JPH02226610A - Anisotropic conductive binder and bonding of electronic parts using this binder - Google Patents
Anisotropic conductive binder and bonding of electronic parts using this binderInfo
- Publication number
- JPH02226610A JPH02226610A JP1044258A JP4425889A JPH02226610A JP H02226610 A JPH02226610 A JP H02226610A JP 1044258 A JP1044258 A JP 1044258A JP 4425889 A JP4425889 A JP 4425889A JP H02226610 A JPH02226610 A JP H02226610A
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- binder
- conductive adhesive
- conductive filler
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011230 binding agent Substances 0.000 title claims abstract 6
- 239000011231 conductive filler Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 17
- 239000007769 metal material Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims description 31
- 239000000853 adhesive Substances 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 20
- 229910052751 metal Inorganic materials 0.000 abstract description 20
- 239000004065 semiconductor Substances 0.000 abstract description 18
- 239000000758 substrate Substances 0.000 abstract description 6
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001000 nickel titanium Inorganic materials 0.000 abstract description 2
- 229910017535 Cu-Al-Ni Inorganic materials 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 230000008602 contraction Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910007610 Zn—Sn Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
Landscapes
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は異方性導電接着剤とそれを用いた電子部品の接
続方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an anisotropic conductive adhesive and a method for connecting electronic components using the same.
（従来の技術）
従来の異方性導電接着剤を用いた電子部品の接続方法を
説明するための半導体素子接続方法の概略構造を第３〜
５図に示す。図中の１は半導体素子、２は金属バンプ、
３は配線基板、４は配線基板３に設けられた電極、５は
異方性導電接着剤。(Prior Art) To explain the conventional method of connecting electronic components using an anisotropic conductive adhesive, a schematic structure of a semiconductor element connecting method is described in the third to
It is shown in Figure 5. In the figure, 1 is a semiconductor element, 2 is a metal bump,
3 is a wiring board, 4 is an electrode provided on the wiring board 3, and 5 is an anisotropic conductive adhesive.
６は異方性導電接着剤を構成する導電性フィラー７は異
方性導電接着剤を構成する樹脂である。6 is a conductive filler that constitutes an anisotropic conductive adhesive; 7 is a resin that constitutes an anisotropic conductive adhesive.
これまでの半導体素子接続方法では、異方性導電接着剤
５としては、炭素粉若しくは繊維、ニッケル粒やはんだ
粒による導電性フィラー６と、接着性を有する熱可塑性
樹脂や熱硬化性樹脂等の樹脂７により構成されたものが
用いられている。前記導電性フィラーは樹脂と良く混練
され分散した状態になっている。この異方性導電接着剤
を介して半導体素子１の金属バンプ２と配線基板３の電
極４をアライメントし、熱圧着ツール（図示せず）で半
導体素子１の裏面より加圧、加熱して半導体素子１を配
線基板３に押し付け、半導体素子１の金属バンプ２と配
線基ｖｉ３の電極４を電気的に接続している。In the conventional semiconductor element connection method, the anisotropic conductive adhesive 5 includes a conductive filler 6 made of carbon powder or fibers, nickel grains, or solder grains, and a thermoplastic resin or thermosetting resin having adhesive properties. A structure made of resin 7 is used. The conductive filler is well kneaded and dispersed with the resin. The metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board 3 are aligned through this anisotropic conductive adhesive, and the semiconductor element 1 is pressed and heated from the back side using a thermocompression bonding tool (not shown). The element 1 is pressed against the wiring board 3, and the metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board vi3 are electrically connected.
しかしながら、この接続方法では異方性導電接着剤５の
樹脂７の熱膨張係数が導電性フィラー６の熱膨張係数に
比べて大きいため、環境温度が低下した場合には第４図
に示すように、合成樹脂７は収縮し導電性フィラー６は
この収縮応力により押し潰され塑性変形を生じる。又、
環境温度が上昇した場合には第５図に示すように、導電
性フィラー６の熱膨張が樹脂７の熱膨張に追従できずに
半導体素子１の金属バンブ２と配線基板３の電極４と導
電性フィラー６との間に隙間を生じる。この温度変化が
繰り返されることにより、半導体素子１の金属バンブ２
と配線基板３の電極４との間の接続不良を生じるため、
電気的接続の信頼性に欠けるという問題点があった。However, in this connection method, the coefficient of thermal expansion of the resin 7 of the anisotropic conductive adhesive 5 is larger than that of the conductive filler 6, so when the environmental temperature decreases, as shown in FIG. , the synthetic resin 7 contracts, and the conductive filler 6 is crushed by this contraction stress, resulting in plastic deformation. or,
When the environmental temperature rises, as shown in FIG. 5, the thermal expansion of the conductive filler 6 cannot follow the thermal expansion of the resin 7, and the metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board 3 become conductive. A gap is created between the body and the sexual filler 6. By repeating this temperature change, the metal bumps 2 of the semiconductor element 1
This will cause a connection failure between the electrode 4 of the wiring board 3 and the wiring board 3.
There was a problem in that the electrical connection was unreliable.
（発明が解決しようとする課題）
本発明は上記に述べた問題点を解消するためになされた
もので、異方性導電接着剤を構成する樹脂の大きな熱膨
張係数に対しても被接続電極間に隙間を生じさせること
なく、電子部品の接続において電気的接続の信頼性が高
く、しかも安価な接続が得られる異方性導電接着剤とそ
の接続方法を提供するものである。(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-mentioned problems. An object of the present invention is to provide an anisotropic conductive adhesive and a method for connecting electronic components, which can provide highly reliable electrical connections at low cost without creating gaps between them.
（課題を解決するための手段）
本発明では、上記課題を解決するために異方性導電接着
剤の導電性フィラーに超弾性金属を用いるようにしたも
のであり、又、前記異方性導電接着剤を介在させて電子
部品と配線基板を加圧、加熱して前記電子部品と配線基
板の各々の電極を電気的に接続し固定するようにしたも
のである。(Means for Solving the Problems) In the present invention, in order to solve the above problems, a superelastic metal is used as the conductive filler of the anisotropic conductive adhesive, and The electronic component and the wiring board are pressurized and heated using an adhesive to electrically connect and fix the respective electrodes of the electronic component and the wiring board.
この超弾性金属材料としては、例えばＮｉ−Ｔｉ。Examples of this superelastic metal material include Ni-Ti.
Ｃｕ−１’Ｊ−Ｎｉ、 Ａｕ−Ｃｄ、 Ａｇ−Ｃｄ、
Ｃｕ−Ｚｎ−１’Ｊ、 Ｃｕ −Ｚｎ−Ｓｎ＋ Ｃｕ−
５ｎ＊ Ｆｅ−Ｐｔ、 Ｆｅ−Ｐｄ、 Ｉｎ −ＴｌＮ
ｉ”ｊＶ等が用いられ、弾性歪みとして０．５％以上の
伸びを示す超弾性金属材料を使用することが望ましい。Cu-1'J-Ni, Au-Cd, Ag-Cd,
Cu-Zn-1'J, Cu-Zn-Sn+ Cu-
5n* Fe-Pt, Fe-Pd, In-TlN
i''jV, etc., and it is desirable to use a superelastic metal material that exhibits elongation of 0.5% or more as elastic strain.
（作 用）
前述の導電性フィラーとして超弾性金属を用いた異方性
導電接着剤により電子部品の接続を行えば、温度変化に
よる異方性導電接着剤を構成する樹脂の膨張、収縮の熱
歪みを超弾性金属が受け、繰り返しの歪みに対しても弾
性範囲で変形を繰り返すことにより柔軟に対応でき、電
気的接続の信頼性向上を図ることができる。(Function) If electronic components are connected using an anisotropic conductive adhesive using a superelastic metal as the conductive filler described above, the heat generated by the expansion and contraction of the resin constituting the anisotropic conductive adhesive due to temperature changes will be reduced. The superelastic metal receives strain and can flexibly respond to repeated strain by repeating deformation within the elastic range, thereby improving the reliability of electrical connections.
以下、本発明の実施例について、図面を用いて具体的に
説明する。Embodiments of the present invention will be specifically described below with reference to the drawings.
（実施例）
実施例１
第１図は本発明の実施例１を示すための半導体素子接続
構造の断面図である。第１図において、１１は半導体素
子、１２は金属バンブ、１３はアルミナ基板、１４はア
ルミナ基板上の電極、１５は異方性導電接着剤、１６は
異方性導電接着剤１５を構成する導電性フィラーの超弾
性金属、１７は異方性導電接着剤１５を構成する樹脂で
ある。(Example) Example 1 FIG. 1 is a sectional view of a semiconductor element connection structure to show Example 1 of the present invention. In FIG. 1, 11 is a semiconductor element, 12 is a metal bump, 13 is an alumina substrate, 14 is an electrode on the alumina substrate, 15 is an anisotropic conductive adhesive, and 16 is a conductive material constituting the anisotropic conductive adhesive 15. The superelastic metal 17 as a filler is a resin constituting the anisotropic conductive adhesive 15.
異方性導電接着剤１５は、平均粒径２ＯｎのＴｉ５０．
５ ａｔＸ Ｎｉ（弾性歪み８％）粒に金めつきを施し
た超弾性導電性フィラー１６を１０重量部と樹脂１７と
してエポキシ系樹脂を９０重量部混練したものである。The anisotropic conductive adhesive 15 is Ti50.0 with an average particle size of 2 On.
5 atX 10 parts by weight of superelastic conductive filler 16, which is gold-plated Ni (elastic strain 8%) grains, and 90 parts by weight of epoxy resin as resin 17 were kneaded.
半導体素子接続を行うには、前記異方性導電接着剤１５
をアルミナ基板１３上に塗布し、前記アルミナ基板１３
上の電極１４と半導体素子１１の金属バンブ１２を位置
合わせする。この後半導体素子１１の裏面より熱圧着プ
レス（図示せず）で３ ｋｇ／ｃｉｉの圧力と１８０°
Ｃの温度で加圧、加熱を行い、樹脂１７を硬化した。In order to connect semiconductor elements, the anisotropic conductive adhesive 15
is applied onto the alumina substrate 13, and the alumina substrate 13
The upper electrode 14 and the metal bump 12 of the semiconductor element 11 are aligned. After that, a thermocompression press (not shown) is applied from the back side of the semiconductor element 11 to a pressure of 3 kg/cii and an angle of 180°.
The resin 17 was cured by applying pressure and heating at a temperature of C.
上記の半導体素子接続方法により、総ての金属バンブ１
２と電極１４は電気的接続が得られ、０〜１５０°Ｃ，
１０００回の温度サイクル試験においても断線すること
なく良好な接続信頼性を示した。By the above semiconductor element connection method, all metal bumps 1
2 and the electrode 14 are electrically connected, and the temperature is 0 to 150°C,
Even in a temperature cycle test of 1000 times, it showed good connection reliability without any disconnection.
実施例２
第２図は本発明の実施例２を示すための配線基板間の接
続構造の断面図である。第２図において、２１はフレキ
シブル配線基板、２２はフレキシブル配線基板上の電極
、２３はリジット配線基板。Embodiment 2 FIG. 2 is a sectional view of a connection structure between wiring boards to show Embodiment 2 of the present invention. In FIG. 2, 21 is a flexible wiring board, 22 is an electrode on the flexible wiring board, and 23 is a rigid wiring board.
２４はリジッド配線基板上の電極、２５は異方性導電接
着剤、２６は異方性導電接着剤２５を構成する導電性フ
ィラーの超弾性金属、２７は異方性導電接着剤２５を構
成する樹脂である。24 is an electrode on the rigid wiring board, 25 is an anisotropic conductive adhesive, 26 is a superelastic metal as a conductive filler constituting the anisotropic conductive adhesive 25, and 27 is an anisotropic conductive adhesive 25. It is resin.
異方性導電接着剤２５は、平均粒径２０ｎのＣｕ３４．
７ ｗｔＸＺｎ −３，ＯｗｔＸ Ｓｎ （弾性歪み２
％）粒に金めつきを施した超弾性導電性フィラー２６を
１０重量部と樹脂２７としてエポキシ系樹脂を９０重量
部混練したものである。The anisotropic conductive adhesive 25 is Cu34.
7 wtXZn -3, OwtX Sn (elastic strain 2
%) 10 parts by weight of superelastic conductive filler 26 whose particles are plated with gold and 90 parts by weight of epoxy resin as resin 27 are kneaded.
配線基板間の接続を行うには、前記異方性導電接着剤２
５をリジット配線基板２３の所定の箇所に塗布し、前記
リジット配線基板２３上の電極２４とフレキシブル配線
基板２１の電極２２を位置合わせする。この後フレキシ
ブル配線基板２１の裏面より熱圧着プレス（図示せず）
で３ ｋｇ ／ ｃｄの圧力と１８０°Ｃの温度で加圧
、加熱を行い、樹脂２７を硬化した。In order to connect between wiring boards, the anisotropic conductive adhesive 2
5 is applied to a predetermined location on the rigid wiring board 23, and the electrodes 24 on the rigid wiring board 23 and the electrodes 22 on the flexible wiring board 21 are aligned. After this, thermocompression press (not shown) is applied from the back side of the flexible wiring board 21.
The resin 27 was cured by applying pressure and heating at a pressure of 3 kg/cd and a temperature of 180°C.
上記の配線基板間の接続方法により、各々の配線基板の
総ての電極２２と２４は電気的接続が得られ、０〜１５
０°Ｃ，１０００回の温度サイクル試験においても断線
することなく良好な接続信頼性を示した。By the above connection method between wiring boards, all the electrodes 22 and 24 of each wiring board can be electrically connected, and 0 to 15
Even in a temperature cycle test of 1000 times at 0°C, there was no disconnection and good connection reliability was demonstrated.
（発明の効果）
以上述べた本発明の超弾性金属を導電性フィラーとした
異方性導電接着剤を介して電子部品と配線基板の接続を
行えば、異方性導電接着剤を構成する樹脂が大きな熱膨
張係数を有していて、周囲の温度変化で膨張、収縮の歪
みが生じても超弾性金属が弾性範囲で変形し応力を吸収
するので、電子部品の電気的接続の信鎖性向上が図れ、
かつ安価な接続を行うことができる。(Effects of the Invention) If electronic components and wiring boards are connected via the anisotropic conductive adhesive containing the superelastic metal of the present invention as a conductive filler, the resin constituting the anisotropic conductive adhesive has a large coefficient of thermal expansion, and even if the strain of expansion and contraction occurs due to changes in the surrounding temperature, the superelastic metal deforms within its elastic range and absorbs the stress, which improves the reliability of electrical connections in electronic components. Improve,
Moreover, the connection can be made at low cost.
第１図及び第２図はそれぞれ本発明に係わる異方性導電
接着剤を用いた電子部品の接続方法を説明するための半
導体素子接続構造、配線基板間の接続構造の断面図、第
３図〜第５図は従来の異方性導電接着剤を用いた半導体
素子接続構造の断面図である。
１．１１・・・半導体素子、２．１２・・・金属バンプ
、３．１３・・・基板、４，１４，２２．２４・・・電
極、５．１５．２５・・・異方性導電接着剤、６・・・
導電性フィラー、７，１７．２７・・・樹脂、１６．２
６・・・超弾性金属による導電性フィラー ２１・・・
フレキシブル配線基板、２３・・・リジット配線基板。
第３図
第４図
第５図1 and 2 are cross-sectional views of a semiconductor element connection structure and a connection structure between wiring boards, respectively, for explaining a method of connecting electronic components using an anisotropic conductive adhesive according to the present invention, and FIG. 5 is a sectional view of a semiconductor element connection structure using a conventional anisotropic conductive adhesive. 1.11... Semiconductor element, 2.12... Metal bump, 3.13... Substrate, 4, 14, 22.24... Electrode, 5.15.25... Anisotropic conduction Adhesive, 6...
Conductive filler, 7, 17.27... Resin, 16.2
6... Conductive filler made of superelastic metal 21...
Flexible wiring board, 23... Rigid wiring board. Figure 3 Figure 4 Figure 5
Claims (2)
分散させた異方性導電接着剤において、導電性フィラー
に超弾性金属材料を用いたことを特徴とする異方性導電
接着剤。(1) An anisotropic conductive adhesive in which a conductive filler is dispersed in a binder made of resin, characterized in that a superelastic metal material is used as the conductive filler.
を挟み、加圧，加熱により前記電子部品の電極間を電気
的に接続することを特徴とする電子部品の接続方法。(2) A method for connecting electronic components, comprising sandwiching the anisotropic conductive adhesive according to claim 1 between electronic components, and electrically connecting electrodes of the electronic components by applying pressure and heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044258A JPH02226610A (en) | 1989-02-25 | 1989-02-25 | Anisotropic conductive binder and bonding of electronic parts using this binder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044258A JPH02226610A (en) | 1989-02-25 | 1989-02-25 | Anisotropic conductive binder and bonding of electronic parts using this binder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02226610A true JPH02226610A (en) | 1990-09-10 |
Family
ID=12686492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1044258A Pending JPH02226610A (en) | 1989-02-25 | 1989-02-25 | Anisotropic conductive binder and bonding of electronic parts using this binder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02226610A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0638276U (en) * | 1992-10-23 | 1994-05-20 | 松下電器産業株式会社 | Thermocompression bonding device |
| JPH08102218A (en) * | 1994-09-30 | 1996-04-16 | Nec Corp | Anisotropic conductive film |
| US6482676B2 (en) | 1997-01-09 | 2002-11-19 | Fujitsu Limited | Method of mounting semiconductor chip part on substrate |
| JP2007208568A (en) * | 2006-01-31 | 2007-08-16 | Nippon Dempa Kogyo Co Ltd | Surface-mounted crystal oscillator |
| JP2011108748A (en) * | 2009-11-13 | 2011-06-02 | Citizen Electronics Co Ltd | Led light emitting device and method of manufacturing led light emitting device |
| JP2012023067A (en) * | 2010-07-12 | 2012-02-02 | Panasonic Corp | Electronic component packaging method |
| WO2014132979A1 (en) * | 2013-02-27 | 2014-09-04 | 日亜化学工業株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
-
1989
- 1989-02-25 JP JP1044258A patent/JPH02226610A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0638276U (en) * | 1992-10-23 | 1994-05-20 | 松下電器産業株式会社 | Thermocompression bonding device |
| JPH08102218A (en) * | 1994-09-30 | 1996-04-16 | Nec Corp | Anisotropic conductive film |
| US6482676B2 (en) | 1997-01-09 | 2002-11-19 | Fujitsu Limited | Method of mounting semiconductor chip part on substrate |
| JP2007208568A (en) * | 2006-01-31 | 2007-08-16 | Nippon Dempa Kogyo Co Ltd | Surface-mounted crystal oscillator |
| JP2011108748A (en) * | 2009-11-13 | 2011-06-02 | Citizen Electronics Co Ltd | Led light emitting device and method of manufacturing led light emitting device |
| JP2012023067A (en) * | 2010-07-12 | 2012-02-02 | Panasonic Corp | Electronic component packaging method |
| WO2014132979A1 (en) * | 2013-02-27 | 2014-09-04 | 日亜化学工業株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
| CN105009314A (en) * | 2013-02-27 | 2015-10-28 | 日亚化学工业株式会社 | Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements |
| JPWO2014132979A1 (en) * | 2013-02-27 | 2017-02-02 | 日亜化学工業株式会社 | Light emitting device, light emitting element mounting method, and light emitting element mounting apparatus |
| US9955619B2 (en) | 2013-02-27 | 2018-04-24 | Nichia Corporation | Light emitting device, light emitting element mounting method, and light emitting element mounter |
| CN105009314B (en) * | 2013-02-27 | 2019-11-05 | 日亚化学工业株式会社 | Light emitting device, light-emitting component installation method and light-emitting component mounting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS61173471A (en) | Heat compressed connector | |
| KR100476488B1 (en) | Wire segment based interposer for high frequency electrical connection | |
| US5759047A (en) | Flexible circuitized interposer with apertured member and method for making same | |
| JPH04332404A (en) | Anisotropic conductive material and connection of integrated circuit element using it | |
| JP3738655B2 (en) | Anisotropic conductive adhesive material and connection method | |
| EP3590133B1 (en) | Flexible conductive bonding | |
| JPH02226610A (en) | Anisotropic conductive binder and bonding of electronic parts using this binder | |
| JP2008186843A (en) | Junction structure of flexible substrate | |
| JP2932185B2 (en) | Anisotropic conductive sheet and method for connecting electronic components using the same | |
| JP2010251336A (en) | Anisotropic conductive film and method for manufacturing connection structure using the same | |
| JP2004319703A (en) | Electrode connection structure of rigid substrate and flexible substrate | |
| EP2395822A1 (en) | Mounting structure, electronic component, circuit board, board assembly, electronic device, and stress relaxation member | |
| JP2006032412A (en) | Elastic conductive adhesive and inter-electrode connection structure | |
| JP3458707B2 (en) | Mounting unit | |
| US20100123258A1 (en) | Low Temperature Board Level Assembly Using Anisotropically Conductive Materials | |
| JP3438583B2 (en) | Anisotropic conductive film connection method | |
| JP2001274197A (en) | Semiconductor device and method of manufacturing the same | |
| JPS63110506A (en) | Anisotropic conducting sheet | |
| KR20050025181A (en) | Rfid tag | |
| CN111987066A (en) | Chip packaging module and electronic equipment | |
| JP4378788B2 (en) | IC chip connection method | |
| JPH10242616A (en) | Ic package and circuit board using it | |
| JPH03209831A (en) | Semiconductor device | |
| JPH0636613A (en) | Joint material for electronic parts and electronic equipment using the material | |
| JP6695409B2 (en) | Electronic component, connecting body, manufacturing method of connecting body, and connecting method of electronic component |