CN104703389A - A method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board - Google Patents
A method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board Download PDFInfo
- Publication number
- CN104703389A CN104703389A CN201410721391.6A CN201410721391A CN104703389A CN 104703389 A CN104703389 A CN 104703389A CN 201410721391 A CN201410721391 A CN 201410721391A CN 104703389 A CN104703389 A CN 104703389A
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- Prior art keywords
- resin
- fiber
- circuit board
- fibers
- cellulose
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/06—Fibrous reinforcements only
- B29C70/10—Fibrous reinforcements only characterised by the structure of fibrous reinforcements, e.g. hollow fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/024—Woven fabric
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/538—Roughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2605/00—Vehicles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Mechanical Engineering (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board, and also relates to the circuit board manufactured in such a way. In the method, firstly, a large amount of fibers, especially glass fibers are provided, and then the fibers are steeped with resin having flowing capability. The resin is then hardened to form a composite body mechanically fixed and composed of fibers and resin. The characteristics of the method are that the fibers are roughened purposely before being subjected to the steeping with the resin so as to improve mechanical connection between the fibers and the resin. The toughening can be carried out after the fibers are interlaced or woven into a mat. The fibers especially can be toughened chemically, mechanically and/or through utilization of light radiation. The circuit board can have a fiber-resin composite manufactured in such a way and an electrically conductive structure on the fiber-resin composite. Through the improved connection between the fibers and the enclosing resin, the circuit board can have raised mechanical stability and accordingly can perform a mechanical bearing function.
Description
Technical field
The present invention relates to a kind of method for the manufacture of cellulose/resin composite and especially a kind of method for the manufacture of circuit board and a kind of circuit board that can correspondingly manufacture.
Background technology
Cellulose/resin composite, is also referred to as fibrous composite sometimes, applies for different technology.It can relatively simply manufacture with very little cost and usually can withstand high mechanical load, chemical load and electric loading.
In order to manufacture cellulose/resin composite, first in general fiber such as glass fibre or carbon fiber being provided and being immersed in one afterwards and have in the resin of fluid ability.This resin surrounds fiber in the case.According to the difference of application, fiber can such as be woven into mat in advance at this or provide as the fabric (Gelege) of non-interwoven.Next the hardening of resin of encirclement fiber is made.
According to the kind of fiber, the type of resin used and the difference of the geometrical arrangements of fiber within the resin surrounded, can using cellulose/resin composite as mechanically stable, chemistry substrate (Substrat) that is corrosion resistant and that scarcely have an electrical conductivity provides.
This cellulose/resin composite is particularly suitable for manufacturing circuit board.Circuit board is typically made up of the carrier material of electric insulation or basis material, installs one or more electrical conductivity structure thereon.This electrical conductivity structure such as can be configured to layers of copper.Thickness can typically be between 10 to 300 μm, wherein, to be typically employed in common application in the scope of 20-50 μm, the thickness of such as 35 μm, and in the application with high current, be used in the thickness between 50 to 300, such as between 70 to 140 μm.Usually use Pei Dina (Pertinax) in early days as carrier material or basis material, it comprises phenolic resins.Utilize epoxy resin impregnated fiberglass packing for of today, usually requiring harsh application mostly to use, it is also with material mark FR4 or FR5(FR=" fire-retardant (flame retardant) "; German: flammenhemmend) known.
Circuit board is nowadays usually except performing the task of itself: except conduction current, also perform mechanical function more and more.Such as should be able to fix by means of circuit board or align member maybe can prevent medium.
Such as in automobile making, use circuit board, in order to construct variator control arrangement, wherein, circuit board can form one for the part of the housing of the electronic installation of variator control arrangement, it should be contained in the inside of transmission for vehicles and therefore it not only relative to the transmission oil of surrounding or such as air, chip, humidity etc. the sealing of other medium, and should should withstand huge mechanical load.
Summary of the invention
Can manufacture cellulose/resin composite in an advantageous manner by means of embodiments of the present invention, described cellulose/resin composite such as can be used as that manufacture the carrier substrates of circuit board or base substrate and have high machinery can load.Especially by means of the method proposed to manufacture cellulose/resin composite, can manufacture following circuit board based on the method here, higher mechanical load more attainable than traditional circuit board stood by described circuit board.
According to a first aspect of the invention, a kind of method for the manufacture of cellulose/resin composite is proposed.The method has: provide a large amount of fibers, fiber utilization one is had the resin-dipping of fluid ability, and this resin that hardens.The method is characterized in that, it also has: described fiber roughening as follows before impregnation, makes the roughness improving fiber.
According to a further aspect in the invention, the method for the manufacture of cellulose/resin composite proposed above may be used for manufacture one circuit board, and mode is, in the configured on surfaces electrical conductivity structure of the cellulose/resin composite correspondingly manufactured.
According to a third aspect of the invention we, a kind of circuit board is proposed, as especially manufactured by means of previously described method.This circuit board has a cellulose/resin composite, and it forms by the fiber utilizing the resin after sclerosis to surround and by the electrical conductivity structure at least one surface of this cellulose/resin composite.The feature of this circuit board is, described fiber roughening as follows, namely on the surface of described fiber an arithmetic average roughness be at least Ra >=0.1 μm, may Ra>0.2 μm or Ra>0.4 μm.
The viewpoint of embodiments of the present invention can especially be interpreted as based on knowledge described below and design.
As started explanation, circuit board nowadays in extensive application except its main task: electric current purposively conducted to a customer from a source and carry in some cases except electric components, also for applying mechanical function or preventing medium.This circuit board in principle a cellulose/resin composite being used as carrier substrates is suitable for receiving large (substanzielle) power.Utilize fibre-reinforced resin material can receive huge pulling force or pressure.Certainly observe, be exposed in the circuit board under power that is extra high or that adversely apply, there will be the resin surrounding fiber can from delamination fiber (delaminieren) and in the most severe case can be broken.Especially in a circuit board stressed perpendicular to its circuit board plane, there will be surround fiber, especially glass fibre and resin attached thereto from delamination circuit board and can be broken.At this, the parts be formed from a resin can be torn and can expose glass fibre in some cases from circuit board.So just cannot reliably perform mechanical function and sealing function again, and there will be the risk of component failure.
In order to improve one is especially vertically applied to the power in circuit board plane resistivity relative to one, can take different measures, wherein, described power is also referred to as withdrawal force sometimes.Such as can optimize a resin used for cellulose/resin composite.Such as can mix a composition in resin, it is such as form with additive, in order to affect its mechanical strength, elasticity and/or adhesion property etc., and so optimize its for the cellulose/resin composite utilized manufactured by it mechanical property important characteristic.Especially attachment between resin and fiber can be improved by adding suitable additive.
Propose according to the embodiment of the present invention, the machinery improved equally between resin and the fiber surrounded by resin keeps (Halt) and therefore improves the force-applied property of machinery of cellulose/resin composite.This can realize in the following way, namely before by fiber utilization resin-dipping, purposively changes the surface of fiber.Especially fiber roughening should purposively be made before impregnation.
Roughening can be interpreted as at this, as follows the surface of processing fiber, makes the form variations adjusting three rank and/or quadravalence.The roughness on surface can be determined according to Deutsche industry norm (DIN) DIN 4760 at this.The form variations on three rank is in the case corresponding to the roughness being form with groove (Rillen).The form variations of quadravalence is corresponding to the roughness being form with groove (Riefen), thin slice (Schuppen) and/or protuberance (Kuppen).
Caused by manufacture, the fiber as being typically processed into cellulose/resin composite has the cover of smoother.Such as embedded by glass fibre in a resinous substrates in a kind of cellulose/resin composite, in this cellulose/resin composite, glass fibre can have surface smooth especially.In order to manufacture glass fibre, from a glass melting thing, pull out thin filament at this.Because the filament that is drawn out is at least momently before glass fibre sclerosis or liquid, therefore the outer surface of glass fibre is smooth especially.Typically, glass fibre directly has the surface of arithmetic mean roughness value Ra<0.1 μm after drawing process.
This smooth glass fibre can preferably individually or bunchy continue process and such as can be woven into mat or notice during laying into fabric, attachment issue between the surface of glass fibre and the resin matrix material of encirclement may be there will be due to the smooth surface of glass fibre.Due to this limited attachment, when the high mechanical load transverse to its surface especially on the cellulose/resin composite of tabular, therefore there will be the delamination of the local between fiber and the resin of encirclement when cellulose/resin composite bends.
Therefore propose, first had in the resin of fluid ability and process as follows by being impregnated into one with the fiber manufactured by a smooth surface before continuation process, the roughness of fiber on its cover is significantly improved.
Preferably make fiber roughening as follows, make the arithmetic average roughness Ra adjusting at least 0.1 μm on the surface of described fiber.By this roughening of fiber surface, on the one hand can contact-making surface between increased fiber and resin around and therefore improve the absorption of resin on fiber.On the other hand, also can be realized by this roughening, resin is no longer merely able to be adsorbed on a smooth surface, but can also rabbet the inclination on the surface at fiber, on bending or that even side is recessed (hinterschnittenen) subregion.Therefore also there will be a kind of positive between resin after curing and the fiber of embedding.Therefore the connection between resin and the fiber of embedding can be improved widely.
According to a kind of execution mode, just fiber be interweaved into before roughening process and/or be woven into a mat.In other words, fiber in the initial state, when that is directly existing with the surface of a smoother after the fabrication, can be continued to be processed into a mat.Utilize its still smooth outer surface can by fiber easily bunchy and interweave afterwards and/or be woven into a fabric.Only have and just fiber is continued as follows to be after this processed into a mat, make to process as follows the entirety of single fiber in mat fiber in other words, that is, make the surface roughening of fiber.
Such as can make fibre chemistry ground roughening.Fiber such as can be utilized an etching solution to soak for this reason.Such as fiber can be transmitted by an etch bath.In order to make glass fibre roughening, such as, can use the etching solution be made up of formic acid or sulfuric acid.
Alternatively or additionally, fibre machinery ground roughening can be made.Such as can to fiber sandblasting or processing in the Rolling Stone bath of a motion.
As other alternative scheme or additional project, fiber can be made to carry out roughening by the radiation with light.Such as fiber can utilize laser to irradiate partly, thus makes fiber melting and to be formed in ensuing solidification with roughness be the out-of-flatness of form momently partly in its surface.
As set forth, fiber also can be made from a variety of materials in principle and provide with different geometries.Especially for the application for the manufacture of circuit board, fiber can such as provide as glass fibre.Glass fibre at this primarily of silica (SiO
x) make and be therefore electric insulation.Glass fibre can receive high pulling force.In addition, glass fibre has a favourable modulus of elasticity, thus it can easily process, and is particularly useful for being processed into mat.Glass fibre especially can have different diameters according to the difference of manufacture, wherein, is typically in the diameter in the scope of 1-100 μm.Glass fibre can provide as short fiber or long fibre.Replace glass fibre also the fiber process be made up of other material can be become a cellulose/resin composite, especially such as carbon fiber, aramid fibre, aramid fiber, different polymer fibers etc. in principle.
As resin, following resin can be used for fibre resin mixture, process under its state that first can have fluid ability one and can be hardened subsequently.Especially thermosetting plastic can be used to be used as resin.Epoxy resin is considered to particularly advantageous for manufacture cellulose/resin composite.Also such as mylar can be used as an alternative.
In order to go out to send manufacture one circuit board from the cellulose/resin composite described before, one or more electrical conductivity structure can be constructed in its surface.This conductivity structure can form printed circuit, can conduction current by printed circuit, and such as electric components can be interconnected conductively by means of printed circuit.In order to construct this electrical conductivity structure, even if spendable technology in all circuit boards traditional in manufacture substantially can be used.
It is to be noted, the possible feature and advantage of embodiments of the present invention this sometimes with reference to a kind of method for the manufacture of a cellulose/resin composite, sometimes with reference to a kind of method for the manufacture of circuit board and sometimes describe with reference to a kind of circuit board that can correspondingly manufacture.Those skilled in the art recognize that, described feature mutually can be changed by rights, replaces or combine, to reach other execution mode of the present invention.
Accompanying drawing explanation
Describe embodiments of the present invention with reference to the accompanying drawings, wherein, specification and accompanying drawing are not considered as limiting the present invention.
Fig. 1 shows the three-dimensional view with the circuit board of cellulose/resin composite according to one embodiment of the present invention;
Fig. 2 shows the vertical view with the cellulose/resin composite of the glass fibre being woven into a mat according to one embodiment of the present invention;
Fig. 3 shows the sectional view of the fiber of the roughening for cellulose/resin composite according to one embodiment of the present invention.
Accompanying drawing is only schematic and be not drawn to scale.Identical Reference numeral represents feature that is identical or phase same-action in the accompanying drawings.
Embodiment
Fig. 1 shows a kind of execution mode of circuit board 1.This circuit board 1 is also referred to as printed circuit board or PCB(Printed Circuit Board).This circuit board 1 may be used for constructing circuit.In an example shown, this circuit board 1 has a substrate having cellulose/resin composite 3 to make, and two surfaces of this substrate arrange electrical conductivity structure 9.In an example shown, electrical conductivity structure 9 is configured with the thin layers of copper of the thickness in the scope of 5-50 μm.
This cellulose/resin composite 3 forms primarily of fiber 5 and a resin 7 surrounding the sclerosis of this fiber.In an example shown, this cellulose/resin composite 3 is configured to the plastics (GfK) of glass fiber reinforcement, and wherein, glass fibre is implanted to the matrix formed by thermosetting plastic resin in other words in matrix (Matrix).Visible in vertical view as shown in Figure 2, glass fibre 5 merges bunchy 13 at this, and these bundles 13 are interweaved again, in order to form a mat 11.
In order to manufacture this cellulose/resin composite 3, first provide a large amount of fibers 5, wherein, single fiber 5 if desired can integrated bundle and can interweave afterwards or also can be woven into fabric.Fetch and fiber 5 is utilized one to have the resin 7 of fluid ability such as epoxy resin impregnated down.Resin 7 enters between adjacent fiber 5 at this or also enters into the gap between the adjacent bundle 13 formed by fiber 5.In the case, resin 7 soaks the surface of fiber 5.Next by hardening of resin, such as, by interpolation one curing agent or by introducing energy, such as, with energy that is hot or UV light form.Afterwards, form a fixing matrix under the state after curing of the resin 7 previously with fluid ability, fiber 5 is implanted in this matrix and this matrix is mechanically firm by glass fibre 5.
In order to improve the mechanical connection between glass fibre 5 and the resin 7 surrounded, by fiber 5 preferably after being processed into a mat 11, but utilizing before the resin 7 with fluid ability floods, in its surface purposively roughening.
As schematically shown in figure 3, glass fibre 5 comprises a microstructure in its surface at this, because produce a large amount of grooves, groove, thin slice and/or protuberance by the roughening process on surface first smooth after manufacturing fiber.Based on this roughness on the surface of fiber 5, its also can be understood as with fiber otherwise linear or smooth three rank of cover or the form variations of quadravalence, obviously can improve the mechanical connection between fiber 5 and the resin 7 surrounded.
Fiber 5 in order to roughening can such as chemically, mechanically and/or by utilizing the radiation of light to process.Described roughening can carry out as follows at this, namely realizes one more than the arithmetic average roughness Ra of 0.1 μm.
This arithmetic average roughness Ra can be interpreted as the numerical value of the coordinate figure z of the roughness curve within a single measuring distance l at this.Therefore it represent the average deviation of this curve and a mean linear 15.Single measuring distance l can sizing like this at this, makes to there is a large amount of out-of-flatnesses or form variations within this single measuring distance, thus can calculate a statistical arithmetic mean.This arithmetic mean roughness value Ra can be calculated to be at this
。
This cellulose/resin composite 3 utilizing the fiber of roughening to be formed can be particularly useful for manufacturing circuit board 1, and described circuit board should adapter mechanical function, and wherein, the electrical characteristics of circuit board can not be influenced by the optimization of fiber surface.
Claims (10)
1., for the manufacture of the method for cellulose/resin composite (3), have:
A large amount of fibers (5) is provided;
A resin (7) with fluid ability is utilized by described fiber (5) to flood;
Harden described resin (7);
It is characterized in that, described method also has:
Make described fiber (5) roughening before impregnation as follows, make the roughness improving described fiber (5).
2. in accordance with the method for claim 1, wherein, make described fiber (5) roughening as follows, make the arithmetic average roughness Ra adjusting at least 0.1 μm on the surface of described fiber (5).
3. according to the method described in claim 1 or 2, wherein, described fiber (5) is interweaved into and/or is woven into a mat (11) between roughening.
4. according to the method according to any one of claims 1 to 3, wherein, described fiber (5) is by chemically roughening.
5. according to the method according to any one of Claims 1-4, wherein, described fiber (5) is by mechanically roughening.
6. according to the method according to any one of claim 1 to 5, wherein, described fiber (5) carrys out roughening by utilizing the radiation of light.
7. according to the method according to any one of claim 1 to 6, wherein, described fiber (5) is glass fibre and/or wherein, and described resin (7) is thermosetting plastic, especially epoxy resin.
8., for the manufacture of the method for circuit board (1), have:
A cellulose/resin composite (3) is manufactured according to any one of claim 1 to 7;
In at least one configured on surfaces electrical conductivity structure (9) of described cellulose/resin composite (3).
9. circuit board (1), has:
One cellulose/resin composite (3) be made up of the fiber (5) utilizing the resin (7) after hardening to surround,
Electrical conductivity structure (9) at least one surface of described cellulose/resin composite (3),
It is characterized in that, described fiber (5) roughening as follows, make the arithmetic average roughness Ra of appearance one at least 0.1 μm on the surface of described fiber (5).
10. according to circuit board according to claim 9, wherein, described fiber (5) is glass fibre and/or wherein, and described resin (7) is thermosetting plastic, especially epoxy resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013224840.7 | 2013-12-04 | ||
| DE102013224840.7A DE102013224840A1 (en) | 2013-12-04 | 2013-12-04 | Process for producing a fiber-resin composite, in particular for manufacturing a printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104703389A true CN104703389A (en) | 2015-06-10 |
Family
ID=53185075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410721391.6A Pending CN104703389A (en) | 2013-12-04 | 2014-12-03 | A method for manufacturing a fiber-resin composite, especially for manufacturing a circuit board |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN104703389A (en) |
| DE (1) | DE102013224840A1 (en) |
| TW (1) | TW201525030A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110142986A (en) * | 2019-03-25 | 2019-08-20 | 山东斯福特实业有限公司 | A kind of surface frosted thermosetting property composite fibre muscle molding machine and technique |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02234492A (en) * | 1989-03-07 | 1990-09-17 | Fujitsu Ltd | Manufacture of printed board |
| CN102209805A (en) * | 2008-12-26 | 2011-10-05 | 东洋纺织株式会社 | Surface-modified fiber and process for producing same |
| CN102775071A (en) * | 2011-05-09 | 2012-11-14 | 代芳 | Manufacture technology for surface-coarsened glass fiber |
-
2013
- 2013-12-04 DE DE102013224840.7A patent/DE102013224840A1/en not_active Withdrawn
-
2014
- 2014-12-02 TW TW103141705A patent/TW201525030A/en unknown
- 2014-12-03 CN CN201410721391.6A patent/CN104703389A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02234492A (en) * | 1989-03-07 | 1990-09-17 | Fujitsu Ltd | Manufacture of printed board |
| CN102209805A (en) * | 2008-12-26 | 2011-10-05 | 东洋纺织株式会社 | Surface-modified fiber and process for producing same |
| CN102775071A (en) * | 2011-05-09 | 2012-11-14 | 代芳 | Manufacture technology for surface-coarsened glass fiber |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110142986A (en) * | 2019-03-25 | 2019-08-20 | 山东斯福特实业有限公司 | A kind of surface frosted thermosetting property composite fibre muscle molding machine and technique |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201525030A (en) | 2015-07-01 |
| DE102013224840A1 (en) | 2015-06-11 |
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Application publication date: 20150610 |