JPH0222326B2 - - Google Patents
Info
- Publication number
- JPH0222326B2 JPH0222326B2 JP55134159A JP13415980A JPH0222326B2 JP H0222326 B2 JPH0222326 B2 JP H0222326B2 JP 55134159 A JP55134159 A JP 55134159A JP 13415980 A JP13415980 A JP 13415980A JP H0222326 B2 JPH0222326 B2 JP H0222326B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave sensor
- array
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010897 surface acoustic wave method Methods 0.000 claims description 37
- 239000013078 crystal Substances 0.000 claims description 9
- 238000003491 array Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000001307 helium Substances 0.000 claims description 3
- 229910052734 helium Inorganic materials 0.000 claims description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 41
- 239000000463 material Substances 0.000 description 14
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 239000010453 quartz Substances 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000002386 leaching Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000001953 recrystallisation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Transmission And Conversion Of Sensor Element Output (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/079,735 US4296347A (en) | 1979-09-28 | 1979-09-28 | Surface acoustic wave sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5664629A JPS5664629A (en) | 1981-06-01 |
| JPH0222326B2 true JPH0222326B2 (en, 2012) | 1990-05-18 |
Family
ID=22152470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13415980A Granted JPS5664629A (en) | 1979-09-28 | 1980-09-26 | Surface soundwave sensor |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4296347A (en, 2012) |
| JP (1) | JPS5664629A (en, 2012) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2100521B (en) * | 1981-05-13 | 1984-09-12 | Plessey Co Plc | Electrical device package |
| US5594979A (en) * | 1984-09-13 | 1997-01-21 | Raytheon Company | Method for packaging a surface acoustic wave device |
| JPS6297418A (ja) * | 1985-10-23 | 1987-05-06 | Clarion Co Ltd | 弾性表面波装置のパツケ−ジ方法 |
| US5010270A (en) * | 1986-12-22 | 1991-04-23 | Raytheon Company | Saw device |
| US5091051A (en) * | 1986-12-22 | 1992-02-25 | Raytheon Company | Saw device method |
| US5345201A (en) * | 1988-06-29 | 1994-09-06 | Raytheon Company | Saw device and method of manufacture |
| US5059848A (en) * | 1990-08-20 | 1991-10-22 | The United States Of America As Represented By The Secretary Of The Army | Low-cost saw packaging technique |
| DE69426789T2 (de) * | 1993-04-28 | 2001-08-02 | Matsushita Electric Industrial Co., Ltd. | Akustische Oberflächenwellenanordnung und Herstellungsverfahren dafür |
| US5729185A (en) * | 1996-04-29 | 1998-03-17 | Motorola Inc. | Acoustic wave filter package lid attachment apparatus and method utilizing a novolac epoxy based seal |
| DE10222068B4 (de) * | 2002-05-15 | 2006-01-05 | Forschungszentrum Karlsruhe Gmbh | Sensor auf der Basis von Oberflächenwellen-Bauelementen |
| US7651879B2 (en) * | 2005-12-07 | 2010-01-26 | Honeywell International Inc. | Surface acoustic wave pressure sensors |
| US7866178B2 (en) * | 2007-07-24 | 2011-01-11 | Asia Vital Components Co., Ltd. | Device and method for vacuum-sealing a cooling medium |
| US7514841B1 (en) * | 2007-10-18 | 2009-04-07 | Honeywell International Inc. | Glass based packaging and attachment of saw torque sensor |
| DE102013103494A1 (de) | 2013-04-08 | 2014-10-09 | Pro-Micron Gmbh & Co. Kg | Dehnungsmesssensor |
| DE102013220717B4 (de) | 2013-10-14 | 2016-04-07 | Continental Automotive Gmbh | Pumpe |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3274828A (en) * | 1963-08-27 | 1966-09-27 | Charles F Pulvari | Force sensor |
| US3427876A (en) * | 1966-07-25 | 1969-02-18 | Aerojet General Co | Pressure sensing cell and system |
| US3888115A (en) * | 1973-03-30 | 1975-06-10 | Texas Instruments Inc | Strain sensor |
| US4096740A (en) * | 1974-06-17 | 1978-06-27 | Rockwell International Corporation | Surface acoustic wave strain detector and gage |
| US4100811A (en) * | 1977-03-18 | 1978-07-18 | United Technologies Corporation | Differential surface acoustic wave transducer |
| US4216401A (en) * | 1978-12-22 | 1980-08-05 | United Technologies Corporation | Surface acoustic wave (SAW) pressure sensor structure |
-
1979
- 1979-09-28 US US06/079,735 patent/US4296347A/en not_active Expired - Lifetime
-
1980
- 1980-09-26 JP JP13415980A patent/JPS5664629A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5664629A (en) | 1981-06-01 |
| US4296347A (en) | 1981-10-20 |
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