JPH0222141Y2 - - Google Patents
Info
- Publication number
- JPH0222141Y2 JPH0222141Y2 JP7526987U JP7526987U JPH0222141Y2 JP H0222141 Y2 JPH0222141 Y2 JP H0222141Y2 JP 7526987 U JP7526987 U JP 7526987U JP 7526987 U JP7526987 U JP 7526987U JP H0222141 Y2 JPH0222141 Y2 JP H0222141Y2
- Authority
- JP
- Japan
- Prior art keywords
- tip
- soldering iron
- circuit board
- printed circuit
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 44
- 238000005476 soldering Methods 0.000 claims description 29
- 229910052742 iron Inorganic materials 0.000 claims description 22
- 229910000679 solder Inorganic materials 0.000 description 10
- 230000006378 damage Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Description
【考案の詳細な説明】
(イ) 産業上の利用分野
本考案は、プリント基板等にIC等の多数個の
半田付端子を同時にはんだ剥しまたははんだ付す
る半田こてに関するものである。[Detailed description of the invention] (a) Industrial application field The present invention relates to a soldering iron for simultaneously stripping or soldering a large number of soldered terminals such as ICs to a printed circuit board or the like.
(ロ) 従来の技術
プリント基板等に装着された多数個の半田付端
子を有する部品を、何んらかの理由により部品を
プリント基板より取り離す場合に、従来の半田こ
てでは、その離脱作業が極めて困難で状況によつ
ては破壊しなければならず、また修復した部品を
再度プリント基板に装着しはんだ付けする作業も
容易ではない。(b) Conventional technology When a component with a large number of soldered terminals attached to a printed circuit board, etc. is removed from the printed circuit board for some reason, conventional soldering irons are used to remove the component from the printed circuit board. The work is extremely difficult and may require destruction depending on the situation, and it is also not easy to remount and solder the repaired parts onto the printed circuit board.
(ハ) 考案が解決しようとする問題点
従来の半田こてにより、多数個の半田付端子を
有する部品を一度半田付けした後に、部品を取り
離す場合同時に複数個の全端子の半田を溶かすこ
とができないために部品を取り離すことは極めて
困難であり、また再度部品を装着する場合１個所
毎の半田作業のため多くの作業時間を要すること
が多かつた。(c) Problems to be solved by the invention After soldering a component with a large number of soldering terminals using a conventional soldering iron, when removing the component, the solder of all the terminals must be melted at the same time. This makes it extremely difficult to remove the parts, and when reattaching the parts, it often takes a lot of time to solder each part.
この考案は簡単な手段によつて、上記の欠点を
除去することを目的とするものである。 This invention aims to eliminate the above-mentioned drawbacks by simple means.
(ニ) 問題点を解決するための手段と作用
この考案は、半田こて先の構造を複数個のこて
先とし、そのそれぞれのこて先の先端部には半田
作業時にその位置決め作用をするガイドを設ける
とともに、半田こて先をその半田こて先ごとにこ
て先方向に可動可能としたもので、プリント基板
等に多数個の半田付端子を有する部品を取り離し
または取り付ける場合、プリント基板等に装着さ
れた多数個のそれぞれの突出高さ寸法に相違があ
り、多数の端子により構成される端子面が平担で
ない場合であつても、複数の半田こて先はそれぞ
れの半田こて先ごとにこて先方向に可動して各端
子先端と接触することにより、複数個の全端子の
半田を一度に溶かすことができ、装着部品を極め
て容易に短時間での離脱を可能とし、また修復し
た部品を再度装着する場合には、各こて先の先端
部を可動としたこて先により、取り離しの際のプ
リント基板上の半田残りの高さにバラツキがあつ
ても、半田を一度に溶かすことを容易とする特徴
を有する半田こてである。(d) Means and action for solving the problem This invention has a soldering iron tip structure with multiple tips, and the tip of each tip has a positioning function during soldering work. This device is equipped with a guide that allows the soldering iron tip to be moved in the direction of the soldering iron tip for each soldering iron tip, and is used when removing or attaching a component with a large number of soldering terminals to a printed circuit board, etc. Even if there are differences in the protruding height dimensions of multiple soldering iron tips attached to a printed circuit board, etc., and the terminal surface made up of multiple terminals is not flat, multiple soldering iron tips will By moving each soldering tip in the direction of the soldering iron tip and making contact with each terminal tip, it is possible to melt the solder of all multiple terminals at once, making it extremely easy to remove attached parts in a short time. In addition, when reinstalling a repaired component, the movable tip of each tip allows for smooth soldering even if the height of the remaining solder on the printed circuit board varies when removed. , a soldering iron that has a feature that makes it easy to melt solder all at once.
(ホ) 実施例
以下、図面に示した実施例を参照して本考案を
詳細に説明する。(e) Embodiments The present invention will be described in detail below with reference to embodiments shown in the drawings.
第１図および第２図に示すように複数の可動こ
て先２はそれぞれホルダー１によりガイドされ可
動こて先２を矢印上下方向に可動としたものであ
り、可動こて先２の先端部２−１には第５図に示
すような位置決め用のテーパー状のガイド２−２
を設け、また可動こて先２の他端部２−３はホル
ダー１に設けたスプリング３と接触している。 As shown in FIGS. 1 and 2, each of the movable tips 2 is guided by a holder 1 and movable in the up and down directions of the arrows, and the tip of the movable tip 2 2-1 has a tapered guide 2-2 for positioning as shown in Fig. 5.
The other end 2-3 of the movable iron tip 2 is in contact with a spring 3 provided on the holder 1.
このスプリング３とホルダー１、はともに発熱
体を有する保持部７により保持されている。 Both the spring 3 and the holder 1 are held by a holding part 7 having a heating element.
第３図に示すように多数の半田付端子６−１を
有する部品６はプリント基板５に装着され、端子
６−１の先端はプリント基板上に突出し、この突
出部にハンダ８の半田付けまたは半田取外しを行
なう。 As shown in FIG. 3, a component 6 having a large number of solder terminals 6-1 is mounted on a printed circuit board 5, and the tips of the terminals 6-1 protrude onto the printed circuit board, and solder 8 is applied to this protrusion. Perform solder removal.
このとき突出部の端子高さH1〜H2にバラツキ
を生じるために従来の作業上の障害原因ともなつ
ていた。 At this time, variation occurs in the terminal heights H 1 to H 2 of the protruding portion, which has caused problems in conventional work.
つぎに本考案による半田こてを使用した半田取
外しについてのべると、第４図に示すように複数
のそれぞれの可動こて先２は上下方向に降下上昇
してその先端部２−１は位置決め用ガイド２−２
により案内されて端子６−１の先端と対向し、そ
れぞれの端子高さH1〜H2に応じて先端部２−１
と端子６−１とが接触してその降下上昇を停止し
加熱作業を行い半田を溶融する。 Next, we will talk about desoldering using the soldering iron according to the present invention. As shown in FIG. Guide 2-2
is guided by the tip of the terminal 6-1, and the tip of the terminal 2-1 is guided by the
When the terminal 6-1 comes into contact with the terminal 6-1, the lowering and rising of the terminal 6-1 is stopped, and a heating operation is performed to melt the solder.
このとき可動こて先２は、端子高さH1〜H2に
バラツキを生じていても、可動こて先２の他端部
２−３と前述のスプリング３との接触により高さ
調節が行なわれる。このような接触により各端子
ともその加熱作業は平均して同時に行なわれるた
め、プリント基板５よりの部品６の抜去は極めて
容易に実施可能となる抜去された部品６の修復後
または相当品をあらためてプリント基板５に装着
するときは、前述のそれぞれのガイド２−２によ
り、端子高さH1〜H2にバラツキを生じていても
スプリング３により高さもそれぞれ調節されて半
田付け作業が実施される。 At this time, the height of the movable tip 2 can be adjusted due to the contact between the other end 2-3 of the movable tip 2 and the spring 3, even if the terminal height H1 to H2 varies. It is done. Due to such contact, the heating work for each terminal is performed simultaneously on average, so it is extremely easy to remove the component 6 from the printed circuit board 5. After repairing the removed component 6 or replacing it with an equivalent product When mounting the terminals on the printed circuit board 5, the respective guides 2-2 mentioned above adjust the heights of the terminals H1 to H2 even if the terminal heights H1 to H2 vary, and the soldering work is carried out by adjusting the respective heights with the springs 3. .
(ヘ) 考案の効果
本考案による半田こての構成によれば、プリン
ト基板等に固定されたIC等の部品全体の破損を
招いたり外観を損じたりすることもなく、また部
品がプリント基板に対してしつかり押圧されるよ
うにすることができる特徴を有するものであり、
従来問題となつていた多数個の半田付端子部品の
取り離し、取り付けが極めて簡単でかつ大規模な
装置を必要としないため出張現地先での離脱・装
着作業も可能となり、その価格も安価で利用範囲
は広く効果は極めて大である。(f) Effects of the invention According to the configuration of the soldering iron according to the invention, there is no risk of damage to the entire parts such as ICs fixed to the printed circuit board, etc., or damage to the appearance, and there is no possibility that the parts may be attached to the printed circuit board. It has the characteristic that it can be pressed firmly against the
It is extremely easy to remove and install a large number of soldered terminal parts, which was a problem in the past, and does not require large-scale equipment, making it possible to remove and install at the site while on a business trip, and the price is low. It has a wide scope of use and is extremely effective.
第１図は本考案半田こての実施例を説明するた
めの構造図、第２図は第１図のＡ−A′断面図、
第３図はプリント基板上に配設された部品の斜視
図、第４図はプリント基板上に配設された部品お
よび部品の端子上方に配置された可動半田こて先
の斜視図、第５図は第４図の可動半田こて先の先
端部の詳細を示す断面図。
１はホルダー、２は可動こて先、３はスプリン
グ、２−２は位置決め用ガイド。
Fig. 1 is a structural diagram for explaining an embodiment of the soldering iron of the present invention, Fig. 2 is a sectional view taken along line A-A' in Fig. 1,
3 is a perspective view of components arranged on a printed circuit board, FIG. 4 is a perspective view of components arranged on a printed circuit board and a movable soldering iron tip arranged above the terminals of the components, and 5. The figure is a sectional view showing details of the tip of the movable soldering iron tip in FIG. 4. 1 is a holder, 2 is a movable iron tip, 3 is a spring, and 2-2 is a positioning guide.
Claims (1)
先端部に位置決め用のガイドを設けるとともに、
該半田こて先をこて先ごとにこて先方向に可動構
造としたことを特徴とする半田こて。 It has multiple soldering iron tips, and a positioning guide is provided at the tip of each soldering iron tip.
A soldering iron characterized in that each soldering iron tip has a movable structure in the direction of the soldering iron tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7526987U JPH0222141Y2 (en) | 1987-05-21 | 1987-05-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7526987U JPH0222141Y2 (en) | 1987-05-21 | 1987-05-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63184670U JPS63184670U (en) | 1988-11-28 |
| JPH0222141Y2 true JPH0222141Y2 (en) | 1990-06-14 |
Family
ID=30921251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7526987U Expired JPH0222141Y2 (en) | 1987-05-21 | 1987-05-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222141Y2 (en) |
-
1987
- 1987-05-21 JP JP7526987U patent/JPH0222141Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63184670U (en) | 1988-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3750252A (en) | Solder terminal strip | |
| US4934582A (en) | Method and apparatus for removing solder mounted electronic components | |
| DE3236229A1 (en) | DEVICE AND METHOD FOR FIXING ASSEMBLIES WITH INTEGRATED CIRCUIT ON A PRINTED CIRCUIT BOARD | |
| EP0420050B1 (en) | Method of soldering of components on circuit boards | |
| JPH0222141Y2 (en) | ||
| DE2925347A1 (en) | Hot air blower for unsoldering faulty component - has heated suction nozzle for removing surplus solder from connection points and holes | |
| JPH0225252Y2 (en) | ||
| JP3012356U (en) | Shield case structure | |
| JPS60201696A (en) | Method of soldering flt package | |
| JP3144096B2 (en) | PCB repair jig | |
| JP3460172B2 (en) | Electronic device and method for manufacturing this electronic device | |
| US5127572A (en) | Soldering method and tool | |
| EP0158230A1 (en) | Piezoelectric-acoustic transducer for electroacoustic units with constructional features for assembling | |
| JPS5828699Y2 (en) | soldering iron | |
| JPS6112701Y2 (en) | ||
| JPS5814625Y2 (en) | Through-hole mask during solder dipping | |
| JPH084210Y2 (en) | IC extraction jig | |
| JP2512217B2 (en) | Deformed parts soldering device | |
| JPH0641726Y2 (en) | Electronic component soldering equipment | |
| JPH075636Y2 (en) | Electronic component remove jig | |
| JP2767677B2 (en) | Temporarily fixing memory connector and printed circuit board during reflow | |
| JPH075680Y2 (en) | Flattening jig for terminal pins | |
| JPS6220985Y2 (en) | ||
| DD217452A1 (en) | DEVICE FOR CONTACTING PCB | |
| JPH0577886U (en) | Neo wedge valve mounting board |