JPH02246139A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH02246139A JPH02246139A JP6688889A JP6688889A JPH02246139A JP H02246139 A JPH02246139 A JP H02246139A JP 6688889 A JP6688889 A JP 6688889A JP 6688889 A JP6688889 A JP 6688889A JP H02246139 A JPH02246139 A JP H02246139A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- component
- maleimide
- silicone compound
- reliability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims abstract description 23
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 21
- 239000011342 resin composition Substances 0.000 claims abstract description 16
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 6
- QHGSGZLLHBKSAH-UHFFFAOYSA-N hydridosilicon Chemical group [SiH] QHGSGZLLHBKSAH-UHFFFAOYSA-N 0.000 claims abstract description 6
- 125000003277 amino group Chemical group 0.000 claims abstract description 5
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 8
- -1 maleimide compound Chemical class 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 2
- 125000003342 alkenyl group Chemical group 0.000 abstract 2
- 239000005011 phenolic resin Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 239000003054 catalyst Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- 239000003063 flame retardant Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000012744 reinforcing agent Substances 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000002841 Lewis acid Chemical class 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- PPQREHKVAOVYBT-UHFFFAOYSA-H dialuminum;tricarbonate Chemical compound [Al+3].[Al+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O PPQREHKVAOVYBT-UHFFFAOYSA-H 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 150000007517 lewis acids Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- IXQGCWUGDFDQMF-UHFFFAOYSA-N o-Hydroxyethylbenzene Natural products CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 150000003003 phosphines Chemical class 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 239000012763 reinforcing filler Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical class O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- CDMGNVWZXRKJNS-UHFFFAOYSA-N 2-benzylphenol Chemical compound OC1=CC=CC=C1CC1=CC=CC=C1 CDMGNVWZXRKJNS-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- MOEFFSWKSMRFRQ-UHFFFAOYSA-N 2-ethoxyphenol Chemical compound CCOC1=CC=CC=C1O MOEFFSWKSMRFRQ-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OSDWBNJEKMUWAV-UHFFFAOYSA-N Allyl chloride Chemical compound ClCC=C OSDWBNJEKMUWAV-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 238000005821 Claisen rearrangement reaction Methods 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000237858 Gastropoda Species 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- AUNAPVYQLLNFOI-UHFFFAOYSA-L [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O Chemical compound [Pb++].[Pb++].[Pb++].[O-]S([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Mo]([O-])(=O)=O AUNAPVYQLLNFOI-UHFFFAOYSA-L 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- BHELZAPQIKSEDF-UHFFFAOYSA-N allyl bromide Chemical compound BrCC=C BHELZAPQIKSEDF-UHFFFAOYSA-N 0.000 description 1
- HFEHLDPGIKPNKL-UHFFFAOYSA-N allyl iodide Chemical compound ICC=C HFEHLDPGIKPNKL-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 229940118662 aluminum carbonate Drugs 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- IRERQBUNZFJFGC-UHFFFAOYSA-L azure blue Chemical compound [Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Na+].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[S-]S[S-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-].[O-][Si]([O-])([O-])[O-] IRERQBUNZFJFGC-UHFFFAOYSA-L 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- CJOBVZJTOIVNNF-UHFFFAOYSA-N cadmium sulfide Chemical compound [Cd]=S CJOBVZJTOIVNNF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000007891 compressed tablet Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- MIHINWMALJZIBX-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ol Chemical class OC1CC=CC=C1 MIHINWMALJZIBX-UHFFFAOYSA-N 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 235000013799 ultramarine blue Nutrition 0.000 description 1
- 125000002256 xylenyl group Chemical class C1(C(C=CC=C1)C)(C)* 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、信顛性に優れた半導体装置に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device with excellent reliability.
トランジスタ、ＩＣ，ＬＳＩ等の半導体素子は、通常、
セラミックパッケージもしくはプラスチックパッケージ
等により封止され、半導体装置化されている。上記セラ
ミックパッケージは、構成材料そのものが耐熱性を有し
、耐透湿性にも優れているため、温度、湿度に対して強
く、しかも中空パッケージのため機械的強度も高く信転
性の高い封止が可能である。しかしながら、構成材料が
比較的高価なものであることと、量産性に劣る欠点があ
るため、最近では上記プラスチックパッケージを用いた
樹脂封止が主流になっている。この種の樹脂封止には、
従来からエポキシ樹脂組成物が使用されており、良好な
成績を収めている。しかしながら、半導体分野の技術革
新によって集積度の向上とともに素子サイズの大形化、
配線の微細化が進み、パッケージも小形化、薄形化する
傾向にあり、これに伴って封止材料に対してより以上の
信頼性（得られる半導体装置の内部応力、耐湿信頼性、
耐衝撃信頼性、耐熱信鯨性等）の向上が要望されている
。Semiconductor elements such as transistors, ICs, and LSIs are usually
It is sealed with a ceramic package, plastic package, etc., and is turned into a semiconductor device. The above ceramic package is resistant to temperature and humidity because the constituent material itself has heat resistance and excellent moisture permeability.Furthermore, since it is a hollow package, it has high mechanical strength and is highly reliable. is possible. However, since the constituent materials are relatively expensive and the mass productivity is poor, resin sealing using the above-mentioned plastic package has recently become mainstream. For this type of resin sealing,
Epoxy resin compositions have been used for a long time and have achieved good results. However, technological innovations in the semiconductor field have led to improvements in the degree of integration, as well as larger device sizes.
As interconnects become increasingly finer, packages tend to become smaller and thinner, and as a result, sealing materials are becoming more reliable (internal stress, moisture resistance, reliability, etc. of the resulting semiconductor devices).
Improvements in impact resistance, reliability, heat resistance, etc.) are desired.
近年、このような高信顛性、特に高耐熱信鯨性を得るた
めに半導体素子の封止樹脂として、エポキシ樹脂（ガラ
ス転移温度１００〜２００°Ｃ）よりも耐熱性に優れて
いるマレイミド樹脂（ガラス転移温度２００〜３００°
Ｃ）を用いる機会が増えている。In recent years, maleimide resins, which have better heat resistance than epoxy resins (glass transition temperature 100 to 200°C), have been used as sealing resins for semiconductor devices to obtain such high reliability, especially high heat resistance. (Glass transition temperature 200-300°
Opportunities to use C) are increasing.
しかしながら、上記マレイミド樹脂は、エポキシ樹脂以
上にその硬化物の弾性率が高く、エネルギー吸収能力が
低いため、硬（て脆いという欠点を有しいる。また、マ
レイミド樹脂を封止樹脂として用いた場合、耐湿信頼性
が不充分であるという問題を有している。However, the above-mentioned maleimide resin has a higher elastic modulus of the cured product than epoxy resin, and has a lower energy absorption ability, so it has the disadvantage of being hard and brittle.Also, when maleimide resin is used as a sealing resin, However, it has a problem of insufficient moisture resistance reliability.
この発明は、このような事情に鑑みなされたもので、耐
湿信鯨性、耐熱信頼性および機械的強度に優れた高信鯨
性を有する半導体装置の提供をその目的とする。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device having high reliability and excellent moisture resistance, heat resistance reliability, and mechanical strength.
ｃ問題点を解決するための手段〕
上記の目的を達成するため、この発明の半導体装置は、
下記の（Ａ、）〜（Ｃ）成分を含有する樹脂組成物を用
いて半導体素子を封止するという構成をとる。Means for Solving Problem c] In order to achieve the above object, the semiconductor device of the present invention has the following features:
The structure is such that a semiconductor element is sealed using a resin composition containing the following components (A,) to (C).
（Ａ）マレイミド樹脂。(A) Maleimide resin.
（Ｂ）アルケニルフェノール樹脂。(B) Alkenylphenol resin.
（Ｃ）末端あるいは側鎖にエポキシ基、ＳｉＨ基および
アミノ基の少なくとも１個を有するシリコーン化合物。(C) A silicone compound having at least one of an epoxy group, a SiH group, and an amino group at its terminal or side chain.
すなわち、本発明者らは、所期の目的を得るために一連
の研究を重ねた。その結果、耐熱性に優れているマレイ
ミド樹脂と、アルケニルフェノール樹脂および特定のシ
リコーン化合物とを組み合わせて用いると、耐熱性に富
んでいるうえに他の緒特性（耐湿信頼性１機械的強度）
にも優れた封止樹脂が得られることを見出しこの発明に
到達した。That is, the present inventors conducted a series of studies in order to obtain the desired objective. As a result, when maleimide resin, which has excellent heat resistance, is used in combination with alkenylphenol resin and specific silicone compounds, it has been found that in addition to being highly heat resistant, it has other properties (humidity resistance, reliability, mechanical strength, etc.)
The present invention was achieved by discovering that an excellent sealing resin can also be obtained.
この発明に用いる樹脂組成物は、マレイミド樹脂（Ａ成
分）とアルケニルフェノール樹脂（Ｂ成分）と特定のシ
リコーン化合物（Ｃ成分）とを用いて得られるものであ
って、通常、粉末状もしくはそれを打錠したタブレット
状になっている。The resin composition used in this invention is obtained using a maleimide resin (component A), an alkenylphenol resin (component B), and a specific silicone compound (component C), and is usually in powder form or in powder form. It is in the form of a compressed tablet.
上記Ａ成分となるマレイミド樹脂としては、下記、の一
般式（１）、（ＩＩ）および（Ｉ［）で表されるマレイ
ミド化合物を用いて得られるものがあげられる。Examples of the maleimide resin serving as the component A include those obtained using maleimide compounds represented by the following general formulas (1), (II), and (I[).
（以下余白）
Ｕ
これらのビスマレイミド化合物は、単独で用いても併用
してもよい。(The following is a blank space) U These bismaleimide compounds may be used alone or in combination.
上記Ａ成分のマレイミド樹脂とともに用いられるＢ成分
のアルケニルフェノール樹脂は、例えば下記の式（ＩＶ
）で表される官能基を１個以上含有するもである
（以下余白）
上記アルケニルフェノール樹脂は、例えば、フェノール
、クレゾール、エチルフェノール、イソプロピルフェノ
ール、ブチルフェノール、オクチルフェノール、キシレ
ノール、ノニルフェノール。The alkenylphenol resin of component B used together with the maleimide resin of component A is, for example, the following formula (IV
) The alkenylphenol resins include, for example, phenol, cresol, ethylphenol, isopropylphenol, butylphenol, octylphenol, xylenol, and nonylphenol.
ビニルフェノール、イソプロピルフェノール、フェニル
フェノール、ベンジルフェノール、クロルフェノール、
プロ、ムフェノール、エトキシフェノール等の一価フエ
ノールや、ビスフェノールＡ。Vinylphenol, isopropylphenol, phenylphenol, benzylphenol, chlorophenol,
Monohydric phenols such as pro, muphenol, and ethoxyphenol, and bisphenol A.
ビスフェノールＦ、ヒドロキノン、カラコール。Bisphenol F, hydroquinone, caracol.
レゾルシノール等の二価フェノール等を原料とし、これ
とホルマリン、バラホルムアルデヒド、グリオキザール
等のアルデヒド化合物を公知の手段で縮合反応させて得
られるフェノール類ノボラック樹脂や、上記の一価およ
び二価フェノール等を塩化アリル、臭化アリル、ヨウ化
アリル等のハロゲン化アリルとアルカリの存在下で反応
せしめて得られるアルケニルフェノール類をクライゼン
転移することによって得られる。Phenolic novolac resins, which are obtained by using dihydric phenols such as resorcinol as raw materials and condensing them with aldehyde compounds such as formalin, paraformaldehyde, and glyoxal, by known means, as well as the monohydric and dihydric phenols mentioned above, are used as raw materials. It is obtained by Claisen rearrangement of alkenylphenols obtained by reacting allyl halides such as allyl chloride, allyl bromide, and allyl iodide in the presence of an alkali.
上記Ａ成分のマレイミド樹脂とＢ成分のアルケニルフェ
ノール樹脂との配合比は、上記マレイミド樹脂中のマレ
イミド基と上記アルケニルフェノール樹脂中のアリル基
との当量比が０．１〜１．２の範囲になるように配合す
ることが好ましい。すなわち、上記範囲を外れると、樹
脂組成物の耐熱性、加工性および機械的強度が劣る傾向
がみられるからである。The blending ratio of the maleimide resin as component A and the alkenylphenol resin as component B is such that the equivalent ratio of the maleimide group in the maleimide resin to the allyl group in the alkenylphenol resin is in the range of 0.1 to 1.2. It is preferable to mix them so that That is, if it is outside the above range, the heat resistance, processability, and mechanical strength of the resin composition tend to be poor.
また、上記Ａ成分のマレイミド樹脂、Ｂ成分のアルケニ
ルフェノール樹脂とともに用いられるＣ成分の特定のシ
リコーン化合物は、末端あるいは側鎖に少なくとも１個
のエポキシ基、ＳｉＨ基またはアミノ基を有するもので
ある。そして、上記シリコーン化合物としては、エポキ
シ当ｌ、ＳｉＨ当量およびアミン当量が１００〜１５０
００で、Ｓｔ含有率が１〜３５重量％（以下「％」と略
す）に設定することが好ましい。さらに、このようなＣ
成分の特定のシリ、コーン化合物の含有量は、Ａ成分、
Ｂ成分およびＣ成分の合計量の５０％以下に設定するの
が好ましく、さらに好ましくは５〜３０％の範囲に設定
することである。すなわち、Ｃ成分の特定のシリコーン
化合物の含有量が５０％を超えると、樹脂組成物の耐熱
性および樹脂強度に著しい低下傾向がみられるからであ
る。Further, the specific silicone compound as component C used together with the maleimide resin as component A and the alkenylphenol resin as component B has at least one epoxy group, SiH group, or amino group at the terminal or side chain. The silicone compound has an epoxy equivalent, a SiH equivalent, and an amine equivalent of 100 to 150.
00, and the St content is preferably set to 1 to 35% by weight (hereinafter abbreviated as "%"). Furthermore, such C
The content of specific silicon and corn compounds of the components is component A,
It is preferable to set it to 50% or less of the total amount of component B and component C, and more preferably to set it in the range of 5 to 30%. That is, if the content of the specific silicone compound as component C exceeds 50%, the heat resistance and resin strength of the resin composition tend to decrease significantly.
また、この発明に用いられる樹脂組成物には、上記Ａ成
分、Ｂ成分およびＣ成分以外に必要に応じて粉末状の補
強剤や充填剤２着色剤、離型剤。In addition to the above-mentioned components A, B, and C, the resin composition used in the present invention may optionally contain a powdered reinforcing agent, a filler, a coloring agent, and a mold release agent.
難燃剤、カップリング剤、硬化触媒等を適宜添加するこ
とができる。Flame retardants, coupling agents, curing catalysts, etc. can be added as appropriate.
上記粉末状の補強剤や充填剤としては、酸化アルミニウ
ム、酸化マグネシウム、水酸化アルミニウム、炭酸アル
ミニウム、炭酸カルシウム、炭酸マグネシウム、ケイソ
ウ土、ケイ酸カルシウム。Examples of the powdered reinforcing agents and fillers include aluminum oxide, magnesium oxide, aluminum hydroxide, aluminum carbonate, calcium carbonate, magnesium carbonate, diatomaceous earth, and calcium silicate.
焼成りレー、粉末シリカ、カーボンブラック、カオリン
、粉末マイカ、グラファイト、アスベスト、三酸化アン
チモン、ガラス繊維、ロックウール、カーボンファイバ
ー等があげられる。そして、上記補強剤および充填剤の
使用量は、用途により異なるが、樹脂成分１００重量部
（以下１部」と略す）に対し５００部まで使用すること
ができる。Examples include fired clay, powdered silica, carbon black, kaolin, powdered mica, graphite, asbestos, antimony trioxide, glass fiber, rock wool, and carbon fiber. The amount of the reinforcing agent and filler used varies depending on the purpose, but up to 500 parts by weight of the resin component (hereinafter abbreviated as 1 part) can be used.
また、着色剤としては、二酸化チタン、黄鉛カーボンブ
ラック、鉄黒、モリブデン赤１群青、紺青、カドミウム
黄、カドミウム赤等があげられる。Further, examples of the coloring agent include titanium dioxide, yellow lead carbon black, iron black, molybdenum red 1 ultramarine blue, navy blue, cadmium yellow, cadmium red, and the like.
上記離型剤としては、高級脂肪族パラフィン。The above-mentioned mold release agent is a higher aliphatic paraffin.
高級脂肪族エステル、天然ワックス、合成ワックス等が
あげられ、難燃剤としては、リン系化合物等かあげられ
る。Examples of the flame retardant include higher aliphatic esters, natural waxes, synthetic waxes, and the like, and phosphorus compounds are examples of the flame retardant.
そして、上記カップリング剤としては、シラン系、チタ
ネート系、アルミ系カップリング剤等があげられる。Examples of the coupling agent include silane-based, titanate-based, and aluminum-based coupling agents.
さらに、上記硬化触媒としては、有機過酸化物、アゾ化
合物等のラジカル開始剤や、三級アミン類、イミダゾー
ル類、四級アンモニウム塩、有機ホスフィン化合物、ル
イス酸、ルイス酸錯体等があげられる。Further, examples of the curing catalyst include radical initiators such as organic peroxides and azo compounds, tertiary amines, imidazoles, quaternary ammonium salts, organic phosphine compounds, Lewis acids, and Lewis acid complexes.
この発明に用いられる樹脂組成物は、例えばつぎのよう
にして製造することができる。すなわち、まず、Ｃ成分
の特定のシリコーン化合物をＡ成分のマレイミド樹脂ま
たはＢ成分のアルケニルフェノール樹脂と反応せしめ、
変性シリコーン化合物を作製する。この場合、Ｃ成分の
特定のシリコーン化合物として、エポキシ基含有シリコ
ーン化合物を用いるときは、三級アミン類、イミダゾー
ル類、四級アンモニウム塩、有機ホスフィン化合物等の
硬化触媒を０．１〜１０％添加するのが好適である。ま
た、ＳｉＨ基含有シリコーン化合物を用いるときは、Ｐ
ｔ触媒を０．１〜１０％添加するのが好適である。つぎ
に、上記のようにして作製された変性シリコーン化合物
と、残りのマレイミド樹脂およびアルケニルフェノール
樹脂、さらに必要に応じて充填剤１着色剤、離型剤、難
燃剤。The resin composition used in this invention can be produced, for example, as follows. That is, first, a specific silicone compound as component C is reacted with a maleimide resin as component A or an alkenylphenol resin as component B,
Create a modified silicone compound. In this case, when using an epoxy group-containing silicone compound as the specific silicone compound of component C, 0.1 to 10% of a curing catalyst such as tertiary amines, imidazoles, quaternary ammonium salts, or organic phosphine compounds is added. It is preferable to do so. In addition, when using a SiH group-containing silicone compound, P
It is preferable to add t catalyst in an amount of 0.1 to 10%. Next, the modified silicone compound produced as described above, the remaining maleimide resin and alkenylphenol resin, and if necessary, filler 1 colorant, mold release agent, and flame retardant.
カップリング剤、硬化触媒等その他の添加剤とを適宜配
合する。そして、この配合物を加熱、混合し混練し、こ
れを室温に冷却したのち公知の手段によって粉砕し、必
要に応じて打錠するという一連の工程により目的とする
樹脂組成物を得ることができる。Other additives such as a coupling agent and a curing catalyst are blended as appropriate. Then, the desired resin composition can be obtained through a series of steps of heating, mixing and kneading this compound, cooling it to room temperature, pulverizing it by known means, and tableting if necessary. .
このような樹脂組成物を用いての半導体素子の封止は特
に限定するものではなく、通常のトランスファー成形等
の公知のモールド方法により行うことができる。Sealing of a semiconductor element using such a resin composition is not particularly limited, and can be performed by a known molding method such as ordinary transfer molding.
このようにして得られる半導体装置は、低応力性８耐熱
性、耐湿性に優れており、信鎖性の高いものである。The semiconductor device thus obtained has low stress, excellent heat resistance, moisture resistance, and high reliability.
以上のように、この発明の半導体装置は、マレイミドＩ
ＪＩＭ（Ａ成分）と、アルケニルフェノール樹脂（Ｂ成
分）と、特定のシリコーン化合物（Ｃ成分）とを含有す
る特殊な樹脂組成物を用いて樹脂封止されており、その
封止プラスチックパッケージが、従来のエポキシ樹脂組
成物製またはマレイミド樹脂組成物製のものとは異なる
ため、内部応力が小さく、さらに耐熱信転性が高（、苛
酷な使用条件下における信顛性が一層高（なっている。As described above, the semiconductor device of the present invention includes maleimide I
It is resin-sealed using a special resin composition containing JIM (component A), alkenylphenol resin (component B), and a specific silicone compound (component C), and the sealed plastic package is Because it is different from conventional epoxy resin compositions or maleimide resin compositions, it has low internal stress, high heat resistance, and even higher reliability under harsh usage conditions. .
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
まず、下記の第１表に示すマレイミド樹脂、アルケニル
フェノール樹脂Ａ−Ｂ、 シリコーン化合物Ｃ−Ｆ、芳
香族アミンを準備した。First, maleimide resins, alkenylphenol resins A-B, silicone compounds C-F, and aromatic amines shown in Table 1 below were prepared.
（以下余白）
〔実施例１〜７、比較例１〜３〕
つぎに、上記第１表に示す化合物を下記の第２表に示す
割合で配合して加熱混合し変性シリコーン化合物ａ −
ｉを作製した。(Left below) [Examples 1 to 7, Comparative Examples 1 to 3] Next, the compounds shown in Table 1 above were blended in the proportions shown in Table 2 below and mixed with heat to form a modified silicone compound a-
i was created.
（以下余白）
上記変性シリコーン化合物ａ ＝ ｉおよび下記の第３
表に示す原料を準備し、これら原料を同表に示す割合で
配合し、溶融混練を行い冷却固化して粉砕したのち、目
的とする粉末状の樹脂組成物を得た。(The following is a blank space) The above modified silicone compound a = i and the following third
The raw materials shown in the table were prepared, these raw materials were blended in the proportions shown in the table, melted and kneaded, cooled and solidified, and pulverized to obtain the intended powdered resin composition.
〔比較例４〕
熱硬化性樹脂としてクレゾールノボラックエポキシ樹脂
を、硬化剤としてフェノールノボラック樹脂を用い、そ
の他の添加剤として下記の第３表に示す原料を、同表に
示す割合で配合した。それ以外は、実施例１と同様にし
て目的とする粉末状のエポキシ樹脂組成物を得た。[Comparative Example 4] A cresol novolak epoxy resin was used as the thermosetting resin, a phenol novolak resin was used as the curing agent, and the raw materials shown in Table 3 below were blended as other additives in the proportions shown in the table. Other than that, the intended powdered epoxy resin composition was obtained in the same manner as in Example 1.
（以下余白）
以上の実施例および比較例によって得られた粉末状の樹
脂組成物を用い、半導体素子をトランスファー成形でモ
ールドすることにより半導体装置を得た。このようにし
て得られた半導体装置について、電圧印加状態でのプレ
ッシャー釜による１０００時間の信鎖性テスト（以下ｒ
ＰＣＢＴテスト」と略す）および−５０°Ｃ／３０分〜
１５０°Ｃ／３０分の３００回の温度サイクルテスト（
以下ｒＴＣＴテスト」と略す）の測定を行った。また、
樹脂組成物のみをトランスファー成形で成形したサンプ
ルについて、曲げ強度および曲げ弾性率の測定を行った
。これらの結果を下記の第４表に示した。(The following is a blank space) A semiconductor device was obtained by molding a semiconductor element by transfer molding using the powdered resin composition obtained in the above Examples and Comparative Examples. The semiconductor device obtained in this way was subjected to a 1000-hour reliability test (hereinafter referred to as r
(abbreviated as "PCBT test") and -50°C/30 minutes ~
Temperature cycle test of 300 times at 150°C/30 minutes (
Measurements were carried out using the "rTCT test" (hereinafter abbreviated as "rTCT test"). Also,
Bending strength and bending elastic modulus were measured for samples made by transfer molding only the resin composition. These results are shown in Table 4 below.
（以下余白）
第４表の結果から、実施例品は高温時の曲げ強度も強く
、かつ曲げ弾性率も低い。そして、ＰＣＢＴテストおよ
びＴＣＴテストにおいて不良品の発生は全くみられなか
った。(The following is a blank space) From the results in Table 4, the example products have high bending strength at high temperatures and low bending elastic modulus. Furthermore, no defective products were observed in the PCBT test and TCT test.
特許出願人 日東電工株式会社 代理人 弁理士 西 藤 征 彦Patent applicant: Nitto Denko Corporation Agent: Patent Attorney Yukihiko Nishifuji
Claims (3)
を用いて半導体素子を封止してなる半導体装置。 （Ａ）マレイミド樹脂。 （Ｂ）アルケニルフェノール樹脂。 （Ｃ）末端あるいは側鎖にエポキシ基、ＳｉＨ基および
アミノ基の少なくとも１個を有 するシリコーン化合物。(1) A semiconductor device in which a semiconductor element is sealed using a resin composition containing the following components (A) to (C). (A) Maleimide resin. (B) Alkenylphenol resin. (C) A silicone compound having at least one of an epoxy group, a SiH group, and an amino group at its terminal or side chain.
の５０重量％以下である請求項（１）記載の半導体装置
。(2) The semiconductor device according to claim 1, wherein the content of component (C) is 50% by weight or less of the entire components (A) to (C).
用樹脂組成物。 （Ａ）マレイミド樹脂。 （Ｂ）アルケニルフェノール樹脂。 （Ｃ）末端あるいは側鎖に少なくとも１個のエポキシ基
、ＳｉＨ基またはアミノ基を有 するシリコーン化合物。(3) A resin composition for semiconductor encapsulation containing the following components (A) to (C). (A) Maleimide resin. (B) Alkenylphenol resin. (C) A silicone compound having at least one epoxy group, SiH group or amino group at the terminal or side chain.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6688889A JPH02246139A (en) | 1989-03-17 | 1989-03-17 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6688889A JPH02246139A (en) | 1989-03-17 | 1989-03-17 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02246139A true JPH02246139A (en) | 1990-10-01 |
Family
ID=13328897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6688889A Pending JPH02246139A (en) | 1989-03-17 | 1989-03-17 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02246139A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359911A (en) * | 1991-06-07 | 1992-12-14 | Shin Etsu Chem Co Ltd | Thermosetting resin composition |
-
1989
- 1989-03-17 JP JP6688889A patent/JPH02246139A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04359911A (en) * | 1991-06-07 | 1992-12-14 | Shin Etsu Chem Co Ltd | Thermosetting resin composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0697325A (en) | Resin-sealed semicondutor device | |
| JP2009001638A (en) | Molding resin composition, molded article and semiconductor package | |
| JPS62254453A (en) | Semiconductor device | |
| JPH02246139A (en) | Semiconductor device | |
| WO2020241594A1 (en) | Encapsulating resin composition and electronic component device | |
| JPH06132426A (en) | Semiconductor device | |
| JPS6222825A (en) | Sealing resin composition | |
| JPH11116775A (en) | Epoxy resin composition for semiconductor sealing and production thereof | |
| JPH04227624A (en) | Epoxy resin curing agent and epoxy resin composition | |
| JPH04153213A (en) | Resin composition | |
| JPH06132427A (en) | Epoxy-resin molding material for sealing | |
| JPH056869A (en) | Semiconductor device | |
| JP2002030133A (en) | Epoxy resin composition for optical semiconductor and optical semiconductor device | |
| JPH08283534A (en) | Melamine-phenol resin composition | |
| JP3976390B2 (en) | Method for producing epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device obtained thereby | |
| JP2534317B2 (en) | Semiconductor device | |
| JP2938173B2 (en) | Resin composition | |
| KR101142300B1 (en) | Epoxy resin composition for sealing semiconductor element | |
| JPH0448760A (en) | Semiconductor device | |
| JPS63114243A (en) | Semiconductor device | |
| JPH06163753A (en) | Semiconductor device | |
| JPH0582675A (en) | Semiconductor device | |
| JP2837538B2 (en) | Semiconductor device | |
| JP2872701B2 (en) | Method for producing resin for semiconductor encapsulation | |
| JPH06128357A (en) | Semiconductor device |