JPH02256030A - Production of matrix type display device - Google Patents

Abstract

PURPOSE:To suppress the electrification of the substrate itself and to facilitate the grounding of the substrate by forming a conductive film to be used for forming function elements and wirings so as to allow the film to remain in the peripheral part of the substrate and the exposed substrate part in the substrate in the initial period in a matrix array process. CONSTITUTION:The conductive film formed in the initial period of the matrix array process is so formed as to remain in the peripheral part of the substrate and the exposed substrate part between a screen display part and terminals for connection which are not intrinsically necessary for the display function. The generation of static electricity and the breakdown, etc., of the elements by the static electricity, etc., in the glass substrate which is liable to be electrified are, therefore, prevented. Further, this antistatic metallic film remains on the matrix array substrate even during the process for assembling and packaging the matrix type display device, such as matrix array process and rubbing stage for liquid crystal oriented films and the substrate is hardly electrifiable and, therefore, the generation of the static electricity faults between thin-film transistors, wirings, etc., is prevented or decreased. The yield of the elements of the matrix array substrate is improved in this way, by which the productivity is enhanced and the cost of the production is reduced and the reliability of the device is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a matrix type display device, and particularly to a method for forming a matrix array substrate.

[Conventional technology]

In a conventional matrix display device, a plurality of row electrode lines and a plurality of column electrode lines are arranged to cross each other on a transparent insulating substrate such as glass, and each row electrode line and column electrode line are connected to each other. It has a structure in which switching elements are provided at the intersections.

FIG. 3 shows an example of such a matrix display device. In the figure, b and -b are row electrode lines (gate electrode lines), and a and ~as are column electrode lines (source electrode lines). ,
CI+C! +... is a switching element connected to the intersection of each electrode wiring. A liquid crystal display device is constructed by configuring such a wiring structure on at least one of an insulating substrate and a counter electrode substrate having a transparent conductive film, and sandwiching a display material such as liquid crystal between the two substrates and the other substrate. There is.

The above switching element CI+C! +... When using a nonlinear element such as at least one thin film transistor (hereinafter abbreviated as TPT), each electrode line is independent of each other as shown in FIG.
A TFT array substrate consisting of the transparent electrode connected to the drain electrode and the above-mentioned wiring is likely to cause dielectric breakdown due to static electricity.

For this reason, in the past, as a countermeasure against element destruction due to static electricity, a structure was adopted in which each wiring was kept at the same potential by shorting each wiring, so that even if the array substrate was exposed to static electricity, it would not be affected. ing.

FIG. 2 shows an example of the structure of a matrix array substrate showing a conventional method of short-circuiting row electrode lines and column electrode lines, as disclosed in, for example, Japanese Patent Laid-Open No. 58-116573. In the figure, a1 to a6 are column electrode lines, b1 to b are row electrode lines, and CI+C! +... is a switching element provided at the intersection of each electrode line. Here, column electrode line a,
-a6 are all short-circuited by short-circuit lines A and D as shown in the figure, and row electrode lines S and -b are also short-circuited by short-circuit lines B and C. Furthermore, short circuit wire A-D
In other words, as shown by the broken lines in the figure, if A-B is connected by wire E, A-C is connected by wire F, B-D is connected by wire H1, and C-D is connected by wire G, all electrode wires Even if the matrix array substrate becomes short-circuited and is exposed to static electricity, the potential is the same everywhere within the matrix array substrate, so the switching elements CI+C! +... will not be destroyed by static electricity.

[Problem to be solved by the invention]

Conventional matrix display devices use the methods described above to protect switching elements from static electricity.
There is no way to prevent the board from being charged before the manufacturing process that forms the short-circuit line and static electricity damage caused by it, and if the board is charged during the process after the short-circuit line is formed, the short-circuit line will simply cause each wiring to have the same potential. , since the insulating substrate remains exposed on the surface in areas not related to the display function such as the peripheral area,
There is no change in the fact that the play board as a whole is easily charged. Therefore, there has been a problem in that local electrostatic damage is likely to occur, particularly in the periphery of a large-area portion where a high-potential short pulse voltage is generated due to static electricity having a polarity opposite to that of the substrate potential.

This invention was made in order to solve the above-mentioned problems, and it is possible to suppress the charging of the substrate itself from the initial stage of the array substrate process to the entire manufacturing process of the matrix type display device, and also to prevent the substrate from grounding. An object of the present invention is to obtain a method for manufacturing a matrix type display device that is easy to manufacture.

[Means to solve the problem]

The method for manufacturing a matrix display device according to the present invention leaves the conductive film used for forming functional elements and wiring in the initial stage of the matrix array process on the periphery of the substrate and on the exposed substrate inside the substrate. This is what I did.

[Effect]

In this invention, the conductive film used for forming functional elements and wiring in the early stage of the matrix array process is left as an antistatic film on the periphery of the substrate and on the exposed parts of the substrate. It is possible to eliminate static electricity damage on the chair glass substrate, which generates static electricity and is easily charged. Moreover, since the above-mentioned antistatic film is formed using a conductive film for forming elements, etc., there is no increase in the number of processes and no increase in cost. Since it is manufactured at an early stage, it is possible to suppress substrate charging and prevent electrostatic damage throughout the manufacturing process of a matrix type display device, thereby making it possible to significantly improve the manufacturing yield of the device.

〔Example〕

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram of a matrix array substrate for explaining a method of manufacturing a matrix type display device according to an embodiment of the present invention. In the figure, 1 is an insulating substrate such as glass;
, ~a, and ~b3 are column electrode lines and row electrode lines arranged on the substrate 1, respectively, and switching elements C4 to c1 such as thin film transistors are provided at each intersection of the column and row electrode lines. is provided near the element, and an element electrode rl+f! connected to the element is provided near the element. Here, an amorphous silicon film or a polycrystalline silicon film is used as the active layer of the thin film transistor, and the screen of the substrate 1 is provided with the switching elements, electrode wires, etc. A display section 10 is configured.

dl+d again! + ... is a connection terminal for connecting the switching element for screen display and an external drive circuit, 2
Some of these are thin film transistors for display purposes.

A metal film such as Al or Cr used for wiring, lead-out wiring parts, etc., and is also formed in peripheral areas of the substrate that are not originally necessary for the display function. e, , ex, . . . are lead-out wiring portions formed by thickening the terminal wiring in the portion where the insulating substrate between the switching element and the connection terminal is exposed on the surface. Here, column electrode lines a1 to a3 + row electrode lines, ~
b, are all short-circuited by the metal film 2.

Next, the manufacturing method will be explained.

In the process of manufacturing a matrix array substrate, Aj! , a conductive film such as Cr, and an insulating film such as SiN are sequentially formed to manufacture a matrix array substrate.

Here, the conductive film used for the wiring etc. is formed so as to remain on the periphery of the substrate which is not originally necessary for the display function, and also on the part where the insulating substrate is exposed to the surface between the screen display section 10 and the connection terminal. do.

In this way, in this embodiment, the conductive film formed at the beginning of the matrix array process is applied to the periphery of the substrate, which is not originally necessary for the display function, and to the exposed parts of the substrate between the screen display part and the connection terminals. This prevents generation of static electricity and destruction of elements due to static electricity on the glass substrate, which is easily charged. Furthermore, this antistatic metal film remains on the matrix array substrate even during matrix type display device assembly and mounting processes such as the matrix array process and the rubbing process of the liquid crystal alignment film, making it difficult for the substrate to be charged (
Therefore, it is possible to prevent or reduce the occurrence of electrostatic damage between thin film transistors, wiring, etc.

Further, since the antistatic film is formed using a metal film used as wiring, etc., it can be formed without increasing the number of processes, and does not result in an increase in cost.

Further, since a conductive film is formed on most of the peripheral portion of the substrate, the structure is easy to ground throughout the manufacturing process of the matrix type display device.

〔Effect of the invention〕

As described above, according to the method for manufacturing a matrix type display device according to the present invention, the conductive film used for forming functional elements and wiring in the initial stage of the matrix array process is applied to the periphery of the substrate or the inside of the substrate. Because it was left on exposed parts, static electricity was generated.

It is possible to eliminate static electricity disturbances on glass substrates that are easily charged, thereby improving the element yield of matrix array substrates, increasing productivity, reducing manufacturing costs, and improving reliability of equipment. There is.

[Brief explanation of drawings]

FIG. 1 is a diagram for explaining a method of manufacturing a matrix type display device according to an embodiment of the present invention, FIG. 2 is a diagram showing a matrix type display device with conventional static electricity countermeasures, and FIG. FIG. 1 is a diagram showing a matrix type display device. 1 is an insulating substrate, 2 is an antistatic film, al+ a2+・
... is a column electrode line, b,,b,,... is a row electrode line, CI
+'-R+ ... is a switching element and a display electrode,
dI. d! , ... are connection terminals, el + ex + ・
. . . e7 is an extraction wiring portion, f+, fz, . . . f is a display electrode. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Claims] (1) A conductive film and an insulating film are sequentially and selectively formed on a transparent insulating substrate to form a functional area including functional elements and electrode wiring for screen display, and further display is performed on the insulating substrate. In a method of manufacturing a matrix display device by arranging a counter electrode substrate through a material, when selectively forming the conductive film, the conductive film is applied to an exposed portion of the substrate other than the functional area as an antistatic film. A method for manufacturing a matrix type display device, characterized in that the matrix type display device is left as