JP2012023067A - Electronic component packaging method - Google Patents

Electronic component packaging method Download PDF

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JP2012023067A
JP2012023067A JP2010157465A JP2010157465A JP2012023067A JP 2012023067 A JP2012023067 A JP 2012023067A JP 2010157465 A JP2010157465 A JP 2010157465A JP 2010157465 A JP2010157465 A JP 2010157465A JP 2012023067 A JP2012023067 A JP 2012023067A
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electronic component
adhesive
circuit board
oxide film
bonding
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JP2010157465A
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JP5310664B2 (en
Inventor
Koji Motomura
耕治 本村
Hiroki Maruo
弘樹 圓尾
Hideki Eifuku
秀喜 永福
Tadahiko Sakai
忠彦 境
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Panasonic Corp
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Panasonic Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

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  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component packaging method which makes it possible to secure good solder joint properties without mixing active ingredients with high oxide film removing capability into adhesive.SOLUTION: In electronic component packaging where a rigid board 1 and electronic components such as flexible boards are joined by adhesive, prior to bonding of electronic components to the rigid board 1 by adhesive, a coating of liquid silane coupling agent comprised of silane compounds 5a and 5b having a functional group such as an amino group (-NH2) or a mercapto group (-SH) containing hydrogen and exhibiting active action on oxide film is applied to the surface of the rigid board 1 which includes a connecting terminal 2 before the rigid board 1 is heated to over a temperature at which reduction action by a functional group is promoted. In that way, oxide film 3 which is generated on the surface of the connecting terminal 2 can be removed in advance, making it possible to secure good solder joint properties without mixing active ingredients with high oxide film removing capability into adhesive.

Description

本発明は、回路基板の端子に電子部品の電極を半田付けして電気的に接続した状態で両者を接合することにより電子部品を回路基板に実装する電子部品実装方法に関するものである。   The present invention relates to an electronic component mounting method for mounting an electronic component on a circuit board by soldering electrodes of the electronic component to terminals of the circuit board and electrically connecting them together.

回路基板に電子部品を実装する方法として、回路基板の接続用の端子に電子部品の電極を半田接合して導通させる半田付けが多用されている。回路基板の端子は大気曝露されるため通常は表面に酸化膜が生成した状態となっており、半田接合においては、このような酸化膜を除去するためにフラックスが使用される。このような目的のフラックスとして、熱硬化性樹脂に活性成分を含有させた熱硬化タイプのものが用いられるようになっている（特許文献１，２，３参照）。このような熱硬化タイプのフラックスを用いることにより、半田を溶融させるための加熱過程において熱硬化性樹脂が硬化した樹脂補強部が形成されて、接合強度を向上させることができる。さらに、残留した活性成分は樹脂補強部内に閉じ込められることから、従来型のフラックスを用いた半田接合において残留活性成分を除去するために必要とされた洗浄工程を省略できる可能性があるという利点がある。   As a method for mounting an electronic component on a circuit board, soldering is often used in which an electrode of the electronic component is soldered to a connection terminal of the circuit board for electrical connection. Since the terminals of the circuit board are exposed to the atmosphere, an oxide film is usually generated on the surface, and flux is used to remove such an oxide film in solder bonding. As such a flux, a thermosetting type in which an active ingredient is contained in a thermosetting resin is used (see Patent Documents 1, 2, and 3). By using such a thermosetting type flux, a resin reinforcing portion in which the thermosetting resin is cured in the heating process for melting the solder is formed, and the bonding strength can be improved. Further, since the remaining active component is confined in the resin reinforcing portion, there is an advantage that the cleaning step required for removing the remaining active component in the solder joint using the conventional flux may be omitted. is there.

特開２００１−１７９４８７号公報JP 2001-179487 A 特開２００１−２１９２９４号公報JP 2001-219294 A 特開２００１−２３９３９５号公報JP 2001-239395 A

ところでフラックスに配合される活性成分の種類は一様ではなく、酸化膜除去能力が異なる複数の種類から使用対象に応じて選定して用いられる。この活性成分の選択において、酸化膜除去能力を優先して活性作用の強いものを選定すると半田接合後の洗浄を省略できなくなる場合が生じる。さらに活性作用が強いことから、製品としてのポットライフが短く、保存安定性の低下が避けがたいという難点がある。これに対し、洗浄工程を省略することを優先して活性作用が低い活性成分を選定すると、酸化膜除去能力が不十分で接合対象の電極表面や半田粒子などの酸化膜が十分に除去されず、接合性が低下するという問題が生じる。このように、従来の熱硬化性のフラックスを用いた半田付けによる電子部品実装方法においては、良好な接合性を確保するためにはフラックスに用いられる熱硬化性樹脂中の活性成分を酸化膜除去能力の優れたものを選定する必要があり、このため半田付け後の洗浄工程を必要とするとともに保存安定性の低下が避けがたいという課題があった。   By the way, the types of active ingredients to be blended in the flux are not uniform, and a plurality of types having different oxide film removal capabilities are selected according to the object of use. In the selection of the active component, if a strong active action is selected with priority given to the ability to remove the oxide film, cleaning after solder bonding cannot be omitted. Furthermore, since the active action is strong, the pot life as a product is short, and there exists a difficulty that the fall of storage stability is unavoidable. On the other hand, if an active ingredient having a low active action is selected with priority given to omitting the cleaning step, the oxide film removal capability is insufficient, and the oxide film such as the electrode surface or solder particles to be joined cannot be removed sufficiently. As a result, there arises a problem that bondability is lowered. As described above, in the conventional electronic component mounting method by soldering using a thermosetting flux, the active component in the thermosetting resin used for the flux is removed from the oxide film in order to ensure good bondability. It is necessary to select one having excellent ability. For this reason, there is a problem that a cleaning process after soldering is required and a decrease in storage stability is unavoidable.

そこで本発明は、接着剤に酸化膜除去能力の高い活性成分を配合することなく、良好な半田接合性を確保することができる電子部品実装方法を提供することを目的とする。   Therefore, an object of the present invention is to provide an electronic component mounting method that can ensure good solderability without blending an active ingredient having a high ability to remove an oxide film into an adhesive.

回路基板の接続用の端子に電子部品の電極を半田付けして電気的に接続した状態で前記回路基板と電子部品とを接着剤によって接合することにより、前記電子部品を回路基板に実装する電子部品実装方法であって、前記接着剤による前記電子部品の回路基板への接着に先立って、酸化膜に対して活性作用を示し水素を含有する官能基を有するカップリング剤を、前記端子を含む回路基板の表面に塗布するカップリング剤塗布工程と、前記カップリング剤塗布工程後の回路基板を前記官能基による還元作用が促進される温度以上に加熱することにより前記端子の表面に生成された酸化膜を除去する加熱工程と、前記加熱工程の後、前記回路基板と電子部品との間に前記接着剤を介在させた状態でこの接着剤を硬化させてこの電子部品を基板に接着する接着工程とを含む。   An electronic device that mounts the electronic component on the circuit board by bonding the circuit board and the electronic component with an adhesive in a state where the electrodes of the electronic component are soldered and electrically connected to the connection terminals of the circuit board. A component mounting method comprising: a coupling agent having a functional group containing hydrogen and having an active action on an oxide film prior to adhesion of the electronic component to a circuit board by the adhesive A coupling agent coating step that is applied to the surface of the circuit board, and the circuit board after the coupling agent coating step is generated on the surface of the terminal by heating to a temperature at which the reduction action by the functional group is promoted or higher. After the heating step for removing the oxide film, and after the heating step, the adhesive is cured with the adhesive interposed between the circuit board and the electronic component so that the electronic component is brought into contact with the substrate. And a bonding step of.

本発明によれば、回路基板と電子部品とを接着剤によって接合する電子部品実装において、接着剤による電子部品の回路基板への接着に先立って、酸化膜に対して活性作用を示し水素を含有する官能基を有するカップリング剤を接続用の端子を含む回路基板の表面に塗布した後、官能基による還元作用が促進される温度以上に加熱することにより、接続用の端子の表面に生成された酸化膜を除去することができ、接着剤に酸化膜除去能力の高い活性成分を配合することなく、良好な半田接合性を確保することができる。   According to the present invention, in electronic component mounting in which a circuit board and an electronic component are bonded by an adhesive, hydrogen is contained and exhibits an active action on the oxide film prior to the bonding of the electronic component to the circuit board by the adhesive. After the coupling agent having a functional group is applied to the surface of the circuit board including the terminal for connection, the coupling agent is generated on the surface of the terminal for connection by heating to a temperature at which the reduction action by the functional group is promoted. The oxide film can be removed, and good solderability can be ensured without adding an active ingredient having a high ability to remove oxide film to the adhesive.

本発明の一実施の形態の電子部品実装方法の概要を示すフロー図The flowchart which shows the outline | summary of the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法を示す工程説明図Process explanatory drawing which shows the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法を示す工程説明図Process explanatory drawing which shows the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法を示す工程説明図Process explanatory drawing which shows the electronic component mounting method of one embodiment of this invention 本発明の一実施の形態の電子部品実装方法を示す工程説明図Process explanatory drawing which shows the electronic component mounting method of one embodiment of this invention

次に本発明の実施の形態を図面を参照して説明する。まず、図１のフローを参照して、電子部品実装方法の概要を説明する。この電子部品実装方法は、回路基板の接続用の端子に電子部品の電極を半田付けして電気的に接続した状態で、回路基板と電子部品とを熱硬化性樹脂を含む接着剤によって接合することにより、電子部品を回路基板に実装するものである。本実施の形態は回路基板としてのリジッド基板に電子部品としてのフレキシブル基板またはＢＧＡ，ＣＳＰなどのバンプ付き部品を実装する例を示している。電子部品の搭載に先立って、予めリジッド基板に官能基を有するシランカップリング剤を塗布し（ＳＴ１）、次いでカップリング剤塗布後のリジッド基板１を加熱処理する（ＳＴ２）ことにより、リジッド基板の接続用の端子の酸化膜および再吸湿による残留水分を除去し、この後にリジッド基板にフレキシブル基板を搭載する電子部品実装（ＳＴ３）を実行するようにしている。   Next, embodiments of the present invention will be described with reference to the drawings. First, the outline of the electronic component mounting method will be described with reference to the flow of FIG. In this electronic component mounting method, the circuit board and the electronic component are joined to each other with an adhesive containing a thermosetting resin in a state where the electrodes of the electronic component are soldered and electrically connected to the connection terminals of the circuit board. Thus, the electronic component is mounted on the circuit board. This embodiment shows an example in which a flexible substrate as an electronic component or a bumped component such as BGA or CSP is mounted on a rigid substrate as a circuit board. Prior to mounting the electronic component, a silane coupling agent having a functional group is applied to the rigid substrate in advance (ST1), and then the rigid substrate 1 after the application of the coupling agent is heated (ST2). The oxide film of the connection terminal and the residual moisture due to re-moisture removal are removed, and thereafter, electronic component mounting (ST3) for mounting the flexible substrate on the rigid substrate is executed.

次に、図２を参照して、シランカップリング剤をリジッド基板に塗布するカップリング剤塗布工程について説明する。図２（ａ）に示すように、リジッド基板１の接続面１ａ（表面）には、接続用の端子２が形成されている。端子２は銅（Ｃｕ）または銅系の合金より成り、図２（ｂ）に示すように、端子２の表面２ａは大気暴露により生成した酸化膜３によって覆われている。またリジッド基板１の表面には、大気曝露中の再吸湿によって残留水分４が付着している。   Next, with reference to FIG. 2, the coupling agent application | coating process which apply | coats a silane coupling agent to a rigid board | substrate is demonstrated. As shown in FIG. 2A, a connection terminal 2 is formed on the connection surface 1 a (front surface) of the rigid substrate 1. The terminal 2 is made of copper (Cu) or a copper-based alloy, and as shown in FIG. 2B, the surface 2a of the terminal 2 is covered with an oxide film 3 generated by exposure to the atmosphere. Residual moisture 4 adheres to the surface of the rigid substrate 1 due to re-absorption during exposure to the atmosphere.

このような酸化膜３や残留水分４は、電子部品の熱圧着による実装品質を阻害する要因となる。すなわち酸化膜３の存在により、端子２へ電子部品を電気的に接続する際の半田接合性が低下し導通不良を招く。また残留水分４が存在したままの状態で接着剤による熱圧着を行うと、加熱過程において接着剤中に残留水分４が閉じ込められたまま気化することにより生じた気泡が、接着剤の熱硬化後もそのまま空隙部として残留し、電子部品とリジッド基板１とを接着して固着する樹脂補強部の強度低下を招く。   Such oxide film 3 and residual moisture 4 are factors that hinder the mounting quality of the electronic component by thermocompression bonding. That is, due to the presence of the oxide film 3, the solderability at the time of electrically connecting the electronic component to the terminal 2 is lowered, leading to poor conduction. In addition, when thermocompression bonding with an adhesive is performed in a state where the residual moisture 4 is present, bubbles generated by vaporization while the residual moisture 4 is confined in the adhesive during the heating process are generated after the adhesive is thermally cured. However, it remains as a gap and causes a decrease in strength of the resin reinforcing portion that adheres and fixes the electronic component and the rigid substrate 1.

本実施の形態においては、このような酸化膜３や残留水分４を予め除去することを目的として、以下のような処理を行う。すなわち、図１（ｃ）に示すように、まず接着剤による電子部品の回路基板への接着に先立って、シラン化合物（図３（ｂ）に示すシラン化合物５ａ、５ｂ参照）を含む液状のシランカップリング剤５を、リジッド基板１において端子２を含む接続面１ａに、ディスペンサなどの塗布手段によって塗布する。シランカップリング剤５は、アミノ基（−ＮＨ２）（シラン化合物５ａ参照）やメルカプト基（−ＳＨ）（シラン化合物５ｂ参照）など、水素を含有する反応性の官能基を有していることから還元能を有し、酸化膜３に対して活性作用を示す。   In the present embodiment, the following processing is performed for the purpose of removing such oxide film 3 and residual moisture 4 in advance. That is, as shown in FIG. 1 (c), first, a liquid silane containing a silane compound (see silane compounds 5a and 5b shown in FIG. 3 (b)) prior to adhesion of the electronic component to the circuit board with an adhesive. The coupling agent 5 is applied to the connection surface 1 a including the terminals 2 in the rigid substrate 1 by an application means such as a dispenser. The silane coupling agent 5 has a reactive functional group containing hydrogen, such as an amino group (—NH 2) (see the silane compound 5 a) or a mercapto group (—SH) (see the silane compound 5 b). It has a reducing ability and exhibits an active action on the oxide film 3.

シランカップリング剤５が塗布されたリジッド基板１は加熱装置に送られ、図３（ａ）に示すように、リジッド基板１とともにシランカップリング剤５が加熱される。この加熱によってシランカップリング剤５と酸化膜３との接触界面の温度は、官能基による還元作用が促進される温度以上に上昇し、酸化膜３には還元作用が及ぶ。すなわちここでは、シランカップリング剤塗布工程後のリジッド基板１を官能基による還元作用が促進される温度以上に加熱することにより、端子２の表面２ａに生成された酸化膜３を除去する（加熱工程）。この加熱は、リジッド基板１をヒータを内蔵したホットプレート上に載置して、リジッド基板１を介してシランカップリング剤５を加熱する方法や、リジッド基板１を加熱炉内に収容して、シランカップリング剤５を加熱する方法などによって行われる。   The rigid substrate 1 to which the silane coupling agent 5 is applied is sent to a heating device, and the silane coupling agent 5 is heated together with the rigid substrate 1 as shown in FIG. By this heating, the temperature at the contact interface between the silane coupling agent 5 and the oxide film 3 rises to a temperature higher than the temperature at which the reducing action by the functional group is promoted, and the reducing action is exerted on the oxide film 3. That is, here, the oxide film 3 formed on the surface 2a of the terminal 2 is removed by heating the rigid substrate 1 after the silane coupling agent coating step to a temperature at which the reduction action by the functional group is promoted (heating). Process). For this heating, the rigid substrate 1 is placed on a hot plate with a built-in heater, and the silane coupling agent 5 is heated via the rigid substrate 1, or the rigid substrate 1 is accommodated in a heating furnace. For example, the silane coupling agent 5 is heated.

この還元作用による酸化膜３の除去について、図３（ｂ）を参照して説明する。前述のようにシラン化合物５ａ、５ｂなど水素を含有する官能基を有するシランカップリング剤５を、リジッド基板１の上面に塗布することにより、シラン化合物５ａ、５ｂは接続面１ａおよび表面２ａに接触する。そして上述のように、官能基による還元作用が加熱によって促進されることにより、酸化膜３が生成された表面２ａに接触したシラン化合物５ａ、５ｂは、アミノ基（−ＮＨ２）、メルカプト基（−ＳＨ）の水素が酸化膜３と反応してこれを還元し、シラン化合物５ａ、５ｂから水素が奪われたシラン化合物５ａ＊、シラン化合物５ｂ＊に変化する。   The removal of the oxide film 3 by this reduction action will be described with reference to FIG. As described above, by applying the silane coupling agent 5 having a functional group containing hydrogen, such as the silane compounds 5a and 5b, to the upper surface of the rigid substrate 1, the silane compounds 5a and 5b come into contact with the connection surface 1a and the surface 2a. To do. As described above, the reduction action by the functional group is promoted by heating, so that the silane compounds 5a and 5b that are in contact with the surface 2a on which the oxide film 3 has been produced have amino groups (-NH2), mercapto groups (- The hydrogen of SH) reacts with the oxide film 3 to reduce it, and changes to silane compound 5a * and silane compound 5b * from which hydrogen has been removed from silane compounds 5a and 5b.

これにより、端子２の表面２ａに生成された酸化膜３は、この還元反応により消失して除去される。そしてこの加熱によってシランカップリング剤５の液状成分が、接続面１ａに残留した残留水分４（図２（ｂ）参照）とともに蒸散し、これにより、図３（ｃ）に示すように、リジッド基板１において、接続面１ａ、表面２ａから正常な熱圧着を阻害する要因となる残留水分４や酸化膜３が除去される。電子部品の実装は、上述の加熱工程の後の、図３（ｃ）に示す状態のリジッド基板１を対象として行われる。すなわち、ここでは酸化膜３や残留水分４が除去された後のリジッド基板１と実装対象の電子部品との間に接着剤を介在させた状態で、この接着剤を硬化させてこの電子部品をリジッド基板１に接着する（接着工程）。   As a result, the oxide film 3 formed on the surface 2a of the terminal 2 disappears and is removed by this reduction reaction. As a result of this heating, the liquid component of the silane coupling agent 5 evaporates together with the residual moisture 4 (see FIG. 2B) remaining on the connection surface 1a, and as a result, as shown in FIG. In FIG. 1, the residual moisture 4 and the oxide film 3 which are factors that hinder normal thermocompression bonding are removed from the connection surface 1a and the surface 2a. Electronic components are mounted on the rigid substrate 1 in the state shown in FIG. 3C after the above-described heating step. That is, here, the adhesive is cured between the rigid substrate 1 from which the oxide film 3 and the residual moisture 4 have been removed and the electronic component to be mounted, and the electronic component is cured. Bonding to the rigid substrate 1 (bonding step).

まず図４を参照して、実装される電子部品がフレキシブル基板７である場合の実装方法について説明する。図４（ａ）に示すように、まず一方側の面に電極８が形成されたフレキシブル基板７を、電極８が下面側の姿勢で熱圧着ツール６によって保持し、次いで表面２ａ上に端子２を覆って樹脂接着剤９が供給されたリジッド基板１上に位置合わせする。樹脂接着剤９は、熱硬化性樹脂９ａに半田粒子９ｂを所定の含有比率（例えば３０〜７５ｗｔ％）で含有させた構成の熱硬化接着剤であり、熱硬化性樹脂９ａを熱硬化させるための硬化剤や、半田粒子９ｂの表面酸化膜を除去するための活性剤などを含んでいる。   First, with reference to FIG. 4, a mounting method when the electronic component to be mounted is the flexible substrate 7 will be described. As shown in FIG. 4A, first, the flexible substrate 7 on which the electrode 8 is formed on one surface is held by the thermocompression bonding tool 6 with the electrode 8 positioned on the lower surface side, and then the terminal 2 on the surface 2a. Is aligned on the rigid substrate 1 supplied with the resin adhesive 9. The resin adhesive 9 is a thermosetting adhesive having a configuration in which solder particles 9b are contained in the thermosetting resin 9a at a predetermined content ratio (for example, 30 to 75 wt%), and is for thermosetting the thermosetting resin 9a. And an activator for removing the surface oxide film of the solder particles 9b.

この後、図４（ｂ）に示すように、熱圧着ツール６を下降させて、電極８を端子２に対向させた状態で、フレキシブル基板７を樹脂接着剤９を介してリジッド基板１に対して着地させる。そしてフレキシブル基板７をリジッド基板１に対して所定の押圧荷重で押圧しながら、熱圧着ツール６およびフレキシブル基板７を介して樹脂接着剤９を加熱する。これにより、図４（ｃ）に示すように、端子２と電極８とを半田接合して電気的に接続する半田接合部９ｂ＊が形成されるとともに、熱硬化性樹脂９ａが熱硬化してフレキシブル基板７をリジッド基板１に固着する樹脂補強部９ａ＊が形成される。   Thereafter, as shown in FIG. 4B, the flexible substrate 7 is attached to the rigid substrate 1 via the resin adhesive 9 in a state where the thermocompression bonding tool 6 is lowered and the electrode 8 is opposed to the terminal 2. To land. Then, the resin adhesive 9 is heated via the thermocompression bonding tool 6 and the flexible substrate 7 while pressing the flexible substrate 7 against the rigid substrate 1 with a predetermined pressing load. As a result, as shown in FIG. 4 (c), a solder joint portion 9b * for soldering and electrically connecting the terminal 2 and the electrode 8 is formed, and the thermosetting resin 9a is thermoset. A resin reinforcing portion 9a * for fixing the flexible substrate 7 to the rigid substrate 1 is formed.

すなわち図４に示す電子部品実装方法は、接着剤として熱硬化性樹脂９ａに半田粒子９ｂを含有した樹脂接着剤９を用い、接着工程において、フレキシブル基板７を熱圧着ツール６によって加熱しながらリジッド基板１に対して押圧して熱圧着する形態となっている。なお、図４に示す例では、接着剤として上述構成の樹脂接着剤９を用いる例を示したが、接着剤としてニッケル（Ｎｉ）などの導電粒子を熱硬化性樹脂に含有させた異方性導電接着剤を用いるようにしてもよい。この場合にも同様に、接着工程において、フレキシブル基板７を熱圧着ツール６によって加熱しながらリジッド基板１に対して押圧して熱圧着する。   That is, the electronic component mounting method shown in FIG. 4 uses a resin adhesive 9 containing solder particles 9b in a thermosetting resin 9a as an adhesive, and in the bonding process, the flexible substrate 7 is heated while being heated by the thermocompression bonding tool 6. It is the form which presses with respect to the board | substrate 1 and thermocompression-bonds. In the example shown in FIG. 4, an example in which the resin adhesive 9 having the above-described configuration is used as the adhesive is shown. However, an anisotropic material in which conductive particles such as nickel (Ni) are contained in the thermosetting resin as the adhesive. A conductive adhesive may be used. Similarly, in this case, in the bonding step, the flexible substrate 7 is pressed against the rigid substrate 1 while being heated by the thermocompression bonding tool 6 and thermocompression bonded.

次に図５を参照して、実装される電子部品が下面に電極としての半田バンプ１２が形成されたバンプ付き部品１１である場合の実装方法について説明する。図５（ａ）に示すように、まずバンプ付き部品１１を半田バンプ１２が下面側の姿勢で移載ツール１０によって保持し、次いで接続面１ａ上に端子２を覆って樹脂接着剤１３が供給されたリジッド基板１上に位置合わせする。樹脂接着剤１３は熱硬化性樹脂を主成分とするものであり、熱硬化性樹脂を熱硬化させるための硬化剤や、半田バンプ１２の表面酸化膜を除去するための活性剤などを含んでいる。そしてこの後、熱圧着ツール６を下降させて、半田バンプ１２を樹脂接着剤１３を介して端子２に対して着地させる。   Next, a mounting method when the electronic component to be mounted is a bumped component 11 having solder bumps 12 as electrodes formed on the lower surface will be described with reference to FIG. As shown in FIG. 5A, first, the bumped component 11 is held by the transfer tool 10 with the solder bump 12 in the posture of the lower surface side, and then the resin adhesive 13 is supplied covering the terminal 2 on the connection surface 1a. Alignment is performed on the rigid substrate 1 formed. The resin adhesive 13 is mainly composed of a thermosetting resin, and includes a curing agent for thermosetting the thermosetting resin, an activator for removing the surface oxide film of the solder bumps 12, and the like. Yes. Thereafter, the thermocompression bonding tool 6 is lowered, and the solder bumps 12 are landed on the terminals 2 via the resin adhesive 13.

次にバンプ付き部品１１が搭載されたリジッド基板１はリフロー工程に送られ、図５（ｂ）に示すように、所定の温度プロファイルにしたがって加熱雰囲気中に保持される。これにより、半田バンプ１２が溶融するとともに、樹脂接着剤１３の熱硬化反応が進行する。そしてリフロー工程が完了した後には、図５（ｃ）に示すように、半田バンプ１２が溶融固化してバンプ付き部品１１と端子２とを半田接合する半田接合部１２＊が形成されるとともに、樹脂接着剤１３が熱硬化することによって、バンプ付き部品１１の下面とリジッド基板１との間には、半田接合部１２＊を周囲から補強する樹脂補強部１３＊が形成される。   Next, the rigid substrate 1 on which the bumped component 11 is mounted is sent to a reflow process, and is held in a heated atmosphere according to a predetermined temperature profile, as shown in FIG. Thereby, the solder bump 12 is melted and the thermosetting reaction of the resin adhesive 13 proceeds. After the reflow process is completed, as shown in FIG. 5C, the solder bumps 12 are melted and solidified to form solder joints 12 * for soldering the bumped parts 11 and the terminals 2, When the resin adhesive 13 is thermally cured, a resin reinforcing portion 13 * that reinforces the solder joint portion 12 * from the periphery is formed between the lower surface of the bumped component 11 and the rigid substrate 1.

すなわち図５に示す電子部品実装方法は、接着剤として熱硬化性樹脂を主成分とする熱硬化接着剤１３を用い、接着工程においてバンプ付き部品１１を加熱雰囲気中に保持することにより、熱硬化性樹脂を熱硬化させてバンプ付き部品１１をリジッド基板１に固着させる形態となっている。なお、図５に示す例では、接着剤として上述構成の樹脂接着剤１３を用いる例を示したが、接着剤として熱硬化性樹脂に半田粒子を含有した構成の熱硬化接着剤を用いるようにしてもよい。この場合には、接着工程においてバンプ付き部品１１を加熱雰囲気中に保持することにより、熱硬化接着剤中の半田粒子を溶融固化させて半田バンプ１２と端子２とを半田接合するとともに、熱硬化性樹脂を熱硬化させてバンプ付き部品１１をリジッド基板１に固着させる。このような構成の接着剤を用いることにより、バンプ付き部品１１に形成されたバンプが半田以外の金属材質よりなる場合であっても、バンプを端子２に半田接合することができる。   That is, the electronic component mounting method shown in FIG. 5 uses a thermosetting adhesive 13 mainly composed of a thermosetting resin as an adhesive, and holds the bumped component 11 in a heating atmosphere in the bonding process, thereby thermosetting. The component 11 with bumps is fixed to the rigid substrate 1 by thermosetting the functional resin. In the example shown in FIG. 5, the example in which the resin adhesive 13 having the above-described configuration is used as the adhesive is shown. However, a thermosetting adhesive having a configuration in which solder particles are contained in a thermosetting resin is used as the adhesive. May be. In this case, by holding the bumped component 11 in the heating atmosphere in the bonding step, the solder particles in the thermosetting adhesive are melted and solidified to solder the solder bumps 12 and the terminals 2 and thermoset. The component 11 with bumps is fixed to the rigid substrate 1 by thermosetting the resin. By using the adhesive having such a configuration, the bump can be soldered to the terminal 2 even when the bump formed on the bumped component 11 is made of a metal material other than solder.

上記説明したように、本実施の形態の電子部品実装方法は、回路基板であるリジッド基板１と電子部品であるフレキシブル基板７やバンプ付き部品１１とを接着剤によって接合する電子部品実装において、接着剤によるフレキシブル基板７やバンプ付き部品１１のリジッド基板１への接着に先立って、酸化膜に対して活性作用を示し水素を含有する官能基を有するシランカップリング剤５を接続用の端子２を含むリジッド基板１の表面に塗布した後、官能基による還元作用が促進される温度以上に加熱するようにしたものである。   As described above, the electronic component mounting method according to the present embodiment is an adhesive in electronic component mounting in which the rigid substrate 1 that is a circuit board and the flexible substrate 7 that is an electronic component or the bumped component 11 are bonded with an adhesive. Prior to adhesion of the flexible substrate 7 and the bumped component 11 to the rigid substrate 1 by the agent, the terminal 2 for connecting the silane coupling agent 5 having an active action on the oxide film and having a functional group containing hydrogen is used. After coating on the surface of the rigid substrate 1 to be included, heating is performed at a temperature higher than the temperature at which the reducing action by the functional group is promoted.

これにより、予め端子２の表面に生成された酸化膜３を除去することができ、電子部品の回路基板への接着に際して使用する接着剤に酸化膜除去能力の高い活性成分を配合することなく、良好な半田接合性を確保することができる。したがって、酸化膜除去能力を優先して活性成分を選定した場合に生じる不具合点、すなわち半田接合後の洗浄を必要とすることによる工程コストの上昇や、活性成分が実際の作業開始前から作用することによる保存安定性の低下などを排除することが可能となっている。   Thereby, it is possible to remove the oxide film 3 generated on the surface of the terminal 2 in advance, and without blending an active ingredient having a high ability to remove oxide film into the adhesive used for bonding the electronic component to the circuit board, Good solderability can be ensured. Therefore, inconveniences that occur when an active component is selected with priority given to the ability to remove the oxide film, that is, an increase in process cost due to the need for cleaning after solder bonding, and the active component acts before the actual work starts. It is possible to eliminate a decrease in storage stability due to the above.

なお上記実施の形態においては、酸化膜を除去するために用いられるカップリング剤としてシランカップリング剤を用いる例を示したが、このような目的で用いられるカップリング剤としてはシランカップリング剤に限定されるものではなく、酸化膜に対して活性作用を示し水素を含有する官能基を有するものであれば、チタンカップリング剤など他の種類のものを用いることもできる。また接続用の端子２の形態として、予め半田コートがなされたものを用いる場合にあっても、本発明を適用することができる。この場合には、半田コートの表面の酸化膜がカップリング剤の作用によって除去される。   In the above embodiment, an example in which a silane coupling agent is used as a coupling agent used for removing an oxide film has been shown. However, as a coupling agent used for such a purpose, a silane coupling agent is used. It is not limited, and other types such as a titanium coupling agent can be used as long as they have an active action on the oxide film and have a functional group containing hydrogen. Further, the present invention can also be applied to the case where a terminal that has been previously coated with solder is used as the form of the connection terminal 2. In this case, the oxide film on the surface of the solder coat is removed by the action of the coupling agent.

本発明の電子部品実装方法は、接着剤中に酸化膜除去能力の高い活性成分を配合することなく、良好な接合性を確保することができるという効果を有し、リジッド基板などの回路基板にフレキシブル基板などの電子部品を実装する電子部品実装分野において有用である。   The electronic component mounting method of the present invention has the effect of ensuring good bondability without blending an active ingredient having a high ability to remove oxide film in an adhesive, and can be applied to a circuit board such as a rigid board. This is useful in the field of electronic component mounting for mounting electronic components such as flexible substrates.

１ リジッド基板
１ａ 接続面
２ 端子
２ａ 表面
３ 酸化膜
４ 残留水分
５ シランカップリング剤
５ａ、５ｂ シラン化合物
６ 熱圧着ツール
７ フレキシブル基板
８ 電極
９、１３ 樹脂接着剤
９ａ 熱硬化性樹脂
９ａ＊、１３＊ 樹脂補強部
９ｂ 半田粒子
９ｂ＊、１２＊ 半田接合部
１１ バンプ付き部品
１２ 半田バンプ
１３ 樹脂接着剤 DESCRIPTION OF SYMBOLS 1 Rigid board | substrate 1a Connection surface 2 Terminal 2a Surface 3 Oxide film 4 Residual moisture 5 Silane coupling agent 5a, 5b Silane compound 6 Thermocompression-bonding tool 7 Flexible board 8 Electrode 9, 13 Resin adhesive 9a Thermosetting resin 9a *, 13 * Resin reinforcement part 9b Solder particles 9b *, 12 * Solder joint part 11 Bumped part 12 Solder bump 13 Resin adhesive

Claims (5)

回路基板の接続用の端子に電子部品の電極を半田付けして電気的に接続した状態で前記回路基板と電子部品とを接着剤によって接合することにより、前記電子部品を回路基板に実装する電子部品実装方法であって、
前記接着剤による前記電子部品の回路基板への接着に先立って、酸化膜に対して活性作用を示し水素を含有する官能基を有するカップリング剤を、前記端子を含む回路基板の表面に塗布するカップリング剤塗布工程と、
前記カップリング剤塗布工程後の回路基板を前記官能基による還元作用が促進される温度以上に加熱することにより前記端子の表面に生成された酸化膜を除去する加熱工程と、
前記加熱工程の後、前記回路基板と電子部品との間に前記接着剤を介在させた状態でこの接着剤を硬化させてこの電子部品を基板に接着する接着工程とを含むことを特徴とする電子部品実装方法。 An electronic device that mounts the electronic component on the circuit board by bonding the circuit board and the electronic component with an adhesive in a state where the electrodes of the electronic component are soldered and electrically connected to the connection terminals of the circuit board. A component mounting method,
Prior to adhesion of the electronic component to the circuit board by the adhesive, a coupling agent having a functional group containing hydrogen and having an active action on the oxide film is applied to the surface of the circuit board including the terminal. A coupling agent application step;
A heating step of removing the oxide film generated on the surface of the terminal by heating the circuit board after the coupling agent coating step to a temperature higher than the temperature at which the reduction action by the functional group is promoted;
An adhesive step of curing the adhesive in a state where the adhesive is interposed between the circuit board and the electronic component and bonding the electronic component to the substrate after the heating step. Electronic component mounting method. 前記接着剤として熱硬化性樹脂に半田粒子を含有した熱硬化接着剤を用い、
前記接着工程において、前記電子部品を熱圧着ツールによって加熱しながら前記回路基板に対して押圧して熱圧着することを特徴とする請求項１記載の電子部品実装方法。 Using a thermosetting adhesive containing solder particles in a thermosetting resin as the adhesive,
2. The electronic component mounting method according to claim 1, wherein in the bonding step, the electronic component is pressed against the circuit board while being heated by a thermocompression-bonding tool and thermocompression-bonded. 前記接着剤として熱硬化性樹脂を主成分とする熱硬化接着剤を用い、前記接着工程において、前記電子部品を加熱雰囲気中に保持することにより前記熱硬化性樹脂を熱硬化させて前記電子部品を回路基板に固着させることを特徴とする請求項１記載の電子部品実装方法。   A thermosetting adhesive mainly composed of a thermosetting resin is used as the adhesive, and the electronic component is thermoset by holding the electronic component in a heated atmosphere in the bonding step. The electronic component mounting method according to claim 1, wherein the circuit board is fixed to the circuit board. 前記接着剤として熱硬化性樹脂に半田粒子を含有した熱硬化接着剤を用い、前記接着工程において、前記電子部品を加熱雰囲気中に保持することにより前記半田粒子を溶融固化させて前記電極と端子とを半田接合するとともに、前記熱硬化性樹脂を熱硬化させて前記電子部品を回路基板に固着させることを特徴とする請求項１記載の電子部品実装方法。   As the adhesive, a thermosetting adhesive containing solder particles in a thermosetting resin is used, and in the bonding step, the electronic components are held in a heated atmosphere to melt and solidify the solder particles, so that the electrodes and terminals 2. The electronic component mounting method according to claim 1, wherein the electronic component is fixed to the circuit board by thermosetting the thermosetting resin. 前記接着剤として導電粒子を含む異方性導電接着剤を用い、前記接着工程において、前記電子部品を熱圧着ツールによって加熱しながら前記回路基板に対して押圧して熱圧着することを特徴とする請求項１記載の電子部品実装方法。   An anisotropic conductive adhesive containing conductive particles is used as the adhesive, and in the bonding step, the electronic component is pressed against the circuit board while being heated by a thermocompression bonding tool, and is thermocompression-bonded. The electronic component mounting method according to claim 1.
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