JPH0225332B2 - - Google Patents
Info
- Publication number
- JPH0225332B2 JPH0225332B2 JP10264982A JP10264982A JPH0225332B2 JP H0225332 B2 JPH0225332 B2 JP H0225332B2 JP 10264982 A JP10264982 A JP 10264982A JP 10264982 A JP10264982 A JP 10264982A JP H0225332 B2 JPH0225332 B2 JP H0225332B2
- Authority
- JP
- Japan
- Prior art keywords
- negative pressure
- pressure suction
- printing table
- printing
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/14—Details
- B41F15/16—Printing tables
- B41F15/18—Supports for workpieces
- B41F15/20—Supports for workpieces with suction-operated elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Screen Printers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10264982A JPS58219054A (ja) | 1982-06-15 | 1982-06-15 | スクリ−ン印刷機における印刷テ−ブルの負圧吸引構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10264982A JPS58219054A (ja) | 1982-06-15 | 1982-06-15 | スクリ−ン印刷機における印刷テ−ブルの負圧吸引構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58219054A JPS58219054A (ja) | 1983-12-20 |
| JPH0225332B2 true JPH0225332B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-06-01 |
Family
ID=14333085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10264982A Granted JPS58219054A (ja) | 1982-06-15 | 1982-06-15 | スクリ−ン印刷機における印刷テ−ブルの負圧吸引構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58219054A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1982
- 1982-06-15 JP JP10264982A patent/JPS58219054A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58219054A (ja) | 1983-12-20 |