JPH02222456A - Dimension stabilizer and resin composition using same - Google Patents
Dimension stabilizer and resin composition using sameInfo
- Publication number
- JPH02222456A JPH02222456A JP4412089A JP4412089A JPH02222456A JP H02222456 A JPH02222456 A JP H02222456A JP 4412089 A JP4412089 A JP 4412089A JP 4412089 A JP4412089 A JP 4412089A JP H02222456 A JPH02222456 A JP H02222456A
- Authority
- JP
- Japan
- Prior art keywords
- tung oil
- resin composition
- resin
- maleic anhydride
- adduct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 22
- 239000003381 stabilizer Substances 0.000 title claims abstract description 14
- 239000002383 tung oil Substances 0.000 claims abstract description 30
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 13
- 238000010438 heat treatment Methods 0.000 abstract description 11
- 229920001568 phenolic resin Polymers 0.000 abstract description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 5
- 229920000647 polyepoxide Polymers 0.000 abstract description 5
- 239000000047 product Substances 0.000 description 16
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000002966 varnish Substances 0.000 description 7
- 239000000123 paper Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000004615 ingredient Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、積層板などに用いられる樹脂組成物、同樹
脂組成物に配合される寸法安定化剤に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a resin composition used for laminates and the like, and a dimensional stabilizer added to the resin composition.
プリント配線板などの電気用積層板には、たとえば、フ
ェノール積層板などがある。積層板は、たとえば、紙基
材などの繊維質基材に樹脂組成物を含浸させてなる樹脂
含浸基材を用いて作られている。Electrical laminates such as printed wiring boards include, for example, phenol laminates. The laminate is made using, for example, a resin-impregnated base material obtained by impregnating a fibrous base material such as a paper base material with a resin composition.
他方、積層板に使用されているフェノール樹脂は、硬化
物が硬くもろいため、可塑剤を配合して硬化物に可撓性
を付与している。前記可塑剤としては、桐油が従来から
よ（使用される。On the other hand, since the cured product of the phenol resin used in the laminate is hard and brittle, a plasticizer is blended therein to impart flexibility to the cured product. Tung oil is conventionally used as the plasticizer.
積層板は、紙基材を使用していると、寸法安定性が悪い
。特に、加熱処理後の厚み方向の寸法変化が大きく、Ｐ
ＷＢに電子部品をはんだ付は無しで用いる用途には全（
不適当である。Laminated boards have poor dimensional stability when paper substrates are used. In particular, the dimensional change in the thickness direction after heat treatment is large, and P
For applications where electronic parts are used on the WB without soldering,
It's inappropriate.
桐油をフェノール樹脂の可塑剤として使用する場合、フ
ェノール樹脂に桐油を付加させることが本来的である。When using tung oil as a plasticizer for phenolic resin, it is essential to add tung oil to the phenolic resin.
しかし、桐油は、フェノール樹脂に付加しに＜＜、混合
物になりやすいため、たとえば、フェノール１モルに対
して、桐油８〜９モル程度と過剰に使用しているのが現
状である。However, since tung oil tends to form a mixture when added to a phenol resin, the current situation is that tung oil is used in excess, for example, about 8 to 9 moles per mole of phenol.
しかも、過剰に使用した桐油は、積層板の製造過程の加
熱により、揮散している。桐油は、天然物であるため価
格が高いので、多く使用すると、コスト上昇を招く。Moreover, the excessively used tung oil evaporates due to heating during the manufacturing process of the laminate. Since tung oil is a natural product, it is expensive, so if a large amount is used, the cost will increase.
そこで、この発明は、フェノール樹脂などに付加しやす
い寸法安定化剤を提供することを第１の課題とし、寸法
安定性、特に厚み方向の寸法安定性の向上した積層板が
得られる樹脂組成物を提供することを第２の課題とする
。Therefore, the first object of the present invention is to provide a dimensional stabilizer that can be easily added to phenolic resins, etc., and provides a resin composition that can provide a laminate with improved dimensional stability, particularly in the thickness direction. The second challenge is to provide the following.
上記第１の課題を解決するために、請求項１記載の発明
にかかる寸法安定化剤は、樹脂組成物に配合されてその
硬化物の寸法変化を抑制するものであって、無水マレイ
ン酸と桐油との付加物からなることを特徴とする。In order to solve the first problem, the dimensional stabilizer according to the invention according to claim 1 is blended into a resin composition to suppress dimensional changes in the cured product, and is a dimensional stabilizer that is mixed with maleic anhydride. It is characterized by consisting of an adduct with tung oil.
上記第２の課題を解決するために、請求項２記載の発明
にかかる樹脂組成物は、寸法安定化剤として、無水マレ
イン酸と桐油との付加物からなるものが配合されたもの
とされている。In order to solve the above second problem, the resin composition according to the invention according to claim 2 is formulated with an adduct of maleic anhydride and tung oil as a dimensional stabilizer. There is.
この発明で用いる桐油としては、たとえば、フェノール
樹脂の可塑化のために使用されているものが挙げられる
が、これに躍るものではない。The tung oil used in this invention includes, for example, those used for plasticizing phenolic resins, but they are not superior to these.
無水マレイン酸と桐油とを加熱下で反応させる、反応温
度や反応時間は、特に限定はないが、たとえば、８０℃
程度の温度で９０分間程度反応させる。この反応により
生成した、無水マレイン酸と桐油との付加物は、発明者
らが調べたところでは、たとえば、常温で２４時間経過
後も桐油と無水マレイン酸とに分離しなかった。The reaction temperature and reaction time for reacting maleic anhydride and tung oil under heating are not particularly limited, but for example, 80°C.
Let the reaction take place for about 90 minutes at a moderate temperature. According to the inventors' investigation, the adduct of maleic anhydride and tung oil produced by this reaction did not separate into tung oil and maleic anhydride even after 24 hours at room temperature.
桐油と無水マレイン酸との割合は、任意の割合でもよい
が、桐油１モルに対して、無水マレイン酸０．５〜１．
５モル程度とするのが好ましく、等モルとするのがより
好ましい。０．５モル未満だと、反応性が低くなって単
なる混合物となり、１．５モルを越えると、反応性が強
くて反応のコントロールがしにくくなる。ここで、桐油
のモル数とは、フェノール樹脂の分野で通常使用されて
いるものであり、たとえば、代表的（または平均）分子
量をもとに・求められるものである。なお、桐油と無水
マレイン酸とは、不純物を全く含んでいない必要はなく
、ある程度、たとえば通常の範囲で、不純物を含んでい
てもよい、このため、桐油と無水マレイン酸とを上記の
ようにして加熱反応させてなる生成物も、たとえば、前
記不純物を含んでいてもよい。The ratio of tung oil and maleic anhydride may be any ratio, but it is 0.5 to 1.
The amount is preferably about 5 moles, and more preferably equimolar. If it is less than 0.5 mol, the reactivity will be low and it will become a mere mixture, and if it exceeds 1.5 mol, the reactivity will be strong and it will be difficult to control the reaction. Here, the number of moles of tung oil is commonly used in the field of phenolic resins, and is determined based on the typical (or average) molecular weight, for example. Note that tung oil and maleic anhydride do not need to be completely free of impurities, and may contain impurities to some extent, for example within the normal range. The product obtained by the heating reaction may also contain, for example, the above-mentioned impurities.
無水マレイン酸と桐油との付加物が配合される樹脂組成
物としては、たとえば、フェノール樹脂組成物、エポキ
シ樹脂組成物など積層板などの製造に用いられるものが
挙げられるが、これに限定するものではない、前記付加
物を樹脂組成物に配合する場合、その配合割合は特に限
定はないが、主成分の樹脂１００重量部（以下、単に「
部」と言う）に対して、前記付加物３０〜１００部程度
とされる。前記付加物は、主成分の樹脂に再付加される
のがよい。この再付加は、樹脂組成物の配合成分の混合
から完全硬化までの間に行われ、詳細は不明であるが、
無水マレイン酸の触媒的役目によりなされるものと考え
られる。Examples of the resin composition in which the adduct of maleic anhydride and tung oil is blended include, but are not limited to, phenol resin compositions, epoxy resin compositions, etc. used in the production of laminates, etc. When the above-mentioned adduct is blended into a resin composition, the blending ratio is not particularly limited, but 100 parts by weight of the main component resin (hereinafter simply "
30 to 100 parts of the additive. The adduct is preferably re-added to the main component resin. This re-addition is carried out between the mixing of the ingredients of the resin composition and the complete curing, and although the details are unknown,
This is thought to be achieved by the catalytic role of maleic anhydride.
前記樹脂組成物がフェノール樹脂組成物である場合、前
記付加物および主成分樹脂であるフェノール樹脂以外に
、必要に応じて、ワニス調製のための溶剤、その他の成
分が配合されてもよい、また、前記樹脂組成物が、エポ
キシ樹脂組成物である場合、前記付加物および主成分樹
脂であるエポキシ樹脂以外に、必ずまたは必要に応じて
、硬化剤、硬化促進剤、ワニス調製のための溶剤、その
他の成分が配合されてもよい。When the resin composition is a phenolic resin composition, in addition to the adduct and the phenol resin which is the main component resin, a solvent for preparing a varnish and other components may be blended as necessary. , when the resin composition is an epoxy resin composition, in addition to the adduct and the epoxy resin as the main component resin, a curing agent, a curing accelerator, a solvent for preparing a varnish, Other ingredients may also be blended.
前記樹脂組成物は、たとえば、配合成分が全部混合され
たワニスとされ、紙基材などの繊維質基材に含浸され、
乾燥される。こうして作製された樹脂含浸基材を１枚ま
たは複数枚（たとえば、４〜１０枚）用い、必要に応じ
て、金属箔、接着剤などを用い、積層成形して積層板が
作製される。The resin composition is, for example, made into a varnish in which all the ingredients are mixed, and is impregnated into a fibrous base material such as a paper base material,
dried. A laminate is produced by laminating one or more (for example, 4 to 10) of the resin-impregnated base materials thus produced and, if necessary, using metal foil, an adhesive, or the like.
得られた積層板など硬化物は、前記付加物を含む樹脂組
成物が硬化されているので、寸法変化の少ない、特に厚
み方向の寸法安定の良いものである。これは、詳細は不
明であるが、前記付加物が加熱により膨張するため、加
熱処理後の厚み方向の寸法変化率が従来品に比べて、た
とえば、ｌ／２〜１／１０程度に少なくなるからである
と考えられる。The resulting cured product, such as a laminate, has little dimensional change, especially good dimensional stability in the thickness direction, because the resin composition containing the additive has been cured. Although the details are unknown, since the additive expands upon heating, the dimensional change rate in the thickness direction after heat treatment is reduced to, for example, 1/2 to 1/10 compared to conventional products. It is thought that this is because
桐油と無水マレイン酸との付加生成物は、加温により膨
張すると考えられるので、樹脂組成物に配合されると、
加熱処理後の厚み方向の変化率が、従来品に比べて少な
くなり、寸法安定に有用である。また、桐油は、フェノ
ール樹脂などの樹脂に付加しにくいが、あらかじめ無水
マレイン酸と反応させておくと、同反応生成物が前記樹
脂に付加しやすくなる。したがって、前記付加生成物を
寸法安定化剤として樹脂組成物に配合すると、加熱によ
る桐油の揮散が防がれ、桐油の歩留まりが高くなる。The addition product of tung oil and maleic anhydride is thought to expand upon heating, so when it is blended into a resin composition,
The rate of change in the thickness direction after heat treatment is smaller than that of conventional products, which is useful for dimensional stability. Further, tung oil is difficult to add to resins such as phenol resins, but if it is reacted with maleic anhydride in advance, the reaction product becomes easier to add to the resin. Therefore, when the addition product is blended into a resin composition as a dimensional stabilizer, volatilization of tung oil due to heating is prevented and the yield of tung oil is increased.
桐油と無水マレイン酸との付加生成物を樹脂組成物に配
合しておくと、同樹脂組成物の硬化物の寸法変化率が小
さ（なる、また、桐油の歩留まりが高くなるので、大幅
なコスト合理化が可能となる。If an addition product of tung oil and maleic anhydride is blended into a resin composition, the dimensional change rate of the cured product of the resin composition will be small (also, the yield of tung oil will be high, resulting in a significant cost reduction). Rationalization becomes possible.
以下に、この発明の具体的な実施例および従来例を示寛
が、この発明は下記実施例に限定されない。Specific examples and conventional examples of the present invention will be described below, but the present invention is not limited to the following examples.
一実施例１−
無水マレイン酸と桐油とを等モルで混合し、８０℃で９
０分間加熱反応させて、無水マレイン酸と桐油との付加
生成物を得た。Example 1 - Maleic anhydride and tung oil were mixed in equimolar proportions and heated to 90°C at 80°C.
A heating reaction was carried out for 0 minutes to obtain an addition product of maleic anhydride and tung oil.
一実施例２〜４一
実施例１で得た付加生成物を用い、第１表に示す成分配
合の樹脂ワニスを調製した。Examples 2 to 4 Using the addition products obtained in Example 1, resin varnishes having the component formulations shown in Table 1 were prepared.
−従来例−
実施例１で得た付加生成物を使用しないで、第１表に示
す成分配合の樹脂ワニスを調製した。-Conventional Example- A resin varnish having the component composition shown in Table 1 was prepared without using the addition product obtained in Example 1.
一実施例５−
ビスフェノール系エポキシ樹脂（油化シェルエポキシ■
の商標エピコー）１００１）１００重１部、実施例１で
得た付加生成物７０重量部、メチルオキシトール１７０
重量部、２−エチル−４−メチル−イミダゾール０．１
重量部、および、ジシアンジアミド３重量部という配合
で樹脂ワニスを調製した。Example 5 - Bisphenol-based epoxy resin (oiled shell epoxy)
Epicor) 1001) 100 parts by weight, 70 parts by weight of the addition product obtained in Example 1, Methyloxytol 170
Part by weight, 2-ethyl-4-methyl-imidazole 0.1
A resin varnish was prepared using a blend of 1 part by weight and 3 parts by weight of dicyandiamide.
各樹脂ワニスをクラフト紙に含浸量５０重量％となるよ
うにして含浸させ、第１表に示す乾燥（反応）条件で乾
燥して樹脂含浸基材（レジンペーパー）を作製した。Kraft paper was impregnated with each resin varnish to an impregnation amount of 50% by weight, and dried under the drying (reaction) conditions shown in Table 1 to produce resin-impregnated base materials (resin paper).
得られた樹脂含浸基材を複数枚重ね合わせ、さらにその
両外側に銅箔を重ね合わせ、温度１６０〜１６５℃、圧
力１００ ｋｇ／ｃｄで６０分間積層成形し、厚み１．
６龍の銅張り積層板を得た。A plurality of the obtained resin-impregnated base materials were stacked together, copper foil was further stacked on both outer sides thereof, and lamination molding was performed at a temperature of 160 to 165°C and a pressure of 100 kg/cd for 60 minutes to obtain a thickness of 1.
A 6-dragon copper-clad laminate was obtained.
得られた積層板をエツチングして、８０℃で６０分間乾
燥し、２０℃、６５％ＲＨの恒温恒湿室内で放冷した後
、マイクロメーターで厚み（初期値）を測定した。つぎ
に、１３０℃のオーブンで加熱し、２０℃、６５％ＲＨ
の恒温恒湿室内で放冷した後、マイクロメーターで厚み
を測定し、前記初期値とで厚み方向寸法変化率（収縮率
）を求めた。また、パンチング性をパンチング可能温度
により調べた。結果を第１表に示した。The obtained laminate was etched, dried at 80° C. for 60 minutes, allowed to cool in a constant temperature and humidity room at 20° C. and 65% RH, and then its thickness (initial value) was measured using a micrometer. Next, heat in an oven at 130°C, 20°C, 65% RH.
After cooling in a constant temperature and humidity chamber, the thickness was measured with a micrometer, and the rate of dimensional change in the thickness direction (shrinkage rate) was determined from the initial value. In addition, the punching property was examined by the punching temperature. The results are shown in Table 1.
第１表かられかるように、実施例のものは、従来例のも
のに比べて、寸法変化率が非常に小さくなっている。As can be seen from Table 1, the dimensional change rate of the examples is much smaller than that of the conventional examples.
請求項１記載の発明にかかる寸法安定化剤は、以上に述
べたように、無水マレイン酸と桐油との付加物からなる
ことを特徴とするものである。このため、同寸法安定化
剤を配合した、請求項２記載の発明にかかる樹脂組成物
は、その硬化物の寸法変化率が非常に小さいものとなる
。As described above, the dimensional stabilizer according to the invention according to claim 1 is characterized in that it consists of an adduct of maleic anhydride and tung oil. Therefore, the resin composition according to the second aspect of the invention, which contains the same dimensional stabilizer, has a very small dimensional change rate of the cured product.
代理人 弁理士 松 本 武 彦Agent: Patent Attorney Takehiko Matsumoto
Claims (1)
制する寸法安定化剤であって、無水マレイン酸と桐油と
の付加物からなることを特徴とする寸法安定化剤。 ２ 寸法安定化剤として、無水マレイン酸と桐油との付
加物からなるものが配合された樹脂組成物。[Scope of Claims] 1. A dimensional stabilizer that is blended into a resin composition to suppress dimensional changes in the cured product, the dimensional stabilizer being comprised of an adduct of maleic anhydride and tung oil. agent. 2. A resin composition containing an adduct of maleic anhydride and tung oil as a dimensional stabilizer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044120A JP2604846B2 (en) | 1989-02-23 | 1989-02-23 | Manufacturing method of laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1044120A JP2604846B2 (en) | 1989-02-23 | 1989-02-23 | Manufacturing method of laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02222456A true JPH02222456A (en) | 1990-09-05 |
| JP2604846B2 JP2604846B2 (en) | 1997-04-30 |
Family
ID=12682746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1044120A Expired - Lifetime JP2604846B2 (en) | 1989-02-23 | 1989-02-23 | Manufacturing method of laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2604846B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010144100A (en) * | 2008-12-19 | 2010-07-01 | Panasonic Electric Works Co Ltd | Resin composition for housing equipment component and resin molded article for housing equipment component |
| JP2012229452A (en) * | 2012-08-30 | 2012-11-22 | Panasonic Corp | Resin composition for housing equipment member |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59102969A (en) * | 1982-12-01 | 1984-06-14 | Matsushita Electric Works Ltd | Adhesive for laminated sheet |
-
1989
- 1989-02-23 JP JP1044120A patent/JP2604846B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59102969A (en) * | 1982-12-01 | 1984-06-14 | Matsushita Electric Works Ltd | Adhesive for laminated sheet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010144100A (en) * | 2008-12-19 | 2010-07-01 | Panasonic Electric Works Co Ltd | Resin composition for housing equipment component and resin molded article for housing equipment component |
| JP2012229452A (en) * | 2012-08-30 | 2012-11-22 | Panasonic Corp | Resin composition for housing equipment member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2604846B2 (en) | 1997-04-30 |
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