JPH02246299A - Multilayer ceramic circuit board and its manufacture - Google Patents

Abstract

PURPOSE:To make small the mounting areas of resistors and to make possible an adjustment of the resistance value subsequent to firing of a circuit board by a method wherein the resistors are formed on the circuit board vertically to the element mounting surface of an LSI and extraction lines, which are connected to other electrode parts provided on the board surface from each layer of green sheets, are provided. CONSTITUTION:A multilayer ceramic circuit board is provided with electrode parts 15 formed at the upper and lower parts of a hole 12 for resistor use, resistors 13 provided in the hole 12, extraction lines 14, which are provided on the surface of the board from each layer of green sheets 11 and are independently formed so as to reach other electrode parts 16, and the like. The lines 14 are respectively connected to one of the resistors 13, one other electrode part is selected from among the other electrode parts 16 and at least one of the resistors 13 is incorporated between the electrode parts 15 and the other electrode part 16 to contrive to adjust the resistance value of the board. Moreover, the resistors 13 are formed vertically to an element mounting surface of a large-scale integrated circuit (an LSI). Thereby, the mounting areas of the resistors 13 can be made small and the resistance value subsequent to firing of the board can be adjusted.

Description

[Detailed Description of the Invention] [Summary] A method for manufacturing a multilayer ceramic circuit board for mounting large-scale integrated circuit (LSI) elements, which requires a small mounting area for resistors and adjusts the resistance value after baking the board. The purpose of the present invention is to provide a multilayer ceramic circuit board with a built-in resistor that is capable of providing three-dimensional wiring. are each provided with an electrode portion, and a lead line connecting each layer of the substrate to another electrode portion on the surface of the substrate is connected to any one of the resistors, and at least one of the resistors is connected by selecting the other electrode portion. A multilayer ceramic circuit board, and a method for manufacturing a multilayer ceramic circuit board having three-dimensional wiring, characterized in that one is incorporated between an electrode part and another electrode part to adjust the resistance value of the board. , a step of forming holes for resistors in advance at predetermined positions in a plurality of green sheets, and providing resistors in these holes; and a step of forming independent lead-out lines from each layer of the green sheets to the electrode portions provided on the surface. and a step of aligning and stacking the green sheets and then firing them.

[Industrial application field]

The present invention relates to a method of manufacturing a multilayer ceramic circuit board for mounting large scale integrated circuit (LSI) elements.

C. Conventional technology] In response to the increased capacity and speed of information processing devices in recent years,
There is a need for a circuit board that can mount SI and VLSI at high density. For this reason, it is necessary to have a multilayer structure in which wiring with low electrical resistance made of copper or the like is spread three-dimensionally inside the circuit board. Furthermore, there is a demand for a more compact circuit board that includes built-in resistors for impedance matching with external circuits.

FIG. 7 is a block diagram of a multilayer ceramic circuit board incorporating a conventional resistor. In the figure, a resistor 2 is formed by printing a thick film of conductive paste such as ruthenium oxide (RuO*) on a green sheet 1, and an extraction line 4 reaching an electrode part 3 formed on the surface of the substrate is formed. Things,
It is known that many sheets are laminated and then fired.

[Problem to be solved by the invention]

However, in a conventional multilayer ceramic circuit board with built-in resistors 2, as the number of resistors 2 increases, the total printing area also increases, leading to an increase in the number of layers and an increase in the size of the board. Furthermore, since the resistor 2 is sealed inside the substrate, it is extremely difficult to adjust the resistance value after firing.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a multilayer ceramic circuit board with built-in resistors, which has a small mounting area and whose resistance value can be adjusted after firing the board.

[Means to solve the problem]

The above-mentioned problem is a multilayer ceramic circuit board having three-dimensional wiring, in which electrode portions are respectively provided above and below a resistor hole made of a resistor and passing through the board in the vertical direction,
An extraction line connecting each layer of the substrate to another electrode section on the surface of the substrate is connected to one of the resistors, and by selecting another electrode section, at least one of the resistors is connected to the electrode section and the other electrode. A multilayer ceramic circuit board, characterized in that it is incorporated between a circuit board and a circuit board to adjust the resistance value of the board.
and a method for manufacturing a multilayer ceramic circuit board having three-dimensional wiring, which includes the steps of forming holes for resistors in advance at predetermined positions in a plurality of green sheets, and providing resistors in the holes; The present invention is solved by a method for manufacturing a multilayer ceramic circuit board characterized by including a step of forming an independent lead-out line that reaches a provided electrode portion, and a step of aligning and stacking the green sheets and then firing them.

FIG. 1 is a diagram explaining the principle of the present invention. In the same figure, 1
Reference numeral 1 denotes a plurality of stacked green sheets, 12 a hole for forming a resistor formed in each green sheet 11, 13 a resistor provided in the hole 12 for forming a resistor, 14
are lead lines formed independently from each layer of the green sheet 11 to reach another electrode section 16 provided on the surface of the substrate, and are formed by aligning and laminating the green sheets 11 and then firing them to form a three-dimensional wiring. A multilayer ceramic circuit board is manufactured. Note that the parts 5 are electrode parts formed above and below the resistor carpenter 2. FIG. 2 is an equivalent circuit diagram of the multilayer ceramic circuit board of FIG. 1, in which resistors 13 are connected in series in the thickness direction of the green sheet 11.
Further, a lead line 14 is formed between each resistor 13 and another electrode part 16 on the surface, and a part of the internal lead line 14 and the electrode part 15 are connected to the LS 117. The resistor 13 is made by filling the resistor hole 12 with a conductive paste 21, firing the resistor hole 12 at a temperature lower than the firing temperature of the green sheet 11, and applying a conductive paste 21 having the same thickness as the green sheet 11. It can also be formed by filling the chip 31 or by filling the resistance hole 12 with conductive resistance powder 41.

[Effect]

According to the present invention, since the resistor 13 is formed perpendicularly to the LSI element mounting surface, the mounting area of the resistor 13 can be reduced. Furthermore, by providing lead lines 14 from each layer to other electrode portions 16 provided on the substrate surface, the resistance value can be adjusted by selecting other electrode portions 16 on the substrate surface after firing.

〔Example〕

Hereinafter, the present invention will be specifically explained with reference to an illustrated embodiment.

FIG. 3 is a configuration diagram of a multilayer ceramic circuit board according to a first embodiment of the present invention. Note 1. Portions corresponding to those in FIG. 1 are denoted by the same reference numerals (the same applies to the following embodiments).

In the figure, a slurry is prepared by mixing alumina, silicate glass, a binder, and a solvent, and a green sheet 11 with a thickness of about 500 μm is prepared using a doctor blade method.
was created. Punch this out into a 100mm square, 0.3a
A through hole was formed using a +mφ drill. Then, fill the through hole of about 0.2 mm + φ as the resistor hole 12 with resistance paste 21 as a resistor, and fill the through hole for the lead wire with copper paste. The lead-out line 14 for reaching was screen printed. The resistance paste 21 was prepared by mixing and kneading LaB powder and silicate glass powder each having a particle size of 3 μm at a ratio of 2:1. Next, these green sheets 11 were aligned and 10 sheets were stacked and laminated under pressure. Subsequently, it was fired in nitrogen at 1000°C to obtain a multilayer ceramic substrate having a total thickness of about 4IllIm.

According to the above manufacturing method, when the resistance values of the obtained resistors were measured using a digital multimeter by the four-terminal method, the resistance values of the 10 layers of resistors were 4.8 to 6.
0Ω, and by connecting them in series, the resistance between 0 and 54
Resistance values in Ω were obtained in steps of approximately 5.4 Ω.

Also, the dimensions of the obtained resistor are 0.2 Xo, 2 X
It was 4Il1113. In order to produce a similar resistor using a conventional method (screen printing method, etc.), a film thickness of 0.02
Assuming 5m-1 line width 0.5a+m, line length is 1.2
Ωm is required (according to calculation). That is, in this embodiment, it is possible to reduce the mounting area of the resistance value.

In this example, (0,2X0.2)80,5Xl,2)
=1/15.

FIG. 4 is a structural diagram of a multilayer ceramic circuit board according to a second embodiment of the present invention.

In the same figure, a thickness of 50 mm was obtained by the same method as in the first embodiment.
A green sheet of approximately 0μ steel was produced. This is 100
It was punched into a square mm square, a through hole was formed with a 0.3 mm φ drill, and the hole was filled with copper paste. Next, a through hole of about 0.2 mmφ is formed as a resistor hole 12 at a predetermined position so as to penetrate through the green sheet 11, and after filling it with a conductive chip 31, other electrode parts on the surface (both sides of the substrate) are formed. A leader line 14 to reach 16 was screen printed. Next, these green sheets 1
1 were aligned and 10 sheets were laminated under pressure. Subsequently, it was fired in nitrogen at 1000°C to obtain a multilayer ceramic substrate with a total thickness of about 4 mm.

The conductive chip 31 was manufactured as follows. First, LaBb powder, each having a particle size of 3 μm, and silicate glass powder were mixed at a ratio of 2:1, and this was pressure-molded.
Heat treated at 0°C. The obtained fired body was crushed in an agate mortar and then sieved to obtain spherical chips with a particle size of 400 to 500 μm.

According to the above manufacturing method, when the resistance values of the obtained resistors were measured using a digital multimeter using the four-terminal method, the resistance values of the 10 layers were 4.0 to 5.0, respectively.
6Ω, and by connecting them in series, the resistance between 0 and 48
Resistance values in Ω were obtained in steps of approximately 4.8 Ω.

Also, the dimensions of the obtained resistor are 0.2X0.2X4ms
''. To make a similar resistor using a conventional method (such as screen printing), assuming a film thickness of 0.025 mm and a line width of 0.5+*m, the line length would need to be 1.2 mm ( According to this embodiment, it is possible to reduce the mounting area of the resistance value.

In this example, (0,2x0.2)/(0,5xl,2)
=1/15.

FIG. 5 is a block diagram of a multilayer ceramic circuit board according to a third embodiment of the present invention.

In the same figure, a thickness of 50 mm was obtained by the same method as in the first embodiment.
A green sheet with a thickness of about 0 μm was produced. This is 100+
It was punched out at +us angle and a through hole was formed with a 0.3+am φ drill. And 0.0 as the resistor hole 12.
After filling the through hole of about 2 mm φ with resistance powder 41 and the through hole for the lead wire with copper paste,
Lead lines 14 for reaching other electrode portions 16 on the front surface (both sides of the substrate) were screen printed.

The resistance powder used was a mixture of LaB powder and silicate glass powder at a ratio of 2:1, each having a particle size of 3 μm. These green sheets 11 were aligned to form 10 sheets. They were laminated under pressure. Subsequently, it was fired in nitrogen at 1000° C. to obtain a multilayer ceramic substrate having a total thickness of about 4IllII+.

According to the above manufacturing method, the resistance value of the obtained resistor was measured using a digital multimeter by the four-terminal method.

The resistance values of each of the 10 layers were 4.5 to 6.4 Ω, and by connecting them in series, resistance values of 0 to 55 Ω were obtained in approximately 5.5 Ω increments. In addition, in the second and third embodiments, electrode portions 15 are formed above and below the resistor hole 12, similarly to the first embodiment.

Also, the dimensions of the obtained resistor are 0.2X0.2X4ms
+''. To make a similar resistor using the conventional method (screen printing method), assuming a film thickness of 0.025 mm and a line width of 0.5 mm, the line length would need to be 1 to 2 mm (according to calculations). ).In other words, according to the present invention, it is possible to reduce the mounting area of the resistance value.In this example,
(0,2xO,2)/(0,5xl,2)=1/15.

In each of the above embodiments, the other electrode portions 16 on the surface of the substrate are formed so as to be arranged in a straight line, but for example, as shown in FIG. If the other electrode portions 16 are formed so as to be located on the circumference, further compactness can be achieved.

〔Effect of the invention〕

As explained above, according to the present invention, by forming the resistor on the ceramic circuit board perpendicular to the LSI element mounting surface, the mounting area of the resistor is small and the resistance value can be adjusted after firing. A multilayer ceramic circuit board with a built-in resistor can be obtained, which greatly contributes to miniaturization and higher performance of devices.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram of the principle of the present invention, Fig. 2 is an equivalent circuit diagram of the multilayer ceramic circuit board of Fig. 1, Fig. 3 is a configuration diagram of the multilayer ceramic circuit board of the first embodiment of the invention, Fig. 4 is a block diagram of a multilayer ceramic circuit board according to a second embodiment of the present invention, FIG. 5 is a block diagram of a multilayer ceramic circuit board according to a third embodiment of the present invention, and FIG. 6 is a diagram showing the arrangement of electrode parts according to a third embodiment of the present invention. 7 are configuration diagrams of a conventional multilayer ceramic circuit board incorporating a resistor. In the figure, 11 is a green sheet, 12 is a resistor hole, 13 is a resistor, 14 is an extraction line, 15 is an electrode part, 16 is another electrode part, and 17 is an LSI. 21 is a resistive paste, 31 is a conductive chip, and 41 is a resistive powder.

Claims (2)

[Claims] (1) A multilayer ceramic circuit board having three-dimensional wiring, in which electrode portions (15) are provided above and below a resistor hole (12) consisting of a resistor (13) and penetrating the board in the vertical direction. , The extraction line (14) connecting each layer of the substrate to another electrode section (16) on the surface of the substrate is connected to any one of the resistors (13), and depending on the selection of the other electrode section (16), A multilayer ceramic circuit board characterized in that at least one resistor (13) is incorporated between an electrode part (15) and another electrode part (16) to adjust the resistance value of the board. (2) In a method for manufacturing a multilayer ceramic circuit board having three-dimensional wiring, resistor holes (12) are formed in advance at predetermined positions in a plurality of green sheets (11), and resistors (1) are inserted into the holes (12).
3), and an independent extraction line (14) reaching from each layer of the green sheet (11) to another electrode part (16) provided on the surface.
); and a step of aligning and stacking the green sheets (11) and then firing them.