | Chip type solid electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2773207B2 (en) | 1998-07-09 |
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