JPH02226610A - Anisotropic conductive binder and bonding of electronic parts using this binder - Google Patents

Anisotropic conductive binder and bonding of electronic parts using this binder

Info

Publication number
JPH02226610A
JPH02226610A JP1044258A JP4425889A JPH02226610A JP H02226610 A JPH02226610 A JP H02226610A JP 1044258 A JP1044258 A JP 1044258A JP 4425889 A JP4425889 A JP 4425889A JP H02226610 A JPH02226610 A JP H02226610A
Authority
JP
Japan
Prior art keywords
anisotropic conductive
binder
conductive adhesive
conductive filler
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1044258A
Other languages
Japanese (ja)
Inventor
Takahide Ono
恭秀 大野
Hiroaki Otsuka
広明 大塚
Yoshio Ozeki
大関 芳雄
Keisuke Watanabe
敬介 渡辺
Takashi Kanamori
孝史 金森
Yasuo Iguchi
泰男 井口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Oki Electric Industry Co Ltd
Original Assignee
Nippon Steel Corp
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Corp, Oki Electric Industry Co Ltd filed Critical Nippon Steel Corp
Priority to JP1044258A priority Critical patent/JPH02226610A/en
Publication of JPH02226610A publication Critical patent/JPH02226610A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Conductive Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent generation of failure in electric connection due to repeated change in temperature by using an ultra-elastic metal for a conductive filler. CONSTITUTION:An anisotropy conductive binder 15 laid between a substrate 13 and an electrode 14, a metal bump 12 of a semiconductor device 11 is welded with pressure and thermal-fused. The anisotropy conductive binder is available when a conductive filler 16 composed of an ultra-elastic metal is added in a resin 17. The binder part, alternately expanded and contracted by the repetition of change in temperature, the deformation is confined within the elastic range of the conductive filler 16, and failure in electric connection does not occur. As the ultra-elastic metal material, for example, Ni-Ti, Cu-Al-Ni, etc., are used, and those of elastic distortion of not less than 0.5% are ideal.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は異方性導電接着剤とそれを用いた電子部品の接
続方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an anisotropic conductive adhesive and a method for connecting electronic components using the same.

(従来の技術) 従来の異方性導電接着剤を用いた電子部品の接続方法を
説明するための半導体素子接続方法の概略構造を第3〜
5図に示す。図中の1は半導体素子、2は金属バンプ、
3は配線基板、4は配線基板3に設けられた電極、5は
異方性導電接着剤。
(Prior Art) To explain the conventional method of connecting electronic components using an anisotropic conductive adhesive, a schematic structure of a semiconductor element connecting method is described in the third to
It is shown in Figure 5. In the figure, 1 is a semiconductor element, 2 is a metal bump,
3 is a wiring board, 4 is an electrode provided on the wiring board 3, and 5 is an anisotropic conductive adhesive.

6は異方性導電接着剤を構成する導電性フィラー7は異
方性導電接着剤を構成する樹脂である。
6 is a conductive filler that constitutes an anisotropic conductive adhesive; 7 is a resin that constitutes an anisotropic conductive adhesive.

これまでの半導体素子接続方法では、異方性導電接着剤
5としては、炭素粉若しくは繊維、ニッケル粒やはんだ
粒による導電性フィラー6と、接着性を有する熱可塑性
樹脂や熱硬化性樹脂等の樹脂7により構成されたものが
用いられている。前記導電性フィラーは樹脂と良く混練
され分散した状態になっている。この異方性導電接着剤
を介して半導体素子1の金属バンプ2と配線基板3の電
極4をアライメントし、熱圧着ツール(図示せず)で半
導体素子1の裏面より加圧、加熱して半導体素子1を配
線基板3に押し付け、半導体素子1の金属バンプ2と配
線基vi3の電極4を電気的に接続している。
In the conventional semiconductor element connection method, the anisotropic conductive adhesive 5 includes a conductive filler 6 made of carbon powder or fibers, nickel grains, or solder grains, and a thermoplastic resin or thermosetting resin having adhesive properties. A structure made of resin 7 is used. The conductive filler is well kneaded and dispersed with the resin. The metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board 3 are aligned through this anisotropic conductive adhesive, and the semiconductor element 1 is pressed and heated from the back side using a thermocompression bonding tool (not shown). The element 1 is pressed against the wiring board 3, and the metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board vi3 are electrically connected.

しかしながら、この接続方法では異方性導電接着剤5の
樹脂7の熱膨張係数が導電性フィラー6の熱膨張係数に
比べて大きいため、環境温度が低下した場合には第4図
に示すように、合成樹脂7は収縮し導電性フィラー6は
この収縮応力により押し潰され塑性変形を生じる。又、
環境温度が上昇した場合には第5図に示すように、導電
性フィラー6の熱膨張が樹脂7の熱膨張に追従できずに
半導体素子1の金属バンブ2と配線基板3の電極4と導
電性フィラー6との間に隙間を生じる。この温度変化が
繰り返されることにより、半導体素子1の金属バンブ2
と配線基板3の電極4との間の接続不良を生じるため、
電気的接続の信頼性に欠けるという問題点があった。
However, in this connection method, the coefficient of thermal expansion of the resin 7 of the anisotropic conductive adhesive 5 is larger than that of the conductive filler 6, so when the environmental temperature decreases, as shown in FIG. , the synthetic resin 7 contracts, and the conductive filler 6 is crushed by this contraction stress, resulting in plastic deformation. or,
When the environmental temperature rises, as shown in FIG. 5, the thermal expansion of the conductive filler 6 cannot follow the thermal expansion of the resin 7, and the metal bumps 2 of the semiconductor element 1 and the electrodes 4 of the wiring board 3 become conductive. A gap is created between the body and the sexual filler 6. By repeating this temperature change, the metal bumps 2 of the semiconductor element 1
This will cause a connection failure between the electrode 4 of the wiring board 3 and the wiring board 3.
There was a problem in that the electrical connection was unreliable.

(発明が解決しようとする課題) 本発明は上記に述べた問題点を解消するためになされた
もので、異方性導電接着剤を構成する樹脂の大きな熱膨
張係数に対しても被接続電極間に隙間を生じさせること
なく、電子部品の接続において電気的接続の信頼性が高
く、しかも安価な接続が得られる異方性導電接着剤とそ
の接続方法を提供するものである。
(Problems to be Solved by the Invention) The present invention has been made in order to solve the above-mentioned problems. An object of the present invention is to provide an anisotropic conductive adhesive and a method for connecting electronic components, which can provide highly reliable electrical connections at low cost without creating gaps between them.

(課題を解決するための手段) 本発明では、上記課題を解決するために異方性導電接着
剤の導電性フィラーに超弾性金属を用いるようにしたも
のであり、又、前記異方性導電接着剤を介在させて電子
部品と配線基板を加圧、加熱して前記電子部品と配線基
板の各々の電極を電気的に接続し固定するようにしたも
のである。
(Means for Solving the Problems) In the present invention, in order to solve the above problems, a superelastic metal is used as the conductive filler of the anisotropic conductive adhesive, and The electronic component and the wiring board are pressurized and heated using an adhesive to electrically connect and fix the respective electrodes of the electronic component and the wiring board.

この超弾性金属材料としては、例えばNi−Ti。Examples of this superelastic metal material include Ni-Ti.

Cu−1’J−Ni、 Au−Cd、 Ag−Cd、 
Cu−Zn−1’J、 Cu −Zn−Sn+ Cu−
5n* Fe−Pt、 Fe−Pd、 In −TlN
i”jV等が用いられ、弾性歪みとして0.5%以上の
伸びを示す超弾性金属材料を使用することが望ましい。
Cu-1'J-Ni, Au-Cd, Ag-Cd,
Cu-Zn-1'J, Cu-Zn-Sn+ Cu-
5n* Fe-Pt, Fe-Pd, In-TlN
i''jV, etc., and it is desirable to use a superelastic metal material that exhibits elongation of 0.5% or more as elastic strain.

(作 用) 前述の導電性フィラーとして超弾性金属を用いた異方性
導電接着剤により電子部品の接続を行えば、温度変化に
よる異方性導電接着剤を構成する樹脂の膨張、収縮の熱
歪みを超弾性金属が受け、繰り返しの歪みに対しても弾
性範囲で変形を繰り返すことにより柔軟に対応でき、電
気的接続の信頼性向上を図ることができる。
(Function) If electronic components are connected using an anisotropic conductive adhesive using a superelastic metal as the conductive filler described above, the heat generated by the expansion and contraction of the resin constituting the anisotropic conductive adhesive due to temperature changes will be reduced. The superelastic metal receives strain and can flexibly respond to repeated strain by repeating deformation within the elastic range, thereby improving the reliability of electrical connections.

以下、本発明の実施例について、図面を用いて具体的に
説明する。
Embodiments of the present invention will be specifically described below with reference to the drawings.

(実施例) 実施例1 第1図は本発明の実施例1を示すための半導体素子接続
構造の断面図である。第1図において、11は半導体素
子、12は金属バンブ、13はアルミナ基板、14はア
ルミナ基板上の電極、15は異方性導電接着剤、16は
異方性導電接着剤15を構成する導電性フィラーの超弾
性金属、17は異方性導電接着剤15を構成する樹脂で
ある。
(Example) Example 1 FIG. 1 is a sectional view of a semiconductor element connection structure to show Example 1 of the present invention. In FIG. 1, 11 is a semiconductor element, 12 is a metal bump, 13 is an alumina substrate, 14 is an electrode on the alumina substrate, 15 is an anisotropic conductive adhesive, and 16 is a conductive material constituting the anisotropic conductive adhesive 15. The superelastic metal 17 as a filler is a resin constituting the anisotropic conductive adhesive 15.

異方性導電接着剤15は、平均粒径2OnのTi50.
5 atX Ni(弾性歪み8%)粒に金めつきを施し
た超弾性導電性フィラー16を10重量部と樹脂17と
してエポキシ系樹脂を90重量部混練したものである。
The anisotropic conductive adhesive 15 is Ti50.0 with an average particle size of 2 On.
5 atX 10 parts by weight of superelastic conductive filler 16, which is gold-plated Ni (elastic strain 8%) grains, and 90 parts by weight of epoxy resin as resin 17 were kneaded.

半導体素子接続を行うには、前記異方性導電接着剤15
をアルミナ基板13上に塗布し、前記アルミナ基板13
上の電極14と半導体素子11の金属バンブ12を位置
合わせする。この後半導体素子11の裏面より熱圧着プ
レス(図示せず)で3 kg/ciiの圧力と180°
Cの温度で加圧、加熱を行い、樹脂17を硬化した。
In order to connect semiconductor elements, the anisotropic conductive adhesive 15
is applied onto the alumina substrate 13, and the alumina substrate 13
The upper electrode 14 and the metal bump 12 of the semiconductor element 11 are aligned. After that, a thermocompression press (not shown) is applied from the back side of the semiconductor element 11 to a pressure of 3 kg/cii and an angle of 180°.
The resin 17 was cured by applying pressure and heating at a temperature of C.

上記の半導体素子接続方法により、総ての金属バンブ1
2と電極14は電気的接続が得られ、0〜150°C,
1000回の温度サイクル試験においても断線すること
なく良好な接続信頼性を示した。
By the above semiconductor element connection method, all metal bumps 1
2 and the electrode 14 are electrically connected, and the temperature is 0 to 150°C,
Even in a temperature cycle test of 1000 times, it showed good connection reliability without any disconnection.

実施例2 第2図は本発明の実施例2を示すための配線基板間の接
続構造の断面図である。第2図において、21はフレキ
シブル配線基板、22はフレキシブル配線基板上の電極
、23はリジット配線基板。
Embodiment 2 FIG. 2 is a sectional view of a connection structure between wiring boards to show Embodiment 2 of the present invention. In FIG. 2, 21 is a flexible wiring board, 22 is an electrode on the flexible wiring board, and 23 is a rigid wiring board.

24はリジッド配線基板上の電極、25は異方性導電接
着剤、26は異方性導電接着剤25を構成する導電性フ
ィラーの超弾性金属、27は異方性導電接着剤25を構
成する樹脂である。
24 is an electrode on the rigid wiring board, 25 is an anisotropic conductive adhesive, 26 is a superelastic metal as a conductive filler constituting the anisotropic conductive adhesive 25, and 27 is an anisotropic conductive adhesive 25. It is resin.

異方性導電接着剤25は、平均粒径20nのCu34.
7 wtXZn −3,OwtX Sn (弾性歪み2
%)粒に金めつきを施した超弾性導電性フィラー26を
10重量部と樹脂27としてエポキシ系樹脂を90重量
部混練したものである。
The anisotropic conductive adhesive 25 is Cu34.
7 wtXZn -3, OwtX Sn (elastic strain 2
%) 10 parts by weight of superelastic conductive filler 26 whose particles are plated with gold and 90 parts by weight of epoxy resin as resin 27 are kneaded.

配線基板間の接続を行うには、前記異方性導電接着剤2
5をリジット配線基板23の所定の箇所に塗布し、前記
リジット配線基板23上の電極24とフレキシブル配線
基板21の電極22を位置合わせする。この後フレキシ
ブル配線基板21の裏面より熱圧着プレス(図示せず)
で3 kg / cdの圧力と180°Cの温度で加圧
、加熱を行い、樹脂27を硬化した。
In order to connect between wiring boards, the anisotropic conductive adhesive 2
5 is applied to a predetermined location on the rigid wiring board 23, and the electrodes 24 on the rigid wiring board 23 and the electrodes 22 on the flexible wiring board 21 are aligned. After this, thermocompression press (not shown) is applied from the back side of the flexible wiring board 21.
The resin 27 was cured by applying pressure and heating at a pressure of 3 kg/cd and a temperature of 180°C.

上記の配線基板間の接続方法により、各々の配線基板の
総ての電極22と24は電気的接続が得られ、0〜15
0°C,1000回の温度サイクル試験においても断線
することなく良好な接続信頼性を示した。
By the above connection method between wiring boards, all the electrodes 22 and 24 of each wiring board can be electrically connected, and 0 to 15
Even in a temperature cycle test of 1000 times at 0°C, there was no disconnection and good connection reliability was demonstrated.

(発明の効果) 以上述べた本発明の超弾性金属を導電性フィラーとした
異方性導電接着剤を介して電子部品と配線基板の接続を
行えば、異方性導電接着剤を構成する樹脂が大きな熱膨
張係数を有していて、周囲の温度変化で膨張、収縮の歪
みが生じても超弾性金属が弾性範囲で変形し応力を吸収
するので、電子部品の電気的接続の信鎖性向上が図れ、
かつ安価な接続を行うことができる。
(Effects of the Invention) If electronic components and wiring boards are connected via the anisotropic conductive adhesive containing the superelastic metal of the present invention as a conductive filler, the resin constituting the anisotropic conductive adhesive has a large coefficient of thermal expansion, and even if the strain of expansion and contraction occurs due to changes in the surrounding temperature, the superelastic metal deforms within its elastic range and absorbs the stress, which improves the reliability of electrical connections in electronic components. Improve,
Moreover, the connection can be made at low cost.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図及び第2図はそれぞれ本発明に係わる異方性導電
接着剤を用いた電子部品の接続方法を説明するための半
導体素子接続構造、配線基板間の接続構造の断面図、第
3図〜第5図は従来の異方性導電接着剤を用いた半導体
素子接続構造の断面図である。 1.11・・・半導体素子、2.12・・・金属バンプ
、3.13・・・基板、4,14,22.24・・・電
極、5.15.25・・・異方性導電接着剤、6・・・
導電性フィラー、7,17.27・・・樹脂、16.2
6・・・超弾性金属による導電性フィラー 21・・・
フレキシブル配線基板、23・・・リジット配線基板。 第3図 第4図 第5図
1 and 2 are cross-sectional views of a semiconductor element connection structure and a connection structure between wiring boards, respectively, for explaining a method of connecting electronic components using an anisotropic conductive adhesive according to the present invention, and FIG. 5 is a sectional view of a semiconductor element connection structure using a conventional anisotropic conductive adhesive. 1.11... Semiconductor element, 2.12... Metal bump, 3.13... Substrate, 4, 14, 22.24... Electrode, 5.15.25... Anisotropic conduction Adhesive, 6...
Conductive filler, 7, 17.27... Resin, 16.2
6... Conductive filler made of superelastic metal 21...
Flexible wiring board, 23... Rigid wiring board. Figure 3 Figure 4 Figure 5

Claims (2)

【特許請求の範囲】[Claims] (1)樹脂からなる結合剤に導電性を有するフィラーを
分散させた異方性導電接着剤において、導電性フィラー
に超弾性金属材料を用いたことを特徴とする異方性導電
接着剤。
(1) An anisotropic conductive adhesive in which a conductive filler is dispersed in a binder made of resin, characterized in that a superelastic metal material is used as the conductive filler.
(2)電子部品間に、請求項1記載の異方性導電接着剤
を挟み、加圧,加熱により前記電子部品の電極間を電気
的に接続することを特徴とする電子部品の接続方法。
(2) A method for connecting electronic components, comprising sandwiching the anisotropic conductive adhesive according to claim 1 between electronic components, and electrically connecting electrodes of the electronic components by applying pressure and heating.
JP1044258A 1989-02-25 1989-02-25 Anisotropic conductive binder and bonding of electronic parts using this binder Pending JPH02226610A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1044258A JPH02226610A (en) 1989-02-25 1989-02-25 Anisotropic conductive binder and bonding of electronic parts using this binder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1044258A JPH02226610A (en) 1989-02-25 1989-02-25 Anisotropic conductive binder and bonding of electronic parts using this binder

Publications (1)

Publication Number Publication Date
JPH02226610A true JPH02226610A (en) 1990-09-10

Family

ID=12686492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1044258A Pending JPH02226610A (en) 1989-02-25 1989-02-25 Anisotropic conductive binder and bonding of electronic parts using this binder

Country Status (1)

Country Link
JP (1) JPH02226610A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638276U (en) * 1992-10-23 1994-05-20 松下電器産業株式会社 Thermocompression bonding device
JPH08102218A (en) * 1994-09-30 1996-04-16 Nec Corp Anisotropic conductive film
US6482676B2 (en) 1997-01-09 2002-11-19 Fujitsu Limited Method of mounting semiconductor chip part on substrate
JP2007208568A (en) * 2006-01-31 2007-08-16 Nippon Dempa Kogyo Co Ltd Surface-mounted crystal oscillator
JP2011108748A (en) * 2009-11-13 2011-06-02 Citizen Electronics Co Ltd Led light emitting device and method of manufacturing led light emitting device
JP2012023067A (en) * 2010-07-12 2012-02-02 Panasonic Corp Electronic component packaging method
WO2014132979A1 (en) * 2013-02-27 2014-09-04 日亜化学工業株式会社 Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0638276U (en) * 1992-10-23 1994-05-20 松下電器産業株式会社 Thermocompression bonding device
JPH08102218A (en) * 1994-09-30 1996-04-16 Nec Corp Anisotropic conductive film
US6482676B2 (en) 1997-01-09 2002-11-19 Fujitsu Limited Method of mounting semiconductor chip part on substrate
JP2007208568A (en) * 2006-01-31 2007-08-16 Nippon Dempa Kogyo Co Ltd Surface-mounted crystal oscillator
JP2011108748A (en) * 2009-11-13 2011-06-02 Citizen Electronics Co Ltd Led light emitting device and method of manufacturing led light emitting device
JP2012023067A (en) * 2010-07-12 2012-02-02 Panasonic Corp Electronic component packaging method
WO2014132979A1 (en) * 2013-02-27 2014-09-04 日亜化学工業株式会社 Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements
CN105009314A (en) * 2013-02-27 2015-10-28 日亚化学工业株式会社 Light emitting device, method for mounting light emitting element, and mounting device for light emitting elements
JPWO2014132979A1 (en) * 2013-02-27 2017-02-02 日亜化学工業株式会社 Light emitting device, light emitting element mounting method, and light emitting element mounting apparatus
US9955619B2 (en) 2013-02-27 2018-04-24 Nichia Corporation Light emitting device, light emitting element mounting method, and light emitting element mounter
CN105009314B (en) * 2013-02-27 2019-11-05 日亚化学工业株式会社 Light emitting device, light-emitting component installation method and light-emitting component mounting device

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