JPH02236173A - Fixed probe board - Google Patents

Abstract

PURPOSE:To prevent antenna effect from being caused with respect to ultra high frequency signals with no redundancy generated in printed wiring by a method wherein a tip on a connection terminal side of print wiring formed on a printed board and a tip on a connection terminal side of a probe are electrically connected with each other. CONSTITUTION:A probe PB has a taper whose tip is bent so that it is opposite to an electrode surface of a device such as a semiconductor chip to be measured. This probe PB is mounted on a printed board surface with a specific angle by being supported by a support. When the probe, a terminal end of a connecting part of print wiring PL to which the probe is to be connected and a terminal end of a connecting part of the probe PB are approximately aligned with one another. This constitution prevents redundancy from being generated in the print wiring PL so that the probe PB and the print wiring PL can be electrically connected with each other by solder HD.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a fixed probe board, and relates to a technique that is effective for use in, for example, measuring and testing ultra-high-speed semiconductor devices.

[Conventional technology]

When semiconductor integrated circuit devices are completed in a grid pattern on a semiconductor wafer, they are inspected to see if they have desired electrical characteristics or circuit functions. In this probing step, a probe needle composed of a thin linear needle is pressed against a bonding pad of the semiconductor chip to establish an electrical connection between the tester and the semiconductor chip. The probe needle is fixed to the printed circuit board in highly accurate alignment with the electrode array of the semiconductor chip to be measured. The above semiconductor wafer is placed on a measurement stage (X.Y
By sequentially moving the stage) in the X and/or Y direction according to the pitch of one semiconductor chip, the operation tests of the individual semiconductor chips formed in the grid pattern are continuously performed. As a fixed probe board used in the above-mentioned blobbing process, for example, Japanese Patent Publication No. 59-43091
There is a publication.

[Problem to be solved by the invention]

In the conventional fixed probe board, no consideration was given to the connection between the probe needle and the wiring pattern of the printed circuit board (hereinafter referred to as printed wiring), and as shown in the perspective view of Fig. 5, the connection of the probe needle PB was Wiring pattern P
Generally, L is connected with solder HD while leaving an extra length L. That is, on the printed circuit board side, the connection end side of the printed wiring PL is extended two times to the vicinity of the support provided around the opening so that it can be used to measure a wide variety of semiconductor chips. As a result, when the probe needle is attached, an extra length L as described above inevitably occurs in the printed wiring PL. The inventor's research has revealed that when the above-mentioned extra length occurs in the printed wiring PL, the following problems occur. In other words, the development of ultra-high-speed devices such as supercomputers and space communication satellites is progressing, and measurement of these ultra-high-speed devices requires ultra-high frequency signal transmission for functional testing. . When carrying out such signal transmission, in order to prevent the effects of reflected waves such as antenna effects as much as possible, in addition to redundant paths such as the extra length L mentioned above, protrusions at the connection parts,
It became clear that it was necessary to eliminate even the level difference.

An object of the present invention is to provide a fixed probe board that can measure ultra-high-speed devices with a simple configuration.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the tip of the printed wiring formed on the printed circuit board on the connection end side and the tip of the probe needle on the connection end side are aligned and electrically connected.

[For production]

According to the above-described means, since no extra length is generated in the printed wiring, it is possible to prevent antenna effects and the like from occurring with respect to signals to be transmitted at ultra-high frequencies.

〔Example〕

FIG. 1 shows a schematic bottom view of an embodiment of a fixed probe board according to the present invention, and FIG. 2 shows a schematic sectional view thereof.

A plurality of probe needles PB whose tips are aligned in correspondence with electrodes such as bonding pads provided on one semiconductor chip (IC) indicated by dotted lines in the figure are placed in the opening of a circular printed circuit board. Arranged radially. These plurality of probe needles PB are fixed by a fixing layer along the support surface of the support BS provided in the printed circuit board opening, and their free ends are inclined toward an imaginary reference plane below the opening. and fixed. The tip end thereof is bent toward an imaginary reference plane corresponding to the semiconductor chip. Although not particularly limited, the fixed probe board of this embodiment uses a support BS having four circular arcs so as to equalize the length of the free end from the fixed part to the tip of the probe PB. Regarding a fixed probe board using such a support BS, the above-mentioned Japanese Patent Publication No. 59-43
Please refer to Publication No. 091.

In this example, in order to correspond to the operation test of ultra-high-speed devices, as shown in the figure, four representative patterns of printed wiring PL are exemplified, and the connection end side or the connection end of the probe needle is Terminated to match. Therefore, the printed wiring of the printed circuit board in this example is
After the arrangement of the probe needles PB corresponding to the device to be measured is determined, the printed wiring P is formed by etching or cutting using a knife, but is not particularly limited.
The extra length L that occurs in the conventional method is removed. In addition, when forming a printed circuit board, a wiring pattern may be formed in advance so as to correspond to each device to be measured so that no extra length L is generated in the printed wiring PL.

In the same figure, in order to distinguish between the probe needle PB and the printed wiring PL, the probe needle PB is drawn as a single line and the printed wiring PL is drawn with a certain width, but in reality, It is desirable that the configuration be as described in detail.

Connector pins P are provided along the circumference of the circular board. These connector pins P are connected to a known fixed probe board used for measuring semiconductor wafers.
It is inserted into a connector having the configuration No. 11, and is connected to a cable or the like for connection to an IC tester via an ultra-high frequency head, although this is not particularly limited. Each of the pins P is connected to one end of the exemplified printed wiring formed on the lower surface of the substrate, and the other end of the printed wiring is electrically connected to each of the probe needles.

In order to form the printed wiring PL with high density, the printed wiring on the lower surface side where the probe needle and the connection part extend as they are as described above, and the printed wiring on the upper surface side from the connection part with the probe needle through a through hole. It may also be composed of printed wiring formed in the same way.

FIG. 3 shows a perspective view of an embodiment of the connecting portion between the probe needle PB and the printed wiring PL. That is, in the figure, the fixed probe board FRB is inverted,
FIG. 2 is a perspective view of one probe needle and the corresponding printed wiring PL taken out from the bottom side.

The probe needle PB has a tapered shape, and its tip is bent so as to face the electrode surface of a device such as a semiconductor chip to be measured as described above. This probe needle PB is attached at an angle of about 10" to the surface of the printed circuit board by being supported by a support BS which is omitted in the figure. Such a probe needle and its connection The relationship between the printed wiring PL and the terminal end of the connection part of the printed wiring PL and the probe needle PB
By making the ends of the connecting portions approximately coincide with X, the printed wiring PL is prevented from having an extra length L as in the conventional case. In this state, the probe needle PB and the printed wiring PL are electrically connected by solder HD, although this is not particularly limited.

In order to prevent a difference in level from occurring at the connection between the printed wiring PL and the probe needle PB, as shown in FIG. 4A,
The solder HD has a certain slope so as to fill in the difference in level. In other words, solder HD is different from the conventional connection method in which it is only necessary to electrically connect the two, and solder HD connects the flat printed wiring & IPL and the connection part of the probe needle PB having a certain thickness. It is carefully formed to fill in the difference in level and create a smooth connection between the two.

Therefore, the solder HD is shaped, such as by cutting off protrusions, etc., as necessary.

The probe meter PB is formed with a tapered shape as shown in FIG. Therefore, printed wiring PL
In order to prevent protrusions from occurring due to the difference in thickness at the connection part of the printed wiring PL, as shown in Figure 4B, the pattern of the connection part of the printed wiring PL is also made so as to have continuity with the taper of the probe needle. A tapered taper is formed.

By doing this, at the connection between the printed wiring on the printed circuit board and the probe needle connected to it, not only the extra length L as in the conventional case but also protrusions and steps are not generated, so that the flow can flow there. Good signal transmission is achieved without causing any disturbance in the flow of ultra-high frequency current.

The effects obtained from the above examples are as follows. That is, (1) By aligning and electrically connecting the tip of the connection end of the printed wiring formed on the printed circuit board and the tip of the connection end of the probe needle, no extra length is created in the printed wiring. , an effect can be obtained in that antenna effects and the like can be prevented from occurring in ultra-high frequency signals to be transmitted.

<<2>> The above-mentioned probe needle is provided with a taper that tapers from the connecting end toward the contact end, and the tip of the probe needle connecting portion. - The wiring pattern should have a continuous taper. As a result, since there is no protrusion at the connection between the probe needle and the printed wiring, it is possible to obtain the effect that an antenna effect or the like does not occur at the protrusion.

(3) A solder layer connecting the printed wiring and the probe needle is formed so as to have a gentle slope so as to fill the difference in level between the probe needle connecting portion and the wiring pattern. As a result, no step is formed at the connection between the probe needle and the printed wiring, so that an antenna effect or the like can be prevented from occurring at the step.

(4) Due to the synergistic effects of (1) to (3) above,
The effect is that a fixed probe board having a signal transmission path suitable for ultra-high-speed devices can be obtained.

Although the invention made by the present inventor has been specifically explained based on Examples above, the present invention is not limited to the above-mentioned Examples, and it goes without saying that various changes can be made without departing from the gist thereof. Nor. For example, probe needle P
The means for electrically connecting B and the printed wiring PL can be various embodiments such as using solder or a conductive adhesive. Further, the structure of the probe needle and its mounting structure can take various embodiments depending on the structure of the device to be measured and the arrangement of the electrodes.

The fixed probe board of this embodiment is used for measuring semiconductor chips completed on a semiconductor wafer, as well as for measuring LM-shaped ICs or ICs formed integrally with a lead frame.
It can also be used for testing ICs arranged on a C tray.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows. In other words, by aligning and electrically connecting the connecting end of the printed wiring formed on the printed circuit board with the connecting end of the probe needle, there is no extra length in the printed wiring, so ultra-high frequency It is possible to prevent antenna effects and the like from occurring in the signals to be transmitted.

[Brief explanation of drawings]

FIG. 1 is a schematic bottom view showing one embodiment of a probe board according to the present invention, FIG. 2 is a schematic cross-sectional view thereof, and FIG. 3 is an embodiment of the connecting portion between the probe needle and printed wiring. FIG. 4A is a sectional view thereof, FIG. 4B is a plan view thereof, and FIG. 5 is a perspective view showing an example of a conventional connecting portion between a probe needle and printed wiring. PRB...probe board, PB...probe needle, PL
・・Printed wiring, }ID・・Solder, BS・・Support, ・・Extra length, P・・Connector bin, Fig. 1

Claims (1)

[Scope of Claims] 1. A fixed probe board, characterized in that the connection end side tip of a wiring pattern formed on a printed circuit board and the connection end side tip of a probe needle are aligned and electrically connected. 2. The probe needle is provided with a taper that tapers from the connection end side toward the contact end, and the wiring pattern is formed so as to have a taper continuous with the taper of the probe needle connection part. A fixed probe board according to claim 1. 3. The wiring pattern and the probe needle are electrically connected by soldering, and the solder layer is formed to have a gentle slope so as to fill the difference in level between the probe needle connection part and the wiring pattern. A fixed probe board according to claim 1 or 2, characterized in that it is a fixed probe board.