JPH02248021A - Laminated ceramic capacitor - Google Patents
Laminated ceramic capacitorInfo
- Publication number
- JPH02248021A JPH02248021A JP6968189A JP6968189A JPH02248021A JP H02248021 A JPH02248021 A JP H02248021A JP 6968189 A JP6968189 A JP 6968189A JP 6968189 A JP6968189 A JP 6968189A JP H02248021 A JPH02248021 A JP H02248021A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- alloy layer
- ceramic capacitor
- alloy
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 27
- 239000000956 alloy Substances 0.000 claims abstract description 27
- 229910017932 Cu—Sb Inorganic materials 0.000 claims abstract description 14
- 229910020816 Sn Pb Inorganic materials 0.000 claims abstract description 8
- 229910020922 Sn-Pb Inorganic materials 0.000 claims abstract description 8
- 229910008783 Sn—Pb Inorganic materials 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000003989 dielectric material Substances 0.000 claims description 2
- 239000007772 electrode material Substances 0.000 abstract description 8
- 238000009713 electroplating Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- 239000011230 binding agent Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 230000007935 neutral effect Effects 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract description 2
- 229910020935 Sn-Sb Inorganic materials 0.000 abstract 1
- 229910008757 Sn—Sb Inorganic materials 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 229910001245 Sb alloy Inorganic materials 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910009038 Sn—P Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010587 phase diagram Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、内部電極と外部電極とに卑金属を用いた積層
セラミックコンデンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a multilayer ceramic capacitor in which base metals are used for internal electrodes and external electrodes.
従来の技術
今日、積層セラミックコンデンサは、軽薄短小化の要望
を満たすため、ますますその需要が高まっており、また
それに伴い改善すべき技術課題も種々上げられている。BACKGROUND OF THE INVENTION Today, the demand for multilayer ceramic capacitors is increasing to meet the demand for smaller, lighter, thinner, and smaller capacitors, and various technical issues to be improved have also been raised accordingly.
その改善すべき項目の一つとして、内部電極に使用され
るバラジュウムなどの材料が高価なため、それを低価格
の材料に置き換え、製品価格を低下させようとの試みが
ある。そして、このような点から、Ｎｉ ｆ内部電極材
料に使用することが提案されており、一部実施されてい
る。この内部電極材料にＮｉ ｆ用いた場合、外部電極
材料にもＣｕなどの卑金属が用いられている。これは通
常用いられるムｇ外部電極では、Ｈｉよりなる内部電極
との十分な接合強度が得られないためである。One of the items that should be improved is the expensive material used for the internal electrodes, such as baladium, so there is an attempt to replace it with a cheaper material to lower the product price. From this point of view, it has been proposed to use Ni f as an internal electrode material, and some implementation has been carried out. When Nif is used as the internal electrode material, a base metal such as Cu is also used as the external electrode material. This is because the commonly used Mg external electrode does not have sufficient bonding strength with the Hi internal electrode.
発明が解決しようとする課題
しかし、このように内部電極材料にＮｉを使用し、外部
電極材料にＣｕ ｆ用いた構成では、内部電極と外部電
極との接合がまだまだ不十分であり、そのため容量が抜
けてしまうという問題点を有しているのが実情である。Problems to be Solved by the Invention However, in this configuration in which Ni is used as the internal electrode material and Cu f is used as the external electrode material, the bonding between the internal electrode and the external electrode is still insufficient, and as a result, the capacitance is reduced. The reality is that it has the problem of falling through the cracks.
本発明はこのような問題点を解決するもので、Ｎ１より
なる内部電極と外部電極との接合強度を十分にとれる構
成とした積層セラミックコンデンサを提供することを目
的とするものである。The present invention is intended to solve these problems, and it is an object of the present invention to provide a multilayer ceramic capacitor having a structure that allows sufficient bonding strength between internal electrodes made of N1 and external electrodes.
課題を解決するための手段
この課題を解決するために本発明の積層セラミックコン
デンサは、外部電極が、Ｎｉよりなる内部電極と接続さ
れる第１層がＣｕ−Ｓｂ合金層、その上に設けられる第
２層がＮ１金属層、最外部に位置する第３層がＳｎ−Ｐ
ｂ合金層よりなる構成としたものである。Means for Solving the Problem In order to solve this problem, the multilayer ceramic capacitor of the present invention has a first layer in which the external electrode is connected to the internal electrode made of Ni, and is provided on a Cu-Sb alloy layer. The second layer is an N1 metal layer, and the third layer located on the outermost side is Sn-P.
It has a structure consisting of a b alloy layer.
作用
この構成によれば、所定の焼付温度（後述する９００℃
付近）で第１層のＣｕ−Ｓｂ合金層の焼付を行う過程で
、ｓｂが溶融し、そのｓｂに外部電極のＣｕ、内部電極
のＮｉが溶けこんでいき合金を作る＠状態図によると、
Ｃｕ−Ｓｂ、Ｎｉ−５ｂ合金はその比率がかなり広い範
囲において溶融状態にあるため、内部電極と外部電極（
Ｃｕ−Ｓｂ合金層）との接合が強くなり、容量が抜けて
しまうということがないものとなる。Function: According to this configuration, a predetermined baking temperature (900° C. to be described later)
In the process of baking the first Cu-Sb alloy layer (near the area), sb melts, and Cu from the external electrode and Ni from the internal electrode melt into the sb to form an alloy. According to the phase diagram:
Cu-Sb and Ni-5b alloys are in a molten state in a fairly wide range of ratios, so the inner electrode and the outer electrode (
(Cu--Sb alloy layer) is strengthened, and there is no possibility that the capacitance will be lost.
実施例 以下１本発明の一実施例について説明する。Example An embodiment of the present invention will be described below.
まず、Ｃｕ１ ｏｏ］ｉ量部に対して、Ｓｂ１〜３０重
量部となるようにＣｕ金属粉、Ｓｂ金属粉全配合し、そ
れにバインダ、溶剤、ガラスフリッｌ−ｉ入れて混合し
、Ｃｕ−Ｓｂペ一ストヲ作製した。次に、このペースト
ラ素体の両端面に塗布し、乾燥し、９００’Ｃ中性雰囲
気中で焼付を行った。次いで、電解メツキ法によりその
上にＮ１メツキ全行い、Ｎ１の金属層を形成し、その後
電解メツキ法によりＮｉ金属層の上にＳｎ−Ｐｂメツキ
を行い、Ｓｎ−Ｐｂ合金層を形成し、積層セラミックコ
ンデンサとした。First, Cu metal powder and Sb metal powder are all mixed so that 1 to 30 parts by weight of Sb are added to Cu1 oo]i parts, and a binder, a solvent, and a glass frit l-i are added and mixed to form a Cu-Sb paste. I made one stroke. Next, it was applied to both end faces of this pastera element body, dried, and baked at 900'C in a neutral atmosphere. Next, all N1 plating is performed on it by electrolytic plating to form an N1 metal layer, and then Sn-Pb plating is performed on the Ni metal layer by electrolytic plating to form a Sn-Pb alloy layer. It is a ceramic capacitor.
ここで、前記素体とは、本実施例により得られた積層セ
ラミックコンデンサを示す第１図に示される通り、誘電
体１とＮｉよりなる内部電極２とが交互に積層されてな
るものであり、かつ前記内部電極２は相異なる端面のＣ
ｕ−Ｓｂ合金層３に一層おきに接続されている。また％
４はＮｉ金属層。Here, the element body is one in which dielectric material 1 and internal electrodes 2 made of Ni are alternately laminated, as shown in FIG. 1 showing the multilayer ceramic capacitor obtained in this example. , and the internal electrodes 2 have different end faces C
It is connected to the u-Sb alloy layer 3 every other layer. Also%
4 is a Ni metal layer.
６はＳｎ−Ｐｂ合金層である。6 is a Sn-Pb alloy layer.
ここで、本発明において外部電極として、第２層のＮ１
金属層、第３層のＳｎ−Ｐｂ合金層を設けている理由は
、従来と同様に半田付は性向上のために第３層のａｎ−
Ｐｂ合金層を設けており、また第２層のＮ１金属層は第
１層のＣｕ−Ｓｂ合金層のうちのＣｕがＳｎ−Ｐｂ合金
層中に移行して起こる半田喰われを防止するために設け
られている。Here, in the present invention, N1 of the second layer is used as an external electrode.
The reason why the metal layer and the third Sn-Pb alloy layer are provided is that the third layer an-Pb is used to improve soldering properties, as in the past.
A Pb alloy layer is provided, and the second N1 metal layer is used to prevent solder erosion caused by Cu in the first Cu-Sb alloy layer migrating into the Sn-Pb alloy layer. It is provided.
次に、内部電極と外部電極との接合を評価するために実
験を行った。ここでは、誘電体１として一般に用いられ
ているＢａＴｉＯ３系材料を使用し、有効誘電体層を１
２層として実験を行った。その結果を下記の第１表に示
す。また、測定は外部電極の第１層にＯｕ合金層用いた
従来の積層セラミックコンデンサと、Ｃｕ−５ｂ合金層
を用いた積層セラミックコンデンサにおける熱衝撃試験
（８６’Ｃ，−４６℃）２００サイクル後の容量変化率
（試料数１０個の平均値）で調べた。′ここで、もちろ
ん実験は外部電極を構成する第２層のＮｉ金属層、第３
層のＳｎ−Ｐｂ合金層を設けた状態でのものである。Next, an experiment was conducted to evaluate the bond between the internal electrode and the external electrode. Here, a commonly used BaTiO3 material is used as the dielectric 1, and the effective dielectric layer is 1.
The experiment was conducted using two layers. The results are shown in Table 1 below. Measurements were also conducted after 200 cycles of thermal shock tests (86'C, -46°C) on conventional multilayer ceramic capacitors using an Ou alloy layer as the first layer of the external electrode and multilayer ceramic capacitors using a Cu-5b alloy layer. The rate of change in capacity (average value of 10 samples) was investigated. 'Here, of course, the experiment was conducted using the second Ni metal layer and the third layer, which constitute the external electrode.
This is a state in which a Sn--Pb alloy layer is provided.
（以下余 白） ＊は従来例で請求範囲外である。(Left below) * indicates a conventional example and is outside the scope of the claims.
この第１表に示す通り、本実施例のように外部電極の第
１図にＣｕ −Ｓｂ合金層を用いた場合、容量変化がほ
とんどなくなり、従ってＮｉ内部電極と外部電極（Ｃｕ
−５ｂ合金層）との接合が強くなっていることは明らか
である。しかし、Ｃｕ１００重量部に対してｓｂが２６
重量部金全光ると、０１１−Ｓｂ合金層が溶融し、容量
を持たなくなる。As shown in Table 1, when a Cu-Sb alloy layer is used for the external electrode in Figure 1 as in this example, there is almost no change in capacitance, and therefore the Ni internal electrode
It is clear that the bond with the -5b alloy layer) is strengthened. However, sb is 26 parts by weight for 100 parts by weight of Cu.
When all parts by weight of gold are exposed, the 011-Sb alloy layer melts and loses its capacity.
ここで、Ｃｕの融点は１０８３℃であり、ｓｂの融点は
それより低い６３１℃であるため、前記実施例における
焼付温度より低い温度で焼付を行うこととすると、Ｃｕ
とＳｔ）の比率は前記実施例の時よりもｓｂの割合を増
やすことが理論上可能であるが、その反面、その焼付温
度におけるＣｕ −ｓｂ金合金溶融状態にある範囲（量
）が減ジ、Ｎｉとの合金ができにくいという側面が現れ
てくる。Here, the melting point of Cu is 1083°C, and the melting point of sb is 631°C, which is lower than that, so if baking is performed at a temperature lower than the baking temperature in the above example, Cu
It is theoretically possible to increase the ratio of sb and St) compared to the above example, but on the other hand, it is possible to reduce the range (amount) of the Cu-sb gold alloy in the molten state at the baking temperature. , it becomes difficult to form an alloy with Ni.
したがって、Ｎｉを内部電極材料に使用した場合におけ
る誘電体の焼成温度（通常１２００℃前後）と、前記Ｎ
ｉ内部電極との合金化のしやすさとの両面から見比場合
、前記実施例における焼付温度の付近でＣｕ−Ｓｂ合金
層の焼付を行うのがよいと思われるので、Ｃｕ１００重
量部に対するｓｂの割合は１〜２０重量部が好ましいと
考えられる。Therefore, when Ni is used as the internal electrode material, the dielectric firing temperature (usually around 1200°C) and the N
i Considering the ease of alloying with the internal electrode, it seems to be better to bake the Cu-Sb alloy layer at around the baking temperature in the above example. It is believed that a preferred proportion is 1 to 20 parts by weight.
発明の効果
以上のよりに本発明によれば、Ｎｉｉ内部電極材料に使
用した積層セラミックコンデンサにおける外部電極にＣ
ｕに代えてＣｕ−５ｂ合金層を用いることにより、内部
電極と外部電極との接合が強くなり、容量が抜けるとい
うこと全防止できる効果が得られる。Effects of the Invention According to the present invention, C is added to the outer electrode of a multilayer ceramic capacitor used as the Nii inner electrode material.
By using a Cu-5b alloy layer instead of u, the bond between the internal electrode and the external electrode becomes stronger, and the effect of completely preventing loss of capacitance can be obtained.
第１図は本発明の一実施例にかかる積層セラミックコン
デンサを示す断面図である。
１・・・・・・誘電体、２・・・・・・内部電極、３・
・・・・・Ｃｕ−３り合金層、４・・・・・・Ｎｉ金属
層、６・・・・・・Ｓｎ−Ｐｂ合金層。
代理人の氏名 弁理士粟 野 重 孝 ほか１名第１図
／ −−一誘電体、
２−−一内呵１叱１！
３−−− Ｃｔ −Ｓｂ令生層
４−−− Ｎ ｉ生馬層
Ｓ −５ｆＬ−Ｐｂ令全１FIG. 1 is a sectional view showing a multilayer ceramic capacitor according to an embodiment of the present invention. 1... Dielectric, 2... Internal electrode, 3...
. . . Cu-3 alloy layer, 4 . . . Ni metal layer, 6 . . . Sn-Pb alloy layer. Name of agent: Patent attorney Shigetaka Awano and one other person Figure 1/--1 Dielectric, 2--1, 1, 1! 3--- Ct -Sb Younger layer 4--- Ni Younger layer S -5fL-Pb Younger total 1
Claims (2)
内部電極と接続される外部電極を両端面部に有する構成
を具備し、かつ前記外部電極が、Ｎｉよりなる前記内部
電極と接続される第１層がＣｕ−Ｓｂ合金層、その上に
設けられる第２層がＮｉ金属層、最外部に位置する第３
層がＳｎ−Ｐｂ合金層よりなる積層セラミックコンデン
サ。(1) A structure in which dielectrics and internal electrodes are alternately laminated, and external electrodes connected to the internal electrodes are provided on both end surfaces, and the external electrodes are connected to the internal electrodes made of Ni. The first layer is a Cu-Sb alloy layer, the second layer provided thereon is a Ni metal layer, and the outermost third layer is a Cu-Sb alloy layer.
A multilayer ceramic capacitor whose layers are made of Sn-Pb alloy layers.
Ｃｕ−Ｓｂ比率が重量部にして１００：１〜１００：２
０である請求項１記載の積層セラミックコンデンサ。(2) The Cu-Sb ratio of the first Cu-Sb alloy layer constituting the external electrode is 100:1 to 100:2 in parts by weight.
2. The multilayer ceramic capacitor according to claim 1, wherein the multilayer ceramic capacitor is 0.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6968189A JP2692250B2 (en) | 1989-03-22 | 1989-03-22 | Monolithic ceramic capacitors |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6968189A JP2692250B2 (en) | 1989-03-22 | 1989-03-22 | Monolithic ceramic capacitors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02248021A true JPH02248021A (en) | 1990-10-03 |
| JP2692250B2 JP2692250B2 (en) | 1997-12-17 |
Family
ID=13409849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6968189A Expired - Fee Related JP2692250B2 (en) | 1989-03-22 | 1989-03-22 | Monolithic ceramic capacitors |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2692250B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283986A (en) * | 2009-09-03 | 2009-12-03 | Taiyo Yuden Co Ltd | Electronic component with externally connected electrode, and circuit module |
-
1989
- 1989-03-22 JP JP6968189A patent/JP2692250B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283986A (en) * | 2009-09-03 | 2009-12-03 | Taiyo Yuden Co Ltd | Electronic component with externally connected electrode, and circuit module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2692250B2 (en) | 1997-12-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |