JPH02234492A - Manufacture of printed board - Google Patents
Manufacture of printed boardInfo
- Publication number
- JPH02234492A JPH02234492A JP5575689A JP5575689A JPH02234492A JP H02234492 A JPH02234492 A JP H02234492A JP 5575689 A JP5575689 A JP 5575689A JP 5575689 A JP5575689 A JP 5575689A JP H02234492 A JPH02234492 A JP H02234492A
- Authority
- JP
- Japan
- Prior art keywords
- glass fiber
- resin
- printed circuit
- prepreg
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000003365 glass fiber Substances 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 16
- 229920005989 resin Polymers 0.000 claims abstract description 16
- 238000007788 roughening Methods 0.000 claims abstract description 10
- 239000011162 core material Substances 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 6
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000004593 Epoxy Substances 0.000 abstract description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明はプリント基板に関し、特にプリント基板に用
いられるガラス繊維の表面処理に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to printed circuit boards, and particularly to surface treatment of glass fibers used in printed circuit boards.
プリント基板に用いられるガラス繊維の表面処理に関し
、
樹脂とガラス繊維との密着性を改善するとともに、スル
ーホールとなる加工大内でのメッキ層とガラス繊維との
密着性の向上をも図ることを目的とし、
〔従来技術〕
第４図は多層プリント基板の製造工程の一部を示すもの
である。多層プリント基板は布状に編んだガラス繊維に
エポキシ樹脂、あるいはポリイミド樹脂等を含浸するこ
とによってプリブレグが形成され、該プリプレグの表裏
に銅板を張った状態で加工加熱して硬化させ銅張基板が
作成される。Regarding the surface treatment of glass fiber used in printed circuit boards, we aim to improve the adhesion between the resin and the glass fiber, and also to improve the adhesion between the plating layer and the glass fiber in the processing area that becomes the through hole. [Prior Art] FIG. 4 shows a part of the manufacturing process of a multilayer printed circuit board. Multilayer printed circuit boards are made by impregnating epoxy resin or polyimide resin into cloth-like glass fibers to form a pre-reg, and with copper plates stretched on the front and back sides of the prepreg, the prepreg is heated and cured to form a copper-clad board. Created.
この銅張基板を用いてパターン形成を行って内層基板を
形成し（ステップＳ１）、このようにして形成された各
内層基板間にブリブレグが挿入されて、積層され、多層
プリント基板が形成される（ステップＳＺ）。 更に、
このように形成された多層プリント基板の各層のパター
ン間の配線を確保するために、スルーホール、パイアホ
ールが設けられるが、このスルーホール、パイアホール
は穴開け工程（ステップＳ３）で開けられた加工穴の内
周面に例えばパネルメッキを施す（ステップＳ４）こと
によって形成される。This copper-clad board is used to form a pattern to form an inner layer board (step S1), and a blob leg is inserted between each of the inner layer boards thus formed and laminated to form a multilayer printed board. (Step SZ). Furthermore,
In order to secure wiring between the patterns of each layer of the multilayer printed circuit board formed in this way, through holes and pier holes are provided, but these through holes and pier holes are made in the hole drilling process (step S3). It is formed by, for example, applying panel plating to the inner peripheral surface of the processed hole (step S4).
ガラス繊維の表面は極めて滑らかであるため、上記によ
うに含浸される樹脂との密着性が悪く、第３図に示すよ
うにガラス繊維１１と樹脂１２との境界に加工時の機械
的な衝撃によって裸眼では確認できない亀裂Ｃが発生す
る。Since the surface of the glass fiber is extremely smooth, it has poor adhesion with the resin impregnated as described above, and as shown in FIG. This causes cracks C that cannot be seen with the naked eye.
このようにして生じた亀裂Ｃはスルーホール、パイアホ
ール用の穴明け工程によって明けられた加工穴２の内周
壁に対するパネルメッキ（無電解銅メッキ等）の析出を
阻止し、その部分にメッキ欠けが生じて不連続にすると
ともに、亀裂Ｃに浸透したメッキ液部分Ｅが洗浄後によ
っても除去されずに絶縁性を劣化させる。The cracks C generated in this way prevent the deposition of panel plating (electroless copper plating, etc.) on the inner circumferential wall of the processed hole 2 made in the drilling process for through holes and pipe holes, causing plating to be chipped in that area. This causes discontinuity, and the portion E of the plating solution that has penetrated into the crack C is not removed even after cleaning, degrading the insulation.
また、亀裂Ｃが発生しなかったにしても、加工穴２内に
露出した滑らかなガラス繊維表面にメッキ層を強固に付
着させることは困難であり、この部分だけ剥離しやすい
状態となって、この点でもプリント基板の信頬性を低下
させる。In addition, even if cracks C do not occur, it is difficult to firmly adhere the plating layer to the smooth glass fiber surface exposed inside the machined hole 2, and this part becomes susceptible to peeling. This also reduces the reliability of the printed circuit board.
この発明は上記従来の事情に鑑みて提案されたものであ
って、樹脂とガラス繊維との密着性を改善するとともに
、スルーホールとなる加工穴内でのメッキ層とガラス繊
維との密着性の向上をも図ることを目的とするものであ
る。This invention was proposed in view of the above-mentioned conventional circumstances, and it improves the adhesion between the resin and glass fiber, and also improves the adhesion between the plated layer and the glass fiber in the processed hole, which is a through hole. The purpose is to also achieve this goal.
上記目的を達成するためにこの発明は、例えば第１図に
示すようにガラス繊維１１の表面を化学的又は物理的に
粗面化した後、樹脂１２を含浸したブリブレグ１を使用
するようにしたものであり、また、第２図に示すように
プリント基板の穴明け加工後、該加工穴２の内壁に゜露
出したガラス繊維１１の表面を化学的に粗面化した後、
ノ々ネノレメッキするようにしている。In order to achieve the above object, the present invention uses a brev leg 1 in which the surface of a glass fiber 11 is chemically or physically roughened and then impregnated with a resin 12, as shown in FIG. 1, for example. As shown in FIG. 2, after drilling a printed circuit board, the surface of the glass fiber 11 exposed on the inner wall of the hole 2 is chemically roughened.
I try to plate it with a special coating.
ガラス繊維１１の表面を予め粗面化することＧこよって
樹脂との密着性がよくなり、ブリプレグ１、及び該ブリ
プレグ１を加熱加圧して硬化させた基板のガラス繊維と
樹脂の引き剥し強度が大きくなる。By roughening the surface of the glass fiber 11 in advance, the adhesion with the resin is improved, and the peel strength between the glass fiber and resin of the Bripreg 1 and the substrate cured by heating and pressurizing the Bripreg 1 is increased. growing.
また、積層基板へのスルーホール用の穴明け加工によっ
て形成された加工穴２の内周壁に露出したガラス繊維に
粗面化処理をすることによって、この後に行われるメッ
キによるメ・ノキ層のガラス繊維との密着力を向上させ
る。In addition, by roughening the glass fibers exposed on the inner circumferential wall of the processed hole 2 formed by drilling holes for through holes in the laminated board, the glass of the metal wood layer by plating that will be performed later can be roughened. Improves adhesion with fibers.
第１図はこの発明によって成形されたブリプレグ１ （
又はプリプレグｌを加熱加圧して硬化させた基板）の断
面図を示すものである。布状に編まれたガラス繊維１１
表面に粗面化処理によって凹凸が形成され、その後にエ
ボキシ等の樹脂１２が含浸されプリプレグｌが形成され
る。上記粗面化処理は例えば５％前後の濃度のフッ化水
素（ＨＦ）の溶液により表面を溶解することによって行
うことができる。この方法はガラス繊維の素材として結
晶化ガラスを用い、結晶化部分を上記フッ化水素（Ｈ
Ｆ）等で選択的に溶解させて、より短時間に行うことが
できる。また、物理的な方法として微細な砥粒をガラス
繊維表面にぶつける（ホーニング）ことによっても可能
である。Figure 1 shows a Bripreg 1 (
or a substrate obtained by heating and pressurizing prepreg l to cure it). Glass fiber woven into cloth 11
Irregularities are formed on the surface by roughening treatment, and then a resin 12 such as epoxy is impregnated to form a prepreg l. The above-mentioned surface roughening treatment can be performed by dissolving the surface with a solution of hydrogen fluoride (HF) having a concentration of about 5%, for example. In this method, crystallized glass is used as the material for the glass fiber, and the crystallized portion is
F) can be selectively dissolved and the process can be carried out in a shorter time. Further, as a physical method, it is possible to bombard the glass fiber surface with fine abrasive grains (honing).
これによって樹脂１２とガラス繊維１１の密着度が向上
し、スルーホール用の加工穴２内での亀裂の発生確率を
少なくすることができ、メッキ欠けの発生、あるいはメ
ッキ液の浸透による絶縁不良を防止できる。上記粗面化
処理は布状体のガラス繊維に対して行うことも、あるい
は布状体にする前の縦横の各ガラス繊維束、あるいはガ
ラス繊維束を構成する各ガラス繊維の単体に対しても行
うことができ、もちろん、ガラス繊維単体に対しての粗
面化が最も大きな効果を期待できる。This improves the degree of adhesion between the resin 12 and the glass fiber 11, reducing the probability of cracks occurring within the processed hole 2 for the through hole, and preventing insulation defects due to plating chipping or penetration of plating solution. It can be prevented. The above-mentioned surface roughening treatment can be performed on the glass fibers of the cloth-like body, or on each of the vertical and horizontal glass fiber bundles before being made into the cloth-like body, or on each individual glass fiber constituting the glass fiber bundle. Of course, the greatest effect can be expected by roughening the surface of the glass fiber alone.
第２図はこの発明の別の実施例を示すものである。FIG. 2 shows another embodiment of the invention.
第４図に示すように内層基板が形成された後、各内層基
板間にプリプレグが挿入されて積層基板４が形成され、
この後にスルーホール、あるいはパイアホールとなる加
工穴２が形成される。この後、穴開け加工された基板４
に対して本願発明が適用され、前記化学的な方法で該加
工穴２の内壁に露出したガラス繊維１１の表面が粗面化
される．その後にパネルメッキがなされる。これによっ
てメッキ層３は樹脂部及びガラス繊維１１に強固に付着
し剥離し難くなり、プリント基板の信頼性を向上させる
ことができる。As shown in FIG. 4, after the inner layer substrates are formed, prepreg is inserted between each inner layer substrate to form the laminated substrate 4,
After this, a processed hole 2 that will become a through hole or a pipe hole is formed. After this, the board 4 with holes drilled
The present invention is applied to this, and the surface of the glass fiber 11 exposed on the inner wall of the processed hole 2 is roughened by the chemical method. Panel plating is then done. As a result, the plating layer 3 firmly adheres to the resin portion and the glass fiber 11 and becomes difficult to peel off, thereby improving the reliability of the printed circuit board.
以上説明したように、この発明はプリント基板の芯材と
して用いられる布状ガラス繊維の表面に粗面化処理をし
ているので、ガラス繊維と樹脂の密着性に優れ、亀裂の
発生確率を少なくすることができる。また、スルーホー
ルとなる穴明けを行った後に、該加工穴の表面に露出し
たガラス繊維に対して、上記粗面化処理をするとメッキ
層とガラス繊維の密着力を高めることができ、メッキ層
の剥離を防止することができる。As explained above, this invention roughens the surface of the cloth-like glass fiber used as the core material of printed circuit boards, so it has excellent adhesion between the glass fiber and resin and reduces the probability of cracking. can do. In addition, after drilling a hole to become a through hole, if the glass fiber exposed on the surface of the processed hole is subjected to the above-mentioned surface roughening treatment, the adhesion between the plating layer and the glass fiber can be increased, and the plating layer peeling can be prevented.
第１図はこの発明の一実施例を示すプリント基板の断面
図、第２図もこの発明の一実施例を示すプリント基板の
断面図、第３図はプリント基板に使用されるガラス繊維
の斜視図、第４図は従来のプリント基板の製造工程を示
す工程図である。
図中、
２・・・加工穴、 ３・・・メッキ層、１１・・
・ガラス繊維、 １２・・・樹脂。
本発明のプリプレグ（又は基板）
第１図
従来のプリント基板断面図
第３図
本発明の基板
第２図
多層プリント基板製造工程図
第４図Fig. 1 is a sectional view of a printed circuit board showing an embodiment of the present invention, Fig. 2 is a sectional view of a printed circuit board showing an embodiment of the invention, and Fig. 3 is a perspective view of glass fiber used in the printed board. 4 are process diagrams showing the conventional manufacturing process of a printed circuit board. In the figure, 2... machined hole, 3... plating layer, 11...
・Glass fiber, 12...resin. Prepreg (or substrate) of the present invention Fig. 1 Cross-sectional view of conventional printed circuit board Fig. 3 Substrate of the present invention Fig. 2 Multilayer printed circuit board manufacturing process diagram Fig. 4
Claims (1)
は物理的に粗面化した後、樹脂（１２）を含浸したプリ
プレグ（１）を用いて、プリント基板を製造することを
特徴とするプリント基板の製造方法。 〔２〕プリント基板の穴明け加工後、該加工穴（２）内
壁に露出したガラス繊維（１１）の表面を化学的に粗面
化した後、メッキすることを特徴とするプリント基板の
製造方法。[Scope of Claims] [1] After chemically or physically roughening the surface of the glass fiber (11) serving as the core material, the prepreg (1) impregnated with the resin (12) is used to fabricate a printed circuit board. A method for manufacturing a printed circuit board, the method comprising: manufacturing a printed circuit board. [2] A method for producing a printed circuit board, which comprises, after drilling a hole in the printed circuit board, chemically roughening the surface of the glass fiber (11) exposed on the inner wall of the hole (2) and then plating it. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5575689A JPH02234492A (en) | 1989-03-07 | 1989-03-07 | Manufacture of printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5575689A JPH02234492A (en) | 1989-03-07 | 1989-03-07 | Manufacture of printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02234492A true JPH02234492A (en) | 1990-09-17 |
Family
ID=13007688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5575689A Pending JPH02234492A (en) | 1989-03-07 | 1989-03-07 | Manufacture of printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02234492A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013097127A1 (en) * | 2011-12-29 | 2013-07-04 | 广东生益科技股份有限公司 | Circuit substrate and manufacturing method thereof |
| CN104703389A (en) * | 2013-12-04 | 2015-06-10 | 罗伯特·博世有限公司 | A method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833353A (en) * | 1971-09-01 | 1973-05-09 | ||
| JPS62111493A (en) * | 1985-11-08 | 1987-05-22 | ユニチカ株式会社 | Treatment of glass cloth |
| JPS62128196A (en) * | 1985-11-28 | 1987-06-10 | 日立エーアイシー株式会社 | Manufacture of multilayer wiring board |
| JPS62239593A (en) * | 1986-04-08 | 1987-10-20 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of eliminating contaminant |
| JPS6321969A (en) * | 1986-07-09 | 1988-01-29 | ユニチカ株式会社 | Treatment of glass cloth |
| JPS6321970A (en) * | 1986-07-09 | 1988-01-29 | ユニチカ株式会社 | Treatment of glass cloth |
-
1989
- 1989-03-07 JP JP5575689A patent/JPH02234492A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4833353A (en) * | 1971-09-01 | 1973-05-09 | ||
| JPS62111493A (en) * | 1985-11-08 | 1987-05-22 | ユニチカ株式会社 | Treatment of glass cloth |
| JPS62128196A (en) * | 1985-11-28 | 1987-06-10 | 日立エーアイシー株式会社 | Manufacture of multilayer wiring board |
| JPS62239593A (en) * | 1986-04-08 | 1987-10-20 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Method of eliminating contaminant |
| JPS6321969A (en) * | 1986-07-09 | 1988-01-29 | ユニチカ株式会社 | Treatment of glass cloth |
| JPS6321970A (en) * | 1986-07-09 | 1988-01-29 | ユニチカ株式会社 | Treatment of glass cloth |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013097127A1 (en) * | 2011-12-29 | 2013-07-04 | 广东生益科技股份有限公司 | Circuit substrate and manufacturing method thereof |
| US9744745B2 (en) | 2011-12-29 | 2017-08-29 | Shengyi Technology Co., Ltd. | Circuit substrate and manufacturing method thereof |
| CN104703389A (en) * | 2013-12-04 | 2015-06-10 | 罗伯特·博世有限公司 | A method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board |
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