JPH0223022Y2 - - Google Patents
Info
- Publication number
- JPH0223022Y2 JPH0223022Y2 JP1983156086U JP15608683U JPH0223022Y2 JP H0223022 Y2 JPH0223022 Y2 JP H0223022Y2 JP 1983156086 U JP1983156086 U JP 1983156086U JP 15608683 U JP15608683 U JP 15608683U JP H0223022 Y2 JPH0223022 Y2 JP H0223022Y2
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- metal casing
- mounting board
- view
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 24
- 230000037431 insertion Effects 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 238000005476 soldering Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Casings For Electric Apparatus (AREA)
- Structure Of Receivers (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15608683U JPS6064645U (ja) | 1983-10-11 | 1983-10-11 | 電子部品の金属筐体 |
GB08423472A GB2148055B (en) | 1983-10-11 | 1984-09-17 | Metallic casing for electronic parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15608683U JPS6064645U (ja) | 1983-10-11 | 1983-10-11 | 電子部品の金属筐体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6064645U JPS6064645U (ja) | 1985-05-08 |
JPH0223022Y2 true JPH0223022Y2 (cs) | 1990-06-21 |
Family
ID=15619991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15608683U Granted JPS6064645U (ja) | 1983-10-11 | 1983-10-11 | 電子部品の金属筐体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS6064645U (cs) |
GB (1) | GB2148055B (cs) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4626963A (en) * | 1985-02-28 | 1986-12-02 | Rca Corporation | Wave solderable RF shield member for a printed circuit board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041743U (cs) * | 1990-04-19 | 1992-01-08 |
-
1983
- 1983-10-11 JP JP15608683U patent/JPS6064645U/ja active Granted
-
1984
- 1984-09-17 GB GB08423472A patent/GB2148055B/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH041743U (cs) * | 1990-04-19 | 1992-01-08 |
Also Published As
Publication number | Publication date |
---|---|
GB2148055A (en) | 1985-05-22 |
JPS6064645U (ja) | 1985-05-08 |
GB8423472D0 (en) | 1984-10-24 |
GB2148055B (en) | 1988-01-20 |
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