JPH02237794A - Cutting device for tapelike material - Google Patents
Cutting device for tapelike materialInfo
- Publication number
- JPH02237794A JPH02237794A JP5603389A JP5603389A JPH02237794A JP H02237794 A JPH02237794 A JP H02237794A JP 5603389 A JP5603389 A JP 5603389A JP 5603389 A JP5603389 A JP 5603389A JP H02237794 A JPH02237794 A JP H02237794A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- cutting
- vacuum suction
- edge
- suction hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Nonmetal Cutting Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はテープ状材料から所要の小片を切り出すための
テープ状材料切断装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a tape-shaped material cutting device for cutting required pieces from a tape-shaped material.
粘着テープからパンチとダイを用いて所要の粘着テープ
小片を切断し、その小片をダイ下方に位置する目的物に
粘着するには、従来第３図のようにバンチ１とダイ （
図示せず）によってテー１２の打ち抜きを行い、バンチ
１内に加工された真空吸着用の孔３によって打ち抜きテ
ープ小片４を保持し、パンチ１をさらに下方に移動させ
ることによって打ち抜きテープ小片４をダイ下方に位置
する目的物に粘着させ固定するようになっていた。Conventionally, in order to cut a required piece of adhesive tape from an adhesive tape using a punch and die and adhere the small piece to an object located below the die, a bunch 1 and a die (
(not shown), the punched tape small piece 4 is held by the vacuum suction hole 3 formed in the bunch 1, and the punched tape small piece 4 is held by the die by moving the punch 1 further downward. It was designed to be fixed by adhering it to an object located below.
テープの使用率を向上させ低コスト化を図るため、また
打ち抜いた後の残りテープを巻取るための装置を省き装
１全体を簡略にするためには、グイとパンチによるテー
プの中抜き方式より、第４図に示すような真空吸着孔３
を有ずる切れ刃５と吸着孔を有しない切れ刃６の一対の
切れ刃をもつテープ切断装置により所要幅のテープ７を
切断し、テープ小片８を得る方式が望ましい。しかし、
切れ刃切断方式はグイとパンチによる中抜き方式と異な
り、切断時にテープ小片８が第５図に示すように上方か
ら先に切れて折れてしまうことがあり、その場合テープ
小片８の真空吸着による保持ができず、テープ小片８を
、下方にある目的物にうまく粘着させることができない
ということがあった。In order to improve the usage rate of the tape and reduce costs, and to simplify the entire assembly by eliminating the need for a device for winding up the remaining tape after punching, we have developed a method of punching out the tape using a punch. , a vacuum suction hole 3 as shown in FIG.
It is preferable to use a tape cutting device having a pair of cutting edges, a cutting edge 5 having a suction hole and a cutting edge 6 having no suction hole, to cut the tape 7 of a required width to obtain tape pieces 8. but,
The cutting edge cutting method differs from the hollowing method using a goo and a punch, and when cutting, the small piece of tape 8 may break and break from the top first, as shown in Figure 5. In this case, the small piece of tape 8 is cut by vacuum suction. In some cases, the small piece of tape 8 could not be properly adhered to the object below.
テープの使用率を向上させ、また、装置全体を簡略にす
るためには切れ刃切断方式を用いて、かつテープ小片８
を真空吸着で確実に保持できる装置が要望されていた。In order to improve the usage rate of the tape and simplify the entire device, a cutting edge cutting method is used and the tape can be cut into small pieces of 8.
There was a need for a device that could reliably hold materials by vacuum suction.
本発明は、テープ状材料の切断時の折れ曲がりを防止し
、真空吸着孔を有する側の切れ刃に切断済みテープ小片
を確実に真空吸着で保持することを可能にする装置を提
供するものである。The present invention provides a device that prevents bending of a tape-like material when cutting it and makes it possible to reliably hold cut tape pieces on the cutting edge on the side having vacuum suction holes by vacuum suction. .
上記目的を達成するため、本発明の装置は何れか一方の
側に切断済み小片を保持するための真空吸着孔を有する
一対の切れ刃をもつテープ状材料切断装置であって、真
空吸着孔を有する側の切れ刃先端部に適当なＲが施され
、他方の側の切れ刃先端部はより鋭利にされている点に
特徴がある。To achieve the above object, the present invention is a tape-shaped material cutting device having a pair of cutting blades having vacuum suction holes on either side for holding the cut pieces. It is characterized in that the tip of the cutting edge on the one side has a suitable radius, and the tip of the cutting edge on the other side is made sharper.
本発明において第２図に拡大して示すように真空吸着孔
３を有する側の切れ刃５の先端部９に適当なＲをもたせ
、他方の真空吸着孔を有しない側の切れ刃先端部をより
鋭利にする。このようにすればテープ状の材料は真空吸
着孔を有する側から切れず、必ず他の側より切断される
ようになり、切断されたテープ小片の保持が確実に行え
る。この機構を第１図により説明する。In the present invention, as shown in an enlarged view in FIG. 2, the tip 9 of the cutting edge 5 on the side with the vacuum suction hole 3 has an appropriate radius, and the tip of the cutting edge 5 on the other side without the vacuum suction hole has an appropriate radius. Make it sharper. In this way, the tape-shaped material will not be cut from the side having the vacuum suction hole, but will always be cut from the other side, and the cut tape pieces can be held securely. This mechanism will be explained with reference to FIG.
第１図（Ａ）において切れ刃５の先端９は３０〜５０μ
ｍのＲ加工が施されており、他方の切れ刃６の先端部１
０は鋭利に加工されている。また切れ刃相互の隙間は約
１０μｍに調整されている。In Fig. 1 (A), the tip 9 of the cutting edge 5 is 30 to 50 μm.
The tip part 1 of the other cutting edge 6 is
0 is sharply machined. Further, the gap between the cutting edges is adjusted to about 10 μm.
第１図（Ｂ）において切れ刃５は、下降してきて、切れ
刃６との間でテープ７を切断するが、その際、切れ刃５
の先端部９はＲ加工されているため、切断は切れ刃６の
側から始まる。このため第１図（Ｃ）に示すようにテー
プ小片８は切れ刃５に設けられた真空吸着用孔３によっ
て吸引・保持され、さらに切れ刃５を下降させることに
より所望の部分に粘着させることができる。In FIG. 1(B), the cutting edge 5 descends and cuts the tape 7 between the cutting edge 6 and the cutting edge 5.
Since the tip 9 of is rounded, cutting starts from the cutting edge 6 side. For this reason, as shown in FIG. 1(C), the small piece of tape 8 is sucked and held by the vacuum suction hole 3 provided in the cutting edge 5, and by further lowering the cutting edge 5, it can be made to adhere to a desired area. I can do it.
本発明装置を適用できるテープ材料は粘着テープに限定
されるものでなくプラスチック、金属箔など粘着剤を有
しないものであっても差支えない。The tape material to which the device of the present invention can be applied is not limited to adhesive tapes, but may also be materials that do not have adhesives, such as plastics and metal foils.
本発明の装置により、切断後のテープ状材料の真空吸着
による保持が確実に行え、正確に目的物に固定させるこ
とが可能となった。With the apparatus of the present invention, it is possible to reliably hold the tape-shaped material after cutting by vacuum suction, and it has become possible to accurately fix it to the target object.
第１図は本発明装置によるテープ切断のメカニズムを示
す図、第２図は本発明装置の真空吸着孔を有する側の切
れ刃先端部を拡大して示す断面図、第３図は打ち抜き方
式を説明する図、第４図は１対の切れ刃による切断装置
を説明する図、第５図は従来の切れ刃切断装置による切
断メカニズムを示す図である。
３・・・真空吸着孔、５・・・真空吸着孔を有する側の
切れ刃、６・・・真空吸着孔を有しない側の切れ刃、７
・・・テープ状材料、８・・・切断テープ小片。
第１図Fig. 1 is a diagram showing the mechanism of tape cutting by the device of the present invention, Fig. 2 is an enlarged cross-sectional view showing the tip of the cutting blade on the side with the vacuum suction hole of the device of the present invention, and Fig. 3 is a diagram showing the punching method. FIG. 4 is a diagram illustrating a cutting device using a pair of cutting blades, and FIG. 5 is a diagram showing a cutting mechanism using a conventional cutting blade cutting device. 3... Vacuum suction hole, 5... Cutting edge on the side with the vacuum suction hole, 6... Cutting edge on the side without the vacuum suction hole, 7
... Tape-shaped material, 8 ... Cutting tape small piece. Figure 1
Claims (1)
着孔を有する一対の切れ刃をもつテープ状材料切断装置
に於て、真空吸着孔を有する側の切れ刃先端部には適当
なＲが施され、他方の側の切れ刃先端はより鋭利にされ
ていることを特徴とするテープ状材料切断装置。In a tape-shaped material cutting device having a pair of cutting blades each having a vacuum suction hole on either side for holding a cut piece, the tip of the cutting blade on the side with the vacuum suction hole has an appropriate radius. A tape-shaped material cutting device characterized in that the tip of the cutting blade on the other side is sharpened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5603389A JPH0710513B2 (en) | 1989-03-10 | 1989-03-10 | Tape material cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5603389A JPH0710513B2 (en) | 1989-03-10 | 1989-03-10 | Tape material cutting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02237794A true JPH02237794A (en) | 1990-09-20 |
| JPH0710513B2 JPH0710513B2 (en) | 1995-02-08 |
Family
ID=13015764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5603389A Expired - Lifetime JPH0710513B2 (en) | 1989-03-10 | 1989-03-10 | Tape material cutting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0710513B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005095991A (en) * | 2003-09-22 | 2005-04-14 | Fuji Kikai Kk | Automatic cutting transfer device |
| JP2006346778A (en) * | 2005-06-14 | 2006-12-28 | Nippon Mektron Ltd | Long-size film base material cutting device |
| WO2014178143A1 (en) * | 2013-05-02 | 2014-11-06 | Ykk株式会社 | Reinforcement-film bonding device |
| WO2015145545A1 (en) * | 2014-03-24 | 2015-10-01 | Ykk株式会社 | Reinforcement film adhering device |
-
1989
- 1989-03-10 JP JP5603389A patent/JPH0710513B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005095991A (en) * | 2003-09-22 | 2005-04-14 | Fuji Kikai Kk | Automatic cutting transfer device |
| JP2006346778A (en) * | 2005-06-14 | 2006-12-28 | Nippon Mektron Ltd | Long-size film base material cutting device |
| WO2014178143A1 (en) * | 2013-05-02 | 2014-11-06 | Ykk株式会社 | Reinforcement-film bonding device |
| CN104302203A (en) * | 2013-05-02 | 2015-01-21 | Ykk株式会社 | Reinforcement-film bonding device |
| CN104302203B (en) * | 2013-05-02 | 2017-06-30 | Ykk株式会社 | Reinforcing film adhering device |
| WO2015145545A1 (en) * | 2014-03-24 | 2015-10-01 | Ykk株式会社 | Reinforcement film adhering device |
| TWI587810B (en) * | 2014-03-24 | 2017-06-21 | Ykk股份有限公司 | Reinforcement film adhesion device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0710513B2 (en) | 1995-02-08 |
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