JPH0224061A - Polishing molded body and manufacture thereof - Google Patents
Polishing molded body and manufacture thereofInfo
- Publication number
- JPH0224061A JPH0224061A JP5565189A JP5565189A JPH0224061A JP H0224061 A JPH0224061 A JP H0224061A JP 5565189 A JP5565189 A JP 5565189A JP 5565189 A JP5565189 A JP 5565189A JP H0224061 A JPH0224061 A JP H0224061A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- weight
- copper
- tin
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 238000005498 polishing Methods 0.000 title abstract description 12
- 238000000227 grinding Methods 0.000 claims abstract description 36
- 239000006061 abrasive grain Substances 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 17
- 239000011574 phosphorus Substances 0.000 claims abstract description 17
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical group [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract 3
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052718 tin Inorganic materials 0.000 claims description 11
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 8
- 229910052582 BN Inorganic materials 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 10
- 239000000203 mixture Substances 0.000 abstract description 7
- RIRXDDRGHVUXNJ-UHFFFAOYSA-N [Cu].[P] Chemical compound [Cu].[P] RIRXDDRGHVUXNJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical group [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229910052759 nickel Inorganic materials 0.000 description 7
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910010271 silicon carbide Inorganic materials 0.000 description 5
- 238000000137 annealing Methods 0.000 description 4
- 238000005056 compaction Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000010437 gem Substances 0.000 description 2
- 239000004579 marble Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 241000501754 Astronotus ocellatus Species 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000002436 steel type Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は焼結による研摩成形体(以下焼結研摩成形体と
いう)、特に面精研削およびカッター刃に好適なメタル
ホント焼結研摩成形体およびその製造法に関するもので
ある。本発明において研摩とは研摩、研削、切削を含む
総称である。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a sintered abrasive compact (hereinafter referred to as a sintered abrasive compact), particularly a metal real sintered abrasive compact suitable for surface precision grinding and cutter blades. and its manufacturing method. In the present invention, polishing is a general term including polishing, grinding, and cutting.
(従来の技術)
従来」二記の如き用途に使用されるメタルボンド焼結研
摩成形体、特にタイヤセント、立方晶窒化ホウ素を研削
砥粒(以下これらを超研削砥粒という)とする焼結研摩
成形体としては、銅錫系ボンドのものか主体である。こ
の銅錫系ボンド焼結体ては錫の含有率を増加させると研
削性は向上するか、材質としては硬く脆いものとなる。(Prior art) Metal bonded sintered abrasive molded bodies used in the following applications, particularly tire cent, sintered products using cubic boron nitride as abrasive grains (hereinafter referred to as super abrasive grains) The polished molded body is mainly made of copper-tin bond. Increasing the content of tin in this copper-tin based bond sintered body improves the grindability, or the material becomes hard and brittle.
それ故製造上は必ず圧粉成形工程を経ざるを得ない。こ
の圧粉成形工程においては3〜5トン/crn’の成形
荷七か必要であるため、サイズの大きい焼結体を作成す
るには限界かある。また、カッター刃として使用する場
合には、圧粉成形工程て薄い成形体を作成することか困
難であり、薄刃カッター用には不向きであった。Therefore, in production, it is necessary to go through a powder compaction process. This powder compaction process requires a compaction load of 3 to 5 tons/crn', so there is a limit to the production of large-sized sintered bodies. Furthermore, when used as a cutter blade, it is difficult to create a thin molded body through a powder compaction process, making it unsuitable for use in thin-blade cutters.
(発明か解決しようとする課題)
本発明は上記従来技術における問題点を解決する目的を
以て靭性と展伸性を付与し、かつ必要な強度を有するメ
タルボンド焼結研摩成形体およびその製造法を提供する
ことにある。(Problems to be Solved by the Invention) The present invention provides a metal bonded sintered abrasive molded body that imparts toughness and malleability and has the necessary strength, and a method for producing the same, with the purpose of solving the problems in the prior art described above. It is about providing.
本発明の第1項、第2項の発明は燐を含有する銅錫系金
属粉末と研削砥粒との焼結研摩成形体であり、これに少
量のニッケル粉末を添加、焼結したものである。第3項
、第4項の発明はこれらの望ましい製造法に関するもの
である。The first and second aspects of the present invention are sintered abrasive compacts of phosphorous-containing copper-tin metal powder and abrasive grains, to which a small amount of nickel powder is added and sintered. be. The inventions in Items 3 and 4 relate to these desirable manufacturing methods.
本発明において燐を含有する銅錫系金属粉末としては燐
銅粉末と銅錫合金粉末との混合粉末を用いるのが最も好
ましい。その外燐銅粉末と錫粉末との混合、燐を含有す
る銅錫合金粉末なども使用可能である。燐銅粉末と錫粉
末との混合の場合は焼結の温度を錫の融点より少し高く
して第1段の焼結を行ない、30分程度保持後さらに温
度を上げ焼結の際かなりの程度銅錫系の合金化か進むよ
うにする。銅錫合金に燐を含有させたものは燐の含有量
(固溶)に限界かあるので、本発明の範囲内において比
較的少ない燐の含有量の場合に可能である。In the present invention, it is most preferable to use a mixed powder of a phosphorus-copper powder and a copper-tin alloy powder as the phosphorus-containing copper-tin metal powder. A mixture of the outer phosphorous copper powder and tin powder, a copper-tin alloy powder containing phosphorus, etc. can also be used. In the case of mixing phosphorous copper powder and tin powder, the first stage of sintering is carried out at a temperature slightly higher than the melting point of tin, and after holding the temperature for about 30 minutes, the temperature is further increased to cause a considerable degree of sintering. Promote copper-tin alloying. Since there is a limit to the phosphorus content (solid solution) in a copper-tin alloy containing phosphorus, a relatively small phosphorus content is possible within the scope of the present invention.
本発明はさらに上記の発明に所定量のニッケルを含有さ
せたものである。ニッケルを添加してニッケル錫系金属
間化合物を分散析出させることにより、面精研削および
カッター刃に極めて良好な性能を付与せしめたものであ
る。The present invention further includes a predetermined amount of nickel in the above invention. By adding nickel to disperse and precipitate a nickel-tin intermetallic compound, extremely good performance is imparted to surface precision grinding and cutter blades.
本発明において、ホントとなる金属粉末は例えばアトマ
イズ粉末等が用いられる。この金属中の錫含有率として
は5〜20重量%か使用に適する。In the present invention, the real metal powder used is, for example, atomized powder. The tin content in this metal is 5 to 20% by weight, which is suitable for use.
5重量%以下では硬さにおいて不足をきたし、研削、切
削性能が低下し、20東量%以上ては圧延体の製造か困
難となる。If it is less than 5% by weight, the hardness will be insufficient and the grinding and cutting performance will deteriorate, and if it is more than 20% by weight, it will be difficult to manufacture a rolled product.
また、ボンド金属に金属間化合物を形成するニッケル粉
末としては100メツシユ以下の粒度を有するものてあ
れば使用できるか形成される金属間化合物か研削、切削
に充分寄与するためには均一に分散析出する必要がある
。そのためには粒度の廁かいものか好ましく、カルボニ
ルニッケルか最適である。量としては0.2〜5重量%
て充分であり、 5重量%以りの添加はボンド材質を硬
く脆くし、圧延体の製造か困難となる。In addition, nickel powder that forms intermetallic compounds in the bond metal may be used as long as it has a particle size of 100 mesh or less, or the intermetallic compounds formed must be uniformly dispersed and precipitated to fully contribute to grinding and cutting. There is a need to. For this purpose, a material with a large particle size is preferable, and carbonyl nickel is optimal. The amount is 0.2-5% by weight
However, addition of more than 5% by weight makes the bond material hard and brittle, making it difficult to manufacture rolled products.
銅錫系金属中の燐は焼結体中で燐青銅を形成し、ボンド
となる金属に、従って焼結体に靭性と展伸性を付与する
。燐含有量か少なすぎると、この特性か達成出来ないた
め、金属中に0.1重量%以上残存させることか必要で
ある。また、多すぎると焼結体の強度低下を招く。強度
の低下は錫含有量の調整によって幾分補填し得るか、燐
含有量は金属中で 1.5重量%以下に抑えることか望
ましい。Phosphorus in the copper-tin metal forms phosphor bronze in the sintered body, imparting toughness and malleability to the bond metal and, therefore, to the sintered body. If the phosphorus content is too low, this property cannot be achieved, so it is necessary to allow 0.1% by weight or more to remain in the metal. On the other hand, if the amount is too large, the strength of the sintered body will be reduced. The decrease in strength can be compensated to some extent by adjusting the tin content, and it is desirable to suppress the phosphorus content to 1.5% by weight or less in the metal.
次に本発明の成形体に使用される研削砥粒について説明
する。砥粒は通常は超研削砥粒が適し、望ましくは研削
面または切断面を均一に仕−ヒげるためこれに一般の研
削砥粒を混合したものである。Next, the grinding abrasive grains used in the molded article of the present invention will be explained. Suitable abrasive grains are usually super-grinding abrasive grains, preferably mixed with general grinding abrasive grains in order to uniformly grind the ground or cut surface.
超研削砥粒としては1/4糾〜200井のタイヤモント
および/または立方晶窒化ホウ素を0.3〜10重量%
混合する。これら砥粒は単体でも、その表面に二・ンケ
ル、銅または錫等を被覆したものてもよく、被覆砥粒を
用いた方がボンドメタルとの濡れ性か良く、多量の砥粒
を混合し得る。被覆砥粒を用いる場合には、その被覆金
属の量を予めホント金属の組成より差し引いておき、最
終的に全体の組成を合わせる必要かある。As super-grinding abrasive grains, 0.3 to 10% by weight of 1/4 to 200 well Tiemon and/or cubic boron nitride are used.
Mix. These abrasive grains may be used alone or their surfaces may be coated with nickel, copper, tin, etc. It is better to use coated abrasive grains for better wettability with bond metal, and it is better to mix a large amount of abrasive grains. obtain. When using coated abrasive grains, it is necessary to subtract the amount of coated metal from the composition of the real metal in advance, and finally adjust the overall composition.
一般の砥粒としては炭化珪素、炭化タングステン等の炭
化物系および/または酸化アルミニウム、酸化珪素等の
酸化物系か好ましく使用される。これら一般の研削砥粒
は超研削砥粒に比し軟かいため研削、切削にはあまり寄
与しないか、固定砥粒特有の条痕を消す作用と焼結体の
目詰まりを防1Fするドレッシング作用を有している。As general abrasive grains, carbide-based abrasive grains such as silicon carbide and tungsten carbide, and/or oxide-based abrasive grains such as aluminum oxide and silicon oxide are preferably used. These general grinding abrasive grains are softer than super-grinding abrasive grains, so they do not contribute much to grinding and cutting, or they have the effect of erasing the streaks peculiar to fixed abrasive grains and the dressing effect of preventing clogging of the sintered body. have.
これら作用を充分達成させるためには、超研削砥粒及び
一般の研削砥粒の粒度と添加量を充分考慮する必要かあ
る。また被削材に対しても配慮する必要かある。被削材
か脆い場合には超研削砥粒の粒度と同しか又はこれより
細かい一般の研削砥粒を115ないし同量程度、軟かい
場合には超研削砥粒の粒度と同じか又はこれよりも粗い
一般の研削砥粒を同量ないし2倍量程度添加すると良い
。In order to fully achieve these effects, it is necessary to take into account the particle size and amount of super-abrasive grains and general grinding grains. It is also necessary to consider the material to be cut. If the workpiece material is brittle, use 115 or the same amount of general grinding grains that are the same or finer than the super-grinding abrasive grains, and if the work material is soft, use the same or finer grain size than the super-grinding grains. It is best to add about the same amount or twice the amount of coarse general grinding abrasive grains.
本発明の焼結研摩成形体の製法は望ましくはボンド金属
の出発材料として燐銅粉末と銅錫合金粉末を使用する。The method for producing a sintered abrasive compact of the present invention preferably uses phosphorous copper powder and copper-tin alloy powder as starting materials for the bond metal.
燐銅粉末の燐含有量は0.5〜12.0重量%のものか
適する。またこの場合の銅錫系合金としては錫含有量1
0〜23重量のものか適する。The phosphorus content of the phosphorous copper powder is preferably from 0.5 to 12.0% by weight. In addition, in this case, the copper-tin alloy has a tin content of 1
0 to 23 weight is suitable.
そしてさらにニッケルを含有させるためにこれらの材料
にニッケル粉末を添加する。これらの粉末は 100メ
ウシユ以下か望ましい。Then, nickel powder is added to these materials to further contain nickel. It is desirable that these powders have a weight of less than 100 mU.
これらの出発材料に研削砥粒を良く混合し、鋳型に入れ
50g/cm’程度の低荷重に加圧しなp)ら焼結する
。焼結体は次に圧延する。この圧延か本発明方法の一つ
の特徴である。これによって薄い大きな成形体も容易に
つくることかてきる。焼結は600〜800℃の温度て
30分〜60分間行なえばよい。このときの雰囲気は真
空、不活性、還元性いずれも可能であるか、金属及び超
研削砥粒等の酸化を防止し、焼結性を向上させるために
は真空または還元性雰囲気か好ましい。圧延は常温て行
なうことか出来る。圧延は焼結体を均一に仕上げるため
には一方向圧延か好ましい。圧延により気孔率か減少す
るか、これは一般研削砥粒の添加によって調整し得る。These starting materials are thoroughly mixed with grinding abrasive grains, placed in a mold, and sintered under pressure under a low load of about 50 g/cm'. The sintered body is then rolled. This rolling is one of the characteristics of the method of the present invention. This makes it possible to easily produce thin and large molded bodies. Sintering may be performed at a temperature of 600 to 800°C for 30 to 60 minutes. The atmosphere at this time can be vacuum, inert, or reducing, or is preferably vacuum or reducing atmosphere in order to prevent oxidation of metals, super-abrasive grains, etc. and improve sinterability. Rolling can be done at room temperature. For rolling, unidirectional rolling is preferred in order to finish the sintered body uniformly. The porosity decreases due to rolling, which can be adjusted by adding general abrasive grains.
圧延体は油分か付着し、かつ少々硬化したり、歪により
変形しているので600℃〜800℃の温度て30〜6
0分間程度焼鈍するとよい、また圧延体を加工する場合
には、この焼鈍前に行なうと良い。Since the rolled product has oil adhering to it and is slightly hardened or deformed due to strain, the temperature of 600 to 800 °C is 30 to 6.
It is recommended that the annealing be performed for about 0 minutes, and if the rolled product is to be processed, it is recommended that the annealing be performed before this annealing.
このようにして作成された焼結体は面精研削においては
熱硬化性接着剤やゴム系接着剤で定盤に貼付けして、プ
リズム、時計用表面ガラス、大理石、貴石、Siウェハ
ー、各種セラミックス焼結体の研削に供することか出来
、カッターにセットし、貴石、大理石、御影石、各種単
結晶、各種セラミックス焼結体の切断に供することかで
きる。During surface precision grinding, the sintered bodies created in this way are attached to a surface plate using a thermosetting adhesive or rubber adhesive to produce prisms, watch surface glass, marble, precious stones, Si wafers, and various ceramics. It can be used for grinding sintered bodies, and when set in a cutter, it can be used to cut precious stones, marble, granite, various single crystals, and various ceramic sintered bodies.
次に実施例を以て本発明を説明する。Next, the present invention will be explained with reference to Examples.
実施例1
100メツシユ以下のアトマイズ青銅粉末(錫含有率1
5重量%)と 100メウシユ以下のアトマイズ燐銅粉
末(燐含有率8重量%)を重量部で5:2に配合した金
属粉末に無電解ニッケルメッキ(メツキ重量55%)を
施した10〜20pのタイヤセント粉末を0.5重量%
混合し、鋳型に入れ、水素ガス雰囲気中で6506C±
15°C145g/crn’の条件下て45分間焼結さ
せ、縦17ca+、 M!114c+*、厚さ0.61
の焼結体を得た。次にこの焼結体を常温て圧延ロール間
を通し、厚さ0.2■の圧延体とした。この圧延体を水
素雰囲気中て650℃±15℃で30分間焼鈍し、次い
てこれを打ち抜き直径100m醜φで6ケ所に巾2.5
1、長さ40mmの切り込みの入ったシートを得た。こ
のシートの燐含有率は0.74重量%てあった。Example 1 Atomized bronze powder of 100 mesh or less (tin content 1
5% by weight) and atomized copper phosphorus powder (phosphorus content: 8% by weight) of 100 Meushie or less (5:2 by weight), electroless nickel plating (55% by weight) is applied to the metal powder. 0.5% by weight of tire cent powder
Mix it, put it in a mold, and heat it in a hydrogen gas atmosphere at 6506C±.
Sintered for 45 minutes at 15°C and 145g/crn', length 17ca+, M! 114c++, thickness 0.61
A sintered body was obtained. Next, this sintered body was passed between rolling rolls at room temperature to form a rolled body having a thickness of 0.2 square centimeters. This rolled body was annealed for 30 minutes at 650°C ± 15°C in a hydrogen atmosphere, and then punched out with a diameter of 100 m and a width of 2.5 mm in 6 places.
1. A sheet with a cut having a length of 40 mm was obtained. The phosphorus content of this sheet was 0.74% by weight.
このシートを平面の研摩皿に接着剤を用いて貼り付けた
。この研削工具を用いて、荒ずつ研削の終了した表面粗
さR□。=18ルの平面の硝子を研削したところ、次の
ような結果か得られた。This sheet was attached to a flat polishing plate using an adhesive. Using this grinding tool, the surface roughness R□ is obtained by rough grinding. When a piece of flat glass with a diameter of 18 mm was ground, the following results were obtained.
研摩機 : オスカー型硝子研摩機鋼子種
: BK−7,70x 70謹寓力ンザシ荷重 :
500g/cゴ
下皿回転数 : 400rpm
クーラント : エチレングリコール系20倍液
5分間研削量 :200p
5分後表面粗さ: R,、、=2牌
研削比(=硝子研削量(ル)/シート研摩量(延)
: 100
実施例2
実施例1の金属粉末に、平均粒子径3〜7μのカルホニ
ルニッケル粉末を3重量%添加した外は実施例1と全く
同様にしてシートを得た。シートの燐含有率は0.64
重量%であった。Polishing machine: Oscar type glass polishing machine steel type
: BK-7, 70x 70 load:
500g/c lower plate rotation speed: 400rpm Coolant: 20x ethylene glycol liquid 5 minutes grinding amount: 200p Surface roughness after 5 minutes: R, , = 2 tiles grinding ratio (= glass grinding amount (le) / sheet Amount of polishing (extension)
: 100 Example 2 A sheet was obtained in exactly the same manner as in Example 1 except that 3% by weight of carbonyl nickel powder having an average particle size of 3 to 7 μm was added to the metal powder of Example 1. The phosphorus content of the sheet is 0.64
% by weight.
実施例1と同様に硝子を研削したところ、次の結果を得
た。When glass was ground in the same manner as in Example 1, the following results were obtained.
5分間研削量 ・ 260牌
5分後表面粗さ: Rwraw = 2.29L研削
比 =93
実施例3
100メツシユ以下のアトマイズ青銅粉末(錫含有率2
0重ψ%)と 100メツシユ以下のアトマイズ燐銅粉
末(燐含有率8重量%)を重量部で5:2に配合したベ
ース粉末に、平均粒子径3〜7延のカルボニルニッケル
粉末を2重量%添加した粉末に無電解ニッケルメッキ(
メツキ重量55%)を施した50〜100 pのタイヤ
セント粉末と同じ粒度の炭化珪素粉末(CC)を各0.
75重量%添加し、実施例1と同様にしてシートを得た
。この金属中溝含有率は0.60%てあった。Amount of grinding for 5 minutes - 260 tiles Surface roughness after 5 minutes: Rwraw = 2.29L Grinding ratio = 93 Example 3 Atomized bronze powder of 100 mesh or less (tin content 2
0 weight ψ%) and 100 mesh or less atomized phosphorous copper powder (phosphorus content 8 weight %) in a ratio of 5:2 by weight, and 2 weight parts of carbonyl nickel powder with an average particle size of 3 to 7 mm. Electroless nickel plating (
Tire cent powder of 50 to 100 p with plating weight of 55%) and silicon carbide powder (CC) of the same particle size as 0.0 p.
A sheet was obtained in the same manner as in Example 1 by adding 75% by weight. The groove content in this metal was 0.60%.
実施例1と同様に炭化珪素焼結体を研削したところ、次
の結果を得た。When a silicon carbide sintered body was ground in the same manner as in Example 1, the following results were obtained.
5分間研削量 ;60ル
5分後表面粗さ: R−JX = 374研削比
:50
実施例4
実施例3と同様の金属粉末に平均粒子径3〜7μのカル
ボニルニッケル粉末を3重量%添加した粉末に、無電解
ニッケルメッキ(メツキ重量55%)を施したlO〜2
0川の立方品窒化ホウ素粉末を0.5ii%と、12〜
25ルの酸化アルミニウム粉末(1#A)を1.0重量
%添加し、実施例1と同様にしてシートを得た。このシ
ートの燐含有率は0.35重量%てあった。実施例1と
同様にSi単結晶を研削したところ、次の結果を得た。Amount of grinding for 5 minutes; Surface roughness after 60 ru for 5 minutes: R-JX = 374 grinding ratio
:50 Example 4 Electroless nickel plating (plating weight 55%) was applied to a powder obtained by adding 3% by weight of carbonyl nickel powder with an average particle size of 3 to 7μ to the same metal powder as in Example 3.
0.5ii% of cubic boron nitride powder, 12~
A sheet was obtained in the same manner as in Example 1 except that 1.0% by weight of aluminum oxide powder (1#A) was added. The phosphorus content of this sheet was 0.35% by weight. When a Si single crystal was ground in the same manner as in Example 1, the following results were obtained.
但し、カンザシ荷重は70g/crn’、単結晶サイズ
は4インチφであった。However, the kanzashi load was 70 g/crn', and the single crystal size was 4 inches φ.
5分間研削量 : 65JL
5分後表面相さ: R,、、、= 1.6鉢研削比
:250
実施例5
100メ・ンシュ以下のアトマイズ青銅粉末(錫含有率
20重量%)と 100メツシユ以下のアトマイズ燐銅
粉末(燐含有率8重量%)を重量部で5:2に配合した
混合粉末に平均粒子径3〜7pのカルボニルニッケル粉
末を5重量%添加したものをベース粉とし、コンセント
レージョンC=50(C=100はグレード単位容積1
crn′当たり 4.4カラツト= 0.88g )の
相当量のダイヤモンド(メツシュサイズ#120 /1
40 )とこれと同様の粒度井120の炭化珪素を添加
し、実施例1と同様に水素ガス雰囲気中て680℃±l
O°C155g/cm’の条件下で35分間焼結させ、
縦17(lsm、横140mm、厚さ0.6*mの焼結
体を得た。以下、圧延及び焼鈍は実施例1に示した同様
の条件にて行い、厚さ 0.2■のシートを得、つぎに
これを外径150m5、内径50.8mmの形状に加工
した。Amount of grinding for 5 minutes: 65 JL Surface texture after 5 minutes: R, , , = 1.6 Pot grinding ratio: 250 Example 5 Atomized bronze powder of 100 mesh or less (tin content 20% by weight) and 100 mesh A base powder was prepared by adding 5% by weight of carbonyl nickel powder with an average particle size of 3 to 7p to a mixed powder of the following atomized copper phosphorus powder (phosphorus content: 8% by weight) in a ratio of 5:2 by weight. Region C=50 (C=100 is grade unit volume 1
4.4 carats per crn' = 0.88g) of diamonds (mesh size #120 /1
40) and silicon carbide of the same grain size well 120 were added, and heated at 680°C ± l in a hydrogen gas atmosphere as in Example 1.
Sintered at 155 g/cm' at O°C for 35 minutes,
A sintered body with a length of 17 (lsm, a width of 140 mm, and a thickness of 0.6*m) was obtained. Hereinafter, rolling and annealing were performed under the same conditions as shown in Example 1, and a sheet with a thickness of 0.2 mm was obtained. This was then processed into a shape with an outer diameter of 150 m5 and an inner diameter of 50.8 mm.
比較例として、上記のアトマイズ燐銅粉末の代りに同一
粒度のアトマイズ銅粉を用い、シートを製作した。但し
、この場合の焼結温度は850 ’C±10°Cて35
分間保持した。このシートを比較例1とする。さらに市
販のタイヤセントレジングレート(ダイヤモンド粒度#
120.寸法は上記と同様)を比較例2として、下記の
条件てテストを行ったところ、表2に示した通り、本発
明品かSiCのような硬脆材料の加工に秀れた性能を発
揮することが明らかとなった。As a comparative example, a sheet was manufactured using atomized copper powder of the same particle size instead of the atomized phosphorous copper powder described above. However, the sintering temperature in this case is 850'C ± 10°C and 35
Hold for minutes. This sheet is referred to as Comparative Example 1. In addition, commercially available tire center resin rate (diamond particle size #
120. When a test was conducted under the following conditions using Comparative Example 2 (the dimensions are the same as above), as shown in Table 2, the product of the present invention exhibited excellent performance in machining hard and brittle materials such as SiC. It became clear that
表1.切断試験条件
切断機 ・
岡木工作製クリープフィート
成型研削盤
3180rpm
20mm/5in
l、3.5m+*の3種
回転数
テーブル速度:
切込量
研削液
被削材
切断方式
水溶性ケミカルタイプ(希釈
60倍)
焼結SiC
ダウンカット
表2切断試験結果
(注)チッピンク量は、万能投影器にて切断面を[察し
、チッピンク量の大きいもの10点を測定したモ均値を
示す。Table 1. Cutting test conditions Cutting machine Creep foot molding grinder made by Okaki Kogyo 3180 rpm 20 mm/5 in 1, 3.5 m + * 3 types of rotation speed Table speed: Depth of cut Grinding fluid Work material Cutting method Water-soluble chemical type (60 times diluted) ) Sintered SiC Down Cut Table 2 Cutting Test Results (Note) The chipping amount is the average value obtained by observing the cut surface with a universal projector and measuring the 10 points with the largest chipping amount.
Claims (4)
重量%の銅錫系金属粉末と5重量%以下のニッケル粉末
と研削砥粒との焼結圧延研摩成形体。(1) Contains 0.1-1.5% phosphorus and 5-20% tin
A sintered rolled abrasive molded body of copper-tin metal powder of 5% by weight or less, nickel powder of 5% by weight or less, and grinding abrasive grains.
を主体とする特許請求の範囲第1項記載の焼結圧延研摩
成形体。(2) The sintered-rolled abrasive compact according to claim 1, wherein the abrasive grains are mainly composed of diamond or cubic boron nitride.
研削砥粒とを混合、加熱焼結して得られた焼結体を圧延
することを特徴とする0.1〜1.5重量%の燐を含有
し錫が5〜20重量%の銅錫系金属粉末と5重量%以下
のニッケル粉末と研削砥粒との焼結圧延研摩成形体の製
造法。(3) 0.1 to 1.5 weight characterized by rolling a sintered body obtained by mixing and heating sintering copper-tin alloy powder, phosphorous copper powder, nickel powder, and grinding abrasive grains. A method for producing a sintered rolled abrasive compact of copper-tin metal powder containing 5% to 20% by weight of tin, 5% by weight or less of nickel powder, and abrasive grains.
を主体とする特許請求の範囲第3項記載の焼結圧延研摩
成形体の製造法。(4) The method for producing a sintered rolled abrasive compact according to claim 3, wherein the abrasive grains are mainly composed of diamond or cubic boron nitride.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5565189A JPH0224061A (en) | 1989-03-08 | 1989-03-08 | Polishing molded body and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5565189A JPH0224061A (en) | 1989-03-08 | 1989-03-08 | Polishing molded body and manufacture thereof |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4198384A Division JPS60186375A (en) | 1984-03-07 | 1984-03-07 | Abrasive molded body and method of manufacturing thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0224061A true JPH0224061A (en) | 1990-01-26 |
Family
ID=13004737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5565189A Pending JPH0224061A (en) | 1989-03-08 | 1989-03-08 | Polishing molded body and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0224061A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110193787A (en) * | 2019-06-27 | 2019-09-03 | 郑州宏拓精密工具有限公司 | A kind of 5G mobile phone pottery backboard diamond grinding head and preparation method thereof |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS557517A (en) * | 1978-06-27 | 1980-01-19 | Mitsui Mining & Smelting Co | Metal bond diamond sintered article and its manufacture |
JPS5732304A (en) * | 1980-07-31 | 1982-02-22 | Showa Denko Kk | Production of glass grinding sheet |
-
1989
- 1989-03-08 JP JP5565189A patent/JPH0224061A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS557517A (en) * | 1978-06-27 | 1980-01-19 | Mitsui Mining & Smelting Co | Metal bond diamond sintered article and its manufacture |
JPS5732304A (en) * | 1980-07-31 | 1982-02-22 | Showa Denko Kk | Production of glass grinding sheet |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110193787A (en) * | 2019-06-27 | 2019-09-03 | 郑州宏拓精密工具有限公司 | A kind of 5G mobile phone pottery backboard diamond grinding head and preparation method thereof |
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