JPH02253167A - Probing device - Google Patents

Abstract

PURPOSE:To prevent parts of an electronic circuit from being mechanically damaged by making a needle of a metal softer than a check object with respect to a probing device where the front end part of the needle is pressed to the object to check the function of the object. CONSTITUTION:A needle 205 whose front end part is pressed to a check object 3 with a prescribed pressing force is made of a metal softer than the check object 3. Therefore, parts of the electronic circuit as the check object 3 are not locally deformed. A prescribed contact resistance value is obtained with a minimum needle pressing force. Further, a maximum pressing force is reduced. Consequently, parts of the electronic circuit are prevented from being mechanically damaged.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a stylus-type blobbing device for functionally testing electronic circuit components, and in particular, the present invention relates to a stylus-type blobbing device for functionally testing electronic circuit components. Concerning a non-damaging blobbing device.

[Prior art] The stylus used in a conventional blobbing device is made of a hard metal base material made of W, BeCu, etc., and the surface thereof is coated with gold plating or rhodium coating, thereby deforming the tip contact portion of the stylus.・Methods are being implemented that suppress wear and extend service life, and prevent an increase in contact resistance due to the formation of a surface oxide film.

Furthermore, since the stylus generates a pressing force when it makes contact, methods have been implemented in which the stylus itself is made of an elastic member or the stylus is made slidable and biased using a spring.

The above-mentioned conventional technology includes, for example, Japanese Patent Application Laid-open No. 60474.
This method has been proposed in Japanese Patent Publication No. 33 and Japanese Patent Application Laid-open No. 40041/1983.

[Problem to be solved by the invention]

In the former prior art, it is difficult to inspect electronic circuit components with low mechanical strength, such as so-called thin film circuit components, without causing mechanical damage.

The reason for this is that in order to obtain a sufficiently low contact resistance value, a certain amount or more of metal contact surface is required at the contact area between the stylus and electronic circuit components, but if the stylus base material is hard, the electronic circuit This is because local deformation on the component side becomes inevitable.

In addition, a contaminated film due to oxides or dust is formed on the tip of the stylus, but when this occurs, it is necessary to destroy this contaminated film and make metal contact, compared to when the surface is clean. Also requires a large pressing force. This is because in conventional devices, the pressing force is usually set high on the assumption that there is a certain degree of contamination film, so the larger the pressing force, the greater the deformation of the electronic circuit component.

Next, in the latter conventional technique, the pressing force has a certain variation for each blowing because it is affected by thickness dimensional errors of electronic circuit components or positioning errors in the height direction of the blowing device. In addition, since the spring constant of the spring is set so that the lower limit of this variation is the minimum pressing force required to obtain a predetermined contact resistance value, the conventional device always applies a pressing force higher than the truly necessary pressing force. This means that it is being pressed down with force. Therefore, similar to the former prior art described above, it is difficult to perform stylus inspection on electronic circuit components with low mechanical strength, such as thin film circuit components, without causing mechanical damage.

An object of the present invention is to provide a probing device that can prevent mechanical damage to electronic circuit components.

[Means for Solving the Problem] In order to achieve the above object, the probing device of the present invention has a stylus made of a metal softer than the object to be inspected.

In order to press the object to be inspected with a predetermined pressing force, the bipedal stylus is made of gold so that its tip deforms when it presses against the object to be inspected. .

In addition, in the blobbing device, in order to keep the tip of the stylus clean and minimize the pressing force against the object to be inspected,
The stylus has a cleaning means for cleaning the tip of the stylus.

Further, the cleaning means is configured to clean the deteriorated tip of the stylus by removing a certain amount of the tip.

Further, the cleaning means is configured to clean the tip of the stylus with a cleaning liquid in order to reduce the material cost of the stylus.

Further, the cleaning means is configured to clean the tip of the stylus by burning it with a reducing flame in order to further reduce the material cost of the stylus.

In addition, in order to stably press the object to be inspected without being affected by thickness dimensional errors, etc., a control means is provided that detects the pressing force of the stylus and controls the pressing force of the stylus based on the detection result. It is something that you have.

In order to stabilize the pressing force of the stylus, the stylus is configured with a spring probe that slidably holds the stylus and urges the stylus toward its tip with a spring.

Further, in order to reduce the material cost of the stylus, the tip of the stylus of the spring probe is constructed by bonding thick metal.

[Effect]

In the probing device of the present invention, the stylus is made of soft metal, and when pressed against the object to be inspected, the tip of the stylus deforms and a predetermined amount of metal contact surface can be obtained.
It is possible to prevent the object to be inspected from being locally significantly deformed and damaged.

Furthermore, since there is a means for cleaning the tip of the stylus when it deteriorates, the pressing force against the object to be inspected can be minimized.

In addition, since it has a control means that detects the pressing force when the tip of the stylus is pressed against the object to be inspected and controls the pressing force of the tip of the stylus based on the detection result, it is possible to measure the thickness of the object to be inspected. Stable pressing is possible without being affected by errors.

Therefore, the maximum pressing force during probing can be reduced.

〔Example〕

Hereinafter, a description will be given of FIGS. 1 to 6 showing a probing apparatus which is an embodiment of the present invention.

FIG. 1 is a perspective view showing the overall configuration of a probing device that is an embodiment of the present invention.

As shown in FIG. 1, there is a moving means 2 supported movably in the X-axis direction on a pedestal 1, a part to be inspected 3, a socket 4, and a first hand in the moving direction of the moving means 2. 5, a cutter 6, and a torch 6a are installed, and a control means 7 is installed at a position different from the top of the pedestal 1.

The moving means 2 includes a sliding table 201 arranged in the X-axis direction.
A moving stage 20 is supported movably in the X-axis direction above.
2, and the movable stage 202 is provided with a bracket 204 that moves in the vertical direction (Z-axis direction) by a Z-axis drive motor 203 installed at its upper end. The bracket 204 has a second hand 20 that is supported on the upper surface of the tip in the horizontal direction and grips a gold wire 205 that is a stylus material.
6 and a capillary 208 supported on the lower surface of the horizontal tip and to which the tip of the conducting wire 207 is attached, and a pulley that is supported on the vertical side and guides the feeding of the gold wire 205.
209 and a loop 210 around which the gold wire 205 is wound.

The conducting wire 207 is connected to an input section of an inspection device (not shown). Also, the capillary 208 of the bracket 204
A load detecting means 8 is installed at the lower end. The load detecting means 8 includes a tip 205 of a gold wire 205 as shown in FIG.
A is configured to detect the pressing force when pressing the probing electrode 301 of the component to be inspected 3 and input a signal to the load input section 701 of the control means 7.

As shown in the perspective view in FIG. 2, the inspection target component 3 has a plurality of (four in the figure) probing electrodes 301 on the top surface.
are installed in series, and a plurality of (four in the figure) glue boards 302 are installed on the bottom surface.

As shown in a perspective view in FIG. 3, the socket 4 has a plurality of holes 401 (four holes in the figure) formed in its upper surface into which the tips of the leads 302 of the component to be inspected 3 are inserted, and It supports a plurality of (four in the figure) conducting wires 402 that are tangential to the input section of the means.

The control means 7 includes a gold wire 20 from the load detection means 8.
The load input means 701 inputs an output signal corresponding to the pressing force of 5, and the pressing force according to the output signal from the load input means 701 is compared with a preset reference pressing force, and the difference between the two pressing forces is calculated. Consisting of a calculation processing means 702 that calculates an output signal to the corresponding Z-axis drive motor 203, and a motor control means 703 that controls the drive of the Z-axis drive motor 203 based on the output signal from the calculation processing means 702. has been done.

Next, the operation will be explained with reference to FIG.

FIG. 4 is a diagram showing the state of a probing test. Fourth
As shown in the figure, the movable stage 202 is moved horizontally (X-axis direction) while holding the gold wire 205 with the second hand 206, and then moved downward (Z-axis direction) to move the gold wire 205. The tip 9 of the probe is pressed against the probing electrode 301 of the component 3 to be inspected.

In this state, signals are exchanged between the component to be inspected 3 and the inspection means via the conducting wire 207 and the conducting wire 402, and the inspection is carried out. The pressing force of the gold wire 205 at this time is detected by the load inspection means 8, and when an output signal based on the inspection result is input to the load input means 701, the load input means 701
The output signal from is input to the arithmetic processing means 702. The calculation processing means 702 calculates the output signal to the Z-axis drive motor 203 necessary to make the pressing force of the gold wire 205 to a predetermined value based on the output signal from the load input means 701, and controls the motor control means 703. An output signal is input to the Z-axis drive motor 703 via the Z-axis drive motor 703. The Z-axis drive motor 703 adjusts the pressing force of the gold wire 205 by moving the bracket 1-204 up and down based on the output signal from the motor control means 703.

If the operation of pressing the tip end 205a of the gold wire 205 against the probing electrode 301 of the component to be inspected 3 is repeated multiple times as described above, the tip end portions 205a of all the wires 205 will gradually deteriorate. That is, the tip 205a of the gold wire 205
A contamination film is formed on the surface. Gold wire 20 due to this contaminated film
The deterioration of the tip portion 205a of No. 5 is measured using a dummy reference resistance. This is done by setting in advance, through experiments, how many times the tip 205a of the gold wire 205 must be pressed before it deteriorates.

Next, FIG. 5, which shows an embodiment of a cleaning means for cleaning the tip of the deteriorated gold wire 205, will be described.

As shown in FIG. 5(a), the upper part of the gold wire 205 is
The movable stage 202 is moved while being held by the hands 206, and the tip 205a of the gold wire 205 is positioned between the open first hands 5.

Next, as shown in FIG. 5(b), the first hand 5 is moved inward to grasp the tip 205a of the gold wire 205, and the second hand 206 is moved outward to grasp the gold wire 205. Solve.

Thereafter, the moving stage 202 is moved upward by a predetermined amount to a position where the load detecting means 8 does not hit the cutter when the cutter 6 closes.

Next, as shown in FIG. 5(C), the second hand 206
After closing and gripping the upper part of the gold wire 205 again, the canter 6 is moved inward to cut the tip 205a of the gold wire 205.

Next, as shown in FIG. 5(d), the cutter 6 and first hand 5 are opened to remove the deteriorated tip 205 of the gold wire 205.
Remove a downward.

Next, the tip 20 of the gold wire 205 deteriorated as shown in FIG.
The operation of forming a new tip 205a after removing the tip 5a will be explained with reference to FIG.

As shown in FIG. 6(a), the movable stage 202 is held with the upper part of the gold wire 205 being held by the second hand 206.
is moved to position the tip of the gold wire 205 at a position opposite to the tip of the torch 6a.

Thereafter, a flame is emitted from the tips of the wires 1 to -6a toward the tip of the gold wire 205.

Then, when the above-mentioned flame generation is waited for a predetermined time and the tip of the gold wire 205 melts and is formed into a spherical shape due to surface tension, 1.
- A new tip 205a can be obtained at the tip of the gold wire 205 by stopping the flame generation from Chiro a and solidifying it.

Next, the tip 205 of the gold wire 205 shown in FIG.
A description will be given of FIG. 7, which shows an embodiment other than the cutting operation.

In the embodiment shown in FIG. 7, a discharge electrode 9 is used in place of the cutter 6 in the embodiment shown in FIG.
Since the other parts are the same as those in FIG. 5, only the different parts will be explained.

The discharge electrode 9 is made of a gold wire 205 held by the first hand 5 and the second hand 206 as shown in FIG. 7(C).
When the tip is brought into contact with the gold wire 205 and a discharge is caused, the tip 205a of the gold wire 205 is removed downward and at the same time a new tip 205a is obtained at the tip of the gold wire 205 as shown in FIG. 7(d). I can do it.

In the above embodiment, a case has been described in which the tip 205a of the spherical gold wire 205 is pressed against the probing electrode 301 of the component to be inspected 3. However, the present invention is not limited to this, and for example, the eighth As shown in the figure, it is also possible to press the gold wire 205 against the probing electrode 301 of the component to be inspected 3 without the spherical tip 205a at the tip.

In this case, when the tip of the gold wire 205 has deteriorated a predetermined number of times (-1 digit), the deteriorated portion of the tip of the gold wire 205 is cut by the operation shown in FIG.
5 can be used.

Next, a ninth example showing an embodiment of the probe bottle 10 of the present invention will be described.
The diagram will be explained.

In the embodiment shown in FIG. 9, the stylus 1 is made of gold.
001 is the tube 100 via the spring 1002
The tube 10 is slidably inserted and held in the tube 10.
03 is press-fitted into the socket 1004.

An electric wire 1006 is connected to the upper end of the socket 004 with the clothing 1005 removed and the tip of the wire 1006 caulked.

Note that in this embodiment as well, the stylus 1001 is urged downward by the spring 1002, as in the prior art.

However, in this embodiment, similar to the embodiment shown in FIG. 1, the stylus 1001 is made of gold, which is softer than the part to be inspected 3, and a cleaning means is provided when the tip of the stylus 1001 deteriorates. Since it has a means for controlling how the stylus 1001 is pushed and attached, it is possible to solve the problems that occur in the prior art due to the provision of the spring 1002, which will be explained in the next section. The same applies to Figure 10.

Next, FIG. 10 showing another embodiment of the probe pin according to the present invention will be described.

The embodiment shown in FIG. 10(a) is compared with the above-mentioned FIG. 9,
The difference is that the stylus 1001' is made of a metal other than the metal, and the tip thereof is plated with thick gold 1007', but other than the above, they are the same.

The embodiment shown in FIG. 10(b) has a slotted groove 1008" at the tip of the stylus 1001" as compared with FIG. 10(a).
They are the same except that a T-shaped bushing 1009'' made of gold is firmly fitted into the slotted groove 1008''.

In the embodiment shown in FIG. 10(C), a hole 1010'' is formed at the tip of the stylus 1001'' and the hole 1010'' is made of T-shaped gold. They are the same except that the bushing 1009'' is firmly fitted.

Next, FIG. 11 showing another embodiment of the stylus cleaning means according to the present invention will be described.

As shown in FIG. 11, the bracket 204 of the moving means 2
A spreading probe 10 is fitted and supported below the tip of the probe 10 through an electric wire 1006. Furthermore, an ultrasonic cleaner 11 that stores cleaning liquid 11a is provided below the spring probe 10.

If it is determined that the stylus 1001 at the tip of the spring probe 10 has been used a predetermined number of times and a contaminated film has been formed, the spring probe 10 is moved in the X direction and the
1 is immersed in the cleaning liquid 11a as shown in the figure. When the ultrasonic cleaner 11 is driven for a predetermined time in this state, the tip of the stylus 1001 is cleaned.

Next, FIG. 12, which shows still another embodiment of the stylus cleaning means according to the present invention, will be described.

In the embodiment shown in FIG. 12, a hydrogen torch 12 is used in place of the ultrasonic cleaner 11 and the cleaning liquid 11a in the embodiment shown in FIG.

The hydrogen torch 12 has a stylus 1001 at a predetermined position above it.
When the tip of the hydrogen torch 12 is positioned, a reducing flame 1201 is ejected from the tip of the hydrogen torch 12 toward the tip of the stylus 1001 to remove the oxide film on the tip of the stylus 1001.

Next, FIG. 13, which shows an embodiment in which the thick gold plating shown in FIG. 10 is bonded to the tip of the stylus, will be described.

As shown in FIG. 13, the stylus 1001 is made of silicone rubber 13
01, and the silicone rubber 1301 is fixedly supported by a bracket +4303 which is supported by a stand 1302 so as to be movable in the vertical and rotational directions. The bracket eye 303 also fixes a negative electrode 1304, and the negative electrode 1304 and the stylus 1001 are connected. As shown in the figure, a gold plating liquid 1307 is stored in the tank 1305 so as to immerse the silicone rubber 1301 and the tip of the positive electrode 1306.
6 is a bracket via an insulator 1308.)) 1303
and is connected to a power source 1308 along with a negative electrode 1304.
is connected to.

When power is started to be applied to the positive electrode 1306 from the power source 1308 in the illustrated state, a gold plating 1309 is formed on the stylus 1001 side, but it is masked by the silicone rubber 1301 and the 17
), the required probe pin is formed by thickly accumulating only at the tip of the stylus 1001.

In this case, since the silicone rubber 1301 is made of a flexible material, the stylus 1001 can be easily removed after plating. Furthermore, although FIG. 13 shows a case where the stylus 1001 is made of one piece of wood, the present invention is not limited to this. A plurality of holes are formed in the silicone rubber 1301 and a plurality of stylus 1001 are inserted into the holes. By doing so, a plurality of stylus needles 1001 can be processed simultaneously.

[Effects of the Invention] Since the blobbing device according to the present invention is configured as described above, it exhibits the effects described below.

Local large deformation of the electronic circuit component to be inspected can be eliminated.

Further, a predetermined contact resistance value can be obtained with the minimum force for pressing the stylus.

Furthermore, since the pressing force can be controlled in a stable state, the maximum pressing force during blobbing can be reduced.

Therefore, it is possible to prevent opportunity damage to the electronic circuit component to be inspected.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a blowing device according to an embodiment of the present invention, Fig. 2 is a perspective view showing a component to be inspected, Fig. 3 is a perspective view showing a socket, and Fig. 4 is a perspective view showing a blowing device according to the present invention. FIG. 5 is an explanatory diagram for explaining the wire cleaning method of the present invention, FIG. 5 is a cleaning process diagram showing one embodiment of the gold wire cleaning means of the present invention, and FIG. 6 is another embodiment of the gold wire cleaning means of the present invention. FIG. 7 is a cleaning process explanatory diagram showing yet another embodiment of the gold wire cleaning means of the present invention, and Part 8 is an explanation showing another embodiment of the tip of the gold wire. Figures 9 and 10 are explanatory diagrams showing an embodiment of the probe pin, Figures 11 and 12 are explanatory diagrams showing an embodiment of the probe pin cleaning device, and Figure 13 is an explanatory diagram showing an embodiment of the probe pin cleaning device. FIG. 2 is an explanatory diagram showing an example in which thick gold plating is applied to the plate. ■... Frame, 2... Moving means, 3... Parts to be inspected, 4... Socket, 5... First hand, 6...
Kamphu, 7... Control means, 8... Load detection means, 1
0... Probe pin, 11... Ultrasonic cleaner, 12
...Hydrogen torch. Taste turn “0 ■ ■ ○:

Claims (1)

[Scope of Claims] 1. In a probing device for functionally testing an object to be tested by pressing the tip of the stylus against the object, the stylus is made of a metal softer than the object to be tested. Probing equipment. 2. The probing device according to claim 1, wherein the stylus is made of gold. 3. A probing device that performs a functional test of an object to be tested by pressing the tip of the stylus against the object, the probing device comprising a cleaning means for cleaning the tip of the stylus. 4. A probing device according to claim 3, wherein the cleaning means is configured to remove a predetermined amount of a deteriorated tip of the stylus. 5. The cleaning means according to claim 3 is a probing device configured to clean the tip of the stylus with a cleaning liquid. 6. The probing device according to claim 3, wherein the cleaning means is configured to clean the tip of the stylus by burning it with a reducing flame. 7. In a probing device that tests the function of an object to be tested by pressing the tip of the stylus against the object, detecting the pressing force of the stylus and controlling the pressing force of the stylus based on the detection result. Probing device with control means. 8. In a probing device that tests the functionality of an object to be tested by pressing the tip of the stylus against the object, the stylus is held slidably and the stylus is urged toward the tip by a spring. A probing device equipped with a spring prong and having the stylus made of gold. 9. In a probing device that tests the functionality of an object to be tested by pressing the tip of the stylus against the object, the stylus is held slidably and the stylus is urged toward the tip by a spring. A probing device equipped with a spring prong and having thick metal bonded to the tip of the stylus.