JPH0224977U - - Google Patents
Info
- Publication number
- JPH0224977U JPH0224977U JP10353088U JP10353088U JPH0224977U JP H0224977 U JPH0224977 U JP H0224977U JP 10353088 U JP10353088 U JP 10353088U JP 10353088 U JP10353088 U JP 10353088U JP H0224977 U JPH0224977 U JP H0224977U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive layer
- sensitive adhesive
- laminate
- transparent
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010410 layer Substances 0.000 claims description 12
- 239000012790 adhesive layer Substances 0.000 claims description 8
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 2
- -1 polyethylene terephthalate Polymers 0.000 claims 2
- 229920005992 thermoplastic resin Polymers 0.000 claims 2
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000003111 delayed effect Effects 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920006352 transparent thermoplastic Polymers 0.000 claims 1
- 229920002799 BoPET Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
Landscapes
- Credit Cards Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10353088U JPH0224977U (US07166745-20070123-C00016.png) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10353088U JPH0224977U (US07166745-20070123-C00016.png) | 1988-08-04 | 1988-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224977U true JPH0224977U (US07166745-20070123-C00016.png) | 1990-02-19 |
Family
ID=31334448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10353088U Pending JPH0224977U (US07166745-20070123-C00016.png) | 1988-08-04 | 1988-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224977U (US07166745-20070123-C00016.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03266696A (ja) * | 1990-03-16 | 1991-11-27 | Ebaa Kooto Kk | 葉書、封書等の通信体とその製造方法 |
| JPH044040U (US07166745-20070123-C00016.png) * | 1990-04-24 | 1992-01-14 |
-
1988
- 1988-08-04 JP JP10353088U patent/JPH0224977U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03266696A (ja) * | 1990-03-16 | 1991-11-27 | Ebaa Kooto Kk | 葉書、封書等の通信体とその製造方法 |
| JPH044040U (US07166745-20070123-C00016.png) * | 1990-04-24 | 1992-01-14 |
